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BAS70-07,215 [NXP]

BAS70 series; 1PS7xSB70 series - General-purpose Schottky diodes SOT-143 4-Pin;
BAS70-07,215
型号： BAS70-07,215
厂家： NXP    NXP
描述：

BAS70 series; 1PS7xSB70 series - General-purpose Schottky diodes SOT-143 4-Pin

测试 光电二极管
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中文：  中文翻译
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BAS70 series;  
1PS7xSB70 series  
General-purpose Schottky diodes  
Rev. 09 — 13 January 2010  
Product data sheet  
1. Product profile  
1.1 General description  
General-purpose Schottky diodes in small Surface-Mounted Device (SMD) plastic  
packages.  
Table 1.  
Product overview  
Type number  
Package  
NXP  
Configuration  
JEITA  
1PS76SB70  
1PS79SB70  
BAS70  
SOD323  
SOD523  
SOT23  
SC-76  
single diode  
SC-79  
single diode  
-
single diode  
BAS70H  
SOD123F  
SOD882  
SOT323  
SOT23  
-
single diode  
BAS70L  
-
single diode  
BAS70W  
SC-70  
single diode  
BAS70-04  
BAS70-04W  
BAS70-05  
BAS70-05W  
BAS70-06  
BAS70-06W  
BAS70-07  
BAS70-07S  
BAS70-07V  
BAS70VV  
BAS70XY  
-
dual series  
SOT323  
SOT23  
SC-70  
dual series  
-
dual common cathode  
dual common cathode  
dual common anode  
dual common anode  
dual isolated  
SOT323  
SOT23  
SC-70  
-
SOT323  
SOT143B  
SOT363  
SOT666  
SOT666  
SOT363  
SC-70  
-
SC-88  
dual isolated  
-
dual isolated  
-
triple isolated  
SC-88  
quadruple; 2 series  
1.2 Features  
„ High switching speed  
„ High breakdown voltage  
„ Low leakage current  
„ Low capacitance  
1.3 Applications  
„ Ultra high-speed switching  
„ Voltage clamping  
 
 
 
 
BAS70 series; 1PS7xSB70 series  
NXP Semiconductors  
General-purpose Schottky diodes  
1.4 Quick reference data  
Table 2.  
Quick reference data  
Symbol  
Parameter  
Conditions  
Min  
Typ  
Max  
Unit  
Per diode  
IF  
forward current  
forward voltage  
reverse voltage  
-
-
-
-
-
-
70  
mA  
mV  
V
[1]  
VF  
VR  
IF = 1 mA  
410  
70  
[1] Pulse test: tp ≤ 300 μs; δ ≤ 0.02.  
2. Pinning information  
Table 3.  
Pin  
BAS70H; 1PS76SB70; 1PS79SB70  
Pinning  
Description  
Simplified outline  
Symbol  
[1]  
1
2
cathode  
anode  
1
2
1
2
sym001  
001aab540  
BAS70L  
[1]  
1
2
cathode  
anode  
1
2
1
2
sym001  
Transparent  
top view  
BAS70; BAS70W  
1
2
3
anode  
3
3
not connected  
cathode  
2
n.c.  
1
006aaa436  
1
2
006aaa144  
BAS70-04; BAS70-04W  
1
2
3
anode (diode 1)  
3
3
cathode (diode 2)  
cathode (diode 1),  
anode (diode 2)  
1
2
006aaa437  
1
2
006aaa144  
BAS70_1PS7XSB70_SER_9  
© NXP B.V. 2010. All rights reserved.  
Product data sheet  
Rev. 09 — 13 January 2010  
2 of 20  
 
 
 
