BGA2748,115 [NXP]
BGA2748 - MMIC wideband amplifier TSSOP 6-Pin;
| 型号： | BGA2748,115 |
| 厂家： | 
NXP |
| 描述： | BGA2748 - MMIC wideband amplifier TSSOP 6-Pin 射频 微波 |
| 文件： | 总11页 (文件大小：82K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
DISCRETE SEMICONDUCTORS
DATA SHEET
book, halfpage
BGA2748
MMIC wideband amplifier
Product specification
2010 Sep 13
Supersedes data of 2002 Jul 03
NXP Semiconductors
Product specification
MMIC wideband amplifier
BGA2748
FEATURES
PINNING
PIN
• Internally matched
• Wide frequency range
• Optimized for 900 MHz
• Excellent isolation
DESCRIPTION
1
2, 5
3
VS
GND2
RF out
GND1
RF in
4
• Low noise
6
• Unconditionally stable.
APPLICATIONS
6
1
5
4
3
1
• Cable systems
• LNB IF amplifiers
• General purpose
• ISM.
6
3
4
2, 5
2
Top view
MAM455
DESCRIPTION
Marking code: G3*
* = - : made in Hong Kong
* = p : made in Hong Kong
* = t : made in Malaysia
Silicon Monolitic Microwave Integrated Circuit (MMIC)
wideband amplifier with internal matching circuit in a 6-pin
SOT363 SMD plastic package.
Fig.1 Simplified outline (SOT363) and symbol.
QUICK REFERENCE DATA
SYMBOL
VS
PARAMETER
DC supply voltage
CONDITIONS
TYP.
MAX.
UNIT
3
4
−
−
−
−
V
IS
|s21|2
DC supply current
insertion power gain
noise figure
5.7
mA
dB
f = 1 GHz
f = 1 GHz
f = 1 GHz
21.8
1.9
NF
dB
PL(sat)
saturated load power
−2.3
dBm
CAUTION
This product is supplied in anti-static packing to prevent damage caused by electrostatic discharge during transport
and handling.
2010 Sep 13
2
NXP Semiconductors
Product specification
MMIC wideband amplifier
BGA2748
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134)
SYMBOL
VS
PARAMETER
DC supply voltage
CONDITIONS
RF input AC coupled
MIN.
MAX.
UNIT
−
−
−
4
V
IS
supply current
15
mA
mW
°C
Ptot
Tstg
Tj
total power dissipation
storage temperature
operating junction temperature
maximum drive power
Ts ≤ 80 °C
200
+150
150
10
−65
−
°C
PD
−
dBm
THERMAL RESISTANCE
SYMBOL
PARAMETER
CONDITIONS
VALUE
300
UNIT
Rth j-s
thermal resistance from junction to solder
point
Ptot = 200 mW; Ts ≤ 80 °C
K/W
CHARACTERISTICS
VS = 3 V; IS = 5.7 mA; f = 1 GHz; Tj = 25 °C; unless otherwise specified.
SYMBOL PARAMETER CONDITIONS
IS supply current
MIN.
4.5
TYP.
5.7
MAX.
UNIT
8
mA
dB
|s21|2
RL IN
RL OUT
NF
insertion power gain
return losses input
return losses output
noise figure
f = 1 GHz
f = 2 GHz
f = 1 GHz
f = 2 GHz
f = 1 GHz
f = 2 GHz
f = 1 GHz
f = 2 GHz
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
21.8
18.5
18
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
dB
dB
14
dB
7
dB
8
dB
1.9
dB
2.4
dB
BW
bandwidth
at |s21|2 −3 dB below flat gain at 1 GHz
1.9
GHz
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
PL(sat)
saturated load power
f = 1 GHz
−2.3
−3.3
−9.2
−10.9
−23.7
−19.9
−1.9
−1.4
f = 2 GHz
PL 1 dB
IP3(in)
IP3(out)
load power
at 1 dB gain compression; f = 1 GHz
at 1 dB gain compression; f = 2 GHz
input intercept point
output intercept point
f = 1 GHz
f = 2 GHz
f = 1 GHz
f = 2 GHz
2010 Sep 13
3
NXP Semiconductors
Product specification
MMIC wideband amplifier
BGA2748
APPLICATION INFORMATION
Figure 2 shows a typical application circuit for the
BGA2748 MMIC. The device is internally matched to 50 Ω,
and therefore does not need any external matching. The
value of the input and output DC blocking capacitors C2,
C3 should be not more than 100 pF for applications above
100 MHz. However, when the device is operated below
100 MHz, the capacitor value should be increased.
DC-block
100 pF
DC-block
100 pF
DC-block
100 pF
handbook, halfpage
input
output
MGU437
The 22 nF supply decoupling capacitor, C1 should be
located as closely as possible to the MMIC.
