BFS20/T3 [NXP]
TRANSISTOR VHF BAND, Si, NPN, RF SMALL SIGNAL TRANSISTOR, TO-236AB, PLASTIC PACKAGE-3, BIP RF Small Signal;
| 型号： | BFS20/T3 |
| 厂家： | 
NXP |
| 描述： | TRANSISTOR VHF BAND, Si, NPN, RF SMALL SIGNAL TRANSISTOR, TO-236AB, PLASTIC PACKAGE-3, BIP RF Small Signal 光电二极管 晶体管 |
| 文件： | 总6页 (文件大小：43K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
DISCRETE SEMICONDUCTORS
DATA SHEET
BFS20
NPN medium frequency transistor
Product specification
2004 Feb 05
Supersedes data of 2004 Jan 5
Philips Semiconductors
Product specification
NPN medium frequency transistor
BFS20
FEATURES
PINNING
PIN
• IC(max) = 25 mA
DESCRIPTION
• VCEO(max) = 20 V
1
2
3
base
• Very low feedback capacitance (typ. 350 fF).
emitter
collector
APPLICATIONS
• IF and VHF thick and thin-film circuit applications.
DESCRIPTION
handbook, halfpage
3
3
NPN medium frequency transistor in a SOT23 plastic
package.
1
MARKING
2
1
2
TYPE NUMBER
BFS20
MARKING CODE(1)
Top view
G1*
MAM255
Note
1. * = p : Made in Hong Kong.
* = t : Made in Malaysia.
* = W : Made in China.
Fig.1 Simplified outline (SOT23) and symbol.
ORDERING INFORMATION
TYPE
PACKAGE
DESCRIPTION
plastic surface mounted package; 3 leads
NUMBER
NAME
VERSION
BFS20
−
SOT23
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).
SYMBOL
VCBO
VCEO
VEBO
IC
PARAMETER
CONDITIONS
open emitter
MIN.
MAX.
UNIT
collector-base voltage
collector-emitter voltage
emitter-base voltage
−
−
−
−
−
−
30
V
open base
20
V
open collector
4
V
collector current (DC)
peak collector current
total power dissipation
storage temperature
25
mA
mA
mW
°C
°C
°C
ICM
25
Ptot
Tamb ≤ 25 °C; note 1
250
+150
150
+150
Tstg
−65
−
Tj
junction temperature
operating ambient temperature
Tamb
−65
Note
1. Transistor mounted on an FR4 printed-circuit board.
2004 Feb 05
2
Philips Semiconductors
Product specification
NPN medium frequency transistor
BFS20
THERMAL CHARACTERISTICS
SYMBOL
PARAMETER
CONDITIONS
note 1
VALUE
UNIT
Rth(j-a)
thermal resistance from junction to ambient
500
K/W
Note
1. Transistor mounted on an FR4 printed-circuit board.
CHARACTERISTICS
Tj = 25 °C unless otherwise specified.
SYMBOL
PARAMETER
collector-base cut-off current IE = 0; VCB = 20 V
IE = 0; VCB = 20 V; Tj = 100 °C
IC = 0; VEB = 4 V
CONDITIONS
MIN.
TYP.
MAX.
100
10
UNIT
nA
ICBO
−
−
−
−
µA
IEBO
hFE
VBE
Cc
emitter-base cut-off current
DC current gain
−
−
100
−
nA
IC = 7 mA; VCE = 10 V
40
−
85
740
1
base-emitter voltage
collector capacitance
feedback capacitance
transition frequency
IC = 7 mA; VCE = 10 V
900
−
mV
pF
IE = Ie = 0; VCB = 10 V; f = 1 MHz
IC = 0; VCB = 10 V; f = 1 MHz
IC = 5 mA; VCE = 10 V; f = 100 MHz
−
Cre
fT
−
350
450
−
fF
275
−
MHz
2004 Feb 05
3
Philips Semiconductors
Product specification
NPN medium frequency transistor
BFS20
PACKAGE OUTLINE
Plastic surface mounted package; 3 leads
SOT23
D
B
E
A
X
H
v
M
A
E
3
Q
A
A
1
c
1
2
e
1
b
p
w M
B
L
p
e
detail X
0
1
2 mm
scale
DIMENSIONS (mm are the original dimensions)
A
1
UNIT
b
c
D
E
e
e
H
L
Q
v
w
A
p
p
1
E
max.
