BCV64B,215 [NXP]
BCV64B - PNP general-purpose double transistor SOT-143 4-Pin;
| 型号： | BCV64B,215 |
| 厂家： | 
NXP |
| 描述： | BCV64B - PNP general-purpose double transistor SOT-143 4-Pin 开关 光电二极管 晶体管 |
| 文件： | 总12页 (文件大小：105K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
BCV64B
PNP general-purpose double transistor
Rev. 4 — 2 August 2010
Product data sheet
1. Product profile
1.1 General description
PNP general-purpose double transistor in a small SOT143B Surface-Mounted
Device (SMD) plastic package.
Table 1.
Product overview
Type number
Package
NXP
PNP complement
JEITA
BCV64B
SOT143B
-
BCV63B
1.2 Features and benefits
Low current (max. 100 mA)
Low voltage (max. 30 V and 6 V)
AEC-Q101 qualified
Small SMD plastic package
1.3 Applications
General-purpose switching and amplification
For use in Schmitt trigger applications
1.4 Quick reference data
Table 2.
Quick reference data
Symbol Parameter
Per transistor
Conditions
Min
Typ
Max Unit
IC
collector current
-
-
−100 mA
Transistor TR1
VCEO
hFE
collector-emitter voltage
DC current gain
open base
-
-
-
−30
V
VCE = −5 mV;
IC = −2 mA
220
475
Transistor TR2
VCEO
hFE
collector-emitter voltage
DC current gain
open base
-
-
-
−6
V
[1]
VCE = −700 V;
IC = −2 mA
220
475
[1] Due to matched dies, hFE values for TR2 are the same as for TR1.
BCV64B
NXP Semiconductors
PNP general-purpose double transistor
2. Pinning information
Table 3.
Pinning
Pin
1
Description
Simplified outline
Graphic symbol
collector TR2 and base TR1
collector TR1
2
1
4
3
2
3
emitter TR1 and TR2
base TR2
TR1
4
TR2
1
2
3
4
006aab230
3. Ordering information
Table 4.
Ordering information
Type number
Package
Name
-
Description
Version
BCV64B
plastic surface-mounted package; 4 leads
SOT143B
4. Marking
Table 5.
Marking codes
Type number
Marking code[1]
BCV64B
*C6
[1] * = -: made in Hong Kong
* = p: made in Hong Kong
* = t: made in Malaysia
* = W: made in China
BCV64B
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 4 — 2 August 2010
2 of 12
BCV64B
NXP Semiconductors
PNP general-purpose double transistor
5. Limiting values
Table 6.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter
Per transistor
Conditions
Min
Max
Unit
VEBO
IC
ICM
IB
emitter-base voltage
open collector
-
-
-
-
−6
V
collector current
peak collector current
base current
−100
−200
−100
mA
mA
mA
Transistor TR1
VCBO
VCEO
collector-base voltage
collector-emitter voltage
open emitter
open base
-
-
−30
−30
V
V
Transistor TR2
VCBO
VCEO
Per device
Ptot
collector-base voltage
open emitter
open base
-
-
−6
−6
V
V
collector-emitter voltage
[1]
total power dissipation
junction temperature
ambient temperature
storage temperature
Tamb ≤ 25 °C
-
250
mW
°C
Tj
-
150
Tamb
Tstg
−65
−65
+150
+150
°C
°C
[1] Device mounted on an FR4 Printed-Circuit Board (PCB).
6. Thermal characteristics
Table 7.
Symbol Parameter
Rth(j-a) thermal resistance from
junction to ambient
Thermal characteristics
Conditions
Min
Typ
Max Unit
[1]
in free air
-
-
500
K/W
[1] Device mounted on an FR4 PCB.
BCV64B
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© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 4 — 2 August 2010
3 of 12
BCV64B
NXP Semiconductors
PNP general-purpose double transistor
7. Characteristics
Table 8.
Characteristics
Tj = 25 °C unless otherwise specified.
