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BF861C-T [NXP]

TRANSISTOR 25 V, N-CHANNEL, Si, SMALL SIGNAL, JFET, TO-236AB, PLASTIC PACKAGE-3, FET General Purpose Small Signal;
BF861C-T
型号： BF861C-T
厂家： NXP    NXP
描述：

TRANSISTOR 25 V, N-CHANNEL, Si, SMALL SIGNAL, JFET, TO-236AB, PLASTIC PACKAGE-3, FET General Purpose Small Signal
文件： 总14页 (文件大小：121K)
中文：  中文翻译
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BF861A; BF861B; BF861C  
T23  
SO  
N-channel junction FETs  
Rev. 5 — 15 September 2011  
Product data sheet  
1. Product profile  
1.1 General description  
N-channel symmetrical junction field effect transistors in a SOT23 package.  
CAUTION  
The device is supplied in an antistatic package. The gate-source input must be protected against  
static discharge during transport or handling.  
MSC895  
1.2 Features and benefits  
High transfer admittance  
Low feedback capacitance  
Low input capacitance  
Low noise.  
1.3 Applications  
Preamplifiers for AM tuners in car radios.  
1.4 Quick reference data  
Table 1.  
Symbol  
VDS  
Quick reference data  
Parameter  
Conditions  
Min  
Typ  
Max  
Unit  
drain-source voltage  
(DC)  
-
-
25  
V
IDSS  
drain current  
BF861A  
VGS = 0 V; VDS = 8 V  
VGS = 0 V; VDS = 8 V  
VGS = 0 V; VDS = 8 V  
2
-
-
-
-
6.5  
15  
mA  
mA  
mA  
mW  
BF861B  
6
BF861C  
12  
-
25  
Ptot  
total power dissipation up to Tamb = 25 C  
250  
yfs  
forward transfer  
admittance;  
BF861A  
BF861B  
VGS = 0 V; VDS = 8 V  
VGS = 0 V; VDS = 8 V  
VGS = 0 V; VDS = 8 V  
f = 1 MHz  
12  
16  
20  
-
-
-
-
-
-
20  
25  
30  
10  
2.7  
mS  
mS  
mS  
pF  
BF861C  
Ciss  
Crss  
input capacitance  
reverse transfer  
capacitance  
f = 1 MHz  
-
pF  
BF861A; BF861B; BF861C  
NXP Semiconductors  
N-channel junction FETs  
2. Pinning information  
Table 2.  
Discrete pinning  
Pin  
1
Description  
source  
drain  
Simplified outline  
Symbol  
1
2
3
2
3
sym053  
3
gate  
1
2
3. Ordering information  
Table 3.  
Ordering information  
Type  
Package  
number  
Name  
Description  
Version  
SOT23  
SOT23  
SOT23  
BF861A  
BF861B  
BF861C  
-
-
-
plastic surface mounted package; 3 leads  
plastic surface mounted package; 3 leads  
plastic surface mounted package; 3 leads  
4. Marking  
Table 4.  
Marking codes  
Type number  
BF861A  
Marking code[1]  
28*  
29*  
30*  
BF861B  
BF861C  
[1] * = p: Made in Hong Kong.  
* = t: Made in Malaysia.  
* = W: Made in China.  
5. Limiting values  
Table 5.  
Limiting values  
In accordance with the Absolute Maximum Rating System (IEC 60134).  
Symbol  
VDS  
VGSO  
VDGO  
IG  
Parameter  
Conditions  
Min  
Max  
25  
Unit  
V
drain-source voltage (DC)  
gate-source voltage  
drain-gate voltage (DC)  
forward gate current (DC)  
total power dissipation  
storage temperature  
-
open drain  
-
25  
V
open source  
-
25  
V
-
10  
mA  
mW  
C  
C  
[1]  
Ptot  
up to Tamb = 25 C  
-
250  
+150  
150  
Tstg  
65  
Tj  
operating junction  
temperature  
-
[1] Device mounted on an FR4 printed-circuit board.  
BF861A_BF861B_BF861C  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2011. All rights reserved.  
