BCV62B [NXP]

PNP general purpose double transistor; PNP通用双晶体管
BCV62B
型号: BCV62B
厂家: NXP    NXP
描述:

PNP general purpose double transistor
PNP通用双晶体管

晶体 小信号双极晶体管 光电二极管
文件: 总8页 (文件大小:55K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
DISCRETE SEMICONDUCTORS  
DATA SHEET  
BCV62  
PNP general purpose  
double transistor  
1999 Apr 08  
Product specification  
Supersedes data of 1997 Jun 18  
Philips Semiconductors  
Product specification  
PNP general purpose double transistor  
BCV62  
FEATURES  
PINNING  
Low current (max. 100 mA)  
Low voltage (max. 30 V)  
Matched pair.  
PIN  
DESCRIPTION  
1
2
3
4
collector TR2; base TR1 and TR2  
collector TR1  
emitter TR1  
APPLICATIONS  
emitter TR2  
For use in applications where the working point must be  
independent of temperature  
Current mirrors.  
handbook, hge  
4
3
2
1
DESCRIPTION  
PNP double transistor in a SOT143B plastic package.  
NPN complement: BCV61.  
TR2  
4
TR1  
3
1
2
MARKING  
Top view  
MAM292  
TYPE  
NUMBER  
MARKING  
CODE  
TYPE  
NUMBER  
MARKING  
CODE  
BCV62  
BCV62A  
3Mp  
3Jp  
BCV62B  
BCV62C  
3Kp  
3Lp  
Fig.1 Simplified outline (SOT143B) and symbol.  
LIMITING VALUES  
In accordance with the Absolute Maximum Rating System (IEC 134).  
SYMBOL  
PARAMETER  
collector-base voltage TR1  
collector-emitter voltage TR1  
emitter-base voltage  
CONDITIONS  
open emitter  
MIN.  
MAX.  
30  
UNIT  
VCBO  
VCEO  
VEBS  
IC  
V
V
V
open base  
VCE = 0  
30  
6  
collector current (DC)  
100  
200  
200  
250  
mA  
mA  
mA  
mW  
°C  
ICM  
peak collector current  
IBM  
peak base current TR1  
total power dissipation  
storage temperature  
Ptot  
Tstg  
Tj  
Tamb 25 °C; note 1  
65  
+150  
150  
junction temperature  
°C  
Tamb  
operating ambient temperature  
65  
+150  
°C  
Note  
1. Device mounted on an FR4 printed-circuit board.  
1999 Apr 08  
2
Philips Semiconductors  
Product specification  
PNP general purpose double transistor  
BCV62  
THERMAL CHARACTERISTICS  
SYMBOL  
PARAMETER  
CONDITIONS  
note 1  
VALUE  
500  
UNIT  
Rth j-a  
thermal resistance from junction to ambient  
K/W  
Note  
1. Device mounted on an FR4 printed-circuit board.  
CHARACTERISTICS  
Tj = 25 °C unless otherwise specified.  
SYMBOL  
PARAMETER  
CONDITIONS  
MIN. TYP. MAX. UNIT  
Transistor TR1  
ICBO  
collector cut-off current  
IE = 0; VCB = 30 V  
15  
5  
nA  
IE = 0; VCB = 30 V; Tj = 150 °C  
IC = 0; VEB = 5 V  
µA  
IEBO  
hFE  
emitter cut-off current  
DC current gain  
100 nA  
IC = 100 µA; VCE = 5 V  
100  
100  
IC = 2 mA; VCE = 5 V  
800  
VCEsat  
VBEsat  
VBE  
collector-emitter saturation  
voltage  
IC = 10 mA; IB = 0.5 mA  
IC = 100 mA; IB = 5 mA  
75  
300 mV  
250 650 mV  
base-emitter saturation  
voltage  
IC = 10 mA; IB =0.5 mA; note 1  
IC = 100 mA; IB = 5 mA; note 1  
IC = 2 mA; VCE = 5 V; note 1  
IC = 10 mA; VCE = 5 V; note 2  
IE = ie = 0; VCB = 10 V  
700  
850  
mV  
mV  
base-emitter voltage  
600 650 750 mV  
820 mV  
Cc  
fT  
collector capacitance  
transition frequency  
noise figure  
4.5  
pF  
IC = 10 mA; VCE = 5 V; f = 100 MHz  
100  
MHz  
dB  
F
IC = 200 µA; VCE = 5 V; RS = 2 k;  
10  
f = 1 kHz; B = 200 Hz  
Transistor TR2  
VEBS base-emitter forward voltage  
IE = 250 mA; VCB = 0  
IE = 10 µA; VCB = 0  
1.5  
V
400  
mV  
hFE  
DC current gain  
BCV62A  
IC = 2 mA; VCE = 5 V  
125  
220  
420  
250  
475  
800  
BCV62B  
BCV62C  
1999 Apr 08  
3
Philips Semiconductors  
Product specification  
PNP general purpose double transistor  
BCV62  
SYMBOL  
PARAMETER  
CONDITIONS  
MIN. TYP. MAX. UNIT  
Transistors TR1 and TR2  
current matching of transistors IE2 = 0.5 mA; VCE1 = 5 V; Tamb 25 °C  
0.7  
1.3  
1.3  
IC1  
-------  
IE2  
TR1 and TR2  
IE2 = 0.5 mA; VCE1 = 5 V; Tamb 150 °C 0.7  
IE2  
emitter current for thermal  
VCE1 = 5 V; note 3 ; (see Fig.2)  
5
mA  
stability of IC1  
Notes  
1. Decreasing 1.7 mV/°C with increasing temperature.  
2. Decreasing 2 mV/°C with increasing temperature.  
3. Device, without emitter resistors, mounted on an FR4 printed-circuit board.  