Symbol Parameter
Per transistor
Conditions
Min
Typ
Max
Unit
ICBO
collector-base
cut-off current
VCB = −30 V; IE = 0 A
-
-
-
-
−15
−5
nA
VCB = −30 V; IE = 0 A;
Tj = 150 °C
μA
VCEsat
VBEsat
collector-emitter
saturation voltage
IC = −10 mA;
IB = −0.5 mA
-
-
−75
−300
mV
mV
[2]
base-emitter
saturation voltage
IC = −10 mA;
IB = −0.5 mA
−700
-
Transistor TR1
hFE
DC current gain
VCE = −5 V;
IC = −2 mA
220
-
475
−650
-
VCEsat
VBEsat
VBE
collector-emitter
saturation voltage
IC = −100 mA;
IB = −5 mA
-
−250
−850
−650
-
mV
mV
mV
mV
MHz
[2]
[3]
[3]
base-emitter
saturation voltage
IC = −100 mA;
IB = −5 mA
-
base-emitter voltage
IC = −2 mA;
VCE = −5 V
−600
-
−750
−820
-
IC = −10 mA;
VCE = −5 V
fT
transition frequency
collector capacitance
VCE = −5 V;
IC = −10 mA;
f = 100 MHz
100
-
Cc
VCB = −10 V;
IE = ie = 0 A;
f = 1 MHz
-
4
-
pF
Transistor TR2
[1]
[3]
hFE
DC current gain
VCE = −700 mV;
IC = −2 mA
220
-
475
VCEsat
VBE
collector-emitter
saturation voltage
IC = −100 mA;
IB = −5 mA
-
-
−250
−700
-
-
mV
mV
base-emitter voltage
IC = −2 mA;
VCE = −700 mV
[1] Due to matched dies, hFE values for TR2 are the same as for TR1.
[2] VBEsat decreases by about 1.7 mV/K with increasing temperature.
[3] VBE decreases by about 2 mV/K with increasing temperature.
BCV64B
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© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 4 — 2 August 2010
4 of 12
BCV64B
NXP Semiconductors
PNP general-purpose double transistor
mgt715
mgt716
1000
−1200
BE
V
h
FE
(mV)
−1000
800
(1)
(2)
−800
−600
−400
−200
0
600
(1)
400
(3)
(2)
200
0
(3)
−2
−1
2
3
−2
−1
2
3
−10
−10
−1
−10
−10
−10
I (mA)
C
−10
−10
−1
−10
−10
−10
(mA)
I
C
VCE = −5 V
VCE = −5 V
(1) Tamb = 150 °C
(2) Tamb = 25 °C
(3) Tamb = −55 °C
(1) Tamb = −55 °C
(2) Tamb = 25 °C
(3) Tamb = 150 °C
Fig 1. DC current gain as a function of collector
current; typical values
Fig 2. Base-emitter voltage as a function of collector
current; typical values
mgt717
mgt718
4
−10
−1200
BEsat
V
(mV)
V
CEsat
−1000
(mV)
(1)
(2)
3
−10
−800
−600
−400
−200
0
(3)
2
−10
(1)
(3) (2)
−10
−1
2
3
−1
2
3
−10
−1
−10
−10
−10
−10
−1
−10
−10
−10
I
C
(mA)
I
C
(mA)
IC/IB = 20
IC/IB = 20
(1) Tamb = 150 °C
(2) Tamb = 25 °C
(3) Tamb = −55 °C
(1) Tamb = −55 °C
(2) Tamb = 25 °C
(3) Tamb = 150 °C
Fig 3. Collector-emitter saturation voltage as a
function of collector current; typical values
Fig 4. Base-emitter saturation voltage as a function
of collector current; typical values
BCV64B
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 4 — 2 August 2010
5 of 12
BCV64B
NXP Semiconductors
PNP general-purpose double transistor
8. Application information
R
R
c
c
1
R1
4
2
V
o
TR1
3
TR2
3
R2
V
i
mgd828
Fig 5. Schmitt trigger application
9. Test information
9.1 Quality information
This product has been qualified in accordance with the Automotive Electronics Council
(AEC) standard Q101 - Stress test qualification for discrete semiconductors, and is
suitable for use in automotive applications.
BCV64B
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 4 — 2 August 2010
6 of 12
BCV64B
NXP Semiconductors
PNP general-purpose double transistor
10. Package outline
3.0
2.8
1.1
0.9
1.9
4
3
0.45
0.15
2.5 1.4
2.1 1.2
1
2
0.88
0.78
0.48
0.38
0.15
0.09
1.7
Dimensions in mm
04-11-16
Fig 6. Package outline SOT143B
11. Packing information
Table 9.
