BAS40XY,135 [NXP]
SIGNAL DIODE;BAS40 series;
1PSxxSB4x series
General-purpose Schottky diodes
Rev. 9 — 18 March 2015
Product data sheet
1. Product profile
1.1 General description
General-purpose Schottky diodes in small Surface-Mounted Device (SMD) plastic
packages.
Table 1.
Product overview
Type number
Package
NXP
Configuration
JEITA
1PS70SB40
1PS76SB40
1PS79SB40
BAS40
SOT323
SOD323
SOD523
SOT23
SC-70
single diode
SC-76
single diode
SC-79
single diode
-
single diode
BAS40H
SOD123F
SOD882
SOT323
SOT323
SOT23
-
single diode
BAS40L
-
single diode
BAS40W
SC-70
single diode
1PS70SB44
BAS40-04
BAS40-04W
1PS70SB45
1PS75SB45
BAS40-05
BAS40-05W
1PS70SB46
BAS40-06
BAS40-06W
BAS40-07
BAS40-07V
BAS40-05V
SC-70
dual series
-
dual series
SOT323
SOT323
SOT416
SOT23
SC-70
dual series
SC-70
dual common cathode
dual common cathode
dual common cathode
dual common cathode
dual common anode
dual common anode
dual common anode
dual isolated
SC-75
-
SOT323
SOT323
SOT23
SC-70
SC-70
-
SOT323
SOT143B
SOT666
SOT666
SC-70
-
-
-
dual isolated
quadruple common cathode/
common cathode
1PS88SB48
BAS40XY
SOT363
SOT363
SC-88
SC-88
quadruple common cathode/
common cathode
quadruple; 2 series
BAS40 series; 1PSxxSB4x series
NXP Semiconductors
General-purpose Schottky diodes
1.2 Features and benefits
High switching speed
Low leakage current
Low capacitance
High breakdown voltage
AEC-Q101 qualified
1.3 Applications
Ultra high-speed switching
Voltage clamping
1.4 Quick reference data
Table 2.
Symbol
Per diode
IF
Quick reference data
Parameter
Conditions
Min
Typ
Max
Unit
forward current
forward voltage
reverse voltage
-
-
-
-
-
-
120
380
40
mA
mV
V
[1]
VF
IF = 1 mA
VR
[1] Pulse test: tp 300 s; 0.02.
2. Pinning information
Table 3.
Pin
BAS40H; 1PS76SB40; 1PS79SB40
Pinning
Description
Simplified outline
Symbol
[1]
1
2
cathode
anode
1
2
1
2
sym001
001aab540
BAS40L
[1]
1
2
cathode
anode
1
2
1
2
sym001
Transparent
top view
BAS40; BAS40W; 1PS70SB40
1
2
3
anode
3
3
not connected
cathode
2
n.c.
1
006aaa436
1
2
006aaa144
BAS40_1PSXXSB4X_SER
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© NXP Semiconductors N.V. 2015. All rights reserved.
Product data sheet
Rev. 9 — 18 March 2015
2 of 22
BAS40 series; 1PSxxSB4x series
NXP Semiconductors
General-purpose Schottky diodes
Table 3.
Pin
BAS40-04; BAS40-04W; 1PS70SB44
Pinning …continued
Description
Simplified outline
Symbol
1
2
3
anode (diode 1)
3
3
cathode (diode 2)
cathode (diode 1),
anode (diode 2)
1
2
006aaa437
1
1
1
2
006aaa144
BAS40-05; BAS40-05W; 1PS70SB45; 1PS75SB45
1
2
3
anode (diode 1)
anode (diode 2)
3
3
cathode (diode 1),
cathode (diode 2)
2
1
2
006aaa144
006aaa438
BAS40-06; BAS40-06W; 1PS70SB46
1
2
3
cathode (diode 1)
cathode (diode 2)
3
3
anode (diode 1),
anode (diode 2)
1
2
006aaa439
2
006aaa144
BAS40-07
1
2
3
4
cathode (diode 1)
cathode (diode 2)
anode (diode 2)
anode (diode 1)
4
3
4
3
2
1
2
1
006aaa434
BAS40-07V
1
2
3
4
5
6
anode (diode 1)
not connected
6
5
2
4
3
6
1
5
2
4
3
cathode (diode 2)
anode (diode 2)
not connected
006aaa440
1
cathode (diode 1)
BAS40_1PSXXSB4X_SER
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© NXP Semiconductors N.V. 2015. All rights reserved.
