BF370,112 [NXP]
TRANSISTOR 100 mA, 15 V, NPN, Si, SMALL SIGNAL TRANSISTOR, TO-92, PLASTIC, SC-43A, 3 PIN, BIP General Purpose Small Signal;
| 型号： | BF370,112 |
| 厂家： | 
NXP |
| 描述： | TRANSISTOR 100 mA, 15 V, NPN, Si, SMALL SIGNAL TRANSISTOR, TO-92, PLASTIC, SC-43A, 3 PIN, BIP General Purpose Small Signal |
| 文件： | 总6页 (文件大小：49K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
DISCRETE SEMICONDUCTORS
DATA SHEET
book, halfpage
BF370
NPN medium frequency transistor
Product specification
2004 Nov 08
Supersedes data of 1999 Apr 21
Philips Semiconductors
Product specification
NPN medium frequency transistor
BF370
FEATURES
PINNING
PIN
• Low current (max. 100 mA)
• Low voltage (max. 15 V).
DESCRIPTION
1
2
3
emitter
base
APPLICATIONS
collector
• IF preamplifiers of television receivers.
DESCRIPTION
1
3
1
2
3
NPN medium frequency transistor in a TO-92; SOT54
plastic package.
2
MAM370
Fig.1 Simplified outline (TO-92; SOT54)
and symbol.
ORDERING INFORMATION
PACKAGE
TYPE NUMBER
NAME
DESCRIPTION
VERSION
BF370
SC-43A
plastic single-ended leaded (through hole) package; 3 leads
SOT54
2004 Nov 08
2
Philips Semiconductors
Product specification
NPN medium frequency transistor
BF370
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).
SYMBOL
PARAMETER
collector-base voltage
CONDITIONS
open emitter
MIN.
MAX.
40
UNIT
VCBO
VCEO
VEBO
IC
−
−
−
−
−
−
V
V
V
collector-emitter voltage
emitter-base voltage
collector current (DC)
peak collector current
total power dissipation
storage temperature
junction temperature
ambient temperature
open base
15
open collector
4.5
100
200
500
+150
150
+150
mA
mA
mW
°C
ICM
Ptot
Tamb ≤ 25 °C; note 1
Tstg
Tj
−65
−
°C
Tamb
−65
°C
Note
1. Transistor mounted on an FR4 printed-circuit board.
THERMAL CHARACTERISTICS
SYMBOL
PARAMETER
CONDITIONS
VALUE
UNIT
Rth(j-a)
thermal resistance from junction to ambient note 1
250
K/W
Note
1. Transistor mounted on an FR4 printed-circuit board.
CHARACTERISTICS
T
amb = 25 °C unless otherwise specified.
SYMBOL PARAMETER
ICBO collector-base cut-off current VCB = 20 V; IE = 0 A
VCB = 20 V; IE = 0 A; Tj = 125 °C
VEB = 2 V; IC = 0 A
CONDITIONS
MIN.
TYP. MAX. UNIT
−
−
400
30
100
−
nA
µA
nA
−
−
IEBO
hFE
Cc
emitter-base cut-off current
DC current gain
−
−
VCE = 1 V; IC = 10 mA
VCB = 10 V; IE = ie = 0 A; f = 1 MHz
VEB = 1 V; IC = ic = 0 A; f = 1 MHz
VCB = 10 V; IC = 0 A; f = 1 MHz
VCE = 10 V; f = 100 MHz
IC = 10 mA
40
−
−
collector capacitance
emitter capacitance
feedback capacitance
transition frequency
2.2
−
−
pF
pF
pF
Ce
−
4.5
−
Cre
fT
−
1.6
500
490
−
−
−
−
MHz
MHz
IC = 40 mA
2004 Nov 08
3
Philips Semiconductors
Product specification
NPN medium frequency transistor
BF370
PACKAGE OUTLINE
Plastic single-ended leaded (through hole) package; 3 leads
SOT54
c
E
d
A
L
b
1
2
e
1
e
D
3
b
1
L
1
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
(1)
L
1
UNIT
A
b
b
c
D
d
E
e
e
L
1
1
max.
5.2
5.0
0.48
0.40
0.66
0.55
0.45
0.38
4.8
4.4
1.7
1.4
4.2
3.6
14.5
12.7
mm
2.54
1.27
2.5
Note
1. Terminal dimensions within this zone are uncontrolled to allow for flow of plastic and terminal irregularities.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
JEITA
97-02-28
04-06-28
SOT54
TO-92
SC-43A
2004 Nov 08
4
Philips Semiconductors
Product specification
NPN medium frequency transistor
BF370
DATA SHEET STATUS
DATA SHEET
STATUS(1)
PRODUCT
STATUS(2)(3)
LEVEL
DEFINITION
I
Objective data
Development This data sheet contains data from the objective specification for product
development. Philips Semiconductors reserves the right to change the
specification in any manner without notice.
II
Preliminary data Qualification
This data sheet contains data from the preliminary specification.
Supplementary data will be published at a later date. Philips
Semiconductors reserves the right to change the specification without
notice, in order to improve the design and supply the best possible
product.
III
Product data
Production
This data sheet contains data from the product specification. Philips
Semiconductors reserves the right to make changes at any time in order
to improve the design, manufacturing and supply. Relevant changes will
be communicated via a Customer Product/Process Change Notification
(CPCN).
Notes
1. Please consult the most recently issued data sheet before initiating or completing a design.
2. The product status of the device(s) described in this data sheet may have changed since this data sheet was
published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com.
3. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.
DEFINITIONS
DISCLAIMERS
Short-form specification
The data in a short-form
Life support applications
These products are not
specification is extracted from a full data sheet with the
same type number and title. For detailed information see
the relevant data sheet or data handbook.
designed for use in life support appliances, devices, or
systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips
Semiconductors customers using or selling these products
for use in such applications do so at their own risk and
agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.
Limiting values definition Limiting values given are in
accordance with the Absolute Maximum Rating System
(IEC 60134). Stress above one or more of the limiting
values may cause permanent damage to the device.
These are stress ratings only and operation of the device
at these or at any other conditions above those given in the
Characteristics sections of the specification is not implied.
Exposure to limiting values for extended periods may
affect device reliability.
Right to make changes
Philips Semiconductors
reserves the right to make changes in the products -
including circuits, standard cells, and/or software -
described or contained herein in order to improve design
and/or performance. When the product is in full production
(status ‘Production’), relevant changes will be
Application information
Applications that are
communicated via a Customer Product/Process Change
Notification (CPCN). Philips Semiconductors assumes no
responsibility or liability for the use of any of these
products, conveys no license or title under any patent,
copyright, or mask work right to these products, and
makes no representations or warranties that these
products are free from patent, copyright, or mask work
right infringement, unless otherwise specified.
described herein for any of these products are for
illustrative purposes only. Philips Semiconductors make
no representation or warranty that such applications will be
suitable for the specified use without further testing or
modification.
2004 Nov 08
5
Philips Semiconductors – a worldwide company
Contact information
For additional information please visit http://www.semiconductors.philips.com.
Fax: +31 40 27 24825
For sales offices addresses send e-mail to: sales.addresses@www.semiconductors.philips.com.
© Koninklijke Philips Electronics N.V. 2004
SCA76
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
R75/04/pp6
Date of release: 2004 Nov 08
Document order number: 9397 750 13581
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