BAS70 series; 1PS7xSB70 series  
NXP Semiconductors  
General-purpose Schottky diodes  
Table 3.  
Pin  
BAS70-05; BAS70-05W  
Pinning …continued  
Description  
Simplified outline  
Symbol  
1
2
3
anode (diode 1)  
3
3
anode (diode 2)  
cathode (diode 1),  
cathode (diode 2)  
1
2
006aaa438  
1
2
006aaa144  
BAS70-06; BAS70-06W  
1
2
3
cathode (diode 1)  
3
3
cathode (diode 2)  
anode (diode 1),  
anode (diode 2)  
1
2
006aaa439  
1
2
006aaa144  
BAS70-07  
1
2
3
4
cathode (diode 1)  
cathode (diode 2)  
anode (diode 2)  
anode (diode 1)  
4
3
4
3
2
1
2
1
006aaa434  
BAS70-07S; BAS70-07V  
1
2
3
4
5
6
anode (diode 1)  
6
1
5
2
4
3
6
1
5
4
not connected  
cathode (diode 2)  
anode (diode 2)  
not connected  
006aaa440  
2
5
3
cathode (diode 1)  
001aab555  
BAS70VV  
1
2
3
4
5
6
anode (diode 1)  
anode (diode 2)  
anode (diode 3)  
cathode (diode 3)  
cathode (diode 2)  
cathode (diode 1)  
6
1
5
4
6
4
3
2
3
sym046  
1
2
BAS70_1PS7XSB70_SER_9  
© NXP B.V. 2010. All rights reserved.  
Product data sheet  
Rev. 09 — 13 January 2010  
3 of 20  
BAS70 series; 1PS7xSB70 series  
NXP Semiconductors  
General-purpose Schottky diodes  
Table 3.  
Pinning …continued  
Pin  
Description  
Simplified outline  
Symbol  
BAS70XY  
1
2
3
anode (diode 1)  
6
1
5
2
4
3
6
5
4
cathode (diode 2)  
anode (diode 3),  
cathode (diode 4)  
4
5
6
anode (diode 4)  
cathode (diode 3)  
1
2
3
cathode (diode 1),  
anode (diode 2)  
006aaa256  
[1] The marking bar indicates the cathode.  
3. Ordering information  
Table 4.  
Ordering information  
Type number  
Package  
Name  
Description  
Version  
SOD323  
SOD523  
SOT23  
1PS76SB70  
1PS79SB70  
BAS70  
SC-76  
plastic surface-mounted package; 2 leads  
plastic surface-mounted package; 2 leads  
plastic surface-mounted package; 3 leads  
plastic surface-mounted package; 2 leads  
SC-79  
-
-
-
BAS70H  
SOD123F  
SOD882  
BAS70L  
leadless ultra small plastic package; 2 terminals;  
body 1.0 × 0.6 × 0.5 mm  
BAS70W  
SC-70  
plastic surface-mounted package; 3 leads  
plastic surface-mounted package; 3 leads  
plastic surface-mounted package; 3 leads  
plastic surface-mounted package; 3 leads  
plastic surface-mounted package; 3 leads  
plastic surface-mounted package; 3 leads  
plastic surface-mounted package; 3 leads  
plastic surface-mounted package; 4 leads  
plastic surface-mounted package; 6 leads  
plastic surface-mounted package; 6 leads  
plastic surface-mounted package; 6 leads  
plastic surface-mounted package; 6 leads  
SOT323  
SOT23  
BAS70-04  
BAS70-04W  
BAS70-05  
BAS70-05W  
BAS70-06  
BAS70-06W  
BAS70-07  
BAS70-07S  
BAS70-07V  
BAS70VV  
BAS70XY  
-
SC-70  
SOT323  
SOT23  
-
SC-70  
SOT323  
SOT23  
-
SC-70  
SOT323  
SOT143B  
SOT363  
SOT666  
SOT666  
SOT363  
-
SC-88  
-
-
SC-88  
BAS70_1PS7XSB70_SER_9  
© NXP B.V. 2010. All rights reserved.  
Product data sheet  
Rev. 09 — 13 January 2010  
4 of 20  
 