Product data sheet
Rev. 9 — 18 March 2015
3 of 22
BAS40 series; 1PSxxSB4x series
NXP Semiconductors
General-purpose Schottky diodes
Table 3.
Pin
BAS40-05V; 1PS88SB48
Pinning …continued
Description
Simplified outline
Symbol
1
2
3
anode (diode 1)
6
5
2
4
6
1
5
2
4
anode (diode 2)
cathode (diode 3),
cathode (diode 4)
4
5
6
anode (diode 3)
anode (diode 4)
3
1
3
001aab555
006aaa446
cathode (diode 1),
cathode (diode 2)
BAS40XY
1
2
3
anode (diode 1)
6
1
5
2
4
3
6
5
4
cathode (diode 2)
anode (diode 3),
cathode (diode 4)
4
5
6
anode (diode 4)
cathode (diode 3)
1
2
3
cathode (diode 1),
anode (diode 2)
006aaa256
[1] The marking bar indicates the cathode.
BAS40_1PSXXSB4X_SER
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© NXP Semiconductors N.V. 2015. All rights reserved.
Product data sheet
Rev. 9 — 18 March 2015
4 of 22
BAS40 series; 1PSxxSB4x series
NXP Semiconductors
General-purpose Schottky diodes
3. Ordering information
Table 4.
Ordering information
Type number
Package
Name
Description
Version
SOT323
SOD323
SOD523
SOT23
1PS70SB40
1PS76SB40
1PS79SB40
BAS40
SC-70
plastic surface-mounted package; 3 leads
plastic surface-mounted package; 2 leads
plastic surface-mounted package; 2 leads
plastic surface-mounted package; 3 leads
plastic surface-mounted package; 2 leads
SC-76
SC-79
-
-
-
BAS40H
SOD123F
SOD882
BAS40L
leadless ultra small plastic package; 2 terminals;
body 1.0 0.6 0.5 mm
BAS40W
SC-70
SC-70
-
plastic surface-mounted package; 3 leads
plastic surface-mounted package; 3 leads
plastic surface-mounted package; 3 leads
plastic surface-mounted package; 3 leads
plastic surface-mounted package; 3 leads
plastic surface-mounted package; 3 leads
plastic surface-mounted package; 3 leads
plastic surface-mounted package; 3 leads
plastic surface-mounted package; 3 leads
plastic surface-mounted package; 3 leads
plastic surface-mounted package; 3 leads
plastic surface-mounted package; 4 leads
plastic surface-mounted package; 6 leads
plastic surface-mounted package; 6 leads
plastic surface-mounted package; 6 leads
plastic surface-mounted package; 6 leads
SOT323
SOT323
SOT23
1PS70SB44
BAS40-04
BAS40-04W
1PS70SB45
1PS75SB45
BAS40-05
SC-70
SC-70
SC-75
-
SOT323
SOT323
SOT416
SOT23
BAS40-05W
1PS70SB46
BAS40-06
SC-70
SC-70
-
SOT323
SOT323
SOT23
BAS40-06W
BAS40-07
SC-70
-
SOT323
SOT143B
SOT666
SOT666
SOT363
SOT363
BAS40-07V
BAS40-05V
1PS88SB48
BAS40XY
-
-
SC-88
SC-88
BAS40_1PSXXSB4X_SER
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© NXP Semiconductors N.V. 2015. All rights reserved.
Product data sheet
Rev. 9 — 18 March 2015
5 of 22
BAS40 series; 1PSxxSB4x series
NXP Semiconductors
General-purpose Schottky diodes
4. Marking
Table 5.
