BAP65-03T/R [NXP]
DIODE 30 V, SILICON, PIN DIODE, PLASTIC, SC-76, 2 PIN, PIN Diode;
| 型号： | BAP65-03T/R |
| 厂家： | 
NXP |
| 描述： | DIODE 30 V, SILICON, PIN DIODE, PLASTIC, SC-76, 2 PIN, PIN Diode 衰减器 开关 光电二极管 |
| 文件： | 总7页 (文件大小：61K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
DISCRETE SEMICONDUCTORS
DATA SHEET
BAP65-03
Silicon PIN diode
Product specification
2004 Feb 11
Supersedes data of 2001 May 11
Philips Semiconductors
Product specification
Silicon PIN diode
BAP65-03
FEATURES
PINNING
• High voltage, current controlled
• RF resistor for RF switches
• Low diode capacitance
PIN
DESCRIPTION
1
2
cathode
anode
• Low diode forward resistance (low loss)
• Very low series inductance.
1
2
APPLICATIONS
• RF attenuators and switches
• Bandswitch for TV tuners
sym006
Top view
• Series diode for mobile communication transmit/receive
switch.
Marking code: D3.
The marking bar indicates the cathode.
DESCRIPTION
Fig.1 Simplified outline (SOD323) and symbol.
Planar PIN diode in a SOD323 small SMD plastic package.
ORDERING INFORMATION
TYPE
PACKAGE
DESCRIPTION
plastic surface mounted package; 2 leads
NUMBER
NAME
VERSION
BAP65-03
−
SOD323
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
VR
IF
continuous reverse voltage
continuous forward current
total power dissipation
storage temperature
−
−
−
30
V
100
500
+150
+150
mA
mW
°C
Ptot
Tstg
Tj
Ts ≤ 90 °C
−65
−65
junction temperature
°C
2004 Feb 11
2
Philips Semiconductors
Product specification
Silicon PIN diode
BAP65-03
ELECTRICAL CHARACTERISTICS
Tj = 25 °C unless otherwise specified.
SYMBOL
VF
PARAMETER
forward voltage
CONDITIONS
IF = 50 mA
TYP.
0.9
MAX.
1.1
UNIT
V
IR
reverse leakage current
diode capacitance
VR = 20 V
−
20
−
nA
pF
pF
pF
pF
Ω
Cd
VR = 0 V; f = 1 MHz
0.65
0.55
0.5
VR = 1 V; f = 1 MHz
0.9
0.8
−
VR = 3 V; f = 1 MHz
VR = 20 V; f = 1 MHz
0.375
1
rD
diode forward resistance
IF = 1 mA; f = 100 MHz
IF = 5 mA; f = 100 MHz; note 1
IF = 10 mA; f = 100 MHz; note 1
IF = 100 mA; f = 100 MHz
VR = 0; f = 900 MHz
−
0.65
0.56
0.35
10.2
5.8
0.95
0.9
−
Ω
Ω
Ω
2
2
2
2
2
|s21
|s21
|s21
|s21
|s21
|
|
|
|
|
isolation
−
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
µs
VR = 0; f = 1800 MHz
VR = 0; f = 2450 MHz
IF = 1 mA; f = 900 MHz
IF = 1 mA; f = 1800 MHz
IF = 1 mA; f = 2450 MHz
IF = 5 mA; f = 900 MHz
IF = 5 mA; f = 1800 MHz
IF = 5 mA; f = 2450 MHz
IF = 10 mA; f = 900 MHz
IF = 10 mA; f = 1800 MHz
IF = 10 mA; f = 2450 MHz
IF = 100 mA; f = 900 MHz
IF = 100 mA; f = 1800 MHz
IF = 100 mA; f = 2450 MHz
−
4.1
−
insertion loss
insertion loss
insertion loss
insertion loss
0.1
−
0.14
0.18
0.06
0.1
−
−
−
−
0.14
0.06
0.1
−
−
−
0.13
0.05
0.1
−
−
−
0.14
−
τL
charge carrier life time
series inductance
when switched from IF = 10 mA to 0.17
IR = 6 mA; RL = 100 Ω;
measured at IR = 3 mA
−
LS
IF = 100 mA; f = 100 MHz
1.5
−
nH
Note
1. Guaranteed on AQL basis: inspection level S4, AQL 1.0.
THERMAL CHARACTERISTICS
SYMBOL
PARAMETER
VALUE
UNIT
Rth(j-s)
thermal resistance from junction to soldering point
120
K/W
2004 Feb 11
3
Philips Semiconductors
Product specification
Silicon PIN diode
BAP65-03
GRAPHICAL DATA
MLD503
MLD504
10
1000
handbook, halfpage
handbook, halfpage
C
d
r
D
(fF)
800
(Ω)
600
400
1
200
−1
10
0
0
−1
2
10
1
10
10
4
8
12
16
20
I
(mA)
F
V
(V)
R
Tj = 25 °C; f = 100 MHz.