BAS70 series; 1PS7xSB70 series  
NXP Semiconductors  
General-purpose Schottky diodes  
4. Marking  
Table 5.  
Marking codes  
Type number  
1PS76SB70  
1PS79SB70  
BAS70  
Marking code[1]  
Type number  
BAS70-05W  
BAS70-06  
BAS70-06W  
BAS70-07  
BAS70-07S  
BAS70-07V  
BAS70VV  
BAS70XY  
-
Marking code[1]  
S2  
G
75*  
76*  
76*  
77*  
77*  
77  
73*  
AH  
S8  
BAS70H  
BAS70L  
BAS70W  
73*  
74*  
74*  
75*  
BAS70-04  
BAS70-04W  
BAS70-05  
N1  
70*  
-
[1] * = -: made in Hong Kong  
* = p: made in Hong Kong  
* = t: made in Malaysia  
* = W: made in China  
5. Limiting values  
Table 6.  
Limiting values  
In accordance with the Absolute Maximum Rating System (IEC 60134).  
Symbol  
Per diode  
VR  
Parameter  
Conditions  
Min  
Max  
Unit  
reverse voltage  
forward current  
-
-
-
70  
70  
70  
V
IF  
mA  
mA  
IFRM  
repetitive peak forward  
current  
tp ≤ 1 s; δ ≤ 0.5  
[1]  
IFSM  
non-repetitive peak forward tp ≤ 10 ms  
-
100  
mA  
current  
Tj  
junction temperature  
ambient temperature  
storage temperature  
-
150  
°C  
°C  
°C  
Tamb  
Tstg  
−65  
−65  
+150  
+150  
[1] Tj = 25 °C prior to surge.  
BAS70_1PS7XSB70_SER_9  
© NXP B.V. 2010. All rights reserved.  
Product data sheet  
Rev. 09 — 13 January 2010  
5 of 20  
 
 
 
 
BAS70 series; 1PS7xSB70 series  
NXP Semiconductors  
General-purpose Schottky diodes  
6. Thermal characteristics  
Table 7.  
Thermal characteristics  
Symbol Parameter  
Per device  
Conditions  
Min  
Typ  
Max  
Unit  
[1]  
Rth(j-a)  
thermal resistance from  
in free air  
junction to ambient  
SOT23  
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
500  
500  
416  
700  
416  
330  
450  
450  
500  
625  
K/W  
K/W  
K/W  
K/W  
K/W  
K/W  
K/W  
K/W  
K/W  
K/W  
SOT143B  
SOT363 (BAS70-07S)  
SOT666 (BAS70VV)  
SOT666 (BAS70-07V)  
SOD123F  
[2]  
[2]  
[2]  
SOD323  
[2]  
[2]  
SOD523  
SOD882  
SOT323  
Rth(j-sp)  
thermal resistance from  
junction to solder point  
[3]  
SOT363 (BAS70XY)  
-
-
260  
K/W  
[1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard  
footprint.  
[2] Reflow soldering is the only recommended soldering method.  
[3] Soldering point at pins 2, 3, 5 and 6.  
7. Characteristics  
Table 8.  
Characteristics  
Tamb = 25 °C unless otherwise specified.  
Symbol Parameter  
Per diode  
Conditions  
Min  
Typ  
Max  
Unit  
[1]  
VF  
forward voltage  
IF = 1 mA  
-
-
-
-
-
-
-
-
-
-
-
-
410  
750  
1
mV  
mV  
V
IF = 10 mA  
IF = 15 mA  
VR = 50 V  
IR  
reverse current  
100  
10  
2
nA  
μA  
pF  
VR = 70 V  
Cd  
diode capacitance  
VR = 0 V; f = 1 MHz  
[1] Pulse test: tp ≤ 300 μs; δ ≤ 0.02.  
BAS70_1PS7XSB70_SER_9  
© NXP B.V. 2010. All rights reserved.  
Product data sheet  
Rev. 09 — 13 January 2010  
6 of 20  
 
 
 
 
 