Marking codes
Type number
1PS70SB40
1PS76SB40
1PS79SB40
BAS40
Marking code[1]
Type number
1PS75SB45
BAS40-05
Marking code[1]
6*3
S4
T
45
45*
65*
6*6
46*
66*
47*
67
BAS40-05W
1PS70SB46
BAS40-06
43*
AJ
BAS40H
BAS40L
S6
63*
6*4
44*
64*
6*5
BAS40-06W
BAS40-07
BAS40W
1PS70SB44
BAS40-04
BAS40-04W
1PS70SB45
BAS40-07V
BAS40-05V
1PS88SB48
BAS40XY
65
8*5
40*
[1] * = -: made in Hong Kong
* = p: made in Hong Kong
* = t: made in Malaysia
* = W: made in China
5. Limiting values
Table 6.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Per diode
VR
Parameter
Conditions
Min
Max
Unit
reverse voltage
forward current
-
-
-
40
V
IF
120
120
mA
mA
IFRM
repetitive peak forward
current
tp 1 s; 0.5
[1]
IFSM
non-repetitive peak forward tp 10 ms
-
200
mA
current
Tj
junction temperature
ambient temperature
storage temperature
-
150
C
C
C
Tamb
Tstg
65
65
+150
+150
[1] Tj = 25 C prior to surge.
BAS40_1PSXXSB4X_SER
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Product data sheet
Rev. 9 — 18 March 2015
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BAS40 series; 1PSxxSB4x series
NXP Semiconductors
General-purpose Schottky diodes
6. Thermal characteristics
Table 7.
Symbol
Per device
Rth(j-a)
Thermal characteristics
Parameter
Conditions
Min
Typ
Max
Unit
[1]
thermal resistance from
junction to ambient
in free air
SOT23
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
500
500
416
833
225
416
330
450
450
500
625
K/W
K/W
K/W
K/W
K/W
K/W
K/W
K/W
K/W
K/W
K/W
SOT143B
SOT363 (1PS88SB48)
SOT416
[2]
[2]
[2]
SOT666 (BAS40-05V)
SOT666 (BAS40-07V)
SOD123F
SOD323
[2]
[2]
SOD523
SOD882
SOT323
Rth(j-sp)
thermal resistance from
junction to solder point
[3]
SOT363 (BAS40XY)
-
-
260
K/W
[1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.
[2] Reflow soldering is the only recommended soldering method.
[3] Soldering point at pins 2, 3, 5 and 6.
7. Characteristics
Table 8.
Characteristics
Tamb = 25 C unless otherwise specified.
Symbol Parameter
Per diode
Conditions
Min
Typ
Max Unit
[1]
VF
forward voltage
IF = 1 mA
-
-
-
-
-
-
-
-
-
-
-
-
380
500
1
mV
mV
V
IF = 10 mA
IF = 40 mA
VR = 30 V
IR
reverse current
1
A
A
pF
VR = 40 V
10
5
Cd
diode capacitance
VR = 0 V; f = 1 MHz
[1] Pulse test: tp 300 s; 0.02.
BAS40_1PSXXSB4X_SER
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© NXP Semiconductors N.V. 2015. All rights reserved.
Product data sheet
Rev. 9 — 18 March 2015
7 of 22
BAS40 series; 1PSxxSB4x series
NXP Semiconductors
General-purpose Schottky diodes
mlc362
mlc361
2
3
10
10
I
R
I
F
(μA)
(mA)
(1)
(2)
2
10
10
10
1
(1) (2) (3)
(4)
1
−1
10
−1
10
(3)
−2
−2
10
10
0
0.2
0.4
0.6
0.8
1
0
10
20
30
40
V
(V)
V
(V)
F
R
(1) Tamb = 125 C
(2) Tamb = 85 C
(3) Tamb = 25 C
(1) Tamb = 125 C
(2) Tamb = 85 C
(3) Tamb = 25 C
(4)
Tamb = 40 C
Fig 1. Forward current as a function of forward
voltage; typical values
Fig 2. Reverse current as a function of reverse
voltage; typical values
mlc363
mlc364
3
10
5
C
d
(pF)
r
dif
(Ω)
4
2
10
3
2
1
0
10
1
10
−1
2
0
10
20
30
40
1
10
10
V
(V)
I
(mA)
F
R
f = 10 kHz
Tamb = 25 C; f = 1 MHz
Fig 3. Differential resistance as a function of forward
current; typical values
Fig 4. Diode capacitance as a function of reverse
voltage; typical values
BAS40_1PSXXSB4X_SER
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Product data sheet
Rev. 9 — 18 March 2015
8 of 22
BAS40 series; 1PSxxSB4x series
NXP Semiconductors
General-purpose Schottky diodes
8. Test information
8.1 Quality information
This product has been qualified in accordance with the Automotive Electronics Council
(AEC) standard Q101 - Stress test qualification for discrete semiconductors, and is
suitable for use in automotive applications.
