BAV103/R,115 [NXP]
BAV102; BAV103 - Single general-purpose switching diodes MELF 2-Pin;型号: | BAV103/R,115 |
厂家: | NXP |
描述: | BAV102; BAV103 - Single general-purpose switching diodes MELF 2-Pin |
文件: | 总11页 (文件大小:100K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
BAV102; BAV103
Single general-purpose switching diodes
Rev. 4 — 6 August 2010
Product data sheet
1. Product profile
1.1 General description
Single general-purpose switching diodes, fabricated in planar technology, and
encapsulated in small hermetically sealed glass SOD80C Surface-Mounted
Device (SMD) packages.
Table 1.
Product overview
Type number
Package
NXP
Configuration
JEITA
BAV102
BAV103
SOD80C
-
single
1.2 Features and benefits
High switching speed: trr ≤ 50 ns
Low leakage current
Low capacitance: Cd ≤ 5 pF
Small hermetically sealed glass
SMD package
1.3 Applications
High-speed switching
Voltage clamping
General-purpose switching
Reverse polarity protection
1.4 Quick reference data
Table 2.
Quick reference data
Symbol Parameter
Conditions
Min
Typ
Max Unit
[1][2]
IF
forward current
-
-
250
mA
VR
reverse voltage
BAV102
-
-
-
-
-
-
150
200
50
V
BAV103
V
[3]
trr
reverse recovery time
ns
[1] Pulse test: tp ≤ 300 μs; δ ≤ 0.02.
[2] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.
[3] When switched from IF = 30 mA to IR = 30 mA; RL = 100 Ω; measured at IR = 3 mA.
BAV102; BAV103
NXP Semiconductors
Single general-purpose switching diodes
2. Pinning information
Table 3.
Pinning
Pin
1
Description
cathode
Simplified outline
Graphic symbol
[1]
k
a
2
anode
2
1
006aab040
[1] The marking band indicates the cathode.
3. Ordering information
Table 4.
Ordering information
Type number
Package
Name
-
Description
Version
BAV102
BAV103
hermetically sealed glass surface-mounted package; SOD80C
2 connectors
4. Marking
Table 5.
Marking codes
Type number
BAV102
Marking code
marking band
marking band
BAV103
5. Limiting values
Table 6.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter
VRRM repetitive peak reverse
voltage
BAV102
Conditions
Min
Max
Unit
-
-
200
250
V
V
BAV103
VR
reverse voltage
BAV102
-
-
-
-
150
200
250
625
V
BAV103
V
[1][2]
[3]
IF
forward current
mA
mA
IFRM
repetitive peak forward
current
IFSM
non-repetitive peak
forward current
square wave
tp = 1 μs
-
-
-
9
3
1
A
A
A
tp = 100 μs
tp = 1 s
BAV102_BAV103
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 4 — 6 August 2010
2 of 11
BAV102; BAV103
NXP Semiconductors
Single general-purpose switching diodes
Table 6.
Limiting values …continued
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter
Conditions
Min
-
Max
400
Unit
mW
°C
[2]
Ptot
Tj
total power dissipation
Tamb ≤ 25 °C
junction temperature
ambient temperature
storage temperature
-
175
Tamb
Tstg
−65
−65
+175
+175
°C
°C
[1] Pulse test: tp ≤ 300 μs; δ ≤ 0.02.
[2] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
[3] Tj = 25 °C prior to surge.
6. Thermal characteristics
Table 7.
Thermal characteristics
Symbol Parameter
Conditions
Min
Typ
Max Unit
[1]
Rth(j-a)
Rth(j-t)
thermal resistance from in free air
junction to ambient
-
-
375
K/W
thermal resistance from
junction to tie-point
-
-
300
K/W
[1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
7. Characteristics
Table 8.
Characteristics
Tamb = 25 °C unless otherwise specified.
Symbol Parameter Conditions
VF forward voltage
Min
Typ
Max Unit
[1]
IF = 100 mA
IF = 200 mA
-
-
-
-
1.0
V
V
1.25
IR
reverse current
BAV102
VR = 150 V
-
-
-
-
-
-
-
-
-
-
-
-
100
100
100
100
5
nA
μA
nA
μA
pF
ns
VR = 150 V; Tj = 150 °C
VR = 200 V
BAV103
VR = 200 V; Tj = 150 °C
f = 1 MHz; VR = 0 V
Cd
trr
diode capacitance
[2]
reverse recovery time
50
[1] Pulse test: tp ≤ 300 μs; δ ≤ 0.02.
[2] When switched from IF = 30 mA to IR = 30 mA; RL = 100 Ω; measured at IR = 3 mA.
BAV102_BAV103
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 4 — 6 August 2010
3 of 11
BAV102; BAV103
NXP Semiconductors
Single general-purpose switching diodes
mbg703
mbg459
2
10
600
I
I
F
FSM
(A)
(mA)
10
400
(1)
(2)
(3)
1
200
−1
10
0
2
3
4
1
10
10
10
10
0
1
2
V
F
(V)
t
p
(μs)
(1) Tamb = 150 °C; typical values
(2) Tamb = 25 °C; typical values
(3) Tamb = 25 °C; maximum values
Based on square wave currents.