 
BAS70 series; 1PS7xSB70 series  
NXP Semiconductors  
General-purpose Schottky diodes  
mra803  
mra805  
2
2
10  
10  
I
(1)  
(2)  
R
I
F
(μA)  
(mA)  
10  
10  
1
1
−1  
10  
−1  
10  
−2  
10  
10  
(3)  
(1)  
(2) (3) (4)  
−2  
−3  
10  
0
0.2  
0.4  
0.6  
0.8  
1
0
20  
40  
60  
80  
V
F
(V)  
V (V)  
R
(1) Tamb = 125 °C  
(2) Tamb = 85 °C  
(3) Tamb = 25 °C  
(4) Tamb = −40 °C  
(1) Tamb = 125 °C  
(2) Tamb = 85 °C  
(3) Tamb = 25 °C  
Fig 1. Forward current as a function of forward  
voltage; typical values  
Fig 2. Reverse current as a function of reverse  
voltage; typical values  
mra802  
mra804  
3
10  
2
C
d
r
(Ω)  
(pF)  
dif  
1.5  
2
10  
1
0.5  
0
10  
1
10  
−1  
2
1
10  
10  
0
20  
40  
60  
80  
I
F
(mA)  
V
R
(V)  
f = 10 kHz  
Tamb = 25 °C; f = 1 MHz  
Fig 3. Differential forward resistance as a function of  
forward current; typical values  
Fig 4. Diode capacitance as a function of reverse  
voltage; typical values  
BAS70_1PS7XSB70_SER_9  
© NXP B.V. 2010. All rights reserved.  
Product data sheet  
Rev. 09 — 13 January 2010  
7 of 20  
BAS70 series; 1PS7xSB70 series  
NXP Semiconductors  
General-purpose Schottky diodes  
8. Package outline  
0.85  
0.75  
0.65  
0.58  
1.35  
1.15  
1.1  
0.8  
0.45  
0.15  
1
1
1.65 1.25  
1.55 1.15  
2.7 1.8  
2.3 1.6  
2
2
0.40  
0.25  
0.25  
0.10  
0.34  
0.26  
0.17  
0.11  
Dimensions in mm  
03-12-17  
Dimensions in mm  
02-12-13  
04-11-29  
04-11-04  
Fig 5. Package outline SOD323 (SC-76)  
Fig 6. Package outline SOD523 (SC-79)  
1.7  
1.5  
1.2  
1.0  
3.0  
2.8  
1.1  
0.9  
1
3
0.55  
0.35  
0.45  
0.15  
2.5 1.4  
2.1 1.2  
3.6 2.7  
3.4 2.5  
1
2
2
0.48  
0.38  
0.15  
0.09  
0.70  
0.55  
0.25  
0.10  
1.9  
Dimensions in mm  
04-11-04  
Dimensions in mm  
Fig 7. Package outline SOT23 (TO-236AB)  
Fig 8. Package outline SOD123F  
2.2  
1.8  
1.1  
0.50  
0.46  
0.62  
0.55  
0.8  
0.45  
0.15  
3
2
1
0.30  
0.22  
2.2 1.35  
2.0 1.15  
1.02  
0.95  
0.65  
0.30  
0.22  
1
2
0.4  
0.3  
0.25  
0.10  
0.55  
0.47  
cathode marking on top side  
1.3  
Dimensions in mm  
03-04-17  
Dimensions in mm  
Fig 9. Package outline SOD882  
Fig 10. Package outline SOT323 (SC-70)  
BAS70_1PS7XSB70_SER_9  
© NXP B.V. 2010. All rights reserved.  
Product data sheet  
Rev. 09 — 13 January 2010  
8 of 20  
 
