BAS70 [NXP]

Schottky barrier double diodes; 肖特基势垒二极管双
BAS70
型号: BAS70
厂家: NXP    NXP
描述:

Schottky barrier double diodes
肖特基势垒二极管双

二极管
文件: 总8页 (文件大小:65K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
DISCRETE SEMICONDUCTORS  
DATA SHEET  
age  
BAS70 series  
Schottky barrier (double) diodes  
1999 Jun 01  
Product specification  
Supersedes data of 1996 Oct 01  
Philips Semiconductors  
Product specification  
Schottky barrier (double) diodes  
BAS70 series  
FEATURES  
PINNING  
Low forward current  
DESCRIPTION  
SOT23  
BAS70-04 BAS70-05  
High breakdown voltage  
Guard ring protected  
SOT143B  
PIN  
BAS70  
BAS70-06  
BAS70-07  
Small plastic SMD package  
Low diode capacitance.  
(see Fig.1b) (see Fig.1c) (see Fig.1d) (see Fig.1e) (see Fig.2)  
1
2
3
4
a1  
n.c.  
k1  
a1  
k2  
a1  
a2  
k1  
k2  
k1  
k2  
a2  
a1  
APPLICATIONS  
k1, a2  
k1, k2  
a1, a2  
Ultra high-speed switching  
Voltage clamping  
Protection circuits.  
3
3
1
DESCRIPTION  
2
Planar Schottky barrier diodes with an  
integrated guard ring for stress  
protection. Single diodes and double  
diodes with different pinning are  
available.  
MGC485  
c. BAS70-04  
1
2
3
1
Top view  
MGC482  
The diodes BAS70, BAS70-04,  
BAS70-05 and BAS70-06 are  
encapsulated in a SOT23 small  
plastic SMD package. The BAS70-07  
is encapsulated in a SOT143B small  
plastic SMD package.  
2
a. Simplified outline SOT23.  
MGC484  
d. BAS70-05.  
3
3
MARKING  
2
n.c.  
1
2
1
MARKING  
TYPE NUMBER  
MGC483  
MGC486  
CODE(1)  
b. BAS70 single diode.  
e. BAS70-06.  
BAS70  
73p  
74p  
75p  
76p  
77p  
BAS70-04  
BAS70-05  
BAS70-06  
BAS70-07  
Fig.1 Simplified outline (SOT23) and symbols.  
Note  
1.  
handbook, halfp
4
3
2
= -: Made in Hong Kong.  
= t: Made in Malaysia.  
4
3
2
1
1
Top view  
MAM194  
Fig.2 Simplified outline (SOT143B) BAS70-07 and symbol.  
2
1999 Jun 01  
Philips Semiconductors  
Product specification  
Schottky barrier (double) diodes  
BAS70 series  
LIMITING VALUES  
In accordance with the Absolute Maximum Rating System (IEC 134).  
SYMBOL  
PARAMETER  
CONDITIONS  
MIN.  
MAX.  
UNIT  
Per diode  
VR  
continuous reverse voltage  
continuous forward current  
repetitive peak forward current  
non-repetitive peak forward current  
storage temperature  
70  
V
IF  
70  
mA  
mA  
mA  
°C  
IFRM  
IFSM  
Tstg  
tp 1 s; δ ≤ 0.5  
70  
tp < 10 ms  
100  
+150  
150  
+150  
65  
Tj  
junction temperature  
°C  
Tamb  
operating ambient temperature  
°C  
65  
ELECTRICAL CHARACTERISTICS  
amb = 25 °C unless otherwise specified.  
T
SYMBOL PARAMETER  
CONDITIONS  
MAX.  
UNIT  
Per diode  
VF  
forward voltage  
see Fig.3  
IF = 1 mA  
IF = 10 mA  
IF = 15 mA  
410  
750  
1
mV  
mV  
V
IR  
reverse current  
VR = 50 V; note 1; see Fig.4  
VR = 70 V; note 1; see Fig.4  
IF = 5 mA  
nA  
µA  
ps  
100  
10  
τ
charge carrier life time (Krakauer  
method)  
100  
Cd  
diode capacitance  
f = 1 MHz; VR = 0; see Fig.6  
2
pF  
Note  
1. Pulse test: tp = 300 µs; δ = 0.02.  
THERMAL CHARACTERISTICS  
SYMBOL  
PARAMETER  
thermal resistance from junction to ambient note 1  
CONDITIONS  
VALUE  
UNIT  
K/W  
Rth j-a  
500  
Note  
1. Refer to SOT23 or SOT143B standard mounting conditions.  
1999 Jun 01  
3
Philips Semiconductors  
Product specification  
Schottky barrier (double) diodes  
BAS70 series  
GRAPHICAL DATA  
MRA803  
MRA805  
2
2
10  
10  
I
R
I
(1)  
F
(µA)  
(mA)  
10  
10  
(2)  
(3)  
1
1
1
10  
1
10  
2
3
10  
(1)  
(2) (3) (4)  
2
10  
10  
0
0.2  
0.4  
0.6  
0.8  
1
0
20  
40  
60  
80  
V
(V)  
V
(V)  
R
F
(1) Tamb = 125 °C.  
(2) Tamb = 85 °C.  
(3) Tamb = 25 °C.  
(4) Tamb = 40 °C.  
(1) Tamb = 150 °C.  
(2) Tamb = 85 °C.  
(3) Tamb = 25 °C.  
Fig.3 Forward current as a function of forward  
voltage; typical values.  
