BAT74S-T [NXP]

DIODE 0.2 A, 2 ELEMENT, SILICON, SIGNAL DIODE, PLASTIC, SC-88, 6 PIN, Signal Diode;


型号：	BAT74S-T
厂家：	NXP
描述：	DIODE 0.2 A, 2 ELEMENT, SILICON, SIGNAL DIODE, PLASTIC, SC-88, 6 PIN, Signal Diode 光电二极管
文件：	总10页 (文件大小：162K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

BAT74S

Dual Schottky barrier diode

22 November 2012

Product data sheet

1. Product profile

1.1 General description

Planar Schottky barrier dual diode with an integrated guard ring for stress protection.

Two electrically isolated Schootky barrier diodes encapsulated in a very small SOT363

(SC-88) Surface-Mounted Device (SMD) plastic package.

1.2 Features and benefits

Low forward voltage

Low capacitance

AEC-Q101 qualified

•

1.3 Applications

Ultra high-speed switching

Line termination

Voltage clamping

Reverse polarity protection

•

1.4 Quick reference data

Table 1.

Symbol

Quick reference data

Parameter

Conditions

Min

Typ

Max

Unit

Per diode

I_F

forward current

reverse voltage

200

V_R

Per diode

V_F

forward voltage

reverse current

I_F= 100 mA; pulsed; t_p= 300 µs;

δ = 0.02 ; T_amb= 25 °C

800

µA

I_R

V_R= 25 V; pulsed; t_p= 300 µs;

δ = 0.02 ; T_amb= 25 °C

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NXP Semiconductors

BAT74S

Dual Schottky barrier diode

2. Pinning information

Table 2.

Pinning information

Symbol Description

Simplified outline

Graphic symbol

anode (diode 1)

not connected

n.c.

cathode (diode 2)

anode (diode 2)

not connected

aaa-005709

TSSOP6 (SOT363)

n.c.

cathode (diode 1)

3. Ordering information

Table 3.

Ordering information

Type number

Package

Name

Description

Version

SOT363

BAT74S

TSSOP6

plastic surface-mounted package; 6 leads

4. Marking

Table 4.

Marking codes

Type number

Marking code

[1]

BAT74S

74%

[1] % = placeholder for manufacturing site code

5. Limiting values

Table 5.

Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol

Per diode

V_R

Parameter

Conditions

Min

Max

Unit

reverse voltage

forward current

I_F

200

300

600

I_FRM

repetitive peak forward current t_p≤ 1 s; δ ≤ 0.5

I_FSM

non-repetitive peak forward

current

t_p< 10 ms; T_j(init)= 25 °C

P_tot

T_j

total power dissipation

junction temperature

T_amb≤ 25 °C

240

125

°C

BAT74S

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Product data sheet

22 November 2012

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NXP Semiconductors

BAT74S

Dual Schottky barrier diode

Symbol

T_amb

Parameter

Conditions

Min

-55

-65

Max

125

150

Unit

°C

ambient temperature

storage temperature

T_stg

°C

Per device

V_R

reverse voltage

forward current

series connection

I_F

[1]

110

200

I_FRM

repetitive peak forward current t_p≤ 1 s; δ ≤ 0.5

[1] If both diodes are in forward operation at the same moment, total device current is maximum 110 mA.

If one diode is in reverse and the other in forward operation at the same moment, total device current is

maximum 200 mA.

mbl889

300

tot

(mW)

200

100

150

(°C)

amb

Fig. 1. Power derating curve

6. Thermal characteristics

Table 6.

Symbol

Thermal characteristics

Parameter

Conditions

Min

Typ

Max

Unit

Per diode

R_th(j-a)

thermal resistance

from junction to

ambient

in free air

[1]

416

K/W

[1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard

footprint.

BAT74S

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Product data sheet

22 November 2012

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NXP Semiconductors

BAT74S

Dual Schottky barrier diode

7. Characteristics

Table 7.