BAS70 series; 1PS7xSB70 series  
NXP Semiconductors  
General-purpose Schottky diodes  
3.0  
2.8  
2.2  
1.8  
1.1  
0.8  
1.1  
0.9  
1.9  
0.45  
0.15  
6
5
4
4
3
0.45  
0.15  
2.2 1.35  
2.0 1.15  
2.5 1.4  
2.1 1.2  
pin 1  
index  
1
2
1
2
3
0.88  
0.78  
0.48  
0.38  
0.15  
0.09  
0.25  
0.10  
0.3  
0.2  
0.65  
1.3  
1.7  
Dimensions in mm  
06-03-16  
Dimensions in mm  
04-11-16  
Fig 11. Package outline SOT143B  
Fig 12. Package outline SOT363 (SC-88)  
1.7  
1.5  
0.6  
0.5  
6
5
4
0.3  
0.1  
1.7 1.3  
1.5 1.1  
pin 1 index  
1
2
3
0.18  
0.08  
0.27  
0.17  
0.5  
1
Dimensions in mm  
04-11-08  
Fig 13. Package outline SOT666  
BAS70_1PS7XSB70_SER_9  
© NXP B.V. 2010. All rights reserved.  
Product data sheet  
Rev. 09 — 13 January 2010  
9 of 20  
BAS70 series; 1PS7xSB70 series  
NXP Semiconductors  
General-purpose Schottky diodes  
9. Packing information  
Table 9.  
Packing methods  
The indicated -xxx are the last three digits of the 12NC ordering code.[1]  
Type number Package Description Packing quantity  
3000 4000 8000 10000  
1PS76SB70  
1PS79SB70  
SOD323  
SOD523  
4 mm pitch, 8 mm tape and reel  
2 mm pitch, 8 mm tape and reel  
4 mm pitch, 8 mm tape and reel  
4 mm pitch, 8 mm tape and reel  
-115  
-
-
-
-135  
-
-
-315  
-115  
-215  
-115  
-
-
-
-135  
-235  
-135  
-315  
-135  
-235  
-135  
-235  
-135  
-235  
-135  
-235  
-135  
-165  
-
BAS70  
SOT23  
-
-
BAS70H  
SOD123F 4 mm pitch, 8 mm tape and reel  
-
-
BAS70L  
SOD882  
SOT323  
SOT23  
2 mm pitch, 8 mm tape and reel  
4 mm pitch, 8 mm tape and reel  
4 mm pitch, 8 mm tape and reel  
4 mm pitch, 8 mm tape and reel  
4 mm pitch, 8 mm tape and reel  
4 mm pitch, 8 mm tape and reel  
4 mm pitch, 8 mm tape and reel  
4 mm pitch, 8 mm tape and reel  
-
-
BAS70W  
-115  
-215  
-115  
-215  
-115  
-215  
-115  
-215  
-115  
-125  
-
-
-
BAS70-04  
BAS70-04W  
BAS70-05  
BAS70-05W  
BAS70-06  
BAS70-06W  
BAS70-07  
BAS70-07S  
-
-
SOT323  
SOT23  
-
-
-
-
SOT323  
SOT23  
-
-
-
-
SOT323  
-
-
SOT143B 4 mm pitch, 8 mm tape and reel  
-
-
[2]  
[3]  
SOT363  
SOT666  
SOT666  
SOT363  
4 mm pitch, 8 mm tape and reel; T1  
4 mm pitch, 8 mm tape and reel; T2  
2 mm pitch, 8 mm tape and reel  
4 mm pitch, 8 mm tape and reel  
2 mm pitch, 8 mm tape and reel  
4 mm pitch, 8 mm tape and reel  
4 mm pitch, 8 mm tape and reel; T1  
4 mm pitch, 8 mm tape and reel; T2  
-
-
-
-
BAS70-07V  
BAS70VV  
BAS70XY  
-
-315  
-
-115  
-
-
-
-
-315  
-
-
-115  
-
-
-
-
[2]  
[3]  
-115  
-125  
-
-
-135  
-165  
[1] For further information and the availability of packing methods, see Section 13.  
[2] T1: normal taping  
[3] T2: reverse taping  
BAS70_1PS7XSB70_SER_9  
© NXP B.V. 2010. All rights reserved.  
Product data sheet  
Rev. 09 — 13 January 2010  
10 of 20  
 
 
 
 
BAS70 series; 1PS7xSB70 series  
NXP Semiconductors  
General-purpose Schottky diodes  
10. Soldering  
3.05  
2.80  
2.10  
1.60  
solder lands  
solder resist  
1.65 0.95  
0.50 0.60  
occupied area  
solder paste  
0.50  
(2×)  
msa433  
Dimensions in mm  
Fig 14. Reflow soldering footprint SOD323 (SC-76)  
5.00  
4.40  
1.40  
solder lands  
solder resist  
occupied area  
2.75 1.20  
msa415  
preferred transport direction during soldering  
Dimensions in mm  
Fig 15. Wave soldering footprint SOD323 (SC-76)  
2.15  
0.50 0.60  
1.20  
solder lands  
solder paste  
solder resist  
occupied area  
0.30  
0.40  
1.80  
1.90  
mgs343  
Reflow soldering is the only recommended soldering method.  
Dimensions in mm  
Fig 16. Reflow soldering footprint SOD523 (SC-79)  
BAS70_1PS7XSB70_SER_9  
© NXP B.V. 2010. All rights reserved.  
Product data sheet  
Rev. 09 — 13 January 2010  
11 of 20  
 