Product data sheet  
Rev. 5 — 15 September 2011  
2 of 14  
BF861A; BF861B; BF861C  
NXP Semiconductors  
N-channel junction FETs  
mrc166  
300  
tot  
P
(mW)  
200  
100  
0
0
50  
100  
150  
T
(°C)  
amb  
Fig 1. Power derating curve.  
6. Thermal characteristics  
Table 6.  
Thermal characteristics  
Parameter  
Symbol  
Conditions  
Typ  
Unit  
[1]  
Rth(j-a)  
thermal resistance from junction  
to ambient  
500  
K/W  
[1] Device mounted on an FR4 printed-circuit board.  
7. Characteristics  
Table 7.  
Characteristics  
Tj = 25 C; VDS = 8 V; VGS = 0 V unless otherwise specified.  
Symbol  
Parameter  
Conditions  
Min  
Typ  
Max Unit  
V(BR)GSS  
gate-source  
IG = 1 A  
25  
-
-
V
breakdown voltage  
VGSoff  
gate-source cut-off  
voltage  
BF861A  
BF861B  
BF861C  
ID = 1 A  
0.2  
0.5  
0.8  
-
-
-
-
-
1  
1.5  
2  
1
V
V
V
V
ID = 1 A  
ID = 1 A  
VGSS  
IDSS  
gate-source forward  
voltage  
VDS = 0 V; IG = 1 mA  
drain current  
BF861A  
2
-
-
-
-
6.5  
15  
25  
1  
mA  
mA  
mA  
nA  
BF861B  
6
BF861C  
12  
-
IGSS  
gate cut-off current  
VGS = 20 V;  
VDS = 0 V  
BF861A_BF861B_BF861C  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2011. All rights reserved.  
Product data sheet  
Rev. 5 — 15 September 2011  
3 of 14  
BF861A; BF861B; BF861C  
NXP Semiconductors  
N-channel junction FETs  
Table 7.  
Characteristics …continued  
Tj = 25 C; VDS = 8 V; VGS = 0 V unless otherwise specified.  
Symbol  
Parameter  
Conditions  
Min  
Typ  
Max Unit  
yfs  
forward transfer  
admittance  
BF861A  
BF861B  
BF861C  
12  
16  
20  
-
-
-
20  
25  
30  
mS  
mS  
mS  
gos  
common source  
output conductance  
BF861A  
BF861B  
-
-
-
-
-
-
200  
250  
300  
10  
S  
S  
S  
pF  
pF  
-
BF861C  
-
Ciss  
Crss  
input capacitance  
f = 1 MHz  
f = 1 MHz  
-
reverse transfer  
capacitance  
2.1  
2.7  
Vn/B  
equivalent input noise VGS = 0 V; f = 1 MHz  
voltage  
-
1.5  
-
nV/Hz  
mbd461  
mbd462  
30  
300  
g
I
os  
DSS  
(μS)  
(mA)  
20  
200  
10  
100  
0
0
0
5
10  
15  
20  
25  
(mA)  
0
−0.5  
−1  
−1.5  
−2  
(V)  
V
GSoff  
I
DSS  
VDS = 8 V.  
VDS = 8 V.  
VGS = 0 V.  
Fig 2. Drain current as a function of gate-source  
cut-off voltage; typical values.  
Fig 3. Common-source output conductance as a  
function of drain current; typical values.  
BF861A_BF861B_BF861C  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2011. All rights reserved.  
Product data sheet  
Rev. 5 — 15 September 2011  
4 of 14  
BF861A; BF861B; BF861C  
NXP Semiconductors  
N-channel junction FETs  
mbd463  
mbd464  
30  
25  
BF861C  
|y  
|
fs  
|y  
|
(mS)  
20  
fs  
BF861B  
(mS)  
20  
BF861A  
15  
10  
5
10  
0
0
0
5
10  
15  
20  
I
25  
(mA)  
0
5
10  
15  
20  
I
(mA)  
DSS  
D
VDS = 8 V.  
VGS = 0 V.  
VDS = 8 V.  
Fig 4. Forward transfer admittance as a function of  
drain current; typical values.  
Fig 5. Forward transfer admittance as a function of  
drain current; typical values.  
mbd465  
mbd466  
5
5
I
I
D
D
(mA)  
(mA)  
4
(1)  
4
3
2
1
0
3
(2)  
2
(3)  
1
(4)  
0
−1  
−0.8  
−0.6  
−0.4  
−0.2  
0
0
2
4
6
8
10  
(V)  
V
GS  
(V)  
V
DS  
VDS = 8 V.  