Packing methods
The indicated -xxx are the last three digits of the 12NC ordering code.[1]
Type number Package Description
Packing quantity
3000
-215
10000
BCV64B
SOT143B 4 mm pitch, 8 mm tape and reel
-235
[1] For further information and the availability of packing methods, see Section 15.
BCV64B
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 4 — 2 August 2010
7 of 12
BCV64B
NXP Semiconductors
PNP general-purpose double transistor
12. Soldering
3.25
1.9
0.6
(3×)
0.5
(3×)
solder lands
solder resist
0.7 0.6
(3×) (3×)
2
solder paste
3
occupied area
0.7 0.6
Dimensions in mm
0.75
0.95
0.9
1
sot143b_fr
Fig 7. Reflow soldering footprint SOT143B
4.45
2.2
1.2
(3×)
1.425
(3×)
solder lands
solder resist
occupied area
2.575
4.6
Dimensions in mm
1.425
preferred transport direction during soldering
1
1.2
sot143b_fw
Fig 8. Wave soldering footprint SOT143B
BCV64B
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 4 — 2 August 2010
8 of 12
BCV64B
NXP Semiconductors
PNP general-purpose double transistor
13. Revision history
Table 10. Revision history
Document ID
BCV64B v.4
Modifications:
Release date
20100802
Data sheet status
Change notice
Supersedes
Product data sheet
-
BCV64B_3
• The format of this data sheet has been redesigned to comply with the new identity
guidelines of NXP Semiconductors.
• Legal texts have been adapted to the new company name where appropriate.
• Section 1 “Product profile”: amended.
• Section 3 “Ordering information”: added.
• Section 4 “Marking”: updated.
• Figure 1, 2, 3 and 4: added.
• Section 8 “Application information”: added.
• Section 9 “Test information”: added.
• Figure 6: superseded by minimized package outline drawing.
• Section 11 “Packing information”: added.
• Section 12 “Soldering”: added.
• Section 14 “Legal information”: updated.
BCV64B_3
19990521
Product specification
-
-
BCV64_CNV_2
-
BCV64_CNV_2
19970310
Product specification
BCV64B
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 4 — 2 August 2010
9 of 12
BCV64B
NXP Semiconductors
PNP general-purpose double transistor
14. Legal information
14.1 Data sheet status
Document status[1][2]
Product status[3]
Development
Definition
Objective [short] data sheet
This document contains data from the objective specification for product development.
This document contains data from the preliminary specification.
This document contains the product specification.
Preliminary [short] data sheet Qualification
Product [short] data sheet Production
[1]
[2]
[3]
Please consult the most recently issued document before initiating or completing a design.
The term ‘short data sheet’ is explained in section “Definitions”.
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
malfunction of an NXP Semiconductors product can reasonably be expected
14.2 Definitions
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
14.3 Disclaimers
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from national authorities.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
BCV64B
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 4 — 2 August 2010
10 of 12
BCV64B
NXP Semiconductors
PNP general-purpose double transistor
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
14.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
15. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
BCV64B
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 4 — 2 August 2010
11 of 12
BCV64B
NXP Semiconductors
PNP general-purpose double transistor
16. Contents
1
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1
1.2
1.3
1.4
General description . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits. . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Quick reference data . . . . . . . . . . . . . . . . . . . . 1
2
Pinning information. . . . . . . . . . . . . . . . . . . . . . 2
Ordering information. . . . . . . . . . . . . . . . . . . . . 2
Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3
Thermal characteristics . . . . . . . . . . . . . . . . . . 3
Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 4
Application information. . . . . . . . . . . . . . . . . . . 6
Test information. . . . . . . . . . . . . . . . . . . . . . . . . 6
Quality information . . . . . . . . . . . . . . . . . . . . . . 6
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 7
Packing information . . . . . . . . . . . . . . . . . . . . . 7
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Revision history. . . . . . . . . . . . . . . . . . . . . . . . . 9
3
4
5
6
7
8
9
9.1
10
11
12
13
14
Legal information. . . . . . . . . . . . . . . . . . . . . . . 10
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 10
Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 11
14.1
14.2
14.3
14.4
15
16
Contact information. . . . . . . . . . . . . . . . . . . . . 11
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2010.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 2 August 2010
Document identifier: BCV64B
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