Symbol

Characteristics

Parameter

Conditions

Min

Typ

Max

Unit

Per diode

V_F

forward voltage

I_F= 0.1 mA; pulsed; t_p= 300 µs;

δ = 0.02 ; T_amb= 25 °C

240

320

400

500

800

µA

I_F= 1 mA; pulsed; t_p= 300 µs;

δ = 0.02 ; T_amb= 25 °C

I_F= 10 mA; pulsed; t_p= 300 µs;

δ = 0.02 ; T_amb= 25 °C

I_F= 30 mA; pulsed; t_p= 300 µs;

δ = 0.02 ; T_amb= 25 °C

I_F= 100 mA; pulsed; t_p= 300 µs;

δ = 0.02 ; T_amb= 25 °C

I_R

reverse current

V_R= 25 V; pulsed; t_p= 300 µs;

δ = 0.02 ; T_amb= 25 °C

C_d

t_rr

diode capacitance

V_R= 1 V; f = 1 MHz; T_amb= 25 °C

reverse recovery time I_F= 10 mA; I_R= 10 mA; R_L= 100 Ω;

I_R(meas)= 1 mA; T_amb= 25 °C

006aac829

aaa-004515

(3)

(1)

(2)

(µA)

(1)

(mA)

(2)

(1) (2)

(3)

-1

0.0

0.4

0.8

1.2

(V)

V (V)

(1) T_amb= 125 °C

(2) T_amb= 85 °C

(3) T_amb= 25 °C

(1) T_amb= 125 °C

(2) T_amb= 85 °C

(3) T_amb= 25 °C

Fig. 2. Forward current as a function of forward

voltage; typical values

Fig. 3. Reverse current as a function of reverse

voltage; typical values

BAT74S

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Product data sheet

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NXP Semiconductors

BAT74S

Dual Schottky barrier diode

006aac891

(pF)

(V)

T_amb= 25 °C; f = 1 MHz

Fig. 4. Diode capacitance as a function of reverse voltage; typical values

8. Test information

D.U.T.

10 %

+ I

= 50 Ω

SAMPLING

OSCILLOSCOPE

= 50 Ω

V = V + I × R

(1)

90 %

mga881

input signal

output signal

(1) I_R= 1 mA

Fig. 5. Reverse recovery time test circuit and waveforms

8.1 Quality information

This product has been qualified in accordance with the Automotive Electronics Council

(AEC) standard Q101 - Stress test qualification for discrete semiconductors, and is

suitable for use in automotive applications.

BAT74S

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Product data sheet

22 November 2012

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NXP Semiconductors

BAT74S

Dual Schottky barrier diode

9. Package outline

2.2

1.8

1.1

0.8

0.45

0.15

2.2 1.35

2.0 1.15

pin 1

index

0.25

0.10

0.3

0.2

0.65

1.3

Dimensions in mm

06-03-16

Fig. 6. Package outline TSSOP6 (SOT363)

10. Soldering

2.65

solder lands

solder resist

0.4 (2×)

1.5

2.35

0.6

(4×)

0.5

(4×)

solder paste

0.5

(4×)

0.6

(2×)

occupied area

0.6

(4×)

Dimensions in mm

sot363_fr

1.8

Fig. 7. Reflow soldering footprint for TSSOP6 (SOT363)

BAT74S

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Product data sheet

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BAT74S

Dual Schottky barrier diode

1.5

solder lands

solder resist

2.5

0.3

4.5

occupied area

1.5

Dimensions in mm

preferred transport

direction during soldering

1.3

2.45

5.3

sot363_fw

Fig. 8. Wave soldering footprint for TSSOP6 (SOT363)

11. Revision history

Table 8.

Revision history

Data sheet ID

BAT74S v.5

Release date

Data sheet status

Change notice

Supersedes

20121122

Product data sheet

BAT74S v.4

Modifications:

The format of this document has been redesigned to comply with the new identity guidelines

of NXP Semiconductors.

•

Legal texts have been adapted to the new company name where appropriate.