VDS = 8 V.  
(1) VGS = 0 V.  
(2) VGS = 100 mV.  
(3)  
VGS = 200 mV.  
(4) VGS = 300 mV.  
Fig 6. Typical input characteristics; BF861A.  
Fig 7. Typical output characteristics: BF861A.  
BF861A_BF861B_BF861C  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2011. All rights reserved.  
Product data sheet  
Rev. 5 — 15 September 2011  
5 of 14  
BF861A; BF861B; BF861C  
NXP Semiconductors  
N-channel junction FETs  
mbd467  
mbd468  
10  
10  
I
I
D
D
(mA)  
(mA)  
8
8
(1)  
(2)  
6
4
2
0
6
4
2
0
(3)  
(4)  
(5)  
(6)  
−1  
−0.8  
−0.6  
−0.4  
−0.2  
0
0
2
4
6
8
10  
(V)  
V
GS  
(V)  
V
DS  
VDS = 8 V.  
VDS = 8 V.  
(1) VGS = 0 V.  
(2) GS = 100 mV.  
V
(3) VGS = 200 mV.  
(4) VGS = 300 mV.  
(5)  
VGS = 400 mV.  
(6) VGS = 500 mV.  
Fig 8. Typical input characteristics; BF861B.  
Fig 9. Typical output characteristics; BF861B.  
BF861A_BF861B_BF861C  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2011. All rights reserved.  
Product data sheet  
Rev. 5 — 15 September 2011  
6 of 14  
BF861A; BF861B; BF861C  
NXP Semiconductors  
N-channel junction FETs  
mbd469  
mbd470  
20  
20  
I
I
D
D
(mA)  
16  
(mA)  
16  
(1)  
(2)  
(3)  
12  
8
12  
8
(4)  
(5)  
(6)  
4
4
0
−2.5  
0
−2  
−1.5  
−1  
−0.5  
0
0
2
4
6
8
10  
(V)  
V
(V)  
V
GS  
DS  
VDS = 8 V.  
VDS = 8 V.  
(1) VGS = 0 V.  
(2) VGS = 200 mV.  
(3)  
VGS = 400 mV.  
(4) VGS = 600 mV.  
(5) VGS = 800 mV.  
(6)  
VGS = 1 V.  
Fig 10. Typical input characteristics; BF861C.  
Fig 11. Typical output characteristics; BF861C.  
mbd472  
mbd471  
2
−10  
10  
(1)  
C , C  
is rs  
(2)  
(pF)  
−10  
I
G
8
6
4
2
0
(nA)  
(3)  
−1  
−1  
−10  
C
C
is  
−2  
−3  
−4  
−5  
−10  
(4)  
−10  
−10  
−10  
rs  
0
5
10  
15  
20  
25  
(V)  
−8  
−6  
−4  
−2  
0
V
V
(V)  
DG  
GS  
VDS = 8 V.  
f = 1 MHz.  
VDS = 8 V.  
(1) ID = 10 mA.  
(2) ID = 1 mA.  
(3)  
ID = 0.1 mA.  
(4) ID = IGSS  
.
Fig 12. Input and reverse transfer capacitance as  
functions of gate-source voltage; typical  
values.  
Fig 13. Gate current as a function of drain-gate  
voltage; typical values.  
BF861A_BF861B_BF861C  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2011. All rights reserved.  
Product data sheet  
Rev. 5 — 15 September 2011  
7 of 14  
BF861A; BF861B; BF861C  
NXP Semiconductors  
N-channel junction FETs  
mbd473  
mbd474  
2
8
10  
V /√B  
n
g , b  
is is  
(nV/√Hz)  
(mS)  
6
b
is  
10  
4
2
0
g
is  
1
−1  
10  
−2  
−1  
2
3
2
3
10  
10  
1
10  
10  
10  
f (kHz)  
10  
10  
10  
f (MHz)  
VDS = 8 V.  
GS = 0 V.  
VDS = 8 V.  
GS = 0 V.  
Tamb = 25 C.  
