BC857BV [NXP]

PNP general purpose double transistor; PNP通用双晶体管
BC857BV
型号: BC857BV
厂家: NXP    NXP
描述:

PNP general purpose double transistor
PNP通用双晶体管

晶体 小信号双极晶体管 光电二极管
文件: 总8页 (文件大小:56K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
DISCRETE SEMICONDUCTORS  
DATA SHEET  
BC857BV  
PNP general purpose double  
transistor  
Product specification  
2001 Nov 07  
Supersedes data of 2001 Sep 10  
Philips Semiconductors  
Product specification  
PNP general purpose double transistor  
BC857BV  
FEATURES  
PINNING  
300 mW total power dissipation  
PIN  
1, 4  
2, 5  
6, 3  
DESCRIPTION  
Very small 1.6 mm × 1.2 mm × 0.55 mm ultra thin  
package  
emitter  
base  
TR1; TR2  
TR1; TR2  
TR1; TR2  
Excellent coplanarity due to straight leads  
Improved thermal behaviour due to flat leads  
collector  
Reduces number of components as replacement of two  
SC-75/SC-89 packaged BISS transistors  
Reduces required board space  
Reduces pick and place costs.  
6
1
5
2
4
6
5
4
APPLICATIONS  
TR2  
General purpose switching and amplification.  
TR1  
DESCRIPTION  
1
2
3
3
PNP double transistor in a SOT666 plastic package.  
NPN complement: BC847BV.  
Top view  
MAM450  
MARKING  
TYPE NUMBER  
BC857BV  
MARKING CODE  
Fig.1 Simplified outline (SOT666) and symbol.  
3F  
2001 Nov 07  
2
Philips Semiconductors  
Product specification  
PNP general purpose double transistor  
BC857BV  
LIMITING VALUES  
In accordance with the Absolute Maximum Rating System (IEC 60134).  
SYMBOL  
PARAMETER  
CONDITIONS  
MIN.  
MAX.  
UNIT  
Per transistor  
VCBO  
VCEO  
VEBO  
IC  
collector-base voltage  
open emitter  
50  
V
V
V
collector-emitter voltage  
emitter-base voltage  
collector current (DC)  
peak collector current  
peak base current  
open base  
45  
open collector  
5  
100  
200  
200  
200  
mA  
mA  
mA  
mW  
°C  
ICM  
IBM  
Ptot  
Tstg  
Tj  
total power dissipation  
storage temperature  
junction temperature  
operating ambient temperature  
Tamb 25 °C; note 1  
65  
+150  
150  
°C  
Tamb  
65  
+150  
°C  
Per device  
Ptot  
total power dissipation  
Tamb 25 °C; note 1  
300  
mW  
Note  
1. Transistor mounted on an FR4 printed-circuit board.  
THERMAL CHARACTERISTICS  
SYMBOL  
PARAMETER  
CONDITIONS  
VALUE  
416  
UNIT  
Rth j-a  
thermal resistance from junction to ambient notes 1 and 2  
K/W  
Notes  
1. Transistor mounted on an FR4 printed-circuit board.  
2. The only recommended soldering method is reflow soldering.  
2001 Nov 07  
3
Philips Semiconductors  
Product specification  
PNP general purpose double transistor  
BC857BV  
CHARACTERISTICS  
Tamb = 25 °C; unless otherwise specified.  
SYMBOL  
PARAMETER  
CONDITIONS  
MIN.  
TYP. MAX. UNIT  
Per transistor  
ICBO  
collector-base cut-off current  
IE = 0; VCB = 30 V  
15  
5  
nA  
µA  
nA  
IE = 0; VCB = 30 V; Tj = 150 °C  
IC = 0; VEB = 5 V  
IEBO  
hFE  
emitter-base cut-off current  
DC current gain  
100  
450  
750  
100  
400  
IC = 2 mA; VCE = 5 V  
IC = 2 mA; VCE = 5 V  
200  
VBE  
base-emitter voltage  
600  
655  
mV  
mV  
mV  
mV  
pF  
VCEsat  
collector-emitter saturation voltage IC = 10 mA; IB = 0.5 mA  
IC = 100 mA; IB = 5. mA; note 1  
VBEsat  
Cc  
base-emitter saturation voltage  
collector capacitance  
IC = 10 mA; IB = 0.5 mA  
755  
IE = ie = 0; VCB = 10 V; f = 1 MHz  
2.2  
Ce  
emitter capacitance  
IC = ic = 0; VEB = 500 mV;  
10  
pF  
f = 1 MHz  
fT  
transition frequency  
IC = 10 mA; VCE = 5 V;  
100  
MHz  
f = 100 MHz  
Note  
1. Pulse test: tp 300 µs; δ ≤ 0.02.  
2001 Nov 07  
4
Philips Semiconductors  
Product specification  
PNP general purpose double transistor  
BC857BV  
Graphical information BC857BV  
MHB975  
MHB976  
1000  
1200  
handbook, halfpage  
handbook, halfpage  
V
BE  
(mV)  
h
FE  
1000  
800  
(1)  
(2)  
800  
600  
400  
600  
(1)  
400  
(2)  
(3)  
200  
(3)  
200  
0  
0
10  
2  
1  
2
I
3
2  
1  
2
3
10  
1
10  
10  
10  
(mA)  
10  
10  
1  
10  
10  
10  
(mA)  
C
I
C
VCE = 5 V.  
(1) Tamb = 55 °C.  
(2) Tamb = 25 °C.  
(3) Tamb = 150 °C.  
VCE = 5 V.  
(1) Tamb = 150 °C.  
(2) Tamb = 25 °C.  
(3) Tamb = 55 °C.  
Fig.3 Base-emitter voltage as a function of  
collector current; typical values.  
Fig.2 DC current gain; typical values.  
MHB977  
MHB978  
4
10  
1200  
BEsat  
(mV)  
handbook, halfpage  
handbook, halfpage  
V
V
CEsat  
(mV)  
1000  
(1)  
3
10  
800  
(2)  
600  
(3)  
2
10  
400  
(1)  
200  
(2)  
(3)  
10  
10  
0
10  
1  
2
3
1  
2
3
1  
10  
10  
10  
1  
10  
10  
10  
I
(mA)  
I
(mA)  
C
C
IC/IB = 20.  
IC/IB 20.  
(1) Tamb = 150 °C.  
(2) Tamb = 25 °C.  
(3) Tamb = 55 °C.  
(1) Tamb = 55 °C.  
(2) Tamb = 25 °C.  
(3) Tamb = 150 °C.  
Fig.4 Collector-emitter saturation voltage as a  
function of collector current; typical values.  
Fig.5 Base-emitter saturation voltage as a  
function of collector current; typical values.  
