BC848ATRL [NXP]
TRANSISTOR 200 mA, 30 V, NPN, Si, SMALL SIGNAL TRANSISTOR, BIP General Purpose Small Signal;
| 型号： | BC848ATRL |
| 厂家： | 
NXP |
| 描述： | TRANSISTOR 200 mA, 30 V, NPN, Si, SMALL SIGNAL TRANSISTOR, BIP General Purpose Small Signal 晶体 晶体管 光电二极管 |
| 文件： | 总12页 (文件大小：125K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
BC848 series
30 V, 100 mA NPN general-purpose transistors
Rev. 07 — 17 November 2009
Product data sheet
1. Product profile
1.1 General description
NPN general-purpose transistors in Surface Mounted Device (SMD) plastic packages.
Table 1. Product overview
Type number
Package
NXP
PNP
complement
JEITA
-
JEDEC
BC848B
BC848W
SOT23
SOT323
TO-236AB
-
BC858B
BC858W
SC-70
1.2 Features
General-purpose transistors
SMD plastic packages
1.3 Applications
General-purpose switching and amplification
1.4 Quick reference data
Table 2.
Symbol
VCEO
IC
Quick reference data
Parameter
Conditions
Min
Typ
Max
30
Unit
collector-emitter voltage
collector current
open base
-
-
-
-
V
100
mA
hFE
DC current gain
VCE = 5 V;
IC = 2 mA
BC848B
BC848W
200
110
290
-
450
800
BC848 series
NXP Semiconductors
30 V, 100 mA NPN general-purpose transistors
2. Pinning information
Table 3.
Pinning
Pin
1
Description
base
Simplified outline
Symbol
3
3
2
emitter
3
collector
1
2
1
2
sym021
006aaa144
3. Ordering information
Table 4.
Ordering information
Type number
Package
Name
-
Description
Version
BC848B
BC848W
plastic surface mounted package; 3 leads
plastic surface mounted package; 3 leads
SOT23
SC-70
SOT323
4. Marking
Table 5.
Marking codes
Type number
BC848B
Marking code[1]
1K*
BC848W
1M*
[1] * = -: made in Hong Kong
* = p: made in Hong Kong
* = t: made in Malaysia
* = W: made in China
BC848_SER_7
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 07 — 17 November 2009
2 of 12
BC848 series
NXP Semiconductors
30 V, 100 mA NPN general-purpose transistors
5. Limiting values
Table 6.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
VCBO
VCEO
VEBO
IC
Parameter
Conditions
open emitter
open base
Min
Max
30
Unit
V
collector-base voltage
collector-emitter voltage
emitter-base voltage
collector current
-
-
-
-
-
30
V
open collector
5
V
100
200
mA
mA
ICM
peak collector current
single pulse;
tp ≤ 1 ms
IBM
Ptot
peak base current
single pulse;
tp ≤ 1 ms
-
200
mA
[1]
total power dissipation
SOT23
Tamb ≤ 25 °C
-
250
mW
mW
°C
SOT323
-
200
Tj
junction temperature
ambient temperature
storage temperature
-
150
Tamb
Tstg
−65
−65
+150
+150
°C
°C
[1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.
6. Thermal characteristics
Table 7.
Thermal characteristics
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
[1]
Rth(j-a)
thermal resistance from
junction to ambient
in free air
SOT23
-
-
-
-
500
625
K/W
K/W
SOT323
[1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
BC848_SER_7
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 07 — 17 November 2009
3 of 12
BC848 series
NXP Semiconductors
30 V, 100 mA NPN general-purpose transistors
7. Characteristics
Table 8.
Characteristics
T
amb = 25 °C unless otherwise specified.
Symbol Parameter Conditions
Min
Typ
Max
15
5
Unit
nA
ICBO
collector-base cut-off VCB = 30 V; IE = 0 A
-
-
-
-
current
VCB = 30 V; IE = 0 A;
μA
Tj = 150 °C
IEBO
hFE
emitter-base cut-off VEB = 5 V; IE = 0 A
current
-
-
-
100
-
nA
DC current gain
VCE = 5 V; IC = 10 μA
VCE = 5 V; IC = 2 mA
BC848B
150
200
290
-
450
800
250
600
-
BC848W
110
VCEsat
VBEsat
VBE
collector-emitter
saturation voltage
IC = 10 mA; IB = 0.5 mA
IC = 100 mA; IB = 5 mA
IC = 10 mA; IB = 0.5 mA
IC = 100 mA; IB = 5 mA
-
90
200
700
900
660
-
mV
mV
mV
mV
mV
mV
MHz
[1]
[2]
[2]
[3]
[3]
-
base-emitter
saturation voltage
-
-
-
base-emitter voltage IC = 2 mA; VCE = 5 V
IC = 10 mA; VCE = 5 V
580
-
700
770
-
fT
transition frequency VCE = 5 V; IC = 10 mA;
f = 100 MHz
100
-
Cc
NF
collector capacitance VCB = 10 V; IE = ie = 0 A;
f = 1 MHz
-
-
2.5
2
3
pF
dB
noise figure
VCE = 5 V; IC = 200 μA;
RS = 2 kΩ; f = 1 kHz;
B = 200 Hz
10
[1] Pulse test: tp ≤ 300 μs; δ ≤ 0.02.