9. Package outline
0.85
0.75
0.65
0.58
1.35
1.15
1.1
0.8
0.45
0.15
1
1
1.65 1.25
1.55 1.15
2.7 1.8
2.3 1.6
2
2
0.40
0.25
0.25
0.10
0.34
0.26
0.17
0.11
Dimensions in mm
03-12-17
Dimensions in mm
02-12-13
Fig 5. Package outline SOD323 (SC-76)
Fig 6. Package outline SOD523 (SC-79)
1.7
1.5
1.2
1.0
3.0
2.8
1.1
0.9
1
3
0.55
0.35
0.45
0.15
2.5 1.4
2.1 1.2
3.6 2.7
3.4 2.5
1
2
2
0.48
0.38
0.15
0.09
0.70
0.55
0.25
0.10
1.9
Dimensions in mm
04-11-04
Dimensions in mm
04-11-29
Fig 7. Package outline SOT23 (TO-236AB)
Fig 8. Package outline SOD123F
BAS40_1PSXXSB4X_SER
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© NXP Semiconductors N.V. 2015. All rights reserved.
Product data sheet
Rev. 9 — 18 March 2015
9 of 22
BAS40 series; 1PSxxSB4x series
NXP Semiconductors
General-purpose Schottky diodes
2.2
1.8
1.1
0.8
0.50
0.46
0.62
0.55
0.45
0.15
3
2
1
0.30
0.22
2.2 1.35
2.0 1.15
1.02
0.95
0.65
0.30
0.22
1
2
0.4
0.3
0.25
0.10
0.55
0.47
cathode marking on top side (if applicable)
03-04-17
1.3
Dimensions in mm
Dimensions in mm
04-11-04
Fig 9. Package outline SOD882
Fig 10. Package outline SOT323 (SC-70)
3.0
2.8
2.2
1.8
1.1
0.8
1.1
0.9
1.9
0.45
0.15
6
5
4
4
3
0.45
0.15
2.5 1.4
2.1 1.2
2.2 1.35
2.0 1.15
pin 1
index
1
2
1
2
3
0.88
0.78
0.48
0.38
0.15
0.09
0.25
0.10
0.3
0.2
0.65
1.7
1.3
Dimensions in mm
14-10-03
Dimensions in mm
04-11-16
Fig 11. Package outline SOT143B
Fig 12. Package outline SOT363 (SC-88)
1.7
1.5
0.6
0.5
1.8
1.4
0.95
0.60
6
5
4
3
0.45
0.15
0.3
0.1
1.75 0.9
1.45 0.7
1.7 1.3
1.5 1.1
pin 1 index
1
2
1
2
3
0.30
0.15
0.25
0.10
0.18
0.08
0.27
0.17
0.5
1
1
Dimensions in mm
04-11-04
Dimensions in mm
04-11-08
Fig 13. Package outline SOT416 (SC-75)
Fig 14. Package outline SOT666
BAS40_1PSXXSB4X_SER
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Product data sheet
Rev. 9 — 18 March 2015
10 of 22
BAS40 series; 1PSxxSB4x series
NXP Semiconductors
General-purpose Schottky diodes
10. Packing information
Table 9.
