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BB184,135

更新时间：2024-10-29 15:03:56
品牌：NXP
描述：BB184 - UHF variable capacitance diode SOD 2-Pin

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BB184,135 概述

BB184 - UHF variable capacitance diode SOD 2-Pin 变容二极管

BB184,135 规格参数

是否Rohs认证：符合生命周期：Obsolete
零件包装代码：SOD包装说明：R-PDSO-F2
针数：2Reach Compliance Code：unknown
ECCN代码：EAR99HTS代码：8541.10.00.70
风险等级：5.73Is Samacsys：N
其他特性：2% MATCHED SETS OF 5 DIODES ARE AVAILABLE最小击穿电压：13 V
配置：SINGLE二极管电容容差：9.29%
最小二极管电容比：6标称二极管电容：14 pF
二极管元件材料：SILICON二极管类型：VARIABLE CAPACITANCE DIODE
频带：ULTRA HIGH FREQUENCYJESD-30 代码：R-PDSO-F2
JESD-609代码：e3元件数量：1
端子数量：2最高工作温度：125 °C
最低工作温度：-55 °C封装主体材料：PLASTIC/EPOXY
封装形状：RECTANGULAR封装形式：SMALL OUTLINE
峰值回流温度（摄氏度）：260认证状态：Not Qualified
最大重复峰值反向电压：13 V子类别：Varactors
表面贴装：YES端子面层：TIN
端子形式：FLAT端子位置：DUAL
处于峰值回流温度下的最长时间：40Base Number Matches：1

BB184,135 数据手册

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BB184  
UHF low voltage variable capacitance diode  
Rev. 3 — 6 September 2011  
Product data sheet  
1. Product profile  
1.1 General description  
The BB184 is a variable capacitance diode, fabricated in planar technology, and  
encapsulated in the SOD523 (SC-79) ultra small SMD plastic package.  
1.2 Features and benefits  
Very steep CV curve  
Cd(1V): 14 pF; Cd(10V): 2 pF  
Cd(1V) to Cd(10V) ratio: typical 7  
Ultra small SMD plastic package.  
1.3 Applications  
Voltage Controlled Oscillators (VCO)  
Tuning in low voltage television.  
2. Pinning information  
Table 1.  
Discrete pinning  
Pin  
1
Description  
cathode  
Simplified outline  
Symbol  
2
anode  
1
2
sym008  
3. Ordering information  
Table 2.  
Ordering information  
Type number  
Package  
Name  
-
Description  
Version  
BB184  
plastic surface mounted package; 2 leads  
SOD523  
4. Marking  
Table 3.  
Marking  
Type number  
Marking code  
BB184  
A2  
 
 
 
 
 
 
 
BB184  
NXP Semiconductors  
UHF low voltage variable capacitance diode  
5. Limiting values  
Table 4.  
Limiting values  
In accordance with the Absolute Maximum Rating System (IEC 60134).  
Symbol Parameter Conditions  
Min  
-
Max  
13  
Unit  
V
VR  
IF  
continuous reverse voltage  
continuous forward current  
storage temperature  
-
10  
mA  
C  
Tstg  
Tj  
55  
55  
+150  
+125  
operating junction temperature  
C  
6. Characteristics  
Table 5.  
Electrical characteristics  
Tj = 25 C unless otherwise specified.  
Symbol  
Parameter  
Conditions  
Min  
Typ  
Max  
10  
Unit  
nA  
nA  
IR  
reverse current  
VR = 10 V; see Figure 2  
-
-
-
-
VR = 10 V; Tj = 85 C; see Figure 2  
diode series resistance f = 470 MHz; Cd = 9 pF  
-
200  
-
rs  
0.65  
Cd  
diode capacitance  
f = 1 MHz; see Figure 1 and 3  
VR = 1 V  
12.7  
-
14  
5.5  
2
15.3  
pF  
pF  
pF  
VR = 4 V  
-
VR = 10 V  
1.87  
6
2.13  
-
capacitance ratio  
f = 1 MHz  
7
Cd1V  
-----------------  
Cd10V  
capacitance matching VR = 1 to 10 V; in a sequence of 5 diodes  
(gliding)  
-
-
2
%
Cd  
---------  
Cd  
BB184  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2011. All rights reserved.  
Product data sheet  
Rev. 3 — 6 September 2011  
2 of 8  
 