handbook, halfpage  
handbook, halfpage  
A
A
I
C1  
I
2
3
1
C1  
2
3
1
V  
I
= constant  
E2  
TR1  
TR2  
R
CE1  
V  
I
= constant  
E2  
TR1  
V
TR2  
CO  
CE1  
4
4
I
E2  
A
R
E
E
V
CO  
MBK081  
MBK080  
VCE1 = -5 V; device, without emitter resistors, mounted on an  
FR4 printed-circuit board.  
2
3
Voltage drop at contacts: VCO < -- U T 16 mV .  
^
=
Fig.2 Test circuit current matching.  
Fig.3 BCV62 with emitter resistors.  
1999 Apr 08  
4
Philips Semiconductors  
Product specification  
PNP general purpose double transistor  
BCV62  
MBK083  
30  
V  
I
CE1max  
E2 =  
(V)  
1 mA  
20  
5 mA  
10 mA  
10  
50 mA  
0
10  
1  
2
1
10  
10  
R
()  
E
IC1  
= 1.3 (see Fig.3).  
-------  
IE2  
Fig.4 Maximum collector-emitter voltage as a function of emitter resistance.  
1999 Apr 08  
5
Philips Semiconductors  
Product specification  
PNP general purpose double transistor  
BCV62  
PACKAGE OUTLINE  
Plastic surface mounted package; 4 leads  
SOT143B  
D
B
E
A
X
y
H
v
M
A
E
e
b
w
M
B
p
4
3
Q
A
A
1
c
1
2
L
p
b
1
e
1
detail X  
0
1
2 mm  
scale  
DIMENSIONS (mm are the original dimensions)  
A
1
max  
UNIT  
A
b
b
c
D
E
e
e
H
L
p
Q
v
w
y
p
1
1
E
1.1  
0.9  
0.48  
0.38  
0.88  
0.78  
0.15  
0.09  
3.0  
2.8  
1.4  
1.2  
2.5  
2.1  
0.45  
0.15  
0.55  
0.45  
0.1  
mm  
1.9  
1.7  
0.2  
0.1  
0.1  
REFERENCES  
JEDEC  
EUROPEAN  
PROJECTION  
OUTLINE  
VERSION  
ISSUE DATE  
IEC  
EIAJ  
97-02-28  
SOT143B  
1999 Apr 08  
6
Philips Semiconductors  
Product specification  
PNP general purpose double transistor  
BCV62  
DEFINITIONS  
Data sheet status  
Objective specification  
Preliminary specification  
Product specification  
This data sheet contains target or goal specifications for product development.  
This data sheet contains preliminary data; supplementary data may be published later.  
This data sheet contains final product specifications.  
Limiting values  
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or  
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation  
of the device at these or at any other conditions above those given in the Characteristics sections of the specification  
is not implied. Exposure to limiting values for extended periods may affect device reliability.  
Application information  
Where application information is given, it is advisory and does not form part of the specification.  
LIFE SUPPORT APPLICATIONS  
These products are not designed for use in life support appliances, devices, or systems where malfunction of these  
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for  
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such  
improper use or sale.  
1999 Apr 08  
7
Philips Semiconductors – a worldwide company  
Argentina: see South America  
Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB,  
Tel. +31 40 27 82785, Fax. +31 40 27 88399  
Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113,  
Tel. +61 2 9805 4455, Fax. +61 2 9805 4466  
New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND,  
Tel. +64 9 849 4160, Fax. +64 9 849 7811  
Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213,  
Tel. +43 1 60 101 1248, Fax. +43 1 60 101 1210  
Norway: Box 1, Manglerud 0612, OSLO,  
Tel. +47 22 74 8000, Fax. +47 22 74 8341  
Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6,  
220050 MINSK, Tel. +375 172 20 0733, Fax. +375 172 20 0773  
Pakistan: see Singapore  
Belgium: see The Netherlands  
Brazil: see South America  
Philippines: Philips Semiconductors Philippines Inc.,  
106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI,  
Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474  
Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor,  
51 James Bourchier Blvd., 1407 SOFIA,  
Tel. +359 2 68 9211, Fax. +359 2 68 9102  
Poland: Ul. Lukiska 10, PL 04-123 WARSZAWA,  
Tel. +48 22 612 2831, Fax. +48 22 612 2327  
Portugal: see Spain  
Romania: see Italy  
Canada: PHILIPS SEMICONDUCTORS/COMPONENTS,  
Tel. +1 800 234 7381, Fax. +1 800 943 0087  
China/Hong Kong: 501 Hong Kong Industrial Technology Centre,  