Fig.3 Easy cascading application circuit.
Separate paths must be used for the ground planes of the
ground pins GND1, GND2, and these paths must be as
short as possible. When using vias, use multiple vias per
pin in order to limit ground path inductance.
mixer
handbook, halfpage
from RF
circuit
to IF circuit
or demodulator
wideband
amplifier
MGU438
V
handbook, halfpage
s
oscillator
C1
V
s
RF in
RF out
RF input
RF output
Fig.4 Application as IF amplifier.
C2
C3
GND1
GND2
MGU435
mixer
handbook, halfpage
Fig.2 Typical application circuit.
to IF circuit
or demodulator
antenna
LNA
wideband
amplifier
MGU439
Figure 3 shows two cascaded MMICs. This configuration
doubles overall gain while preserving broadband
characteristics. Supply decoupling and grounding
conditions for each MMIC are the same as those for the
circuit of Fig.2.
oscillator
Fig.5 Application as RF amplifier.
The excellent wideband characteristics of the MMIC make
it and ideal building block in IF amplifier applications such
as LBNs (see Fig.4).
As a buffer amplifier between an LNA and a mixer in a
receiver circuit, the MMIC offers an easy matching, low
noise solution (see Fig.5).
mixer
handbook, halfpage
from modulation
or IF circuit
to power
amplifier
wideband
amplifier
In Fig.6 the MMIC is used as a driver to the power amplifier
in part of a transmitter circuit. Good linear performance
and matched input and output offer quick design solutions
in such applications.
MGU440
oscillator
Fig.6 Application as driver amplifier.
2010 Sep 13
4
NXP Semiconductors
Product specification
MMIC wideband amplifier
BGA2748
90°
+1
1.0
0.8
0.6
0.4
0.2
0
135°
45°
+2
+0.5
+0.2
+5
100 MHz
0.2
0.5
1
2
5
180°
0
0°
3 GHz
−5
−0.2
−0.5
−2
−45°
−135°
−1
MGU465
1.0
−90°
IS = 5.66 mA; VS = 3 V; PD = −30 dBm; ZO = 50 Ω.
Fig.7 Input reflection coefficient (s11); typical values.
90°
+1
1.0
0.8
0.6
0.4
0.2
0
135°
+0.2
45°
+2
+0.5
+5
0.2
0.5
1
5
100 MHz
180°
0
0°
3 GHz
−5
−0.2
−0.5
−2
−45°
−135°
−1
MGU466
1.0
−90°
IS = 5.66 mA; VS = 3 V; PD = −30 dBm; ZO = 50 Ω.
Fig.8 Output reflection coefficient (s22); typical values.
5
2010 Sep 13
NXP Semiconductors
Product specification
MMIC wideband amplifier
BGA2748
MGU467
MGU468
0
30
handbook, halfpage
handbook, halfpage
2
s
2
s
12
21
(dBm)
(dB)
−20
20
−40
−60
−80
10
0
0
0
1000
2000
3000
1000
2000
3000
f (MHz)
f (MHz)
IS = 5.66 mA; VS = 3 V; PD = −30 dBm; ZO = 50 Ω.
IS = 5.66 mA; VS = 3 V; PD = −30 dBm; ZO = 50 Ω.
Fig.9 Isolation (|s12|2) as a function of frequency;
typical values.
Fig.10 Insertion gain (|s21|2) as a function of
frequency; typical values.
MGU469
MGU470
0
0
handbook, halfpage
handbook, halfpage
P
L
(dBm)
P
L
(dBm)
−10
−10
−20
−30
−20
−30
−50
−40
−30
−20
−10
0
−50
−40
−30
−20
−10
0
P
(dBm)
P
(dBm)
D
D
VS = 3 V; f = 1 GHz; ZO = 50 Ω.
VS = 3 V; f = 2 GHz; ZO = 50 Ω.
Fig.11 Load power as a function of drive power at
1 GHz; typical values.
Fig.12 Load power as a function of drive power at
2 GHz; typical values.
2010 Sep 13
6
NXP Semiconductors
Product specification
MMIC wideband amplifier
BGA2748
MGU471
MGU472
5
15
K
handbook, halfpage
NF
(dB)
4
3
2
1
0
10
5
0
0
1000
2000
3000
0
1000
2000
3000
f (MHz)
f (MHz)
IS = 5.66 mA; VS = 3 V; ZO = 50 Ω.