 
BB184  
NXP Semiconductors  
UHF low voltage variable capacitance diode  
001aaa643  
25  
C
d
(pF)  
20  
15  
10  
5
0
10  
−1  
2
1
10  
10  
V
R
(V)  
f = 1 MHz; Tj = 25 C.  
Fig 1. Diode capacitance as a function of reverse voltage; typical values.  
001aaa657  
001aaa658  
3
−2  
10  
10  
I
TC  
R
d
(nA)  
-1  
(K  
)
2
−3  
10  
10  
10  
10  
−4  
10  
−5  
10  
1
−1  
2
0
20  
40  
60  
80  
100  
1
10  
10  
T (°C)  
j
V
(V)  
R
Fig 2. Reverse current as a function of junction  
temperature; maximum values.  
Fig 3. Temperature coefficient of diode capacitance  
as a function of reverse voltage; typical  
values.  
BB184  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2011. All rights reserved.  
Product data sheet  
Rev. 3 — 6 September 2011  
3 of 8  
BB184  
NXP Semiconductors  
UHF low voltage variable capacitance diode  
7. Package outline  
Plastic surface-mounted package; 2 leads  
SOD523  
A
c
v
M
A
H
E
A
D
0
0.5  
1 mm  
scale  
1
2
DIMENSIONS (mm are the original dimensions)  
b
E
p
UNIT  
A
b
c
D
E
H
v
p
E
0.34  
0.26  
0.17  
0.11  
0.65  
0.58  
1.25  
1.15  
0.85  
0.75  
1.65  
1.55  
mm  
0.1  
(1)  
Note  
1. The marking bar indicates the cathode.  
REFERENCES  
JEDEC  
EUROPEAN  
PROJECTION  
OUTLINE  
VERSION  
ISSUE DATE  
IEC  
JEITA  
02-12-13  
06-03-16  
SOD523  
SC-79  
Fig 4. Package outline.  
BB184  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2011. All rights reserved.  
Product data sheet  
Rev. 3 — 6 September 2011  
4 of 8  
 
BB184  
NXP Semiconductors  
UHF low voltage variable capacitance diode  
8. Revision history  
Table 6.  
Revision history  
Document ID  
BB184 v.3  
Release date  
Data sheet status  
Change notice  
Supersedes  
20110906  
Product data sheet  
-
BB184 v.2  
Modifications:  
• The format of this data sheet has been redesigned to comply with the new identity  
guidelines of NXP Semiconductors.  
• Legal texts have been adapted to the new company name where appropriate.  
• Package outline drawings have been updated to the latest version.  
BB184 v.2  
20040422  
Product data  
-
BB184_N v.1  
(9397 750 13004)  
BB184_N v.1  
20040114  
Preliminary data  
-
-
(9397 750 12694)  
BB184  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2011. All rights reserved.  
Product data sheet  
Rev. 3 — 6 September 2011  
5 of 8  
 