Section 1 Product profile: updated

•

Section 4 Marking: updated

Table 5 Limiting values: changed Tamb minimum value to -55 °C according to AEC-Q101

Figure 2 and 3: updated

Section 8 Test information: added

Figure 6: superseded by minimized package outline drawing

Section 10 Soldering: added

Section 11 Legal information: updated

BAT74S v.4

BAT74S v.3

BAT74S v.2

BAT74S v.1

20030411

Product specification

BAT74S v.3

BAT74S v.2

BAT74S v.1

19980710

19980206

19971107

BAT74S

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Product data sheet

22 November 2012

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NXP Semiconductors

BAT74S

Dual Schottky barrier diode

In no event shall NXP Semiconductors be liable for any indirect, incidental,

punitive, special or consequential damages (including - without limitation -

lost profits, lost savings, business interruption, costs related to the removal

or replacement of any products or rework charges) whether or not such

damages are based on tort (including negligence), warranty, breach of

contract or any other legal theory.

12. Legal information

12.1 Data sheet status

Notwithstanding any damages that customer might incur for any reason

whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards

customer for the products described herein shall be limited in accordance

with the Terms and conditions of commercial sale of NXP Semiconductors.

Document

Product

Definition

status [1][2] status [3]

Objective

[short] data

sheet

Development This document contains data from

the objective specification for product

development.

Right to make changes — NXP Semiconductors reserves the right to

make changes to information published in this document, including without

limitation specifications and product descriptions, at any time and without

notice. This document supersedes and replaces all information supplied prior

to the publication hereof.

Preliminary

[short] data

sheet

Qualification This document contains data from the

preliminary specification.

Suitability for use in automotive applications — This NXP

Semiconductors product has been qualified for use in automotive

applications. Unless otherwise agreed in writing, the product is not designed,

authorized or warranted to be suitable for use in life support, life-critical or

safety-critical systems or equipment, nor in applications where failure or

malfunction of an NXP Semiconductors product can reasonably be expected

to result in personal injury, death or severe property or environmental

damage. NXP Semiconductors and its suppliers accept no liability for

inclusion and/or use of NXP Semiconductors products in such equipment or

applications and therefore such inclusion and/or use is at the customer's own

risk.

Product

[short] data

sheet

Production

This document contains the product

specification.

[1] Please consult the most recently issued document before initiating or

completing a design.

[2] The term 'short data sheet' is explained in section "Definitions".

[3] The product status of device(s) described in this document may have

changed since this document was published and may differ in case of

multiple devices. The latest product status information is available on

the Internet at URL http://www.nxp.com.

Quick reference data — The Quick reference data is an extract of the

product data given in the Limiting values and Characteristics sections of this

document, and as such is not complete, exhaustive or legally binding.

12.2 Definitions

Applications — Applications that are described herein for any of these

products are for illustrative purposes only. NXP Semiconductors makes no

representation or warranty that such applications will be suitable for the

specified use without further testing or modification.

Preview — The document is a preview version only. The document is still

subject to formal approval, which may result in modifications or additions.

NXP Semiconductors does not give any representations or warranties as to

the accuracy or completeness of information included herein and shall have

no liability for the consequences of use of such information.

Customers are responsible for the design and operation of their

applications and products using NXP Semiconductors products, and NXP

Semiconductors accepts no liability for any assistance with applications or

customer product design. It is customer’s sole responsibility to determine

whether the NXP Semiconductors product is suitable and fit for the

customer’s applications and products planned, as well as for the planned

application and use of customer’s third party customer(s). Customers should

provide appropriate design and operating safeguards to minimize the risks

associated with their applications and products.

Draft — The document is a draft version only. The content is still under

internal review and subject to formal approval, which may result in

modifications or additions. NXP Semiconductors does not give any

representations or warranties as to the accuracy or completeness of

information included herein and shall have no liability for the consequences

of use of such information.

Short data sheet — A short data sheet is an extract from a full data sheet

with the same product type number(s) and title. A short data sheet is

intended for quick reference only and should not be relied upon to contain

detailed and full information. For detailed and full information see the

relevant full data sheet, which is available on request via the local NXP

Semiconductors sales office. In case of any inconsistency or conflict with the

short data sheet, the full data sheet shall prevail.

