BAT760 [NXP]
Schottky barrier diode; 肖特基二极管
| 型号： | BAT760 |
| 厂家： | 
NXP |
| 描述： | Schottky barrier diode |
| 文件： | 总7页 (文件大小：57K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
DISCRETE SEMICONDUCTORS
DATA SHEET
BAT760
Schottky barrier diode
Product specification
2004 Jan 26
Supersedes data of 2001 Mar 12
Philips Semiconductors
Product specification
Schottky barrier diode
BAT760
FEATURES
PINNING
• Ultra high-speed switching
• Very low forward voltage
• Guard ring protected
PIN
DESCRIPTION
1
2
cathode
anode
• Very small SMD plastic package.
k, 4 columns
APPLICATIONS
1
2
• Ultra high-speed switching
• Voltage clamping
MGU328
• Protection circuits.
Marking code: A4.
The marking bar indicates the cathode.
DESCRIPTION
Planar Schottky barrier diode with an integrated guard ring
for stress protection in a SOD323 (SC-76) very small SMD
plastic package.
Fig.1 Simplified outline (SOD323; SC-76) and
symbol.
ORDERING INFORMATION
TYPE
PACKAGE
DESCRIPTION
plastic surface mounted package; 2 leads
NUMBER
NAME
VERSION
BAT760
−
SOD323
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).
SYMBOL
VR
PARAMETER
CONDITIONS
MIN.
MAX.
20
UNIT
continuous reverse voltage
continuous forward current
−
−
−
V
A
A
IF
1
5
IFSM
non-repetitive peak forward current t = 8.3 ms half sinewave;
JEDEC method
Tstg
Tj
storage temperature
−65
−
+150
125
°C
°C
°C
junction temperature
Tamb
operating ambient temperature
−65
+125
2004 Jan 26
2
Philips Semiconductors
Product specification
Schottky barrier diode
BAT760
CHARACTERISTICS
Tamb = 25 °C unless otherwise specified.
SYMBOL
VF
PARAMETER
CONDITIONS
TYP.
MAX.
UNIT
continuous forward voltage
see Fig.2 and note 1
IF = 10 mA
240
270
mV
IF = 100 mA
IF = 1 A
300
480
350
550
mV
mV
IR
reverse current
see Fig.3 and note 1
VR = 5 V
5
10
20
50
25
µA
µA
µA
pF
VR = 8 V
7
VR = 15 V
10
Cd
diode capacitance
VR = 5 V; f = 1 MHz; see Fig.4 19
Note
1. Pulse test: tp = 300 µs; δ = 0.02.
THERMAL CHARACTERISTICS
SYMBOL
PARAMETER
thermal resistance from junction to ambient
CONDITIONS
VALUE
UNIT
Rth(j-a)
note 1
note 2
220
180
K/W
K/W
Notes
1. Mounted on printed-circuit board 10 × 10 mm2 Cu.
2. Mounted on printed-circuit board 40 × 40 mm2 Cu.
2004 Jan 26
3
Philips Semiconductors
Product specification
Schottky barrier diode
BAT760
GRAPHICAL DATA
MLD562
MLD563
3
5
10
10
handbook, halfpage
handbook, halfpage
I
R
I
F
(µA)
(mA)
(1)
(2)
4
10
2
10
3
10
(1)
(2)
(3)
10
2
10
(3)
1
10
−1
10
1
0
0
0.2
0.4
0.6
5
10
15
20
25
V
(V)
V
(V)
F
R
(1) Tamb = 125 °C.
(2) Tamb = 85 °C.
(3) Tamb = 25 °C.
(1) Tamb = 125 °C.
(2) Tamb = 85 °C.
(3) Tamb = 25 °C.
Fig.2 Forward current as a function of forward
voltage; typical values.
Fig.3 Reverse current as a function of reverse
voltage; typical values.
MLD564
80
handbook, halfpage
C
d
(pF)
60
40
20
0
0
5
10
15
20
V
(V)
R
Tamb = 25 °C; f = 1 MHz.