[2] VBEsat decreases by approximately 1.7 mV/K with increasing temperature.
[3] VBE decreases by approximately 2 mV/K with increasing temperature.
BC848_SER_7
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 07 — 17 November 2009
4 of 12
BC848 series
NXP Semiconductors
30 V, 100 mA NPN general-purpose transistors
mgt727
mgt728
600
1200
V
BE
h
FE
(mV)
1000
(1)
(2)
500
(1)
(2)
400
300
200
100
0
800
600
400
200
0
(3)
(3)
−2
−1
2
3
−1
2
3
10
10
1
10
10
10
10
1
10
10
10
I
(mA)
I
(mA)
C
C
VCE = 5 V
VCE = 5 V
(1) Tamb = 150 °C
(2) Tamb = 25 °C
(3) Tamb = −55 °C
(1) Tamb = −55 °C
(2) Tamb = 25 °C
(3) Tamb = 150 °C
Fig 1. BC848B: DC current gain as a function of
collector current; typical values
Fig 2. BC848B: Base-emitter voltage as a function of
collector current; typical values
mgt729
mgt730
4
10
1200
BEsat
V
(mV)
1000
V
CEsat
(mV)
(1)
(2)
3
10
800
600
400
200
0
(3)
2
10
(1)
(3) (2)
10
10
−1
2
3
−1
2
3
1
10
10
10
10
1
10
10
10
I
(mA)
I (mA)
C
C
IC/IB = 20
IC/IB = 10
(1) Tamb = 150 °C
(2) Tamb = 25 °C
(3) Tamb = −55 °C
(1) Tamb = −55 °C
(2) Tamb = 25 °C
(3) Tamb = 150 °C
Fig 3. BC848B: Collector-emitter saturation voltage
as a function of collector current; typical
values
Fig 4. BC848B: Base-emitter saturation voltage as a
function of collector current; typical values
BC848_SER_7
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 07 — 17 November 2009
5 of 12
BC848 series
NXP Semiconductors
30 V, 100 mA NPN general-purpose transistors
8. Package outline
3.0
2.8
1.1
0.9
2.2
1.8
1.1
0.8
0.45
0.15
3
3
0.45
0.15
2.5 1.4
2.1 1.2
2.2 1.35
2.0 1.15
1
2
1
2
0.4
0.3
0.25
0.10
0.48
0.38
0.15
0.09
1.9
1.3
Dimensions in mm
04-11-04
Dimensions in mm
04-11-04
Fig 5. Package outline SOT23 (TO-236AB)
Fig 6. Package outline SOT323 (SC-70)
9. Packing information
Table 9.
Packing methods
The indicated -xxx are the last three digits of the 12NC ordering code.[1]
Type number
Package
Description
Packing quantity
3000
-215
-115
10000
-235
BC848B
BC848W
SOT23
4 mm pitch, 8 mm tape and reel
4 mm pitch, 8 mm tape and reel
SOT323
-135
[1] For further information and the availability of packing methods, see Section 14.
