BAP70-03_04 [NXP]
Silicon PIN diode; 硅PIN二极管
| 型号： | BAP70-03_04 |
| 厂家： | 
NXP |
| 描述： | Silicon PIN diode |
| 文件： | 总7页 (文件大小：51K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
DISCRETE SEMICONDUCTORS
DATA SHEET
BAP70-03
Silicon PIN diode
Product specification
2004 Feb 10
Supersedes data of 2002 Aug 06
Philips Semiconductors
Product specification
Silicon PIN diode
BAP70-03
FEATURES
PINNING
• High voltage, current controlled RF resistor for
attenuators
PIN
DESCRIPTION
1
2
cathode
• Low diode capacitance
anode
• Very low series inductance.
APPLICATIONS
1
2
• RF attenuators
• (SAT)TV
sym006
Top view
• Car radio.
Marking code: A9.
The marking bar indicates the cathode.
DESCRIPTION
Planar PIN diode in a SOD323 (SC-76) small SMD plastic
package.
Fig.1 Simplified outline (SOD323; SC-76) and
symbol.
ORDERING INFORMATION
TYPE
PACKAGE
DESCRIPTION
plastic surface mounted package; 2 leads
NUMBER
NAME
VERSION
BAP70-03
−
SOD323
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).
SYMBOL
VR
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
continuous reverse voltage
continuous forward current
total power dissipation
storage temperature
−
−
−
50
V
IF
100
500
+150
+150
mA
mW
°C
Ptot
Tstg
Tj
Ts = 90 °C
−65
−65
junction temperature
°C
2004 Feb 10
2
Philips Semiconductors
Product specification
Silicon PIN diode
BAP70-03
CHARACTERISTICS
Tj = 25 °C unless otherwise specified.
SYMBOL
VF
PARAMETER
forward voltage
CONDITIONS
TYP.
0.9
MAX.
1.1
UNIT
IF = 50 mA
VR = 30 V
V
IR
reverse leakage current
diode capacitance
−
20
−
nA
fF
fF
fF
fF
Ω
Cd
VR = 0 V; f = 1 MHz
570
400
270
200
77
VR = 1 V; f = 1 MHz
−
VR = 5 V; f = 1 MHz
−
VR = 20 V; f = 1 MHz
IF = 0.5 mA; f = 100 MHz
IF = 1 mA; f = 100 MHz
IF = 10 mA; f = 100 MHz
IF = 100 mA; f = 100 MHz
250
100
50
7
rD
diode forward resistance
40
Ω
5.4
1.4
1.25
Ω
1.9
−
Ω
τL
charge carrier life time
series inductance
when switched from IF = 10 mA to
IR = 6 mA; RL = 100 Ω;
measured at IR = 3 mA
µs
LS
IF = 100 mA; f = 100 MHz
1.5
−
nH
THERMAL CHARACTERISTICS
SYMBOL
PARAMETER
VALUE
120
UNIT
Rth(j-s)
thermal resistance from junction to soldering point
K/W
2004 Feb 10
3
Philips Semiconductors
Product specification
Silicon PIN diode
BAP70-03
GRAPHICAL DATA
MCE007
MCE008
3
10
600
handbook, halfpage
handbook, halfpage
C
d
r
D
(fF)
(Ω)
500
2
10
400
300
200
100
10
1
10
0
0
−1
2
1
10
10
5
10
15
20
I
(mA)
V
(V)
F
R
Tj = 25 °C; f = 100 MHz.
Tj = 25 °C; f = 1 MHz.
Fig.2 Forward resistance as a function of forward
current; typical values.
Fig.3 Diode capacitance as a function of reverse
voltage; typical values.
2004 Feb 10
4
Philips Semiconductors
Product specification
Silicon PIN diode
BAP70-03
PACKAGE OUTLINE
Plastic surface mounted package; 2 leads
SOD323
A
D
E
X
M
A
H
D
v
Q
1
2
b
p
A
A
1
(1)
c
L
p
detail X
0
1
2 mm
scale
DIMENSIONS (mm are the original dimensions)
A
1
UNIT
mm
b
c
D
E
H
L
p
Q
v
A
p
D
max
1.1
0.8
0.40 0.25
0.25 0.10
1.8
1.6
1.35
1.15
2.7
2.3
0.45 0.25
0.15 0.15
0.05
0.2
Note
1. The marking bar indicates the cathode
REFERENCES
JEDEC JEITA
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
99-09-13
03-12-17
SOD323
SC-76
2004 Feb 10
5
Philips Semiconductors
Product specification
Silicon PIN diode
BAP70-03
DATA SHEET STATUS
DATA SHEET
LEVEL
PRODUCT
STATUS(2)(3)
DEFINITION
STATUS(1)
I
Objective data
Development This data sheet contains data from the objective specification for product
development. Philips Semiconductors reserves the right to change the
specification in any manner without notice.
II
Preliminary data Qualification
This data sheet contains data from the preliminary specification.
Supplementary data will be published at a later date. Philips
Semiconductors reserves the right to change the specification without
notice, in order to improve the design and supply the best possible
product.
III
Product data
Production
This data sheet contains data from the product specification. Philips
Semiconductors reserves the right to make changes at any time in order
to improve the design, manufacturing and supply. Relevant changes will
be communicated via a Customer Product/Process Change Notification
(CPCN).
Notes
1. Please consult the most recently issued data sheet before initiating or completing a design.
2. The product status of the device(s) described in this data sheet may have changed since this data sheet was
published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com.
3. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.
DEFINITIONS
DISCLAIMERS
Short-form specification
The data in a short-form
Life support applications
These products are not
specification is extracted from a full data sheet with the
same type number and title. For detailed information see
the relevant data sheet or data handbook.
designed for use in life support appliances, devices, or
systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips
Semiconductors customers using or selling these products
for use in such applications do so at their own risk and
agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.
Limiting values definition Limiting values given are in
accordance with the Absolute Maximum Rating System
(IEC 60134). Stress above one or more of the limiting
values may cause permanent damage to the device.
These are stress ratings only and operation of the device
at these or at any other conditions above those given in the
Characteristics sections of the specification is not implied.
Exposure to limiting values for extended periods may
affect device reliability.
Right to make changes
Philips Semiconductors
reserves the right to make changes in the products -
including circuits, standard cells, and/or software -
described or contained herein in order to improve design
and/or performance. When the product is in full production
(status ‘Production’), relevant changes will be
Application information
Applications that are
communicated via a Customer Product/Process Change
Notification (CPCN). Philips Semiconductors assumes no
responsibility or liability for the use of any of these
products, conveys no licence or title under any patent,
copyright, or mask work right to these products, and
makes no representations or warranties that these
products are free from patent, copyright, or mask work
right infringement, unless otherwise specified.
described herein for any of these products are for
illustrative purposes only. Philips Semiconductors make
no representation or warranty that such applications will be
suitable for the specified use without further testing or
modification.
2004 Feb 10
6
Philips Semiconductors – a worldwide company
Contact information
For additional information please visit http://www.semiconductors.philips.com.
Fax: +31 40 27 24825
For sales offices addresses send e-mail to: sales.addresses@www.semiconductors.philips.com.
© Koninklijke Philips Electronics N.V. 2004
SCA76
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
R77/04/pp7
Date of release: 2004 Feb 10
Document order number: 9397 750 12636
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