BCP55-10TRL13 [NXP]

TRANSISTOR 1 A, 60 V, NPN, Si, POWER TRANSISTOR, PLASTIC, SC-73, 4 PIN, BIP General Purpose Power;
BCP55-10TRL13
型号: BCP55-10TRL13
厂家: NXP    NXP
描述:

TRANSISTOR 1 A, 60 V, NPN, Si, POWER TRANSISTOR, PLASTIC, SC-73, 4 PIN, BIP General Purpose Power

开关 光电二极管 晶体管
文件: 总8页 (文件大小:49K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
DISCRETE SEMICONDUCTORS  
DATA SHEET  
book, halfpage  
M3D087  
BCP54; BCP55; BCP56  
NPN medium power transistors  
Product specification  
2001 Oct 10  
Supersedes data of 1999 Apr 08  
Philips Semiconductors  
Product specification  
NPN medium power transistors  
BCP54; BCP55; BCP56  
FEATURES  
PINNING  
PIN  
High current (max. 1 A)  
Low voltage (max. 80 V).  
DESCRIPTION  
1
2, 4  
3
base  
collector  
emitter  
APPLICATIONS  
Switching.  
4
handbook, halfpage  
DESCRIPTION  
2, 4  
NPN medium power transistor in a SOT223 plastic  
package. PNP complements: BCP51, BCP52 and BCP53.  
1
3
1
2
3
Top view  
MAM287  
Fig.1 Simplified outline (SOT223) and symbol.  
LIMITING VALUES  
In accordance with the Absolute Maximum Rating System (IEC 60134).  
SYMBOL  
PARAMETER  
collector-base voltage  
CONDITIONS  
open emitter  
MIN.  
MAX.  
UNIT  
VCBO  
BCP54  
45  
V
V
V
BCP55  
60  
BCP56  
100  
VCEO  
collector-emitter voltage  
BCP54  
open base  
45  
V
V
V
V
A
A
A
BCP55  
60  
BCP56  
80  
VEBO  
IC  
emitter-base voltage  
collector current (DC)  
peak collector current  
peak base current  
total power dissipation  
storage temperature  
junction temperature  
operating ambient temperature  
open collector  
5
1
ICM  
IBM  
Ptot  
Tstg  
Tj  
1.5  
0.2  
1.33  
+150  
150  
+150  
Tamb 25 °C; note 1  
W
65  
°C  
°C  
°C  
Tamb  
65  
Note  
1. Device mounted on printed-circuit board, single sided copper, tinplated, mounting pad for collector 1 cm2.  
For other mounting conditions, see “Thermal considerations for SOT223 in the General Part of associated  
Handbook”.  
2001 Oct 10  
2
Philips Semiconductors  
Product specification  
NPN medium power transistors  
BCP54; BCP55; BCP56  
THERMAL CHARACTERISTICS  
SYMBOL  
PARAMETER  
CONDITIONS  
note 1  
VALUE  
UNIT  
Rth j-a  
Rth j-s  
thermal resistance from junction to ambient  
94  
13  
K/W  
K/W  
thermal resistance from junction to soldering point  
Note  
1. Device mounted on printed-circuit board, single sided copper, tinplated, mounting pad for collector 1 cm2.  
For other mounting conditions, see “Thermal considerations for SOT223 in the General Part of associated  
Handbook”.  
CHARACTERISTICS  
Tamb = 25 °C unless otherwise specified.  
SYMBOL  
PARAMETER  
CONDITIONS  
IE = 0; VCB = 30 V  
MIN. TYP. MAX. UNIT  
ICBO  
collector cut-off current  
100  
10  
100  
nA  
µA  
nA  
IE = 0; VCB = 30 V; Tj = 125 °C  
IC = 0; VEB = 5 V  
IEBO  
hFE  
emitter cut-off current  
DC current gain  
IC = 5 mA; VCE = 2 V  
63  
63  
40  
IC = 150 mA; VCE = 2 V  
IC = 500 mA; VCE = 2 V  
IC = 150 mA; VCE = 2 V  
250  
hFE  
DC current gain  
BCP55-10; 56-10  
63  
100  
160  
250  
500  
1
BCP54-16; 55-16; 56-16  
VCEsat  
VBE  
fT  
collector-emitter saturation voltage IC = 0.5 A; IB = 50 mA  
mV  
V
base-emitter voltage  
transition frequency  
IC = 0.5 A; VCE = 2 V  
IC = 10 mA; VCE = 5 V; f = 100 MHz  
IC = 150 mA; VCE = 2 V  
130  
MHz  
DC current gain ratio of the  
complementary pairs  
1.6  
hFE1  
-----------  
hFE2  
2001 Oct 10  
3
Philips Semiconductors  
Product specification  
NPN medium power transistors  
BCP54; BCP55; BCP56  
PACKAGE OUTLINE  
Plastic surface mounted package; collector pad for good heat transfer; 4 leads  
SOT223  
D
B
E
A
X
c
y
H
v
M
A
E
b
1
4
Q
A
A
1
L
1
2
3
p
e
b
p
w
M
B
detail X  
1
e
0
2
4 mm  
scale  
DIMENSIONS (mm are the original dimensions)  
A
UNIT  
A
b
b
c
D
E
e
e
H
L
p
Q
v
w
y
p
1
1
1
E
1.8  
1.5  
0.10 0.80  
0.01 0.60  
3.1  
2.9  
0.32  
0.22  
6.7  
6.3  
3.7  
3.3  
7.3  
6.7  
1.1  
0.7  
0.95  
0.85  
mm  
4.6  
2.3  
0.2  
0.1  
0.1  
REFERENCES  
JEDEC  
EUROPEAN  
PROJECTION  
OUTLINE  
VERSION  
ISSUE DATE  
IEC  
EIAJ  
97-02-28  
99-09-13  
SOT223  
SC-73  
2001 Oct 10  
4
Philips Semiconductors  
Product specification  
NPN medium power transistors  
BCP54; BCP55; BCP56  
DATA SHEET STATUS  
PRODUCT  
DATA SHEET STATUS(1)  
STATUS(2)  
DEFINITIONS  