Fig.4 Reverse current as a function of reverse  
voltage; typical values.  
MRA804  
MGL762  
3
10  
2
C
d
r
dif  
(pF)  
()  
1.5  
2
10  
1
0.5  
0
10  
1
10  
1  
2
0
20  
40  
60  
80  
1
10  
10  
I
(mA)  
V
(V)  
F
R
f = 10 kHz.  
f = 1 MHz.  
Fig.5 Differential forward resistance as a function  
of forward current; typical values.  
Fig.6 Diode capacitance as a function of reverse  
voltage; typical values.  
1999 Jun 01  
4
Philips Semiconductors  
Product specification  
Schottky barrier (double) diodes  
BAS70 series  
PACKAGE OUTLINES  
Plastic surface mounted package; 3 leads  
SOT23  
D
B
E
A
X
H
v
M
A
E
3
Q
A
A
1
c
1
2
e
1
b
p
w M  
B
L
p
e
detail X  
0
1
2 mm  
scale  
DIMENSIONS (mm are the original dimensions)  
A
1
UNIT  
b
c
D
E
e
e
H
L
Q
v
w
A
p
p
1
E
max.  
1.1  
0.9  
0.48  
0.38  
0.15  
0.09  
3.0  
2.8  
1.4  
1.2  
2.5  
2.1  
0.45  
0.15  
0.55  
0.45  
mm  
0.1  
1.9  
0.95  
0.2  
0.1  
REFERENCES  
JEDEC  
EUROPEAN  
PROJECTION  
OUTLINE  
VERSION  
ISSUE DATE  
IEC  
EIAJ  
97-02-28  
SOT23  
1999 Jun 01  
5
Philips Semiconductors  
Product specification  
Schottky barrier (double) diodes  
BAS70 series  
Plastic surface mounted package; 4 leads  
SOT143B  
D
B
E
A
X
y
H
v
M
A
E
e
b
p
w
M
B
4
3
Q
A
A
1
c
1
2
L
p
b
1
e
1
detail X  
0
1
2 mm  
scale  
DIMENSIONS (mm are the original dimensions)  
A
1
max  
UNIT  
A
b
b
c
D
E
e
e
H
L
p
Q
v
w
y
p
1
1
E
1.1  
0.9  
0.48  
0.38  
0.88  
0.78  
0.15  
0.09  
3.0  
2.8  
1.4  
1.2  
2.5  
2.1  
0.45  
0.15  
0.55  
0.45  
0.1  
mm  
1.9  
1.7  
0.2  
0.1  
0.1  
REFERENCES  
JEDEC  
EUROPEAN  
PROJECTION  
OUTLINE  
VERSION  
ISSUE DATE  
IEC  
EIAJ  
97-02-28  
SOT143B  
1999 Jun 01  
6
Philips Semiconductors  
Product specification  
Schottky barrier (double) diodes  
BAS70 series  
DEFINITIONS  
Data sheet status  
Objective specification  
Preliminary specification  
Product specification  
This data sheet contains target or goal specifications for product development.  
This data sheet contains preliminary data; supplementary data may be published later.  
This data sheet contains final product specifications.  
Limiting values  
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or  
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation  
of the device at these or at any other conditions above those given in the Characteristics sections of the specification  
is not implied. Exposure to limiting values for extended periods may affect device reliability.  
Application information  
Where application information is given, it is advisory and does not form part of the specification.  
LIFE SUPPORT APPLICATIONS  
These products are not designed for use in life support appliances, devices, or systems where malfunction of these  
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for  
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such  
improper use or sale.  
1999 Jun 01  
7
Philips Semiconductors – a worldwide company  
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Philippines: Philips Semiconductors Philippines Inc.,  
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For all other countries apply to: Philips Semiconductors,  
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International Marketing & Sales Communications, Building BE-p, P.O. Box 218,  
5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825  
© Philips Electronics N.V. 1999  
SCA65  
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.  
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed  
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license  
under patent- or other industrial or intellectual property rights.  
Printed in The Netherlands  
115002/05/pp8  
Date of release: 1999 Jun 01  
Document order number: 9397 750 05968  

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