Fig.4 Diode capacitance as a function of reverse
voltage; typical values.
2004 Jan 26
4
Philips Semiconductors
Product specification
Schottky barrier diode
BAT760
PACKAGE OUTLINE
Plastic surface mounted package; 2 leads
SOD323
A
D
E
X
M
A
H
D
v
Q
1
2
b
p
A
A
1
(1)
c
L
p
detail X
0
1
2 mm
scale
DIMENSIONS (mm are the original dimensions)
A
1
UNIT
mm
b
c
D
E
H
L
p
Q
v
A
p
D
max
1.1
0.8
0.40 0.25
0.25 0.10
1.8
1.6
1.35
1.15
2.7
2.3
0.45 0.25
0.15 0.15
0.05
0.2
Note
1. The marking bar indicates the cathode
REFERENCES
JEDEC JEITA
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
99-09-13
03-12-17
SOD323
SC-76
2004 Jan 26
5
Philips Semiconductors
Product specification
Schottky barrier diode
BAT760
DATA SHEET STATUS
DATA SHEET
STATUS(1)
PRODUCT
STATUS(2)(3)
LEVEL
DEFINITION
I
Objective data
Development This data sheet contains data from the objective specification for product
development. Philips Semiconductors reserves the right to change the
specification in any manner without notice.
II
Preliminary data Qualification
This data sheet contains data from the preliminary specification.
Supplementary data will be published at a later date. Philips
Semiconductors reserves the right to change the specification without
notice, in order to improve the design and supply the best possible
product.
III
Product data
Production
This data sheet contains data from the product specification. Philips
Semiconductors reserves the right to make changes at any time in order
to improve the design, manufacturing and supply. Relevant changes will
be communicated via a Customer Product/Process Change Notification
(CPCN).
Notes
1. Please consult the most recently issued data sheet before initiating or completing a design.
2. The product status of the device(s) described in this data sheet may have changed since this data sheet was
published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com.
3. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.
DEFINITIONS
DISCLAIMERS
Short-form specification
The data in a short-form
Life support applications
These products are not
specification is extracted from a full data sheet with the
same type number and title. For detailed information see
the relevant data sheet or data handbook.
designed for use in life support appliances, devices, or
systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips
Semiconductors customers using or selling these products
for use in such applications do so at their own risk and
agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.
Limiting values definition Limiting values given are in
accordance with the Absolute Maximum Rating System
(IEC 60134). Stress above one or more of the limiting
values may cause permanent damage to the device.
These are stress ratings only and operation of the device
at these or at any other conditions above those given in the
Characteristics sections of the specification is not implied.
Exposure to limiting values for extended periods may
affect device reliability.
Right to make changes
Philips Semiconductors
reserves the right to make changes in the products -
including circuits, standard cells, and/or software -
described or contained herein in order to improve design
and/or performance. When the product is in full production
(status ‘Production’), relevant changes will be
Application information
Applications that are
communicated via a Customer Product/Process Change
Notification (CPCN). Philips Semiconductors assumes no
responsibility or liability for the use of any of these
products, conveys no licence or title under any patent,
copyright, or mask work right to these products, and
makes no representations or warranties that these
products are free from patent, copyright, or mask work
right infringement, unless otherwise specified.
described herein for any of these products are for
illustrative purposes only. Philips Semiconductors make
no representation or warranty that such applications will be
suitable for the specified use without further testing or
modification.
2004 Jan 26
6
Philips Semiconductors – a worldwide company
Contact information
For additional information please visit http://www.semiconductors.philips.com.
Fax: +31 40 27 24825
For sales offices addresses send e-mail to: sales.addresses@www.semiconductors.philips.com.
© Koninklijke Philips Electronics N.V. 2004
SCA76
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
R76/02/pp7
Date of release: 2004 Jan 26
Document order number: 9397 750 12625
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