IS = 5.66 mA; VS = 3 V; ZO = 50 Ω.
Fig.13 Noise figure as a function of frequency;
typical values.
Fig.14 Stability factor as a function of frequency;
typical values.
Table 1 Scattering parameters: IS = 5.66 mA; VS = 3 V; PD = −30 dBm; ZO = 50 Ω; Tamb = 25 °C
s11
s21
s12
s22
f
MAGNITUDE ANGLE MAGNITUDE ANGLE MAGNITUDE ANGLE MAGNITUDE ANGLE
(MHz)
(ratio)
(deg)
(ratio)
(deg)
(ratio)
(deg)
(ratio)
(deg)
100
200
0.08233
0.08934
0.10677
0.12257
0.12902
0.12635
0.11634
0.11643
0.12552
0.15177
0.18258
0.20634
0.22422
0.22777
0.21931
0.22247
−6.058
1.505
5.4700
6.8702
9.7365
11.586
12.372
12.519
12.232
11.550
10.664
9.6775
8.5565
7.5480
6.5362
5.6120
4.8007
3.9567
14.75
17.10
0.00049
0.00078
0.00164
0.00168
0.00233
0.00363
0.00551
0.00659
0.00779
0.00871
0.01025
0.01124
0.01078
0.00884
0.00548
0.00384
−92.64
−91.63
−108.6
−119.4
−113.0
−129.6
−140.5
−151.4
−163.4
−176.5
172.8
0.32715
0.32763
0.33688
0.36332
0.39884
0.44177
0.47449
0.48300
0.46932
0.43106
0.37882
0.31996
0.26441
0.22542
0.18502
0.12693
−3.589
−2.304
−1.542
−1.800
−3.931
−8.067
−14.54
−21.47
−28.10
−34.03
−38.74
−41.11
−40.43
−37.88
−38.37
−37.56
400
1.621
5.277
600
−2.565
−8.769
−11.24
−9.574
1.8040
14.913
23.659
27.689
29.316
28.365
26.661
28.691
37.201
−12.73
−31.11
−48.70
−65.32
−81.52
−96.69
−111.1
−124.5
−136.9
−148.4
−158.5
−167.7
−175.6
800
1000
1200
1400
1600
1800
2000
2200
2400
2600
2800
3000
160.7
146.8
131.1
123.8
160.7
2010 Sep 13
7
NXP Semiconductors
Product specification
MMIC wideband amplifier
BGA2748
PACKAGE OUTLINE
Plastic surface-mounted package; 6 leads
SOT363
D
B
E
A
X
y
H
v
M
A
E
6
5
4
Q
pin 1
index
A
A
1
1
2
3
c
e
1
b
L
p
w
M B
p
e
detail X
0
1
2 mm
scale
DIMENSIONS (mm are the original dimensions)
A
1
UNIT
A
b
c
D
E
e
e
H
L
Q
v
w
y
p
p
1
E
max
0.30
0.20
1.1
0.8
0.25
0.10
2.2
1.8
1.35
1.15
2.2
2.0
0.45
0.15
0.25
0.15
mm
0.1
1.3
0.65
0.2
0.2
0.1
REFERENCES
JEDEC JEITA
EUROPEAN
PROJECTION
OUTLINE
VERSION
ISSUE DATE
IEC
04-11-08
06-03-16
SOT363
SC-88
2010 Sep 13
8
NXP Semiconductors
Product specification
MMIC wideband amplifier
BGA2748
DATA SHEET STATUS
DOCUMENT
STATUS(1)
PRODUCT
STATUS(2)
DEFINITION
Objective data sheet
Development
This document contains data from the objective specification for product
development.
Preliminary data sheet
Product data sheet
Qualification
Production
This document contains data from the preliminary specification.
This document contains the product specification.
Notes
1. Please consult the most recently issued document before initiating or completing a design.
2. The product status of device(s) described in this document may have changed since this document was published
and may differ in case of multiple devices. The latest product status information is available on the Internet at
URL http://www.nxp.com.
DISCLAIMERS
expected to result in personal injury, death or severe
property or environmental damage. NXP Semiconductors
accepts no liability for inclusion and/or use of NXP
Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at
the customer’s own risk.
Limited warranty and liability ⎯ Information in this
document is believed to be accurate and reliable.
However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to
the accuracy or completeness of such information and
shall have no liability for the consequences of use of such
information.
Applications ⎯ Applications that are described herein for
any of these products are for illustrative purposes only.