BB184  
NXP Semiconductors  
UHF low voltage variable capacitance diode  
9. Legal information  
9.1  
Data sheet status  
Document status[1][2]  
Product status[3]  
Definition  
Objective [short] data sheet  
Development  
This document contains data from the objective specification for product development.  
This document contains data from the preliminary specification.  
This document contains the product specification.  
Preliminary [short] data sheet Qualification  
Product [short] data sheet Production  
[1]  
[2]  
[3]  
Please consult the most recently issued document before initiating or completing a design.  
The term ‘short data sheet’ is explained in section “Definitions”.  
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status  
information is available on the Internet at URL http://www.nxp.com.  
malfunction of an NXP Semiconductors product can reasonably be expected  
to result in personal injury, death or severe property or environmental  
9.2  
Definitions  
damage. NXP Semiconductors accepts no liability for inclusion and/or use of  
NXP Semiconductors products in such equipment or applications and  
therefore such inclusion and/or use is at the customer’s own risk.  
Draft — The document is a draft version only. The content is still under  
internal review and subject to formal approval, which may result in  
modifications or additions. NXP Semiconductors does not give any  
representations or warranties as to the accuracy or completeness of  
information included herein and shall have no liability for the consequences of  
use of such information.  
Applications — Applications that are described herein for any of these  
products are for illustrative purposes only. NXP Semiconductors makes no  
representation or warranty that such applications will be suitable for the  
specified use without further testing or modification.  
Short data sheet — A short data sheet is an extract from a full data sheet  
with the same product type number(s) and title. A short data sheet is intended  
for quick reference only and should not be relied upon to contain detailed and  
full information. For detailed and full information see the relevant full data  
sheet, which is available on request via the local NXP Semiconductors sales  
office. In case of any inconsistency or conflict with the short data sheet, the  
full data sheet shall prevail.  
Customers are responsible for the design and operation of their applications  
and products using NXP Semiconductors products, and NXP Semiconductors  
accepts no liability for any assistance with applications or customer product  
design. It is customer’s sole responsibility to determine whether the NXP  
Semiconductors product is suitable and fit for the customer’s applications and  
products planned, as well as for the planned application and use of  
customer’s third party customer(s). Customers should provide appropriate  
design and operating safeguards to minimize the risks associated with their  
applications and products.  
Product specification — The information and data provided in a Product  
data sheet shall define the specification of the product as agreed between  
NXP Semiconductors and its customer, unless NXP Semiconductors and  
customer have explicitly agreed otherwise in writing. In no event however,  
shall an agreement be valid in which the NXP Semiconductors product is  
deemed to offer functions and qualities beyond those described in the  
Product data sheet.  
NXP Semiconductors does not accept any liability related to any default,  
damage, costs or problem which is based on any weakness or default in the  
customer’s applications or products, or the application or use by customer’s  
third party customer(s). Customer is responsible for doing all necessary  
testing for the customer’s applications and products using NXP  
Semiconductors products in order to avoid a default of the applications and  
the products or of the application or use by customer’s third party  
customer(s). NXP does not accept any liability in this respect.  
9.3  
Disclaimers  
Limiting values — Stress above one or more limiting values (as defined in  
the Absolute Maximum Ratings System of IEC 60134) will cause permanent  
damage to the device. Limiting values are stress ratings only and (proper)  
operation of the device at these or any other conditions above those given in  
the Recommended operating conditions section (if present) or the  
Characteristics sections of this document is not warranted. Constant or  
repeated exposure to limiting values will permanently and irreversibly affect  
the quality and reliability of the device.  
Limited warranty and liability — Information in this document is believed to  
be accurate and reliable. However, NXP Semiconductors does not give any  
representations or warranties, expressed or implied, as to the accuracy or  
completeness of such information and shall have no liability for the  
consequences of use of such information.  
In no event shall NXP Semiconductors be liable for any indirect, incidental,  
punitive, special or consequential damages (including - without limitation - lost  
profits, lost savings, business interruption, costs related to the removal or  
replacement of any products or rework charges) whether or not such  
damages are based on tort (including negligence), warranty, breach of  
contract or any other legal theory.  
Terms and conditions of commercial sale — NXP Semiconductors  
products are sold subject to the general terms and conditions of commercial  
sale, as published at http://www.nxp.com/profile/terms, unless otherwise  
agreed in a valid written individual agreement. In case an individual  
agreement is concluded only the terms and conditions of the respective  
agreement shall apply. NXP Semiconductors hereby expressly objects to  
applying the customer’s general terms and conditions with regard to the  
purchase of NXP Semiconductors products by customer.  
Notwithstanding any damages that customer might incur for any reason  
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards  
customer for the products described herein shall be limited in accordance  
with the Terms and conditions of commercial sale of NXP Semiconductors.  
Right to make changes — NXP Semiconductors reserves the right to make  
changes to information published in this document, including without  
limitation specifications and product descriptions, at any time and without  
notice. This document supersedes and replaces all information supplied prior  
to the publication hereof.  
No offer to sell or license — Nothing in this document may be interpreted or  
construed as an offer to sell products that is open for acceptance or the grant,  
conveyance or implication of any license under any copyrights, patents or  
other industrial or intellectual property rights.  
Export control — This document as well as the item(s) described herein  
may be subject to export control regulations. Export might require a prior  
authorization from national authorities.  
Suitability for use — NXP Semiconductors products are not designed,  
authorized or warranted to be suitable for use in life support, life-critical or  
safety-critical systems or equipment, nor in applications where failure or  
BB184  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2011. All rights reserved.  
Product data sheet  
Rev. 3 — 6 September 2011  
6 of 8  
 
