BGR269,112 [NXP]
BGR269 - 200 MHz, 35 dB gain reverse amplifier SFM 7-Pin;型号: | BGR269,112 |
厂家: | NXP |
描述: | BGR269 - 200 MHz, 35 dB gain reverse amplifier SFM 7-Pin 高功率电源 射频 微波 |
文件: | 总8页 (文件大小:89K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
BGR269
200 MHz, 35 dB gain reverse amplifier
Rev. 6 — 5 August 2010
Product data sheet
1. Product profile
1.1 General description
High performance amplifier in a SOT115J package, operating at a voltage supply of
24 V (DC).
CAUTION
This device is sensitive to ElectroStatic Discharge (ESD). Therefore care should be taken
during transport and handling.
1.2 Features and benefits
Excellent linearity
Silicon nitride passivation
Rugged construction
Gold metallization ensures excellent reliability
35 dB amplification up to 200 MHz
1.3 Applications
Reverse amplifier in two-way CATV systems operating in the 5 MHz to 200 MHz
frequency range
1.4 Quick reference data
Table 1.
Quick reference data
Symbol Parameter
Conditions
f = 5 MHz
Min
34.5
35
Typ
35
-
Max
35.5
36
Unit
dB
Gp
Itot
power gain
total current
f = 200 MHz
VB = 24 V
dB
[1]
145
160
175
mA
[1] The module normally operates at VB = 24 V, but is able to withstand supply transients up to VB = 35 V.
BGR269
NXP Semiconductors
200 MHz, 35 dB gain reverse amplifier
2. Pinning information
Table 2.
Pinning
Pin
1
Description
input
Simplified outline
Symbol
5
2
common
common
+VB
1
9
1 3 5 7 9
3
5
2
3 7 8
7
common
common
output
sym095
8
9
3. Ordering information
Table 3.
Ordering information
Type number
Package
Name
-
Description
Version
BGR269
rectangular single-ended package; aluminium flange; SOT115J
2 vertical mounting holes; 2 × 6-32 UNC and 2 extra
horizontal mounting holes; 7 gold-plated in-line leads
4. Limiting values
Table 4.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Vi
Parameter
Conditions
Min
-
Max
50
Unit
dBmV
°C
RF input voltage
Tmb
mounting base temperature
storage temperature
−20
−40
+100
+100
Tstg
range
°C
BGR269
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 6 — 5 August 2010
2 of 8
BGR269
NXP Semiconductors
200 MHz, 35 dB gain reverse amplifier
5. Characteristics
Table 5.
Characteristics
Bandwidth 5 MHz to 200 MHz; VB = 24 V; Tmb = 30 °C; ZS = ZL = 75 Ω; unless otherwise specified.
Symbol Parameter
Conditions
Min
Typ
Max Unit
Gp
power gain
f = 5 MHz
34.5 35
35.5 dB
f = 200 MHz
35
-
-
-
-
-
-
-
-
-
36
dB
dB
SL
FL
slope straight line
f = 5 MHz to 200 MHz
−0.2
−0.1
−0.1
−0.1
20
0.6
flatness of frequency response f = 5 MHz to 10 MHz
f = 10 MHz to 190 MHz
+0.4 dB
+0.5 dB
+0.4 dB
f = 190 MHz to 200 MHz
s11
input return losses
output return losses
phase response
f = 5 MHz to 200 MHz
-
dB
dB
deg
dB
s22
f = 5 MHz to 200 MHz
20
-
ϕs21
s12
f = 5 MHz
−45
-
+45
−42
reverse isolation
f = 5 MHz to 200 MHz
CTB
composite triple beat
Vo = 50 dBmV
[1]
[2]
[3]
6 channels flat; measured at 37 MHz
10 channels flat; measured at 67.25 MHz
28 channels flat; measured at 199.25 MHz
Vo = 50 dBmV
-
-
-
-
-
-
−74
−68
−57
dB
dB
dB
Xmod
cross modulation
[1]
[2]
[3]
6 channels flat; measured at 37 MHz
10 channels flat; measured at 25 MHz
28 channels flat; measured at 25 MHz
Vo = 50 dBmV
-
-
-
-
-
-
−66
−57
−50
dB
dB
dB
CSO
composite second order
distortion
[1]
[2]
[3]
[4]
[5]
6 channels flat; measured at 38 MHz
10 channels flat; measured at 68.5 MHz
28 channels flat; measured at 200.5 MHz
dim = −60 dB
-
-
−74
−74
−66
-
dB
-
-
dB
-
-
dB
Vo
d2
output voltage
62
-
dBmV
dB
second-order distortion
noise figure
-
-
−70
5.3
5.5
175
NF
f = 70 MHz
-
-
dB
f = 200 MHz
-
-
dB
[6]
Itot
total current
145
160
mA
[1] From the following frequencies: 7.00 MHz, 13.00 MHz, 19.00 MHz, 25.00 MHz, 31.00 MHz and 37.00 MHz.