Tj = 25 °C; f = 1 MHz.
Fig.2 Forward resistance as a function of forward
current; typical values.
Fig.3 Diode capacitance as a function of reverse
voltage; typical values.
MLD505
MLD506
0
0
handbook, halfpage
handbook, halfpage
2
s
21
2
s
21
(dB)
−0.1
(5)
(4)
(dB)
−10
(1)
(2) (3)
−0.2
−0.3
−0.4
−0.5
−20
−30
−40
0
1000
2000
3000
0
1000
2000
3000
f (MHz)
f (MHz)
(1)
I
F = 0.5 mA.
(4) IF = 10 mA.
(5) IF = 100 mA.
(2) IF = 1 mA.
(3) IF = 5 mA.
Diode zero biased and inserted in series with a 50 Ω stripline circuit.
Tamb = 25 °C.
Diode inserted in series with a 50 Ω stripline circuit and biased
via the analyzer Tee network; Tamb = 25 °C.
Fig.4 Insertion loss (|s21|2) of the diode as a
Fig.5 Isolation (|s21|2) of the diode as a function of
function of frequency; typical values.
frequency; typical values.
2004 Feb 11
4
Philips Semiconductors
Product specification
Silicon PIN diode
BAP65-03
PACKAGE OUTLINE
Plastic surface mounted package; 2 leads
SOD323
A
D
E
X
M
A
H
D
v
Q
1
2
b
p
A
A
1
(1)
c
L
p
detail X
0
1
2 mm
scale
DIMENSIONS (mm are the original dimensions)
A
1
UNIT
mm
b
c
D
E
H
L
p
Q
v
A
p
D
max
1.1
0.8
0.40 0.25
0.25 0.10
1.8
1.6
1.35
1.15
2.7
2.3
0.45 0.25
0.15 0.15
0.05
0.2
Note
1. The marking bar indicates the cathode
REFERENCES
JEDEC JEITA
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
99-09-13
03-12-17
SOD323
SC-76
2004 Feb 11
5
Philips Semiconductors
Product specification
Silicon PIN diode
BAP65-03
DATA SHEET STATUS
DATA SHEET
LEVEL
PRODUCT
STATUS(2)(3)
DEFINITION
STATUS(1)
I
Objective data
Development This data sheet contains data from the objective specification for product
development. Philips Semiconductors reserves the right to change the
specification in any manner without notice.
II
Preliminary data Qualification
This data sheet contains data from the preliminary specification.
Supplementary data will be published at a later date. Philips
Semiconductors reserves the right to change the specification without
notice, in order to improve the design and supply the best possible
product.
III
Product data
Production
This data sheet contains data from the product specification. Philips
Semiconductors reserves the right to make changes at any time in order
to improve the design, manufacturing and supply. Relevant changes will
be communicated via a Customer Product/Process Change Notification
(CPCN).
Notes
1. Please consult the most recently issued data sheet before initiating or completing a design.
2. The product status of the device(s) described in this data sheet may have changed since this data sheet was
published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com.
3. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.
DEFINITIONS
DISCLAIMERS
Short-form specification
The data in a short-form
Life support applications
These products are not
specification is extracted from a full data sheet with the
same type number and title. For detailed information see
the relevant data sheet or data handbook.
designed for use in life support appliances, devices, or
systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips
Semiconductors customers using or selling these products
for use in such applications do so at their own risk and
agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.
Limiting values definition Limiting values given are in
accordance with the Absolute Maximum Rating System
(IEC 60134). Stress above one or more of the limiting
values may cause permanent damage to the device.
These are stress ratings only and operation of the device
at these or at any other conditions above those given in the
Characteristics sections of the specification is not implied.
Exposure to limiting values for extended periods may
affect device reliability.
Right to make changes
Philips Semiconductors
reserves the right to make changes in the products -
including circuits, standard cells, and/or software -
described or contained herein in order to improve design
and/or performance. When the product is in full production
(status ‘Production’), relevant changes will be
Application information
Applications that are
communicated via a Customer Product/Process Change
Notification (CPCN). Philips Semiconductors assumes no
responsibility or liability for the use of any of these
products, conveys no licence or title under any patent,
copyright, or mask work right to these products, and
makes no representations or warranties that these
products are free from patent, copyright, or mask work
right infringement, unless otherwise specified.
described herein for any of these products are for
illustrative purposes only. Philips Semiconductors make
no representation or warranty that such applications will be
suitable for the specified use without further testing or
modification.
2004 Feb 11
6
Philips Semiconductors – a worldwide company
Contact information
For additional information please visit http://www.semiconductors.philips.com.
Fax: +31 40 27 24825
For sales offices addresses send e-mail to: sales.addresses@www.semiconductors.philips.com.
© Koninklijke Philips Electronics N.V. 2004
SCA76
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
R77/04/pp7
Date of release: 2004 Feb 11
Document order number: 9397 750 12635
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