BAS28-T [NXP]

DIODE 0.215 A, 85 V, 2 ELEMENT, SILICON, SIGNAL DIODE, PLASTIC PACKAGE-4, Signal Diode;


型号：	BAS28-T
厂家：	NXP
描述：	DIODE 0.215 A, 85 V, 2 ELEMENT, SILICON, SIGNAL DIODE, PLASTIC PACKAGE-4, Signal Diode 光电二极管
文件：	总12页 (文件大小：256K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

BAS28

High-speed double diode

Rev. 3 — 22 July 2010

Product data sheet

1. Product profile

1.1 General description

Two high-speed switching diodes fabricated in planar technology, and encapsulated in a

small SOT143B Surface-Mounted Device (SMD) plastic package. The diodes are not

connected.

1.2 Features and benefits

High switching speed: t_rr≤ 4 ns

Reverse voltage: V_R≤ 75 V

Repetitive peak reverse voltage: V_RRM≤ 85 V

Repetitive peak forward current: I_FRM≤ 500 mA

AEC-Q101 qualified

Small SMD package

1.3 Applications

High-speed switching in e.g. surface-mounted circuits

1.4 Quick reference data

Table 1.

Quick reference data

Parameter

Symbol

Conditions

Min

Typ

Max

Unit

Per diode

[1]

[2]

I_F

forward current

215

μA

I_R

V_R

t_rr

reverse current

V_R= 75 V

reverse voltage

reverse recovery time

[1] Device mounted on an FR4 Printed-Circuit Board (PCB).

[2] When switched from I_F= 10 mA to I_R= 10 mA; R_L= 100 Ω; measured at I_R= 1 mA.

BAS28

NXP Semiconductors

High-speed double diode

2. Pinning information

Table 2.

Pinning

Description

Simplified outline

Graphic symbol

cathode (diode 1)

cathode (diode 2)

anode (diode 2)

anode (diode 1)

006aab100

3. Ordering information

Table 3.

Ordering information

Type number

Package

Name

Description

Version

BAS28

plastic surface-mounted package; 4 leads

SOT143B

4. Marking

Table 4.

Marking codes

Type number

Marking code^[1]

BAS28

JT*

[1] * = -: made in Hong Kong

* = p: made in Hong Kong

* = t: made in Malaysia

* = W: made in China

BAS28

All information provided in this document is subject to legal disclaimers.

Product data sheet

Rev. 3 — 22 July 2010

2 of 12

BAS28

NXP Semiconductors

High-speed double diode

5. Limiting values

Table 5.

Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol

Per diode

V_RRM

Parameter

Conditions

Min

Max

Unit

repetitive peak

reverse voltage

V_R

I_F

reverse voltage

forward current

[1]

[3]

215

500

I_FRM

repetitive peak

forward current

I_FSM

non-repetitive peak

forward current

square wave

t_p= 1 μs

t_p= 1 ms

t_p= 1 s

0.5

Per device

[1][2]

P_tot

T_j

total power dissipation

junction temperature

storage temperature

T_amb= 25 °C

250

°C

150

T_stg

−65

+150

°C

[1] Device mounted on an FR4 PCB.

[2] One diode loaded.

[3] T_j= 25 °C prior to surge.

6. Thermal characteristics

Table 6.

Symbol

Per device; one diode loaded

R_th(j-a)thermal resistance from

Thermal characteristics

Parameter

Conditions

Min

Typ

Max Unit

[1]

in free air

500

360

K/W

junction to ambient

R_th(j-t)

thermal resistance from

junction to tie-point

[1] Device mounted on an FR4 PCB.

BAS28

All information provided in this document is subject to legal disclaimers.

Product data sheet

Rev. 3 — 22 July 2010

3 of 12

BAS28

NXP Semiconductors

High-speed double diode

7. Characteristics

Table 7.

Characteristics

T_amb= 25 °C unless otherwise specified.

Symbol Parameter

Per diode

Conditions

Min

Typ

Max Unit

V_F

forward voltage

I_F= 1 mA

715

855

I_F= 10 mA

I_F= 50 mA

I_F= 150 mA

1.25

I_R

reverse current

V_R= 25 V

μA

V_R= 75 V

V_R= 25 V; T_j= 150 °C

V_R= 75 V; T_j= 150 °C

f = 1 MHz; V_R= 0 V

C_d

t_rr

diode capacitance

1.5

[1]

[2]

reverse recovery time

forward recovery voltage

V_FR

1.75

[1] When switched from I_F= 10 mA to I_R= 10 mA; R_L= 100 Ω; measured at I_R= 1 mA.