 
 
 
BB184  
NXP Semiconductors  
UHF low voltage variable capacitance diode  
Non-automotive qualified products — Unless this data sheet expressly  
states that this specific NXP Semiconductors product is automotive qualified,  
the product is not suitable for automotive use. It is neither qualified nor tested  
in accordance with automotive testing or application requirements. NXP  
Semiconductors accepts no liability for inclusion and/or use of  
NXP Semiconductors’ specifications such use shall be solely at customer’s  
own risk, and (c) customer fully indemnifies NXP Semiconductors for any  
liability, damages or failed product claims resulting from customer design and  
use of the product for automotive applications beyond NXP Semiconductors’  
standard warranty and NXP Semiconductors’ product specifications.  
non-automotive qualified products in automotive equipment or applications.  
In the event that customer uses the product for design-in and use in  
automotive applications to automotive specifications and standards, customer  
(a) shall use the product without NXP Semiconductors’ warranty of the  
product for such automotive applications, use and specifications, and (b)  
whenever customer uses the product for automotive applications beyond  
9.4  
Trademarks  
Notice: All referenced brands, product names, service names and trademarks  
are the property of their respective owners.  
10. Contact information  
For more information, please visit: http://www.nxp.com  
For sales office addresses, please send an email to: salesaddresses@nxp.com  
BB184  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2011. All rights reserved.  
Product data sheet  
Rev. 3 — 6 September 2011  
7 of 8  
 
 
BB184  
NXP Semiconductors  
UHF low voltage variable capacitance diode  
11. Contents  
1
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1  
1.1  
1.2  
1.3  
General description . . . . . . . . . . . . . . . . . . . . . 1  
Features and benefits. . . . . . . . . . . . . . . . . . . . 1  
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1  
2
3
4
5
6
7
8
Pinning information. . . . . . . . . . . . . . . . . . . . . . 1  
Ordering information. . . . . . . . . . . . . . . . . . . . . 1  
Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1  
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2  
Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 2  
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 4  
Revision history. . . . . . . . . . . . . . . . . . . . . . . . . 5  
9
Legal information. . . . . . . . . . . . . . . . . . . . . . . . 6  
Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 6  
Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6  
Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . . 6  
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 7  
9.1  
9.2  
9.3  
9.4  
10  
11  
Contact information. . . . . . . . . . . . . . . . . . . . . . 7  
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8  
Please be aware that important notices concerning this document and the product(s)  
described herein, have been included in section ‘Legal information’.  
© NXP B.V. 2011.  
All rights reserved.  
For more information, please visit: http://www.nxp.com  
For sales office addresses, please send an email to: salesaddresses@nxp.com  
Date of release: 6 September 2011  
Document identifier: BB184  
 

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