1.1
0.9
0.48
0.38
0.15
0.09
3.0
2.8
1.4
1.2
2.5
2.1
0.45
0.15
0.55
0.45
mm
0.1
1.9
0.95
0.2
0.1
REFERENCES
EUROPEAN
PROJECTION
OUTLINE
VERSION
ISSUE DATE
IEC
JEDEC
EIAJ
97-02-28
99-09-13
SOT23
TO-236AB
2004 Feb 05
4
Philips Semiconductors
Product specification
NPN medium frequency transistor
BFS20
DATA SHEET STATUS
DATA SHEET
STATUS(1)
PRODUCT
STATUS(2)(3)
LEVEL
DEFINITION
I
Objective data
Development This data sheet contains data from the objective specification for product
development. Philips Semiconductors reserves the right to change the
specification in any manner without notice.
II
Preliminary data Qualification
This data sheet contains data from the preliminary specification.
Supplementary data will be published at a later date. Philips
Semiconductors reserves the right to change the specification without
notice, in order to improve the design and supply the best possible
product.
III
Product data
Production
This data sheet contains data from the product specification. Philips
Semiconductors reserves the right to make changes at any time in order
to improve the design, manufacturing and supply. Relevant changes will
be communicated via a Customer Product/Process Change Notification
(CPCN).
Notes
1. Please consult the most recently issued data sheet before initiating or completing a design.
2. The product status of the device(s) described in this data sheet may have changed since this data sheet was
published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com.
3. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.
DEFINITIONS
DISCLAIMERS
Short-form specification
The data in a short-form
Life support applications
These products are not
specification is extracted from a full data sheet with the
same type number and title. For detailed information see
the relevant data sheet or data handbook.
designed for use in life support appliances, devices, or
systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips
Semiconductors customers using or selling these products
for use in such applications do so at their own risk and
agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.
Limiting values definition Limiting values given are in
accordance with the Absolute Maximum Rating System
(IEC 60134). Stress above one or more of the limiting
values may cause permanent damage to the device.
These are stress ratings only and operation of the device
at these or at any other conditions above those given in the
Characteristics sections of the specification is not implied.
Exposure to limiting values for extended periods may
affect device reliability.
Right to make changes
Philips Semiconductors
reserves the right to make changes in the products -
including circuits, standard cells, and/or software -
described or contained herein in order to improve design
and/or performance. When the product is in full production
(status ‘Production’), relevant changes will be
Application information
Applications that are
communicated via a Customer Product/Process Change
Notification (CPCN). Philips Semiconductors assumes no
responsibility or liability for the use of any of these
products, conveys no licence or title under any patent,
copyright, or mask work right to these products, and
makes no representations or warranties that these
products are free from patent, copyright, or mask work
right infringement, unless otherwise specified.
described herein for any of these products are for
illustrative purposes only. Philips Semiconductors make
no representation or warranty that such applications will be
suitable for the specified use without further testing or
modification.
2004 Feb 05
5
Philips Semiconductors – a worldwide company
Contact information
For additional information please visit http://www.semiconductors.philips.com.
Fax: +31 40 27 24825
For sales offices addresses send e-mail to: sales.addresses@www.semiconductors.philips.com.
© Koninklijke Philips Electronics N.V. 2004
SCA76
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
R75/05/pp6
Date of release: 2004 Feb 05
Document order number: 9397 750 12769
相关型号：
BFS20/T4
TRANSISTOR VHF BAND, Si, NPN, RF SMALL SIGNAL TRANSISTOR, TO-236AB, PLASTIC PACKAGE-3, BIP RF Small Signal
NXP
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