Objective data  
Development This data sheet contains data from the objective specification for product  
development. Philips Semiconductors reserves the right to change the  
specification in any manner without notice.  
Preliminary data  
Qualification  
This data sheet contains data from the preliminary specification.  
Supplementary data will be published at a later date. Philips  
Semiconductors reserves the right to change the specification without  
notice, in order to improve the design and supply the best possible  
product.  
Product data  
Production  
This data sheet contains data from the product specification. Philips  
Semiconductors reserves the right to make changes at any time in order  
to improve the design, manufacturing and supply. Changes will be  
communicated according to the Customer Product/Process Change  
Notification (CPCN) procedure SNW-SQ-650A.  
Notes  
1. Please consult the most recently issued data sheet before initiating or completing a design.  
2. The product status of the device(s) described in this data sheet may have changed since this data sheet was  
published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com.  
DEFINITIONS  
DISCLAIMERS  
Short-form specification  
The data in a short-form  
Life support applications  
These products are not  
specification is extracted from a full data sheet with the  
same type number and title. For detailed information see  
the relevant data sheet or data handbook.  
designed for use in life support appliances, devices, or  
systems where malfunction of these products can  
reasonably be expected to result in personal injury. Philips  
Semiconductors customers using or selling these products  
for use in such applications do so at their own risk and  
agree to fully indemnify Philips Semiconductors for any  
damages resulting from such application.  
Limiting values definition Limiting values given are in  
accordance with the Absolute Maximum Rating System  
(IEC 60134). Stress above one or more of the limiting  
values may cause permanent damage to the device.  
These are stress ratings only and operation of the device  
at these or at any other conditions above those given in the  
Characteristics sections of the specification is not implied.  
Exposure to limiting values for extended periods may  
affect device reliability.  
Right to make changes  
Philips Semiconductors  
reserves the right to make changes, without notice, in the  
products, including circuits, standard cells, and/or  
software, described or contained herein in order to  
improve design and/or performance. Philips  
Semiconductors assumes no responsibility or liability for  
the use of any of these products, conveys no licence or title  
under any patent, copyright, or mask work right to these  
products, and makes no representations or warranties that  
these products are free from patent, copyright, or mask  
work right infringement, unless otherwise specified.  
Application information  
Applications that are  
described herein for any of these products are for  
illustrative purposes only. Philips Semiconductors make  
no representation or warranty that such applications will be  
suitable for the specified use without further testing or  
modification.  
2001 Oct 10  
5
Philips Semiconductors  
Product specification  
NPN medium power transistors  
BCP54; BCP55; BCP56  
NOTES  
2001 Oct 10  
6
Philips Semiconductors  
Product specification  
NPN medium power transistors  
BCP54; BCP55; BCP56  
NOTES  
2001 Oct 10  
7
Philips Semiconductors – a worldwide company  
Contact information  
For additional information please visit http://www.semiconductors.philips.com.  
Fax: +31 40 27 24825  
For sales offices addresses send e-mail to: sales.addresses@www.semiconductors.philips.com.  
© Koninklijke Philips Electronics N.V. 2001  
SCA73  
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.  
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed  
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license  
under patent- or other industrial or intellectual property rights.  
Printed in The Netherlands  
613514/04/pp8  
Date of release: 2001 Oct 10  
Document order number: 9397 750 08742  

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