[2] When switched from I_F= 10 mA; t_r= 20 ns.

mbg704

mbg382

300

FSM

(A)

)

(mA

(1)

(2)

(3)

200

100

−1

(V)

(μs)

(1) T_j= 150 °C; typical values

(2) T_j= 25 °C; typical values

Based on square wave currents.

T_j= 25 °C; prior to surge

(3) T_j= 25 °C; maximum values

Fig 1. Forward current as a function of forward

voltage

Fig 2. Non-repetitive peak forward current as a

function of pulse duration; maximum values

BAS28

All information provided in this document is subject to legal disclaimers.

Product data sheet

Rev. 3 — 22 July 2010

4 of 12

BAS28

NXP Semiconductors

High-speed double diode

mbg446

mga884

0.8

(pF

)

(nA)

(1)

0.6

0.4

(2)

(3)

0.2

100

200

(V)

T (°C)

V_R= V_Rmax

f = 1 MHz; T_j= 25 °C

(1) V_R= 75 V; maximum values

(2) V_R= 75 V; typical values

(3) V_R= 25 V; typical values

Fig 3. Reverse current as a function of junction

temperature

Fig 4. Diode capacitance as a function of reverse

voltage; typical values

msa562

250

(mA)

200

150

100

150

200

(°C)

amb

Fig 5. Forward current as a function of ambient temperature; derating curve

BAS28

All information provided in this document is subject to legal disclaimers.

Product data sheet

Rev. 3 — 22 July 2010

5 of 12

BAS28

NXP Semiconductors

High-speed double diode

8. Test information

D.U.T.

10 %

+ I

= 50 Ω

SAMPLING

OSCILLOSCOPE

= 50 Ω

V = V + I × R

(1)

90 %

mga881

input signal

output signal

(1) I_R= 1 mA

Fig 6. Reverse recovery time test circuit and waveforms

1 kΩ

450 Ω

90 %

= 50 Ω

OSCILLOSCOPE

= 50 Ω

D.U.T.

10 %

input signal

output signal

mga882

Fig 7. Forward recovery voltage test circuit and waveforms

8.1 Quality information

This product has been qualified in accordance with the Automotive Electronics Council

(AEC) standard Q101 - Stress test qualification for discrete semiconductors, and is

suitable for use in automotive applications.

BAS28

All information provided in this document is subject to legal disclaimers.

Product data sheet

Rev. 3 — 22 July 2010

6 of 12

BAS28

NXP Semiconductors

High-speed double diode

9. Package outline

3.0

2.8

1.1

0.9

1.9

0.45

0.15

2.5 1.4

2.1 1.2

0.88

0.78

0.48

0.38

0.15

0.09

1.7

Dimensions in mm

04-11-16

Fig 8. Package outline BAS28 (SOT143B)

10. Packing information

Table 8.

Packing methods

The indicated -xxx are the last three digits of the 12NC ordering code.^[1]

Type number

Package

Description

Packing quantity

3000

10000

BAS28

SOT143B

4 mm pitch, 8 mm tape and reel

-215

-235

[1] For further information and the availability of packing methods, see Section 14.

BAS28

All information provided in this document is subject to legal disclaimers.

Product data sheet

Rev. 3 — 22 July 2010

7 of 12

BAS28

NXP Semiconductors

High-speed double diode

11. Soldering

3.25

1.9

0.6

(3×)

0.5

(3×)

solder lands

solder resist

0.7 0.6

(3×) (3×)

solder paste

occupied area

0.7 0.6

Dimensions in mm

0.75

0.95

0.9

sot143b_fr

Fig 9. Reflow soldering footprint BAS28 (SOT143B)

4.45

2.2

1.2

(3×)

1.425

(3×)

solder lands

solder resist

2.575

4.6

occupied area

Dimensions in mm

1.425

preferred transport direction during soldering

1.2

sot143b_fw

Fig 10. Wave soldering footprint BAS28 (SOT143B)

BAS28

All information provided in this document is subject to legal disclaimers.