2001 Nov 07  
5
Philips Semiconductors  
Product specification  
PNP general purpose double transistor  
BC857BV  
PACKAGE OUTLINE  
Plastic surface mounted package; 6 leads  
SOT666  
D
A
E
X
Y
S
S
H
E
6
5
4
pin 1 index  
A
c
1
2
3
e
1
b
p
w
M
A
L
p
e
detail X  
0
1
2 mm  
scale  
DIMENSIONS (mm are the original dimensions)  
UNIT  
b
c
D
E
e
e
H
L
w
y
A
p
p
1
E
0.6  
0.5  
0.27  
0.17  
0.18  
0.08  
1.7  
1.5  
1.3  
1.1  
1.7  
1.5  
0.3  
0.1  
mm  
1.0  
0.5  
0.1  
0.1  
REFERENCES  
JEDEC  
EUROPEAN  
PROJECTION  
OUTLINE  
VERSION  
ISSUE DATE  
IEC  
EIAJ  
01-01-04  
01-08-27  
SOT666  
2001 Nov 07  
6
Philips Semiconductors  
Product specification  
PNP general purpose double transistor  
BC857BV  
DATA SHEET STATUS  
PRODUCT  
DATA SHEET STATUS(1)  
STATUS(2)  
DEFINITIONS  
Objective data  
Development This data sheet contains data from the objective specification for product  
development. Philips Semiconductors reserves the right to change the  
specification in any manner without notice.  
Preliminary data  
Qualification  
This data sheet contains data from the preliminary specification.  
Supplementary data will be published at a later date. Philips  
Semiconductors reserves the right to change the specification without  
notice, in order to improve the design and supply the best possible  
product.  
Product data  
Production  
This data sheet contains data from the product specification. Philips  
Semiconductors reserves the right to make changes at any time in order  
to improve the design, manufacturing and supply. Changes will be  
communicated according to the Customer Product/Process Change  
Notification (CPCN) procedure SNW-SQ-650A.  
Notes  
1. Please consult the most recently issued data sheet before initiating or completing a design.  
2. The product status of the device(s) described in this data sheet may have changed since this data sheet was  
published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com.  
DEFINITIONS  
DISCLAIMERS  
Short-form specification  
The data in a short-form  
Life support applications  
These products are not  
specification is extracted from a full data sheet with the  
same type number and title. For detailed information see  
the relevant data sheet or data handbook.  
designed for use in life support appliances, devices, or  
systems where malfunction of these products can  
reasonably be expected to result in personal injury. Philips  
Semiconductors customers using or selling these products  
for use in such applications do so at their own risk and  
agree to fully indemnify Philips Semiconductors for any  
damages resulting from such application.  
Limiting values definition Limiting values given are in  
accordance with the Absolute Maximum Rating System  
(IEC 60134). Stress above one or more of the limiting  
values may cause permanent damage to the device.  
These are stress ratings only and operation of the device  
at these or at any other conditions above those given in the  
Characteristics sections of the specification is not implied.  
Exposure to limiting values for extended periods may  
affect device reliability.  
Right to make changes  
Philips Semiconductors  
reserves the right to make changes, without notice, in the  
products, including circuits, standard cells, and/or  
software, described or contained herein in order to  
improve design and/or performance. Philips  
Semiconductors assumes no responsibility or liability for  
the use of any of these products, conveys no licence or title  
under any patent, copyright, or mask work right to these  
products, and makes no representations or warranties that  
these products are free from patent, copyright, or mask  
work right infringement, unless otherwise specified.  
Application information  
Applications that are  
described herein for any of these products are for  
illustrative purposes only. Philips Semiconductors make  
no representation or warranty that such applications will be  
suitable for the specified use without further testing or  
modification.  
2001 Nov 07  
7
Philips Semiconductors – a worldwide company  
Contact information  
For additional information please visit http://www.semiconductors.philips.com.  
Fax: +31 40 27 24825  
For sales offices addresses send e-mail to: sales.addresses@www.semiconductors.philips.com.  
© Koninklijke Philips Electronics N.V. 2001  
SCA73  
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.  
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed  
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license  
under patent- or other industrial or intellectual property rights.  
Printed in The Netherlands  
613514/02/pp8  
Date of release: 2001 Nov 07  
Document order number: 9397 750 09041  

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