72 Tat Chee Avenue, Kowloon Tong, HONG KONG,  
Tel. +852 2319 7888, Fax. +852 2319 7700  
Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW,  
Tel. +7 095 755 6918, Fax. +7 095 755 6919  
Singapore: Lorong 1, Toa Payoh, SINGAPORE 319762,  
Colombia: see South America  
Czech Republic: see Austria  
Tel. +65 350 2538, Fax. +65 251 6500  
Slovakia: see Austria  
Slovenia: see Italy  
Denmark: Sydhavnsgade 23, 1780 COPENHAGEN V,  
Tel. +45 33 29 3333, Fax. +45 33 29 3905  
South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale,  
2092 JOHANNESBURG, P.O. Box 7430 Johannesburg 2000,  
Tel. +27 11 470 5911, Fax. +27 11 470 5494  
Finland: Sinikalliontie 3, FIN-02630 ESPOO,  
Tel. +358 9 615 800, Fax. +358 9 6158 0920  
France: 51 Rue Carnot, BP317, 92156 SURESNES Cedex,  
Tel. +33 1 4099 6161, Fax. +33 1 4099 6427  
South America: Al. Vicente Pinzon, 173, 6th floor,  
04547-130 SÃO PAULO, SP, Brazil,  
Tel. +55 11 821 2333, Fax. +55 11 821 2382  
Germany: Hammerbrookstraße 69, D-20097 HAMBURG,  
Tel. +49 40 2353 60, Fax. +49 40 2353 6300  
Spain: Balmes 22, 08007 BARCELONA,  
Tel. +34 93 301 6312, Fax. +34 93 301 4107  
Hungary: see Austria  
Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM,  
Tel. +46 8 5985 2000, Fax. +46 8 5985 2745  
India: Philips INDIA Ltd, Band Box Building, 2nd floor,  
254-D, Dr. Annie Besant Road, Worli, MUMBAI 400 025,  
Tel. +91 22 493 8541, Fax. +91 22 493 0966  
Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,  
Tel. +41 1 488 2741 Fax. +41 1 488 3263  
Indonesia: PT Philips Development Corporation, Semiconductors Division,  
Gedung Philips, Jl. Buncit Raya Kav.99-100, JAKARTA 12510,  
Tel. +62 21 794 0040 ext. 2501, Fax. +62 21 794 0080  
Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1,  
TAIPEI, Taiwan Tel. +886 2 2134 2886, Fax. +886 2 2134 2874  
Ireland: Newstead, Clonskeagh, DUBLIN 14,  
Tel. +353 1 7640 000, Fax. +353 1 7640 200  
Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,  
209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260,  
Tel. +66 2 745 4090, Fax. +66 2 398 0793  
Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053,  
TEL AVIV 61180, Tel. +972 3 645 0444, Fax. +972 3 649 1007  
Turkey: Talatpasa Cad. No. 5, 80640 GÜLTEPE/ISTANBUL,  
Tel. +90 212 279 2770, Fax. +90 212 282 6707  
Italy: PHILIPS SEMICONDUCTORS, Piazza IV Novembre 3,  
20124 MILANO, Tel. +39 2 6752 2531, Fax. +39 2 6752 2557  
Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,  
252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461  
Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku,  
TOKYO 108-8507, Tel. +81 3 3740 5130, Fax. +81 3 3740 5077  
United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,  
MIDDLESEX UB3 5BX, Tel. +44 181 730 5000, Fax. +44 181 754 8421  
Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL,  
Tel. +82 2 709 1412, Fax. +82 2 709 1415  
United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,  
Tel. +1 800 234 7381, Fax. +1 800 943 0087  
Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR,  
Tel. +60 3 750 5214, Fax. +60 3 757 4880  
Uruguay: see South America  
Vietnam: see Singapore  
Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905,  
Tel. +9-5 800 234 7381, Fax +9-5 800 943 0087  
Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,  
Middle East: see Italy  
Tel. +381 11 62 5344, Fax.+381 11 63 5777  
For all other countries apply to: Philips Semiconductors,  
Internet: http://www.semiconductors.philips.com  
International Marketing & Sales Communications, Building BE-p, P.O. Box 218,  
5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825  
© Philips Electronics N.V. 1999  
SCA63  
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.  
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed  
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license  
under patent- or other industrial or intellectual property rights.  
Printed in The Netherlands  
115002/00/03/pp8  
Date of release: 1999 Apr 08  
Document order number: 9397 750 05558  

