BAP64-06,215 [NXP]
BAP64-06 - Silicon PIN diode TO-236 3-Pin;
| 型号： | BAP64-06,215 |
| 厂家： | 
NXP |
| 描述： | BAP64-06 - Silicon PIN diode TO-236 3-Pin 衰减器 高压 开关 测试 光电二极管 |
| 文件： | 总9页 (文件大小：145K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
BAP64-06
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Silicon PIN diode
Rev. 4 — 28 April 2015
Product data sheet
1. Product profile
1.1 General description
Two planar PIN diodes in common anode configuration in a SOT23 small SMD plastic
package.
1.2 Features and benefits
High voltage, current controlled
RF resistor for RF attenuators and switches
Low diode capacitance
Low diode forward resistance
Low series inductance
For applications up to 3 GHz
AEC-Q101 qualified
1.3 Applications
RF attenuators and switches
2. Pinning information
Table 1.
Discrete pinning
Pin
1
Description
cathode 1
Simplified outline
Symbol
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2
cathode 2
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common connection
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top view
3. Ordering information
Table 2.
Ordering information
Type number Package
Name
Description
plastic surface-mounted package; 3 leads
Version
BAP64-06
-
SOT23
BAP64-06
NXP Semiconductors
Silicon PIN diode
4. Marking
Table 3.
Marking
Type number
Marking
Description
BAP64-06
6K*
* = t : made in Malaysia
* = W : made in China
5. Limiting values
Table 4.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Values are specified per diode.
Symbol
VR
Parameter
Conditions
Min
Max
175
Unit
V
reverse voltage
-
IF
forward current
-
100
mA
mW
C
Ptot
Tstg
Tj
total power dissipation
storage temperature
junction temperature
Tsp = 90 C
-
250
65
65
+150
+150
C
6. Thermal characteristics
Table 5.
Thermal characteristics
Symbol Parameter
Conditions
Typ Unit
Rth(j-sp)
thermal resistance from junction to solder point
220 K/W
7. Characteristics
Table 6.
Characteristics
Values are specified per diode; Tj = 25 C unless otherwise specified.
Symbol
Parameter
Conditions
IF = 50 mA
Min
Typ
Max
1.1
10
Unit
V
VF
IR
forward voltage
reverse current
-
-
-
0.95
VR = 175 V
VR = 20 V
-
-
A
A
1
Cd
diode capacitance
see Figure 1; f = 1 MHz;
VR = 0 V
-
-
-
0.52
0.37
0.23
-
pF
pF
pF
VR = 1 V
-
VR = 20 V
0.35
BAP64-06
All information provided in this document is subject to legal disclaimers.
© NXP Semiconductors N.V. 2015. All rights reserved.
Product data sheet
Rev. 4 — 28 April 2015
2 of 9
BAP64-06
NXP Semiconductors
Silicon PIN diode
Table 6.
Characteristics …continued
Values are specified per diode; Tj = 25 C unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
[1]
rD
diode forward resistance see Figure 2; f = 100 MHz;
IF = 0.5 mA
IF = 1 mA
-
-
-
-
-
20
40
20
3.8
1.35
-
s
10
IF = 10 mA
IF = 100 mA
2.0
0.7
1.55
L
charge carrier life time
series inductance
when switched from IF = 10 mA to
IR = 6 mA; RL = 100 ; measured at
IR = 3 mA
LS
-
1.4
-
nH
[1] Guaranteed on AQL basis: inspection level S4, AQL 1.0.
7.1 Graphical data
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f = 1 MHz; Tj = 25 C.
f = 100 MHz; Tj = 25 C.
Fig 1. Diode capacitance as a function of reverse
voltage; typical values
Fig 2. Forward resistance as a function of forward
current; typical values
BAP64-06
All information provided in this document is subject to legal disclaimers.
© NXP Semiconductors N.V. 2015. All rights reserved.
Product data sheet
Rev. 4 — 28 April 2015
3 of 9
BAP64-06
NXP Semiconductors
Silicon PIN diode
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Tamb = 25 C
Tamb = 25 C
Diode zero biased and inserted in series with a 50
stripline circuit
(1) IF = 100 mA
(2) IF = 10 mA
(3) IF = 1 mA
(4) IF = 0.5 mA
Diode inserted in series with a 50 stripline circuit and
biased via the analyzer Tee network
Fig 3. Isolation of the diode as a function of
frequency; typical values
Fig 4. Insertion loss of the diode as a function of
frequency; typical values
BAP64-06
All information provided in this document is subject to legal disclaimers.