NXP Semiconductors does not accept any liability related to any default,

damage, costs or problem which is based on any weakness or default

in the customer’s applications or products, or the application or use by

customer’s third party customer(s). Customer is responsible for doing all

necessary testing for the customer’s applications and products using NXP

Semiconductors products in order to avoid a default of the applications

and the products or of the application or use by customer’s third party

customer(s). NXP does not accept any liability in this respect.

Product specification — The information and data provided in a Product

data sheet shall define the specification of the product as agreed between

NXP Semiconductors and its customer, unless NXP Semiconductors and

customer have explicitly agreed otherwise in writing. In no event however,

shall an agreement be valid in which the NXP Semiconductors product

is deemed to offer functions and qualities beyond those described in the

Product data sheet.

Limiting values — Stress above one or more limiting values (as defined in

the Absolute Maximum Ratings System of IEC 60134) will cause permanent

damage to the device. Limiting values are stress ratings only and (proper)

operation of the device at these or any other conditions above those

given in the Recommended operating conditions section (if present) or the

Characteristics sections of this document is not warranted. Constant or

repeated exposure to limiting values will permanently and irreversibly affect

the quality and reliability of the device.

12.3 Disclaimers

Terms and conditions of commercial sale — NXP Semiconductors

products are sold subject to the general terms and conditions of commercial

sale, as published at http://www.nxp.com/profile/terms, unless otherwise

agreed in a valid written individual agreement. In case an individual

agreement is concluded only the terms and conditions of the respective

agreement shall apply. NXP Semiconductors hereby expressly objects to

applying the customer’s general terms and conditions with regard to the

purchase of NXP Semiconductors products by customer.

Limited warranty and liability — Information in this document is believed

to be accurate and reliable. However, NXP Semiconductors does not give

any representations or warranties, expressed or implied, as to the accuracy

or completeness of such information and shall have no liability for the

consequences of use of such information. NXP Semiconductors takes no

responsibility for the content in this document if provided by an information

source outside of NXP Semiconductors.

BAT74S

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Product data sheet

22 November 2012

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NXP Semiconductors

BAT74S

Dual Schottky barrier diode

No offer to sell or license — Nothing in this document may be interpreted

or construed as an offer to sell products that is open for acceptance or the

grant, conveyance or implication of any license under any copyrights, patents

or other industrial or intellectual property rights.

Export control — This document as well as the item(s) described herein

may be subject to export control regulations. Export might require a prior

authorization from competent authorities.

Translations — A non-English (translated) version of a document is for

reference only. The English version shall prevail in case of any discrepancy

between the translated and English versions.

12.4 Trademarks

Notice: All referenced brands, product names, service names and

trademarks are the property of their respective owners.

Adelante, Bitport, Bitsound, CoolFlux, CoReUse, DESFire, EZ-HV,

FabKey, GreenChip, HiPerSmart, HITAG, I²C-bus logo, ICODE, I-CODE,

ITEC, Labelution, MIFARE, MIFARE Plus, MIFARE Ultralight, MoReUse,

QLPAK, Silicon Tuner, SiliconMAX, SmartXA, STARplug, TOPFET,

TOPTriac, TrenchMOS, TriMedia and UCODE — are trademarks of NXP

B.V.

HD Radio and HD Radio logo — are trademarks of iBiquity Digital

Corporation.

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BAT74S

Dual Schottky barrier diode

13. Contents

Product profile ....................................................... 1

General description .............................................. 1

Features and benefits ...........................................1

Applications ..........................................................1

Quick reference data ............................................ 1

1.1

1.2

1.3

1.4

Pinning information ...............................................2

Ordering information .............................................2

Marking ...................................................................2

Limiting values .......................................................2

Thermal characteristics .........................................3

Characteristics .......................................................4

Test information .....................................................5

8.1

Quality information .........................................

Package outline ..................................................... 6

Soldering ................................................................ 6

Revision history .....................................................7

Legal information ...................................................8

Data sheet status ................................................. 8

Definitions .............................................................8

Disclaimers ...........................................................8

Trademarks .......................................................... 9

12.1

12.2

12.3

12.4

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

Date of release: 22 November 2012

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Product data sheet

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BAT74S-T [NXP]

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