V
V
Fig 14. Equivalent input noise as a function of  
frequency; typical values.  
Fig 15. Common-source input admittance; typical  
values.  
mbd475  
mbd476  
2
2
10  
10  
g , b  
rs rs  
(mS)  
g
, b  
fs fs  
10  
(mS)  
g
fs  
b
rs  
g
1
10  
b
fs  
rs  
−1  
10  
−2  
10  
1
2
3
2
3
10  
10  
10  
10  
10  
10  
f (MHz)  
f (MHz)  
VDS = 8 V.  
GS = 0 V.  
Tamb = 25 C.  
V
V
DS = 8 V.  
GS = 0 V.  
V
Tamb = 25 C.  
Fig 16. Common-source reverse admittance; typical  
values.  
Fig 17. Common-source forward transfer admittance;  
typical values.  
BF861A_BF861B_BF861C  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2011. All rights reserved.  
Product data sheet  
Rev. 5 — 15 September 2011  
8 of 14  
BF861A; BF861B; BF861C  
NXP Semiconductors  
N-channel junction FETs  
mbd477  
2
10  
g
, b  
os os  
(mS)  
10  
b
os  
1
g
os  
−1  
10  
2
3
10  
10  
10  
f (MHz)  
VDS = 8 V.  
GS = 0 V.  
Tamb = 25 C.  
V
Fig 18. Common-source output admittance; typical values.  
BF861A_BF861B_BF861C  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2011. All rights reserved.  
Product data sheet  
Rev. 5 — 15 September 2011  
9 of 14  
BF861A; BF861B; BF861C  
NXP Semiconductors  
N-channel junction FETs  
8. Package outline  
Plastic surface-mounted package; 3 leads  
SOT23  
D
B
E
A
X
H
v
M
A
E
3
Q
A
A
1
c
1
2
e
b
w M  
B
1
L
p
p
e
detail X  
0
1
2 mm  
scale  
DIMENSIONS (mm are the original dimensions)  
A
1
UNIT  
b
c
D
E
e
e
H
L
Q
v
w
A
p
p
1
E
max.  
1.1  
0.9  
0.48  
0.38  
0.15  
0.09  
3.0  
2.8  
1.4  
1.2  
2.5  
2.1  
0.45  
0.15  
0.55  
0.45  
mm  
0.1  
1.9  
0.95  
0.2  
0.1  
REFERENCES  
EUROPEAN  
PROJECTION  
OUTLINE  
VERSION  
ISSUE DATE  
IEC  
JEDEC  
JEITA  
04-11-04  
06-03-16  
SOT23  
TO-236AB  
Fig 19. Package outline  
BF861A_BF861B_BF861C  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2011. All rights reserved.  
Product data sheet  
Rev. 5 — 15 September 2011  
10 of 14  
BF861A; BF861B; BF861C  
NXP Semiconductors  
N-channel junction FETs  
9. Revision history  
Table 8.  
Document ID  
BF861A_BF861B_BF861C v.5 20110915  
Revision history  
Release date  
Data sheet status  
Product data sheet  
Change notice Supersedes  
BF861A_BF861B_BF861C v.4  
-
Modifications:  
• The format of this data sheet has been redesigned to comply with the new identity  
guidelines of NXP Semiconductors.  
• Legal texts have been adapted to the new company name where appropriate.  
• Package outline drawings have been updated to the latest version.  
BF861A_BF861B_BF861C v.4 20040924  
(9397 750 13395)  
Product data sheet  
-
BF861 v.3  
BF861 v.3  
19970904  
Product specification  
-
BF861 v.2  
(9397 750 02667)  
BF861 v.2  
BF861 v.1  
19950414  
19940829  
-
-
-
-
BF861 v.1  
-
BF861A_BF861B_BF861C  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2011. All rights reserved.  
Product data sheet  
Rev. 5 — 15 September 2011  
11 of 14  
BF861A; BF861B; BF861C  
NXP Semiconductors  
N-channel junction FETs  
10. Legal information  
10.1 Data sheet status  
Document status[1][2]  
Product status[3]  
Development  
Definition  
Objective [short] data sheet  
This document contains data from the objective specification for product development.  
This document contains data from the preliminary specification.  
This document contains the product specification.  