BC848_SER_7
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 07 — 17 November 2009
6 of 12
BC848 series
NXP Semiconductors
30 V, 100 mA NPN general-purpose transistors
10. Soldering
2.90
2.50
solder lands
solder resist
2
1
0.85
0.85
occupied area
solder paste
2.70
3.00
1.30
3
0.60
(3x)
0.50 (3x)
0.60 (3x)
1.00
3.30
MSA439
Dimensions in mm
Fig 7. Reflow soldering footprint SOT23 (TO-236AB)
3.40
1.20 (2x)
solder lands
solder resist
occupied area
2
1
4.60 4.00 1.20
3
preferred transport direction during soldering
2.80
4.50
MSA427
Dimensions in mm
Fig 8. Wave soldering footprint SOT23 (TO-236AB)
BC848_SER_7
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 07 — 17 November 2009
7 of 12
BC848 series
NXP Semiconductors
30 V, 100 mA NPN general-purpose transistors
2.65
0.75
1.30
1.325
solder lands
2
solder paste
0.50
3
0.60
(3×)
2.35 0.85
1.90
(3×)
solder resist
occupied area
1
Dimensions in mm
0.55
(3×)
msa429
2.40
Fig 9. Reflow soldering footprint SOT323 (SC-70)
4.60
4.00
1.15
2
3
3.65 2.10
2.70
solder lands
0.90
(2×)
solder resist
1
occupied area
Dimensions in mm
msa419
preferred transport direction during soldering
Fig 10. Wave soldering footprint SOT323 (SC-70)
BC848_SER_7
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 07 — 17 November 2009
8 of 12
BC848 series
NXP Semiconductors
30 V, 100 mA NPN general-purpose transistors
11. Mounting
43.4
43.4
0.7
0.6
0.6
40
0.55
0.6
40
0.7
0.5
0.5
006aaa672
Dimensions in mm
006aaa527
Dimensions in mm
PCB thickness:
FR4 PCB = 1.6 mm
PCB thickness:
FR4 PCB = 1.6 mm
Fig 11. FR4 PCB, standard footprint
SOT23 (TO-236AB)
Fig 12. FR4 PCB, standard footprint
SOT323 (SC-70)
BC848_SER_7
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 07 — 17 November 2009
9 of 12
BC848 series
NXP Semiconductors
30 V, 100 mA NPN general-purpose transistors
12. Revision history
Table 10. Revision history
Document ID
BC848_SER_7
Modifications:
Release date
20091117
Data sheet status
Change notice
Supersedes
Product data sheet
-
BC848_SER_6
• This data sheet was changed to reflect the new company name NXP Semiconductors,
including new legal definitions and disclaimers. No changes were made to the technical
content.
• Figure 9 “Reflow soldering footprint SOT323 (SC-70)”: updated
• Figure 10 “Wave soldering footprint SOT323 (SC-70)”: updated
BC848_SER_6
20060203
Product data sheet
-
BC846_BC847_
BC848_5
BC846W_BC847W_
BC848W_4
BC846_BC847_BC848_5 20040206
Product specification
Product specification
-
-
BC846_BC847_
BC848_4
BC846W_BC847W_
BC848W_4
20020204
BC846W_847W_3
BC848_SER_7
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 07 — 17 November 2009
10 of 12
BC848 series
NXP Semiconductors
30 V, 100 mA NPN general-purpose transistors
13. Legal information
13.1 Data sheet status
Document status[1][2]
Product status[3]
Development
Definition
Objective [short] data sheet
This document contains data from the objective specification for product development.
This document contains data from the preliminary specification.
This document contains the product specification.
Preliminary [short] data sheet Qualification
Product [short] data sheet Production
[1]
[2]
[3]
Please consult the most recently issued document before initiating or completing a design.
The term ‘short data sheet’ is explained in section “Definitions”.
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
13.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.nxp.com/profile/terms, including those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between information in this document and such
terms and conditions, the latter will prevail.
13.3 Disclaimers
General — Information in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give any representations or
warranties, expressed or implied, as to the accuracy or completeness of such
information and shall have no liability for the consequences of use of such
information.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from national authorities.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
13.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
14. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
BC848_SER_7
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 07 — 17 November 2009
11 of 12
BC848 series
NXP Semiconductors
30 V, 100 mA NPN general-purpose transistors
15. Contents
1
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1
1.2
1.3
1.4
General description . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Quick reference data . . . . . . . . . . . . . . . . . . . . 1
2
Pinning information. . . . . . . . . . . . . . . . . . . . . . 2
Ordering information. . . . . . . . . . . . . . . . . . . . . 2
Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3
Thermal characteristics . . . . . . . . . . . . . . . . . . 3
Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 4
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 6
Packing information . . . . . . . . . . . . . . . . . . . . . 6
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Mounting. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Revision history. . . . . . . . . . . . . . . . . . . . . . . . 10
3
4
5
6
7
8
9
10
11
12
13
Legal information. . . . . . . . . . . . . . . . . . . . . . . 11
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 11
Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 11
13.1
13.2
13.3
13.4
14
15
Contact information. . . . . . . . . . . . . . . . . . . . . 11
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2009.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 17 November 2009
Document identifier: BC848_SER_7
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