Tj = 25 °C; prior to surge
Fig 1. Forward current as a function of forward
voltage
Fig 2. Non-repetitive peak forward current as a
function of pulse duration; maximum values
mgd005
mgd009
3
10
1.6
I
R
C
(pF)
d
(μA)
2
10
1.4
10
1
1.2
1.0
0.8
−1
10
−2
10
0
10
20
0
100
200
V
R
(V)
T (°C)
j
VR = VRmax
f = 1 MHz; Tamb = 25 °C
Solid line: maximum values
Dotted line: typical values
Fig 3. Reverse current as a function of junction
temperature
Fig 4. Diode capacitance as a function of reverse
voltage; typical values
BAV102_BAV103
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 4 — 6 August 2010
4 of 11
BAV102; BAV103
NXP Semiconductors
Single general-purpose switching diodes
mbh278
mgl588
300
300
V
R
I
F
(V)
(mA)
(1)
(2)
200
200
100
100
0
0
0
100
200
0
100
200
T
amb
(°C)
T
amb
(°C)
FR4 PCB, standard footprint
FR4 PCB, standard footprint
(1) BAV103
(2) BAV102
Fig 5. Forward current as a function of ambient
temperature; derating curve
Fig 6. Reverse voltage as a function of ambient
temperature; derating curve
8. Test information
t
r
t
p
t
D.U.T.
10 %
I
F
+ I
F
t
rr
R
S
= 50 Ω
SAMPLING
OSCILLOSCOPE
t
R
= 50 Ω
V = V + I × R
S
i
R
F
(1)
90 %
V
R
mga881
input signal
output signal
(1) IR = 1 mA
Fig 7. Reverse recovery time test circuit and waveforms
BAV102_BAV103
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 4 — 6 August 2010
5 of 11
BAV102; BAV103
NXP Semiconductors
Single general-purpose switching diodes
9. Package outline
1.60
1.45
0.3
0.3
3.7
3.3
Dimensions in mm
06-03-16
Fig 8. Package outline SOD80C
10. Packing information
Table 9.
Packing methods
The indicated -xxx are the last three digits of the 12NC ordering code.[1]
Type number
Package
Description
Packing quantity
2500
10000
BAV102
BAV103
SOD80C
4 mm pitch, 8 mm tape and reel
-115
-135
[1] For further information and the availability of packing methods, see Section 14.
BAV102_BAV103
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 4 — 6 August 2010
6 of 11
BAV102; BAV103
NXP Semiconductors
Single general-purpose switching diodes
11. Soldering
4.55
4.30
2.30
solder lands
solder paste
solder resist
occupied area
2.25 1.70 1.60
Dimensions in mm
0.90
(2x)
sod080c
Fig 9. Reflow soldering footprint SOD80C
6.30
4.90
2.70
1.90
solder lands
solder resist
occupied area
tracks
2.90 1.70
Dimensions in mm
sod080c
Fig 10. Wave soldering footprint SOD80C
BAV102_BAV103
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 4 — 6 August 2010
7 of 11
BAV102; BAV103
NXP Semiconductors
Single general-purpose switching diodes
12. Revision history
Table 10. Revision history
Document ID
Release date
20100806
Data sheet status
Change notice
Supersedes
BAV102_BAV103 v.4
Modifications:
Product data sheet
-
BAV102_BAV103_3
• Section 4 “Marking”: updated
• Section 13 “Legal information”: updated
BAV102_BAV103_3
BAV100_2
20070816
19960917
19960423
Product data sheet
Product specification
Product specification
-
-
-
BAV100_2
BAV100_1
-
BAV100_1
BAV102_BAV103
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 4 — 6 August 2010
8 of 11
BAV102; BAV103
NXP Semiconductors
Single general-purpose switching diodes
13. Legal information
13.1 Data sheet status
Document status[1][2]
Product status[3]
Development
Definition
Objective [short] data sheet
This document contains data from the objective specification for product development.
This document contains data from the preliminary specification.
This document contains the product specification.
Preliminary [short] data sheet Qualification
Product [short] data sheet Production
[1]
[2]
[3]
Please consult the most recently issued document before initiating or completing a design.
The term ‘short data sheet’ is explained in section “Definitions”.
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
malfunction of an NXP Semiconductors product can reasonably be expected
13.2 Definitions
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
13.3 Disclaimers
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from national authorities.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
BAV102_BAV103
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 4 — 6 August 2010
9 of 11
BAV102; BAV103
NXP Semiconductors
Single general-purpose switching diodes
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in automotive equipment or applications.
13.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
14. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
BAV102_BAV103
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 4 — 6 August 2010
10 of 11
BAV102; BAV103
NXP Semiconductors
Single general-purpose switching diodes
15. Contents
1
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1
1.2
1.3
1.4
General description . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits. . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Quick reference data . . . . . . . . . . . . . . . . . . . . 1
2
Pinning information. . . . . . . . . . . . . . . . . . . . . . 2
Ordering information. . . . . . . . . . . . . . . . . . . . . 2
Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2
Thermal characteristics . . . . . . . . . . . . . . . . . . 3
Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 3
Test information. . . . . . . . . . . . . . . . . . . . . . . . . 5
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 6
Packing information . . . . . . . . . . . . . . . . . . . . . 6
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Revision history. . . . . . . . . . . . . . . . . . . . . . . . . 8
3
4
5
6
7
8
9
10
11
12
13
Legal information. . . . . . . . . . . . . . . . . . . . . . . . 9
Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 9
Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 10
13.1
13.2
13.3
13.4
14
15
Contact information. . . . . . . . . . . . . . . . . . . . . 10
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2010.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 6 August 2010
Document identifier: BAV102_BAV103
相关型号:
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