Packing methods
The indicated -xxx are the last three digits of the 12NC ordering code.[1]
Type number Package Description
Packing quantity
3000 4000 8000 10000
1PS70SB40
1PS76SB40
1PS79SB40
SOT323
SOD323
SOD523
4 mm pitch, 8 mm tape and reel
4 mm pitch, 8 mm tape and reel
2 mm pitch, 8 mm tape and reel
4 mm pitch, 8 mm tape and reel
4 mm pitch, 8 mm tape and reel
-115
-115
-
-
-
-135
-135
-
-
-
-
-315
-115
-215
-115
-
-
-
-135
-235
-135
-315
-135
-135
-235
-135
-135
-135
-235
-135
-135
-235
-135
-235
-
BAS40
SOT23
-
-
BAS40H
SOD123F 4 mm pitch, 8 mm tape and reel
-
-
BAS40L
SOD882
SOT323
SOT323
SOT23
2 mm pitch, 8 mm tape and reel
4 mm pitch, 8 mm tape and reel
4 mm pitch, 8 mm tape and reel
4 mm pitch, 8 mm tape and reel
4 mm pitch, 8 mm tape and reel
4 mm pitch, 8 mm tape and reel
4 mm pitch, 8 mm tape and reel
4 mm pitch, 8 mm tape and reel
4 mm pitch, 8 mm tape and reel
4 mm pitch, 8 mm tape and reel
4 mm pitch, 8 mm tape and reel
4 mm pitch, 8 mm tape and reel
-
-
BAS40W
-115
-115
-215
-115
-115
-115
-215
-115
-115
-215
-115
-215
-
-
-
1PS70SB44
BAS40-04
BAS40-04W
1PS70SB45
1PS75SB45
BAS40-05
BAS40-05W
1PS70SB46
BAS40-06
BAS40-06W
BAS40-07
BAS40-07V
-
-
-
-
SOT323
SOT323
SOT416
SOT23
-
-
-
-
-
-
-
-
SOT323
SOT323
SOT23
-
-
-
-
-
-
SOT323
-
-
SOT143B 4 mm pitch, 8 mm tape and reel
-
-
SOT666
SOT666
SOT363
SOT363
2 mm pitch, 8 mm tape and reel
4 mm pitch, 8 mm tape and reel
2 mm pitch, 8 mm tape and reel
4 mm pitch, 8 mm tape and reel
4 mm pitch, 8 mm tape and reel; T1
4 mm pitch, 8 mm tape and reel; T2
4 mm pitch, 8 mm tape and reel; T1
4 mm pitch, 8 mm tape and reel; T2
-
-315
-
-115
-
-
BAS40-05V
1PS88SB48
BAS40XY
-
-
-315
-
-
-115
-
-
-
-
-
-
[2]
[3]
[2]
[3]
-115
-125
-115
-125
-
-
-
-
-135
-165
-135
-165
[1] For further information and the availability of packing methods, see Section 14.
[2] T1: normal taping
[3] T2: reverse taping
BAS40_1PSXXSB4X_SER
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© NXP Semiconductors N.V. 2015. All rights reserved.
Product data sheet
Rev. 9 — 18 March 2015
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BAS40 series; 1PSxxSB4x series
NXP Semiconductors
General-purpose Schottky diodes
11. Soldering
3.05
2.80
2.10
1.60
solder lands
solder resist
1.65 0.95
0.50 0.60
occupied area
solder paste
0.50
(2×)
msa433
Dimensions in mm
Fig 15. Reflow soldering footprint SOD323 (SC-76)
5.00
4.40
1.40
solder lands
solder resist
occupied area
2.75 1.20
msa415
preferred transport direction during soldering
Dimensions in mm
Fig 16. Wave soldering footprint SOD323 (SC-76)
2.15
0.50 0.60
1.20
solder lands
solder paste
solder resist
occupied area
0.30
0.40
1.80
1.90
mgs343
Reflow soldering is the only recommended soldering method.
Dimensions in mm
Fig 17. Reflow soldering footprint SOD523 (SC-79)
BAS40_1PSXXSB4X_SER
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Product data sheet
Rev. 9 — 18 March 2015
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BAS40 series; 1PSxxSB4x series
NXP Semiconductors
General-purpose Schottky diodes
2.90
2.50
solder lands
solder resist
2
1
0.85
0.85
occupied area
solder paste
2.70
3.00
1.30
3
0.60
(3x)
0.50 (3x)
0.60 (3x)
1.00
3.30
MSA439
Dimensions in mm
Fig 18. Reflow soldering footprint SOT23 (TO-236AB)
3.40
1.20 (2x)
solder lands
solder resist
occupied area
2
1
4.60 4.00 1.20
3
preferred transport direction during soldering
2.80
4.50
MSA427
Dimensions in mm
Fig 19. Wave soldering footprint SOT23 (TO-236AB)
BAS40_1PSXXSB4X_SER
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© NXP Semiconductors N.V. 2015. All rights reserved.