BAS70 series; 1PS7xSB70 series  
NXP Semiconductors  
General-purpose Schottky diodes  
2.90  
2.50  
solder lands  
solder resist  
2
1
0.85  
0.85  
occupied area  
solder paste  
2.70  
3.00  
1.30  
3
0.60  
(3x)  
0.50 (3x)  
0.60 (3x)  
1.00  
3.30  
MSA439  
Dimensions in mm  
Fig 17. Reflow soldering footprint SOT23 (TO-236AB)  
3.40  
1.20 (2x)  
solder lands  
solder resist  
occupied area  
2
1
4.60 4.00 1.20  
3
preferred transport direction during soldering  
2.80  
4.50  
MSA427  
Dimensions in mm  
Fig 18. Wave soldering footprint SOT23 (TO-236AB)  
BAS70_1PS7XSB70_SER_9  
© NXP B.V. 2010. All rights reserved.  
Product data sheet  
Rev. 09 — 13 January 2010  
12 of 20  
BAS70 series; 1PS7xSB70 series  
NXP Semiconductors  
General-purpose Schottky diodes  
4.4  
4
2.9  
1.6  
solder lands  
solder resist  
2.1 1.6  
1.1 1.2  
solder paste  
occupied area  
1.1  
(2×)  
Reflow soldering is the only recommended soldering method.  
Dimensions in mm  
Fig 19. Reflow soldering footprint SOD123F  
1.30  
0.30  
R = 0.05 (8×)  
R = 0.05 (8×)  
0.60 0.70 0.80  
(2×) (2×) (2×)  
0.90  
0.30  
solder lands  
solder paste  
solder resist  
occupied area  
(2×)  
0.40  
(2×)  
0.50  
(2×)  
mbl872  
Reflow soldering is the only recommended soldering method.  
Dimensions in mm  
Fig 20. Reflow soldering footprint SOD882  
BAS70_1PS7XSB70_SER_9  
© NXP B.V. 2010. All rights reserved.  
Product data sheet  
Rev. 09 — 13 January 2010  
13 of 20  
BAS70 series; 1PS7xSB70 series  
NXP Semiconductors  
General-purpose Schottky diodes  
2.65  
0.75  
1.30  
1.325  
solder lands  
solder paste  
2
0.50  
3
0.60  
(3×)  
2.35 0.85  
1.90  
(3×)  
solder resist  
occupied area  
Dimensions in mm  
1
0.55  
(3×)  
msa429  
2.40  
Dimensions in mm  
Fig 21. Reflow soldering footprint SOT323 (SC-70)  
4.60  
4.00  
1.15  
2
3
3.65 2.10  
2.70  
solder lands  
0.90  
(2×)  
solder resist  
1
occupied area  
Dimensions in mm  
msa419  
preferred transport direction during soldering  
Dimensions in mm  
Fig 22. Wave soldering footprint SOT323 (SC-70)  
BAS70_1PS7XSB70_SER_9  
© NXP B.V. 2010. All rights reserved.  
Product data sheet  
Rev. 09 — 13 January 2010  
14 of 20  
BAS70 series; 1PS7xSB70 series  
NXP Semiconductors  
General-purpose Schottky diodes  
3.25  
0.60 (3x)  
0.50 (3x)  
solder lands  
0.60  
(4x)  
solder resist  
occupied area  
solder paste  
4
3
2
2.70  
1.30 3.00  
1
msa441  
0.90  
1.00  
2.50  
Dimensions in mm  
Fig 23. Reflow soldering footprint SOT143B  
4.45  
1.20 (3×)  
4
3
1.15 4.00 4.60  
solder lands  
solder resist  
occupied area  
1
2
Dimensions in mm  
1.00  
preferred transport direction during soldering  
3.40  
msa422  
Dimensions in mm  
Fig 24. Wave soldering footprint SOT143B  
BAS70_1PS7XSB70_SER_9  
© NXP B.V. 2010. All rights reserved.  
Product data sheet  
Rev. 09 — 13 January 2010  
15 of 20  
BAS70 series; 1PS7xSB70 series  
NXP Semiconductors  
General-purpose Schottky diodes  
2.65  
0.60  
(2×)  
0.40  
(2×)  
2.35  
0.90 2.10  
0.50  
(4×)  
solder paste  
solder lands  
solder resist  
occupied area  
0.50  
(4×)  
1.20  
2.40  
MSA432  
Dimensions in mm  
Fig 25. Reflow soldering footprint SOT363 (SC-88)  
1.5  
solder lands  
2.5  
0.3  
4.5  
solder resist  
occupied area  
1.5  
Dimensions in mm  
preferred transport  
direction during soldering  
1.3  
1.3  
2.45  
5.3  
sot363_fw  
Fig 26. Wave soldering footprint SOT363 (SC-88)  
BAS70_1PS7XSB70_SER_9  
© NXP B.V. 2010. All rights reserved.  
Product data sheet  
Rev. 09 — 13 January 2010  
16 of 20  
BAS70 series; 1PS7xSB70 series  
NXP Semiconductors  
General-purpose Schottky diodes  
2.75  
2.45  
2.1  
1.6  
solder lands  
0.4  
(6×)  
0.3  
(2×)  
0.25  
(2×)  
placement area  
0.538  
0.55  
1.075  
1.7  
2
(2×)  
solder paste  
occupied area  
0.325 0.375  
(4×) (4×)  
Dimensions in mm  
1.7  
0.45  
0.6  
(4×)  
(2×)  
0.5  
0.65  
(4×)  
(2×)  
sot666_fr  
Reflow soldering is the only recommended soldering method.  
Fig 27. Reflow soldering footprint SOT666  
BAS70_1PS7XSB70_SER_9  
© NXP B.V. 2010. All rights reserved.  
Product data sheet  
Rev. 09 — 13 January 2010  
17 of 20  
BAS70 series; 1PS7xSB70 series  
NXP Semiconductors  
General-purpose Schottky diodes  
11. Revision history  
Table 10. Revision history  
Document ID  
Release date  
Data sheet status  
Change notice Supersedes  
BAS70_1PS7XSB70_SER_8  
BAS70_1PS7XSB70_SER_9 20100113  
Product data sheet  
-
Modifications:  
• This data sheet was changed to reflect the new company name NXP Semiconductors,  
including new legal definitions and disclaimers. No changes were made to the technical  
content.  
BAS70_1PS7XSB70_SER_8 20060504  
BAS70_1PS7XSB70_SER_7 20050718  
Product data sheet  
Product data sheet  
-
-
BAS70_1PS7XSB70_SER_7  
1PS76SB70_2  
1PS79SB70_1 BAS70H_1  
BAS70L_1 BAS70-07V_1  
BAS70VV_1 BAS70W_3  
BAS70-07S_4  
BAS70_SERIES_6  
1PS76SB70_2  
1PS79SB70_1  
BAS70H_1  
20040126  
19980716  
20050425  
20030520  
20020117  
20040910  
19990326  
20030411  
20011011  
Product specification  
Product specification  
Product data sheet  
Product specification  
Product specification  
Product data sheet  
Product specification  
Product specification  
Product specification  
-
-
-
-
-
-
-
-
-
1PS76SB70_1  
-
-
BAS70L_1  
-
BAS70-07V_1  
BAS70VV_1  
BAS70W_3  
-
-
BAS70W_2  
BAS70_07S_3  
BAS70_5  
BAS70-07S_4  
BAS70_SERIES_6  
BAS70_1PS7XSB70_SER_9  
© NXP B.V. 2010. All rights reserved.  
Product data sheet  
Rev. 09 — 13 January 2010  
18 of 20  
 
