BAT54XY,115 [NXP]
BAT54XY - Schottky barrier quadruple diode TSSOP 6-Pin;
| 型号： | BAT54XY,115 |
| 厂家： | 
NXP |
| 描述： | BAT54XY - Schottky barrier quadruple diode TSSOP 6-Pin 光电二极管 |
| 文件： | 总9页 (文件大小：86K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
BAT54XY
Schottky barrier quadruple diode in very small SOT363
package
Rev. 02 — 13 January 2010
Product data sheet
1. Product profile
1.1 General description
Schottky barrier quadruple diode with an integrated guard ring for stress protection. Two
electrically isolated dual Schottky barrier diodes series, encapsulated in a SOT363 very
small SMD plastic package.
1.2 Features
Low forward voltage
Ultra small SMD plastic package
Low capacitance
1.3 Applications
Ultra high-speed switching
Voltage clamping
Line termination
Inverse-polarity protection
1.4 Quick reference data
Table 1.
Symbol
VR
Quick reference data
Parameter
Conditions
Min
Typ
Max
30
Unit
V
continuous reverse voltage
continuous forward current
forward voltage
-
-
-
-
-
-
IF
200
400
mA
mV
[1]
VF
IF = 10 mA;
see Figure 1
[1] Pulse test: tp ≤ 30 ms; δ ≤ 0.02.
BAT54XY
NXP Semiconductors
Schottky barrier quadruple diode in very small SOT363 package
2. Pinning information
Table 2.
Pinning
Pin
1
Description
anode 1
Simplified outline
Symbol
6
5
4
6
5
4
2
cathode 2
3
anode 3 / cathode 4
anode 4
4
1
2
3
5
cathode 3
6
cathode 1 / anode 2
1
2
3
006aaa256
3. Ordering information
Table 3.
Ordering information
Type number Package
Name
Description
Version
BAT54XY
SC-88
plastic surface mounted package; 6 leads
SOT363
4. Marking
Table 4.
Marking codes
Type number
Marking code[1]
BAT54XY
*C5
[1] * = -: made in Hong Kong
* = t: made in Malaysia
* = W: made in China
5. Limiting values
Table 5.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Per diode
VR
Parameter
Conditions
Min
Max
Unit
continuous reverse voltage
continuous forward current
-
-
-
30
V
IF
200
300
mA
mA
IFRM
repetitive peak forward
current
tp ≤ 1 s; δ ≤ 0.5
IFSM
non-repetitive peak forward tp < 10 ms
current
-
600
mA
Tj
junction temperature
ambient temperature
storage temperature
-
125
°C
°C
°C
Tamb
Tstg
−65
−65
+125
+150
BAT54XY_2
© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 02 — 13 January 2010
2 of 9
BAT54XY
NXP Semiconductors
Schottky barrier quadruple diode in very small SOT363 package
6. Thermal characteristics
Table 6.
Thermal characteristics
Symbol Parameter
Conditions
Min
Typ Max Unit
[1]
Rth(j-s)
thermal resistance from junction to in free air
soldering point
-
-
260
K/W
[1] Soldering point at pins 2, 3, 5 and 6.
7. Characteristics
Table 7.
Characteristics
Tamb = 25 °C unless otherwise specified.
Symbol
Per diode
VF
Parameter
Conditions
Min
Typ
Max Unit
[1]
forward voltage
see Figure 1;
IF = 0.1 mA
-
-
-
-
-
-
-
-
-
-
-
-
-
-
240
320
400
500
800
2
mV
mV
mV
mV
mV
μA
IF = 1 mA
IF = 10 mA
IF = 30 mA
IF = 100 mA
VR = 25 V; see Figure 2
IR
reverse current
Cd
diode capacitance
VR = 1 V; f = 1 MHz;
see Figure 3
10
pF
[1] Pulse test: tp ≤ 300 μs; δ ≤ 0.02.