NXP Semiconductors makes no representation or
warranty that such applications will be suitable for the
specified use without further testing or modification.
In no event shall NXP Semiconductors be liable for any
indirect, incidental, punitive, special or consequential
damages (including - without limitation - lost profits, lost
savings, business interruption, costs related to the
removal or replacement of any products or rework
charges) whether or not such damages are based on tort
(including negligence), warranty, breach of contract or any
other legal theory.
Customers are responsible for the design and operation of
their applications and products using NXP
Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or
customer product design. It is customer’s sole
responsibility to determine whether the NXP
Notwithstanding any damages that customer might incur
for any reason whatsoever, NXP Semiconductors’
aggregate and cumulative liability towards customer for
the products described herein shall be limited in
accordance with the Terms and conditions of commercial
sale of NXP Semiconductors.
Semiconductors product is suitable and fit for the
customer’s applications and products planned, as well as
for the planned application and use of customer’s third
party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks
associated with their applications and products.
Right to make changes ⎯ NXP Semiconductors
reserves the right to make changes to information
published in this document, including without limitation
specifications and product descriptions, at any time and
without notice. This document supersedes and replaces all
information supplied prior to the publication hereof.
NXP Semiconductors does not accept any liability related
to any default, damage, costs or problem which is based
on any weakness or default in the customer’s applications
or products, or the application or use by customer’s third
party customer(s). Customer is responsible for doing all
necessary testing for the customer’s applications and
products using NXP Semiconductors products in order to
avoid a default of the applications and the products or of
the application or use by customer’s third party
customer(s). NXP does not accept any liability in this
respect.
Suitability for use ⎯ NXP Semiconductors products are
not designed, authorized or warranted to be suitable for
use in life support, life-critical or safety-critical systems or
equipment, nor in applications where failure or malfunction
of an NXP Semiconductors product can reasonably be
2010 Sep 13
9
NXP Semiconductors
Product specification
MMIC wideband amplifier
BGA2748
Limiting values ⎯ Stress above one or more limiting
values (as defined in the Absolute Maximum Ratings
System of IEC 60134) will cause permanent damage to
the device. Limiting values are stress ratings only and
(proper) operation of the device at these or any other
conditions above those given in the Recommended
operating conditions section (if present) or the
Characteristics sections of this document is not warranted.
Constant or repeated exposure to limiting values will
permanently and irreversibly affect the quality and
reliability of the device.
Quick reference data ⎯ The Quick reference data is an
extract of the product data given in the Limiting values and
Characteristics sections of this document, and as such is
not complete, exhaustive or legally binding.
Non-automotive qualified products ⎯ Unless this data
sheet expressly states that this specific NXP
Semiconductors product is automotive qualified, the
product is not suitable for automotive use. It is neither
qualified nor tested in accordance with automotive testing
or application requirements. NXP Semiconductors accepts
no liability for inclusion and/or use of non-automotive
qualified products in automotive equipment or
applications.
Terms and conditions of commercial sale ⎯ NXP
Semiconductors products are sold subject to the general
terms and conditions of commercial sale, as published at
http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an
individual agreement is concluded only the terms and
conditions of the respective agreement shall apply. NXP
Semiconductors hereby expressly objects to applying the
customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
In the event that customer uses the product for design-in
and use in automotive applications to automotive
specifications and standards, customer (a) shall use the
product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and
specifications, and (b) whenever customer uses the
product for automotive applications beyond NXP
Semiconductors’ specifications such use shall be solely at
customer’s own risk, and (c) customer fully indemnifies
NXP Semiconductors for any liability, damages or failed
product claims resulting from customer design and use of
the product for automotive applications beyond NXP
Semiconductors’ standard warranty and NXP
No offer to sell or license ⎯ Nothing in this document
may be interpreted or construed as an offer to sell products
that is open for acceptance or the grant, conveyance or
implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Semiconductors’ product specifications.
Export control ⎯ This document as well as the item(s)
described herein may be subject to export control
regulations. Export might require a prior authorization from
national authorities.
2010 Sep 13
10
NXP Semiconductors
provides High Performance Mixed Signal and Standard Product
solutions that leverage its leading RF, Analog, Power Management,
Interface, Security and Digital Processing expertise
Customer notification
This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal
definitions and disclaimers. No changes were made to the technical content, except for the marking codes
and the package outline drawings which were updated to the latest version.
Contact information
For additional information please visit: http://www.nxp.com
For sales offices addresses send e-mail to: salesaddresses@nxp.com
© NXP B.V. 2010
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
R77/04/pp11
Date of release: 2010 Sep 13
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