BAS70 series; 1PS7xSB70 series  
NXP Semiconductors  
General-purpose Schottky diodes  
12. Legal information  
12.1 Data sheet status  
Document status[1][2]  
Product status[3]  
Development  
Definition  
Objective [short] data sheet  
This document contains data from the objective specification for product development.  
This document contains data from the preliminary specification.  
This document contains the product specification.  
Preliminary [short] data sheet Qualification  
Product [short] data sheet Production  
[1]  
[2]  
[3]  
Please consult the most recently issued document before initiating or completing a design.  
The term ‘short data sheet’ is explained in section “Definitions”.  
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status  
information is available on the Internet at URL http://www.nxp.com.  
damage. NXP Semiconductors accepts no liability for inclusion and/or use of  
NXP Semiconductors products in such equipment or applications and  
therefore such inclusion and/or use is at the customer’s own risk.  
12.2 Definitions  
Draft — The document is a draft version only. The content is still under  
internal review and subject to formal approval, which may result in  
modifications or additions. NXP Semiconductors does not give any  
representations or warranties as to the accuracy or completeness of  
information included herein and shall have no liability for the consequences of  
use of such information.  
Applications — Applications that are described herein for any of these  
products are for illustrative purposes only. NXP Semiconductors makes no  
representation or warranty that such applications will be suitable for the  
specified use without further testing or modification.  
Limiting values — Stress above one or more limiting values (as defined in  
the Absolute Maximum Ratings System of IEC 60134) may cause permanent  
damage to the device. Limiting values are stress ratings only and operation of  
the device at these or any other conditions above those given in the  
Characteristics sections of this document is not implied. Exposure to limiting  
values for extended periods may affect device reliability.  
Short data sheet — A short data sheet is an extract from a full data sheet  
with the same product type number(s) and title. A short data sheet is intended  
for quick reference only and should not be relied upon to contain detailed and  
full information. For detailed and full information see the relevant full data  
sheet, which is available on request via the local NXP Semiconductors sales  
office. In case of any inconsistency or conflict with the short data sheet, the  
full data sheet shall prevail.  
Terms and conditions of sale — NXP Semiconductors products are sold  
subject to the general terms and conditions of commercial sale, as published  
at http://www.nxp.com/profile/terms, including those pertaining to warranty,  
intellectual property rights infringement and limitation of liability, unless  
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of  
any inconsistency or conflict between information in this document and such  
terms and conditions, the latter will prevail.  
12.3 Disclaimers  
General — Information in this document is believed to be accurate and  
reliable. However, NXP Semiconductors does not give any representations or  
warranties, expressed or implied, as to the accuracy or completeness of such  
information and shall have no liability for the consequences of use of such  
information.  
No offer to sell or license — Nothing in this document may be interpreted or  
construed as an offer to sell products that is open for acceptance or the grant,  
conveyance or implication of any license under any copyrights, patents or  
other industrial or intellectual property rights.  
Right to make changes — NXP Semiconductors reserves the right to make  
changes to information published in this document, including without  
limitation specifications and product descriptions, at any time and without  
notice. This document supersedes and replaces all information supplied prior  
to the publication hereof.  
Export control — This document as well as the item(s) described herein  
may be subject to export control regulations. Export might require a prior  
authorization from national authorities.  
Quick reference data — The Quick reference data is an extract of the  
product data given in the Limiting values and Characteristics sections of this  
document, and as such is not complete, exhaustive or legally binding.  
Suitability for use — NXP Semiconductors products are not designed,  
authorized or warranted to be suitable for use in medical, military, aircraft,  
space or life support equipment, nor in applications where failure or  
malfunction of an NXP Semiconductors product can reasonably be expected  
to result in personal injury, death or severe property or environmental  
12.4 Trademarks  
Notice: All referenced brands, product names, service names and trademarks  
are the property of their respective owners.  
13. Contact information  
For more information, please visit: http://www.nxp.com  
For sales office addresses, please send an email to: salesaddresses@nxp.com  
BAS70_1PS7XSB70_SER_9  
© NXP B.V. 2010. All rights reserved.  
Product data sheet  
Rev. 09 — 13 January 2010  
19 of 20  
 