Product data sheet

Rev. 3 — 22 July 2010

8 of 12

BAS28

NXP Semiconductors

High-speed double diode

12. Revision history

Table 9.

Revision history

Document ID

BAS28 v.3

Release date

Data sheet status

Change notice

Supersedes

20100722

Product data sheet

BAS28_2

Modifications:

• The format of this data sheet has been redesigned to comply with the new identity

guidelines of NXP Semiconductors.

• Legal texts have been adapted to the new company name where appropriate.

• Section 1.1 “General description”: amended

• Section 4 “Marking”: updated

• Table 1 “Quick reference data”: added

• Section 8 “Test information”: added

• Figure 8: superseded by minimized package outline drawing

• Section 10 “Packing information”: added

• Section 11 “Soldering”: added

• Section 13 “Legal information”: updated

BAS28_2

BAS28_1

19960910

Product specification

BAS28_1

19960403

Product specification

BAS28

All information provided in this document is subject to legal disclaimers.

Product data sheet

Rev. 3 — 22 July 2010

9 of 12

BAS28

NXP Semiconductors

High-speed double diode

13. Legal information

13.1 Data sheet status

Document status^[1][2]

Product status^[3]

Development

Definition

Objective [short] data sheet

This document contains data from the objective specification for product development.

This document contains data from the preliminary specification.

This document contains the product specification.

Preliminary [short] data sheet Qualification

Product [short] data sheet Production

[1]

[2]

[3]

Please consult the most recently issued document before initiating or completing a design.

The term ‘short data sheet’ is explained in section “Definitions”.

The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status

information is available on the Internet at URL http://www.nxp.com.

malfunction of an NXP Semiconductors product can reasonably be expected

13.2 Definitions

to result in personal injury, death or severe property or environmental

damage. NXP Semiconductors accepts no liability for inclusion and/or use of

NXP Semiconductors products in such equipment or applications and

therefore such inclusion and/or use is at the customer’s own risk.

Draft — The document is a draft version only. The content is still under

internal review and subject to formal approval, which may result in

modifications or additions. NXP Semiconductors does not give any

representations or warranties as to the accuracy or completeness of

information included herein and shall have no liability for the consequences of

use of such information.

Applications — Applications that are described herein for any of these

products are for illustrative purposes only. NXP Semiconductors makes no

representation or warranty that such applications will be suitable for the

specified use without further testing or modification.

Short data sheet — A short data sheet is an extract from a full data sheet

with the same product type number(s) and title. A short data sheet is intended

for quick reference only and should not be relied upon to contain detailed and

full information. For detailed and full information see the relevant full data

sheet, which is available on request via the local NXP Semiconductors sales

office. In case of any inconsistency or conflict with the short data sheet, the

full data sheet shall prevail.

Customers are responsible for the design and operation of their applications

and products using NXP Semiconductors products, and NXP Semiconductors

accepts no liability for any assistance with applications or customer product

design. It is customer’s sole responsibility to determine whether the NXP

Semiconductors product is suitable and fit for the customer’s applications and

products planned, as well as for the planned application and use of

customer’s third party customer(s). Customers should provide appropriate

design and operating safeguards to minimize the risks associated with their

applications and products.

Product specification — The information and data provided in a Product

data sheet shall define the specification of the product as agreed between

NXP Semiconductors and its customer, unless NXP Semiconductors and

customer have explicitly agreed otherwise in writing. In no event however,

shall an agreement be valid in which the NXP Semiconductors product is

deemed to offer functions and qualities beyond those described in the

Product data sheet.

NXP Semiconductors does not accept any liability related to any default,

damage, costs or problem which is based on any weakness or default in the

customer’s applications or products, or the application or use by customer’s

third party customer(s). Customer is responsible for doing all necessary

testing for the customer’s applications and products using NXP

Semiconductors products in order to avoid a default of the applications and

the products or of the application or use by customer’s third party

customer(s). NXP does not accept any liability in this respect.

13.3 Disclaimers

Limiting values — Stress above one or more limiting values (as defined in

the Absolute Maximum Ratings System of IEC 60134) will cause permanent

damage to the device. Limiting values are stress ratings only and (proper)

operation of the device at these or any other conditions above those given in

the Recommended operating conditions section (if present) or the

Characteristics sections of this document is not warranted. Constant or

repeated exposure to limiting values will permanently and irreversibly affect

the quality and reliability of the device.