相关型号:

BCV62B,215

BCV62 - PNP general-purpose double transistors SOT-143 4-Pin
NXP

BCV62B,235

TRANS PNP 30V 100MA DUAL SOT143B
ETC

BCV62B-E6327

Small Signal Bipolar Transistor, 0.1A I(C), 30V V(BR)CEO, 1-Element, PNP, Silicon
INFINEON

BCV62B-E6433

Small Signal Bipolar Transistor, 0.1A I(C), 30V V(BR)CEO, 1-Element, PNP, Silicon
INFINEON

BCV62B-TAPE-13

TRANSISTOR 100 mA, 30 V, PNP, Si, SMALL SIGNAL TRANSISTOR, BIP General Purpose Small Signal
NXP

BCV62B-TAPE-7

TRANSISTOR 100 mA, 30 V, PNP, Si, SMALL SIGNAL TRANSISTOR, BIP General Purpose Small Signal
NXP

BCV62B/T1

TRANSISTOR SOT-23
ETC

BCV62B/T3

TRANSISTOR 100 mA, 30 V, PNP, Si, SMALL SIGNAL TRANSISTOR, PLASTIC PACKAGE-4, BIP General Purpose Small Signal
NXP

BCV62BE6433HTMA1

Small Signal Bipolar Transistor, 0.1A I(C), 30V V(BR)CEO, 2-Element, PNP, Silicon, ROHS COMPLIANT PACKAGE-4
INFINEON

BCV62BT/R

TRANSISTOR | BJT | ARRAY | BLDG BLOCK | 30V V(BR)CEO | 100MA I(C) | SOT-143
ETC

BCV62C

PNP general purpose double transistor
NXP

BCV62C

PNP Silicon Double Transistors (To be used as a current mirror Good thermal coupling and VBE matching)
INFINEON