 
 
 
 
 
BAS70 series; 1PS7xSB70 series  
NXP Semiconductors  
General-purpose Schottky diodes  
14. Contents  
1
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1  
General description . . . . . . . . . . . . . . . . . . . . . 1  
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1  
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1  
Quick reference data . . . . . . . . . . . . . . . . . . . . 2  
1.1  
1.2  
1.3  
1.4  
2
Pinning information. . . . . . . . . . . . . . . . . . . . . . 2  
Ordering information. . . . . . . . . . . . . . . . . . . . . 4  
Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5  
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 5  
Thermal characteristics . . . . . . . . . . . . . . . . . . 6  
Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 6  
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 8  
Packing information . . . . . . . . . . . . . . . . . . . . 10  
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11  
Revision history. . . . . . . . . . . . . . . . . . . . . . . . 18  
3
4
5
6
7
8
9
10  
11  
12  
Legal information. . . . . . . . . . . . . . . . . . . . . . . 19  
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 19  
Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 19  
Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 19  
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 19  
12.1  
12.2  
12.3  
12.4  
13  
14  
Contact information. . . . . . . . . . . . . . . . . . . . . 19  
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20  
Please be aware that important notices concerning this document and the product(s)  
described herein, have been included in section ‘Legal information’.  
© NXP B.V. 2010.  
All rights reserved.  
For more information, please visit: http://www.nxp.com  
For sales office addresses, please send an email to: salesaddresses@nxp.com  
Date of release: 13 January 2010  
Document identifier: BAS70_1PS7XSB70_SER_9  
 

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