Preliminary [short] data sheet Qualification  
Product [short] data sheet Production  
[1]  
[2]  
[3]  
Please consult the most recently issued document before initiating or completing a design.  
The term ‘short data sheet’ is explained in section “Definitions”.  
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status  
information is available on the Internet at URL http://www.nxp.com.  
malfunction of an NXP Semiconductors product can reasonably be expected  
10.2 Definitions  
to result in personal injury, death or severe property or environmental  
damage. NXP Semiconductors accepts no liability for inclusion and/or use of  
NXP Semiconductors products in such equipment or applications and  
therefore such inclusion and/or use is at the customer’s own risk.  
Draft — The document is a draft version only. The content is still under  
internal review and subject to formal approval, which may result in  
modifications or additions. NXP Semiconductors does not give any  
representations or warranties as to the accuracy or completeness of  
information included herein and shall have no liability for the consequences of  
use of such information.  
Applications — Applications that are described herein for any of these  
products are for illustrative purposes only. NXP Semiconductors makes no  
representation or warranty that such applications will be suitable for the  
specified use without further testing or modification.  
Short data sheet — A short data sheet is an extract from a full data sheet  
with the same product type number(s) and title. A short data sheet is intended  
for quick reference only and should not be relied upon to contain detailed and  
full information. For detailed and full information see the relevant full data  
sheet, which is available on request via the local NXP Semiconductors sales  
office. In case of any inconsistency or conflict with the short data sheet, the  
full data sheet shall prevail.  
Customers are responsible for the design and operation of their applications  
and products using NXP Semiconductors products, and NXP Semiconductors  
accepts no liability for any assistance with applications or customer product  
design. It is customer’s sole responsibility to determine whether the NXP  
Semiconductors product is suitable and fit for the customer’s applications and  
products planned, as well as for the planned application and use of  
customer’s third party customer(s). Customers should provide appropriate  
design and operating safeguards to minimize the risks associated with their  
applications and products.  
Product specification — The information and data provided in a Product  
data sheet shall define the specification of the product as agreed between  
NXP Semiconductors and its customer, unless NXP Semiconductors and  
customer have explicitly agreed otherwise in writing. In no event however,  
shall an agreement be valid in which the NXP Semiconductors product is  
deemed to offer functions and qualities beyond those described in the  
Product data sheet.  
NXP Semiconductors does not accept any liability related to any default,  
damage, costs or problem which is based on any weakness or default in the  
customer’s applications or products, or the application or use by customer’s  
third party customer(s). Customer is responsible for doing all necessary  
testing for the customer’s applications and products using NXP  
Semiconductors products in order to avoid a default of the applications and  
the products or of the application or use by customer’s third party  
customer(s). NXP does not accept any liability in this respect.  
10.3 Disclaimers  
Limiting values — Stress above one or more limiting values (as defined in  
the Absolute Maximum Ratings System of IEC 60134) will cause permanent  
damage to the device. Limiting values are stress ratings only and (proper)  
operation of the device at these or any other conditions above those given in  
the Recommended operating conditions section (if present) or the  
Characteristics sections of this document is not warranted. Constant or  
repeated exposure to limiting values will permanently and irreversibly affect  
the quality and reliability of the device.  
Limited warranty and liability — Information in this document is believed to  
be accurate and reliable. However, NXP Semiconductors does not give any  
representations or warranties, expressed or implied, as to the accuracy or  
completeness of such information and shall have no liability for the  
consequences of use of such information.  
In no event shall NXP Semiconductors be liable for any indirect, incidental,  
punitive, special or consequential damages (including - without limitation - lost  
profits, lost savings, business interruption, costs related to the removal or  
replacement of any products or rework charges) whether or not such  
damages are based on tort (including negligence), warranty, breach of  
contract or any other legal theory.  
Terms and conditions of commercial sale — NXP Semiconductors  
products are sold subject to the general terms and conditions of commercial  
sale, as published at http://www.nxp.com/profile/terms, unless otherwise  
agreed in a valid written individual agreement. In case an individual  
agreement is concluded only the terms and conditions of the respective  
agreement shall apply. NXP Semiconductors hereby expressly objects to  
applying the customer’s general terms and conditions with regard to the  
purchase of NXP Semiconductors products by customer.  