Product data sheet
Rev. 9 — 18 March 2015
13 of 22
BAS40 series; 1PSxxSB4x series
NXP Semiconductors
General-purpose Schottky diodes
4.4
4
2.9
1.6
solder lands
solder resist
2.1 1.6
1.1 1.2
solder paste
occupied area
1.1
(2×)
Reflow soldering is the only recommended soldering method.
Dimensions in mm
Fig 20. Reflow soldering footprint SOD123F
1.30
0.30
R = 0.05 (8×)
R = 0.05 (8×)
0.60 0.70 0.80
(2×) (2×) (2×)
0.90
0.30
(2×)
0.40
(2×)
0.50
(2×)
solder lands
solder paste
solder resist
occupied area
mbl872
Reflow soldering is the only recommended soldering method.
Dimensions in mm
Fig 21. Reflow soldering footprint SOD882
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Product data sheet
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BAS40 series; 1PSxxSB4x series
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General-purpose Schottky diodes
2.65
0.75
1.30
1.325
solder lands
solder paste
2
0.50
3
0.60
(3×)
2.35 0.85
1.90
(3×)
solder resist
occupied area
Dimensions in mm
1
0.55
(3×)
msa429
2.40
Fig 22. Reflow soldering footprint SOT323 (SC-70)
4.60
4.00
1.15
2
3
3.65 2.10
2.70
solder lands
0.90
(2×)
solder resist
1
occupied area
Dimensions in mm
msa419
preferred transport direction during soldering
Fig 23. Wave soldering footprint SOT323 (SC-70)
BAS40_1PSXXSB4X_SER
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Product data sheet
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BAS40 series; 1PSxxSB4x series
NXP Semiconductors
General-purpose Schottky diodes
3.25
0.60 (3x)
0.50 (3x)
solder lands
0.60
(4x)
solder resist
occupied area
solder paste
4
3
2
2.70
1.30 3.00
1
msa441
0.90
1.00
2.50
Dimensions in mm
Fig 24. Reflow soldering footprint SOT143B
4.45
1.20 (3×)
4
3
1.15 4.00 4.60
solder lands
solder resist
occupied area
1
2
Dimensions in mm
1.00
preferred transport direction during soldering
3.40
msa422
Fig 25. Wave soldering footprint SOT143B
BAS40_1PSXXSB4X_SER
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Product data sheet
Rev. 9 — 18 March 2015
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BAS40 series; 1PSxxSB4x series
NXP Semiconductors
General-purpose Schottky diodes
2.65
solder lands
0.4 (2×)
1.5
2.35
0.6
0.5
solder resist
(4×)
(4×)
solder paste
0.5
(4×)
0.6
(2×)
occupied area
0.6
(4×)
Dimensions in mm
1.8
sot363_fr
Fig 26. Reflow soldering footprint SOT363 (SC-88)
1.5
solder lands
solder resist
occupied area
2.5
0.3
4.5
1.5
Dimensions in mm
preferred transport
direction during soldering
1.3
1.3
2.45
5.3
sot363_fw
Fig 27. Wave soldering footprint SOT363 (SC-88)
BAS40_1PSXXSB4X_SER
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Product data sheet
Rev. 9 — 18 March 2015
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BAS40 series; 1PSxxSB4x series
NXP Semiconductors
General-purpose Schottky diodes
2.2
0.6
1.1
0.7
2
3
2.0 0.85
1.5
0.5
(3x)
1
0.6
(3x)
msa438
1.9
Dimensions in mm
solder lands
solder resist
solder paste
occupied area
Fig 28. Reflow soldering footprint SOT416
2.75
2.45
2.1
1.6
solder lands
0.4
(6×)
0.3
(2×)
0.25
(2×)
placement area
0.538
0.55
1.075
1.7
2
(2×)
solder paste
occupied area
0.325 0.375
(4×) (4×)
Dimensions in mm
1.7
0.45
0.6
(4×)
(2×)
0.5
0.65
(4×)
(2×)
sot666_fr
Reflow soldering is the only recommended soldering method.
Fig 29. Reflow soldering footprint SOT666
BAS40_1PSXXSB4X_SER
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Product data sheet
Rev. 9 — 18 March 2015
18 of 22
BAS40 series; 1PSxxSB4x series
NXP Semiconductors
General-purpose Schottky diodes
12. Revision history
Table 10. Revision history
Document ID
Release date
20150318
Data sheet status
Change notice Supersedes
- BAS40_1PSXXSB4X_SER_8
BAS40_1PSXXSB4X_SER
v.9
Product data sheet
Modifications:
• The format of this data sheet has been redesigned to comply with the new identity
guidelines of NXP Semiconductors.