BAT54XY_2
© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 02 — 13 January 2010
3 of 9
BAT54XY
NXP Semiconductors
Schottky barrier quadruple diode in very small SOT363 package
msa893
msa892
3
3
10
10
I
(1)
(2)
I
R
F
(1) (2) (3)
(μA)
(mA)
2
2
10
10
10
10
(1)
(2) (3)
1
1
(3)
−1
−1
0
10
10
10
20
30
0
0.4
0.8
1.2
V
R
(V)
V
F
(V)
(1) Tamb = 125 °C
(2) Tamb = 85 °C
(3) Tamb = 25 °C
(1) Tamb = 125 °C
(2) Tamb = 85 °C
(3) Tamb = 25 °C
Fig 1. Forward current as a function of forward
voltage; typical values
Fig 2. Reverse current as a function of reverse
voltage; typical values
msa891
15
C
d
(pF)
10
5
0
0
10
20
30
V
(V)
R
Tamb = 25 °C; f = 1 MHz
Fig 3. Diode capacitance as a function of reverse voltage; typical values
BAT54XY_2
© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 02 — 13 January 2010
4 of 9
BAT54XY
NXP Semiconductors
Schottky barrier quadruple diode in very small SOT363 package
8. Package outline
Plastic surface-mounted package; 6 leads
SOT363
D
B
E
A
X
y
H
v
M
A
E
6
5
4
Q
pin 1
index
A
A
1
1
2
3
c
e
1
b
L
p
w
M B
p
e
detail X
0
1
2 mm
scale
DIMENSIONS (mm are the original dimensions)
A
1
UNIT
A
b
c
D
E
e
e
H
L
Q
v
w
y
p
p
1
E
max
0.30
0.20
1.1
0.8
0.25
0.10
2.2
1.8
1.35
1.15
2.2
2.0
0.45
0.15
0.25
0.15
mm
0.1
1.3
0.65
0.2
0.2
0.1
REFERENCES
JEDEC JEITA
EUROPEAN
PROJECTION
OUTLINE
VERSION
ISSUE DATE
IEC
04-11-08
06-03-16
SOT363
SC-88
Fig 4. Package outline SOT363 (SC-88)
BAT54XY_2
© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 02 — 13 January 2010
5 of 9
BAT54XY
NXP Semiconductors
Schottky barrier quadruple diode in very small SOT363 package
9. Packing information
Table 8.
Packing methods
The indicated -xxx are the last three digits of the 12NC ordering code.[1]
Type number
Package
Description
Packing quantity
3000
-115
-125
10000
[2]
[3]
BAT54XY
SOT363
4 mm pitch, 8 mm tape and reel; T1
4 mm pitch, 8 mm tape and reel; T2
-135
-165
[1] For further information and the availability of packing methods, see Section 12.
[2] T1: normal taping
[3] T2: reverse taping
BAT54XY_2
© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 02 — 13 January 2010
6 of 9
BAT54XY
NXP Semiconductors
Schottky barrier quadruple diode in very small SOT363 package
10. Revision history
Table 9.
Revision history
Document ID
BAT54XY_2
Modifications:
Release date
Data sheet status
Change notice
Supersedes
20100113
Product data sheet
-
BAT54XY_1
• This data sheet was changed to reflect the new company name NXP Semiconductors,
including new legal definitions and disclaimers. No changes were made to the technical
content.
• Table 2 “Pinning”: updated
• Figure 4 “Package outline SOT363 (SC-88)”: updated
BAT54XY_1
20050117
Product data sheet
-
-
BAT54XY_2
© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 02 — 13 January 2010
7 of 9
BAT54XY
NXP Semiconductors
Schottky barrier quadruple diode in very small SOT363 package
11. Legal information
11.1 Data sheet status
Document status[1][2]
Product status[3]
Development
Definition
Objective [short] data sheet
This document contains data from the objective specification for product development.
This document contains data from the preliminary specification.
This document contains the product specification.
Preliminary [short] data sheet Qualification
Product [short] data sheet Production
[1]
[2]
[3]
Please consult the most recently issued document before initiating or completing a design.
The term ‘short data sheet’ is explained in section “Definitions”.
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
11.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.nxp.com/profile/terms, including those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between information in this document and such
terms and conditions, the latter will prevail.
11.3 Disclaimers
General — Information in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give any representations or
warranties, expressed or implied, as to the accuracy or completeness of such
information and shall have no liability for the consequences of use of such
information.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from national authorities.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
11.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
12. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
BAT54XY_2
© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 02 — 13 January 2010
8 of 9
BAT54XY
NXP Semiconductors
Schottky barrier quadruple diode in very small SOT363 package
13. Contents
1
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
General description . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Quick reference data . . . . . . . . . . . . . . . . . . . . 1
1.1
1.2
1.3
1.4
2
Pinning information. . . . . . . . . . . . . . . . . . . . . . 2
Ordering information. . . . . . . . . . . . . . . . . . . . . 2
Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2
Thermal characteristics . . . . . . . . . . . . . . . . . . 3
Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 3
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 5
Packing information . . . . . . . . . . . . . . . . . . . . . 6
Revision history. . . . . . . . . . . . . . . . . . . . . . . . . 7
3
4
5
6
7
8
9
10
11
Legal information. . . . . . . . . . . . . . . . . . . . . . . . 8
Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 8
Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
11.1
11.2
11.3
11.4
12
13
Contact information. . . . . . . . . . . . . . . . . . . . . . 8
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2010.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 13 January 2010
Document identifier: BAT54XY_2
相关型号：
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