[2] From the following frequencies: 7.00 MHz, 13.00 MHz, 19.00 MHz, 25.00 MHz, 31.00 MHz, 37.00 MHz, 43.00 MHz, 55.25 MHz,
61.25 MHz and 67.25 MHz.
[3] From the following frequencies: 7.00 MHz, 13.00 MHz, 19.00 MHz, 25.00 MHz, 31.00 MHz, 37.00 MHz, 43.00 MHz, 55.25 MHz,
61.25 MHz, 67.25 MHz, 77.25 MHz, 83.25 MHz, 109.25 MHz, 115.25 MHz, 121.25 MHz, 127.25 MHz, 133.25 MHz, 139.25 MHz,
145.25 MHz, 151.25 MHz, 157.25 MHz, 163.25 MHz, 169.25 MHz, 175.25 MHz, 181.25 MHz, 187.25 MHz, 193.25 MHz and
199.25 MHz.
[4] Measured according to DIN45004B;
fp = 197.25 MHz; Vp = Vo; fq = 204.25 MHz; Vq = Vo − 6 dB; fr = 206.25 MHz; Vr = Vo − 6 dB; measured at fp + fq − fr = 195.25 MHz.
[5] fp = 83.25 MHz; Vp = 50 dBmV; fq = 115.25 MHz; Vq = 50 dBmV; measured at fp + fq = 198.5 MHz.
[6] The module normally operates at VB = 24 V, but is able to withstand supply transients up to VB = 35 V.
BGR269
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 6 — 5 August 2010
3 of 8
BGR269
NXP Semiconductors
200 MHz, 35 dB gain reverse amplifier
6. Package outline
Rectangular single-ended package; aluminium flange; 2 vertical mounting holes;
2 x 6-32 UNC and 2 extra horizontal mounting holes; 7 gold-plated in-line leads
SOT115J
D
E
Z
p
A
2
1
2
3
5
7
8
9
A
L
F
S
W
e
b
M
w
x
c
e
1
d
q
y
M
B
2
1
U
Q
2
B
q
M
B
y
M
B
p
U
q
1
0
5
10 mm
scale
DIMENSIONS (mm are the original dimensions)
A
A
max.
D
max.
E
max.
L
min.
Q
max.
Z
y
2
UNIT
e
e
p
q
W
w
x
b
c
d
F
q
q
S
U
U
2
1
1
2
1
max.
max.
4.15
3.85
0.51
0.38
2.04
2.54
44.75 8.2 6-32
44.25 7.8 UNC
mm 20.8 9.5
0.25 27.2
13.75 2.54 5.08 12.7 8.8
2.4 38.1 25.4 10.2 4.2
0.25 0.7 0.1 3.8
REFERENCES
JEDEC
EUROPEAN
PROJECTION
OUTLINE
VERSION
ISSUE DATE
IEC
JEITA
04-02-04
10-06-18
SOT115J
Fig 1. Package outline SOT115J
BGR269
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 6 — 5 August 2010
4 of 8
BGR269
NXP Semiconductors
200 MHz, 35 dB gain reverse amplifier
7. Revision history
Table 6.
Revision history
Release date Data sheet status
20100805 Product data sheet
Document ID
BGR269 v.6
Modifications:
Change notice
Supersedes
-
BGR269_5
• The format of this data sheet has been redesigned to comply with the new identity guidelines of
NXP Semiconductors.
• Legal texts have been adapted to the new company name where appropriate.
• Table 5 “Characteristics” SL minimum value modified.
BGR269_5
20050530
20020305
20010928
20001212
20000501
Product data sheet
-
-
-
-
-
BGR269_4
BGR269_N_3
BGR269_N_2
BGR269_1
-
BGR269_4
Product specification
Preliminary specification
Preliminary specification
Objective specification
BGR269_N_3
BGR269_N_2
BGR269_1
BGR269
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 6 — 5 August 2010
5 of 8
BGR269
NXP Semiconductors
200 MHz, 35 dB gain reverse amplifier
8. Legal information
8.1
Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
This document contains data from the preliminary specification.
This document contains the product specification.
Preliminary [short] data sheet Qualification
Product [short] data sheet Production
[1]
[2]
[3]
Please consult the most recently issued document before initiating or completing a design.
The term ‘short data sheet’ is explained in section “Definitions”.
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
8.2
Definitions
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
8.3
Disclaimers
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from national authorities.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
BGR269
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 6 — 5 August 2010
6 of 8
BGR269
NXP Semiconductors
200 MHz, 35 dB gain reverse amplifier
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
8.4
Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
9. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
BGR269
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 6 — 5 August 2010
7 of 8
BGR269
NXP Semiconductors
200 MHz, 35 dB gain reverse amplifier
10. Contents
1
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1
1.2
1.3
1.4
General description . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits. . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Quick reference data . . . . . . . . . . . . . . . . . . . . 1
2
3
4
5
6
7
Pinning information. . . . . . . . . . . . . . . . . . . . . . 2
Ordering information. . . . . . . . . . . . . . . . . . . . . 2
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2
Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 3
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 4
Revision history. . . . . . . . . . . . . . . . . . . . . . . . . 5
8
Legal information. . . . . . . . . . . . . . . . . . . . . . . . 6
Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 6
Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
8.1
8.2
8.3
8.4
9
Contact information. . . . . . . . . . . . . . . . . . . . . . 7
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
10
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2010.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 5 August 2010
Document identifier: BGR269
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