Limited warranty and liability — Information in this document is believed to

be accurate and reliable. However, NXP Semiconductors does not give any

representations or warranties, expressed or implied, as to the accuracy or

completeness of such information and shall have no liability for the

consequences of use of such information.

In no event shall NXP Semiconductors be liable for any indirect, incidental,

punitive, special or consequential damages (including - without limitation - lost

profits, lost savings, business interruption, costs related to the removal or

replacement of any products or rework charges) whether or not such

damages are based on tort (including negligence), warranty, breach of

contract or any other legal theory.

Terms and conditions of commercial sale — NXP Semiconductors

products are sold subject to the general terms and conditions of commercial

sale, as published at http://www.nxp.com/profile/terms, unless otherwise

agreed in a valid written individual agreement. In case an individual

agreement is concluded only the terms and conditions of the respective

agreement shall apply. NXP Semiconductors hereby expressly objects to

applying the customer’s general terms and conditions with regard to the

purchase of NXP Semiconductors products by customer.

Notwithstanding any damages that customer might incur for any reason

whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards

customer for the products described herein shall be limited in accordance

with the Terms and conditions of commercial sale of NXP Semiconductors.

Right to make changes — NXP Semiconductors reserves the right to make

changes to information published in this document, including without

limitation specifications and product descriptions, at any time and without

notice. This document supersedes and replaces all information supplied prior

to the publication hereof.

No offer to sell or license — Nothing in this document may be interpreted or

construed as an offer to sell products that is open for acceptance or the grant,

conveyance or implication of any license under any copyrights, patents or

other industrial or intellectual property rights.

Export control — This document as well as the item(s) described herein

may be subject to export control regulations. Export might require a prior

authorization from national authorities.

Suitability for use — NXP Semiconductors products are not designed,

authorized or warranted to be suitable for use in life support, life-critical or

safety-critical systems or equipment, nor in applications where failure or

BAS28

All information provided in this document is subject to legal disclaimers.

Product data sheet

Rev. 3 — 22 July 2010

10 of 12

BAS28

NXP Semiconductors

High-speed double diode

Quick reference data — The Quick reference data is an extract of the

product data given in the Limiting values and Characteristics sections of this

document, and as such is not complete, exhaustive or legally binding.

13.4 Trademarks

Notice: All referenced brands, product names, service names and trademarks

are the property of their respective owners.

14. Contact information

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

BAS28

All information provided in this document is subject to legal disclaimers.

Product data sheet

Rev. 3 — 22 July 2010

11 of 12

BAS28

NXP Semiconductors

High-speed double diode

15. Contents

Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1

1.1

1.2

1.3

1.4

General description . . . . . . . . . . . . . . . . . . . . . 1

Features and benefits. . . . . . . . . . . . . . . . . . . . 1

Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

Quick reference data . . . . . . . . . . . . . . . . . . . . 1

Pinning information. . . . . . . . . . . . . . . . . . . . . . 2

Ordering information. . . . . . . . . . . . . . . . . . . . . 2

Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3

Thermal characteristics . . . . . . . . . . . . . . . . . . 3

Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 4

Test information. . . . . . . . . . . . . . . . . . . . . . . . . 6

Quality information . . . . . . . . . . . . . . . . . . . . . . 6

Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 7

Packing information . . . . . . . . . . . . . . . . . . . . . 7

Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Revision history. . . . . . . . . . . . . . . . . . . . . . . . . 9

8.1

Legal information. . . . . . . . . . . . . . . . . . . . . . . 10

Data sheet status . . . . . . . . . . . . . . . . . . . . . . 10

Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 10

Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 11

13.1

13.2

13.3

13.4

Contact information. . . . . . . . . . . . . . . . . . . . . 11

Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

Please be aware that important notices concerning this document and the product(s)

described herein, have been included in section ‘Legal information’.

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

Date of release: 22 July 2010

Document identifier: BAS28

BAS28-T [NXP]

相关型号：

BAS28.215

BAS28/T1

BAS28/T3

BAS281

BAS281-GS08

BAS281-GS18

BAS281GS08

BAS281GS18

BAS281_08

BAS281_10

BAS281_12

BAS281_15