• Legal texts have been adapted to the new company name where appropriate.
BAS40_1PSXXSB4X_SER_8 20100113
BAS40_1PSXXSB4X_SER_7 20060512
BAS40_1PSXXSB4X_SER_6 20050809
Product data sheet
Product data sheet
Product data sheet
-
-
-
BAS40_1PSXXSB4X_SER_7
BAS40_1PSXXSB4X_SER_6
1PS70SB40_3
1PS75SB45_2
1PS76SB40_3
1PS79SB40_2
1PS88SB48_3 BAS40H_1
BAS40L_1 BAS40-05V_1
BAS40-07V_1 BAS40W_3
BAS40_SERIES_5
1PS70SB40_3
1PS75SB45_2
1PS76SB40_3
1PS79SB40_2
1PS88SB48_3
BAS40H_1
19990426
19990426
20040126
19990426
20021107
20050425
20030520
20021121
20020327
19990426
20011010
Product specification
Product specification
Product specification
Product specification
Product specification
Product data sheet
Product specification
Product specification
Product specification
Product specification
Product specification
-
-
-
-
-
-
-
-
-
-
-
1PS70SB40_2
1PS75SB45_1
1PS76SB40_2
1PS79SB40_1
1PS88SB48_2
-
BAS40L_1
-
BAS40-05V_1
BAS40-07V_1
BAS40W_3
-
-
BAS40W_2
BAS40_4
BAS40_SERIES_5
BAS40_1PSXXSB4X_SER
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Product data sheet
Rev. 9 — 18 March 2015
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BAS40 series; 1PSxxSB4x series
NXP Semiconductors
General-purpose Schottky diodes
13. Legal information
13.1 Data sheet status
Document status[1][2]
Product status[3]
Development
Definition
Objective [short] data sheet
This document contains data from the objective specification for product development.
This document contains data from the preliminary specification.
This document contains the product specification.
Preliminary [short] data sheet Qualification
Product [short] data sheet Production
[1]
[2]
[3]
Please consult the most recently issued document before initiating or completing a design.
The term ‘short data sheet’ is explained in section “Definitions”.
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
Suitability for use in automotive applications — This NXP
13.2 Definitions
Semiconductors product has been qualified for use in automotive
applications. Unless otherwise agreed in writing, the product is not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer's own
risk.
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
13.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
BAS40_1PSXXSB4X_SER
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Product data sheet
Rev. 9 — 18 March 2015
20 of 22
BAS40 series; 1PSxxSB4x series
NXP Semiconductors
General-purpose Schottky diodes
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Translations — A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
13.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
14. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
BAS40_1PSXXSB4X_SER
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Product data sheet
Rev. 9 — 18 March 2015
21 of 22
BAS40 series; 1PSxxSB4x series
NXP Semiconductors
General-purpose Schottky diodes
15. Contents
1
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
General description . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits. . . . . . . . . . . . . . . . . . . . 2
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Quick reference data . . . . . . . . . . . . . . . . . . . . 2
1.1
1.2
1.3
1.4
2
Pinning information. . . . . . . . . . . . . . . . . . . . . . 2
Ordering information. . . . . . . . . . . . . . . . . . . . . 5
Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 6
Thermal characteristics . . . . . . . . . . . . . . . . . . 7
Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 7
Test information. . . . . . . . . . . . . . . . . . . . . . . . . 9
Quality information . . . . . . . . . . . . . . . . . . . . . . 9
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9
Packing information . . . . . . . . . . . . . . . . . . . . 11
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Revision history. . . . . . . . . . . . . . . . . . . . . . . . 19
3
4
5
6
7
8
8.1
9
10
11
12
13
Legal information. . . . . . . . . . . . . . . . . . . . . . . 20
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 20
Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 21
13.1
13.2
13.3
13.4
14
15
Contact information. . . . . . . . . . . . . . . . . . . . . 21
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP Semiconductors N.V. 2015.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 18 March 2015
Document identifier: BAS40_1PSXXSB4X_SER
相关型号:
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