Notwithstanding any damages that customer might incur for any reason  
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards  
customer for the products described herein shall be limited in accordance  
with the Terms and conditions of commercial sale of NXP Semiconductors.  
Right to make changes — NXP Semiconductors reserves the right to make  
changes to information published in this document, including without  
limitation specifications and product descriptions, at any time and without  
notice. This document supersedes and replaces all information supplied prior  
to the publication hereof.  
No offer to sell or license — Nothing in this document may be interpreted or  
construed as an offer to sell products that is open for acceptance or the grant,  
conveyance or implication of any license under any copyrights, patents or  
other industrial or intellectual property rights.  
Export control — This document as well as the item(s) described herein  
may be subject to export control regulations. Export might require a prior  
authorization from national authorities.  
Suitability for use — NXP Semiconductors products are not designed,  
authorized or warranted to be suitable for use in life support, life-critical or  
safety-critical systems or equipment, nor in applications where failure or  
BF861A_BF861B_BF861C  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2011. All rights reserved.  
Product data sheet  
Rev. 5 — 15 September 2011  
12 of 14  
BF861A; BF861B; BF861C  
NXP Semiconductors  
N-channel junction FETs  
Quick reference data — The Quick reference data is an extract of the  
product data given in the Limiting values and Characteristics sections of this  
document, and as such is not complete, exhaustive or legally binding.  
product for such automotive applications, use and specifications, and (b)  
whenever customer uses the product for automotive applications beyond  
NXP Semiconductors’ specifications such use shall be solely at customer’s  
own risk, and (c) customer fully indemnifies NXP Semiconductors for any  
liability, damages or failed product claims resulting from customer design and  
use of the product for automotive applications beyond NXP Semiconductors’  
standard warranty and NXP Semiconductors’ product specifications.  
Non-automotive qualified products — Unless this data sheet expressly  
states that this specific NXP Semiconductors product is automotive qualified,  
the product is not suitable for automotive use. It is neither qualified nor tested  
in accordance with automotive testing or application requirements. NXP  
Semiconductors accepts no liability for inclusion and/or use of  
non-automotive qualified products in automotive equipment or applications.  
10.4 Trademarks  
Notice: All referenced brands, product names, service names and trademarks  
are the property of their respective owners.  
In the event that customer uses the product for design-in and use in  
automotive applications to automotive specifications and standards, customer  
(a) shall use the product without NXP Semiconductors’ warranty of the  
11. Contact information  
For more information, please visit: http://www.nxp.com  
For sales office addresses, please send an email to: salesaddresses@nxp.com  
BF861A_BF861B_BF861C  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2011. All rights reserved.  
Product data sheet  
Rev. 5 — 15 September 2011  
13 of 14  
BF861A; BF861B; BF861C  
NXP Semiconductors  
N-channel junction FETs  
12. Contents  
1
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1  
1.1  
1.2  
1.3  
1.4  
General description . . . . . . . . . . . . . . . . . . . . . 1  
Features and benefits. . . . . . . . . . . . . . . . . . . . 1  
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1  
Quick reference data . . . . . . . . . . . . . . . . . . . . 1  
2
3
4
5
6
7
8
9
Pinning information. . . . . . . . . . . . . . . . . . . . . . 2  
Ordering information. . . . . . . . . . . . . . . . . . . . . 2  
Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2  
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2  
Thermal characteristics . . . . . . . . . . . . . . . . . . 3  
Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 3  
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 10  
Revision history. . . . . . . . . . . . . . . . . . . . . . . . 11  
10  
Legal information. . . . . . . . . . . . . . . . . . . . . . . 12  
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 12  
Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 12  
Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 12  
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 13  
10.1  
10.2  
10.3  
10.4  
11  
12  
Contact information. . . . . . . . . . . . . . . . . . . . . 13  
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14  
Please be aware that important notices concerning this document and the product(s)  
described herein, have been included in section ‘Legal information’.  
© NXP B.V. 2011.  
All rights reserved.  
For more information, please visit: http://www.nxp.com  
For sales office addresses, please send an email to: salesaddresses@nxp.com  
Date of release: 15 September 2011  
Document identifier: BF861A_BF861B_BF861C  

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