© NXP Semiconductors N.V. 2015. All rights reserved.
Product data sheet
Rev. 4 — 28 April 2015
4 of 9
BAP64-06
NXP Semiconductors
Silicon PIN diode
8. Package outline
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Fig 5. Package outline SOT23
BAP64-06
All information provided in this document is subject to legal disclaimers.
© NXP Semiconductors N.V. 2015. All rights reserved.
Product data sheet
Rev. 4 — 28 April 2015
5 of 9
BAP64-06
NXP Semiconductors
Silicon PIN diode
9. Abbreviations
Table 7.
Abbreviations
Description
Acronym
AQL
Acceptable Quality Level
P-type, Intrinsic, N-type
Surface Mounted Device
Special inspection level 4
PIN
SMD
S4
10. Revision history
Table 8.
Revision history
Document ID
BAP64-06 v.4
Modifications:
Release date
Data sheet status
Change notice
Supersedes
20150428
Product data sheet
-
BAP64-06 v.3.1
• The format of this data sheet has been redesigned to comply with the new identity
guidelines of NXP Semiconductors.
• Legal texts have been adapted to the new company name where appropriate.
• AEC-Q101 qualified
BAP64-06_v.3
(9397 750 06664)
20010217
20000322
19991217
Product specification
Product specification
Preliminary specification
-
-
-
BAP64-06 v.2
BAP64-06 v.2
(9397 750 06911)
BAP64-06_N v.1
-
BAP64-06_N v.1
(9397 750 08033)
BAP64-06
All information provided in this document is subject to legal disclaimers.
© NXP Semiconductors N.V. 2015. All rights reserved.
Product data sheet
Rev. 4 — 28 April 2015
6 of 9
BAP64-06
NXP Semiconductors
Silicon PIN diode
11. Legal information
11.1 Data sheet status
Document status[1][2]
Product status[3]
Development
Definition
Objective [short] data sheet
This document contains data from the objective specification for product development.
This document contains data from the preliminary specification.
This document contains the product specification.
Preliminary [short] data sheet Qualification
Product [short] data sheet Production
[1]
[2]
[3]
Please consult the most recently issued document before initiating or completing a design.
The term ‘short data sheet’ is explained in section “Definitions”.
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
Suitability for use in automotive applications — This NXP
11.2 Definitions
Semiconductors product has been qualified for use in automotive
applications. Unless otherwise agreed in writing, the product is not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer's own
risk.
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
11.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
BAP64-06
All information provided in this document is subject to legal disclaimers.
© NXP Semiconductors N.V. 2015. All rights reserved.
Product data sheet
Rev. 4 — 28 April 2015
7 of 9
BAP64-06
NXP Semiconductors
Silicon PIN diode
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Translations — A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
11.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
12. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
BAP64-06
All information provided in this document is subject to legal disclaimers.
© NXP Semiconductors N.V. 2015. All rights reserved.
Product data sheet
Rev. 4 — 28 April 2015
8 of 9
BAP64-06
NXP Semiconductors
Silicon PIN diode
13. Contents
1
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1
1.2
1.3
General description . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits. . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
2
Pinning information. . . . . . . . . . . . . . . . . . . . . . 1
Ordering information. . . . . . . . . . . . . . . . . . . . . 1
Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2
Thermal characteristics . . . . . . . . . . . . . . . . . . 2
Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 2
Graphical data . . . . . . . . . . . . . . . . . . . . . . . . . 3
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 5
Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Revision history. . . . . . . . . . . . . . . . . . . . . . . . . 6
3
4
5
6
7
7.1
8
9
10
11
Legal information. . . . . . . . . . . . . . . . . . . . . . . . 7
Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 7
Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
11.1
11.2
11.3
11.4
12
13
Contact information. . . . . . . . . . . . . . . . . . . . . . 8
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP Semiconductors N.V. 2015.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 28 April 2015
Document identifier: BAP64-06
相关型号：
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