BGY135 [NXP]

VHF power amplifier modules; 甚高频功率放大器模块
BGY135
型号: BGY135
厂家: NXP    NXP
描述:

VHF power amplifier modules
甚高频功率放大器模块

放大器 功率放大器
文件: 总10页 (文件大小:106K)
中文:  中文翻译
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DISCRETE SEMICONDUCTORS  
DATA SHEET  
BGY135; BGY136  
VHF power amplifier modules  
1996 May 08  
Product specification  
Supersedes data of June 1993  
File under Discrete Semiconductors, SC09  
Philips Semiconductors  
Product specification  
VHF power amplifier modules  
BGY135; BGY136  
FEATURES  
PINNING - SOT132B  
PIN  
12.5 V nominal supply voltage  
18 W output power.  
DESCRIPTION  
1
RF input  
2
ground  
VS1  
APPLICATIONS  
3
4
ground  
VS2  
Mobile communication equipment operating directly  
from 12 V vehicle electrical systems.  
5
6
7
ground  
DESCRIPTION  
RF output  
ground  
Flange  
The BGY135 and BGY136 are two-stage broadband RF  
amplifier modules in a SOT132B package. Each module  
consists of two NPN transistor dies together with  
lumped-element matching components.  
handbook, halfpage  
5 6 7  
1 2 3 4  
Top view  
MSB029  
Fig.1 Simplified outline.  
QUICK REFERENCE DATA  
TYPE  
MODE OF  
f
VS1; VS2  
PD  
PL  
ZS; ZL  
NUMBER  
OPERATION  
(MHz)  
(V)  
(mW)  
(W)  
()  
BGY135  
BGY136  
CW  
CW  
132 to 156  
146 to 174  
12.5  
150  
18  
50  
WARNING  
Product and environmental safety - toxic materials  
This product contains beryllium oxide. The product is entirely safe provided that the BeO inserts are not damaged.  
All persons who handle, use or dispose of this product should be aware of its nature and of the necessary safety  
precautions. After use, dispose of as chemical or special waste according to the regulations applying at the location of  
the user. It must never be thrown out with the general or domestic waste.  
1996 May 08  
2
Philips Semiconductors  
Product specification  
VHF power amplifier modules  
BGY135; BGY136  
LIMITING VALUES  
In accordance with the Absolute Maximum Rating System (IEC 134).  
SYMBOL  
VS1  
PARAMETER  
MIN.  
MAX.  
15.6  
UNIT  
DC supply voltage  
DC supply voltage  
RF input voltage  
RF output voltage  
input drive power  
load power  
V
V
V
V
VS2  
Vi  
15.6  
25  
Vo  
25  
PD  
PL  
300  
25  
mW  
W
Tstg  
Th  
storage temperature  
40  
20  
+100  
+90  
°C  
heatsink operating temperature  
°C  
MRC267  
30  
handbook, halfpage  
P
L
(W)  
20  
10  
0
–50  
0
50  
100  
T
(°C)  
h
VS1 = VS2 12.5 V; VSWR = 1 : 1.  
Fig.2 Power derating curve.  
1996 May 08  
3
Philips Semiconductors  
Product specification  
VHF power amplifier modules  
BGY135; BGY136  
CHARACTERISTICS  
ZS = ZL = 50 ; PD = 150 mW; VS1 = VS2 = 12.5 V; Th = 25 °C; unless otherwise specified.  
SYMBOL  
PARAMETER  
frequency  
CONDITIONS  
MIN.  
TYP.  
MAX.  
UNIT  
f
BGY135  
BGY136  
132  
156  
MHz  
146  
174  
1
MHz  
mA  
W
IQ2  
PL  
η
leakage current  
load power  
efficiency  
VS1 = 0; PD = 0  
18  
38  
adjust PD for PL = 18 W  
adjust PD for PL = 18 W  
adjust PD for PL = 18 W  
adjust PD for PL = 18 W  
45  
%
H2  
H3  
second harmonic  
third harmonic  
input VSWR  
stability  
25  
25  
3
dBc  
dBc  
VSWRin  
1.5  
VS1 = VS2 = 10.8 to 15.6 V;  
60  
dBc  
PL = 2 to 20 W; VSWR = 3 : 1  
ruggedness  
PD 300 mW;  
V
S1 = VS2 = 15.6 V duration 5 s;  
no degradation  
PL < 25 W; VSWR = 50 : 1  
MRC261  
MRC266  
35  
30  
handbook, halfpage  
handbook, halfpage  
P
L
(W)  
30  
f = 146 MHz  
P
L
(W)  
161 MHz  
174 MHz  
f =  
25  
20  
15  
10  
5
132 MHz  
144 MHz  
156 MHz  
20  
10  
0
0
0
0
100  
200  
300  
100  
200  
300  
P
(mW)  
P
(mW)  
D
D
VS1 = VS2 = 12.5 V.  
VS1 = VS2 = 12.5 V.  
Fig.3 Load power as a function of drive power;  
BGY135; typical values.  
Fig.4 Load power as a function of drive power;  
BGY136; typical values.  
1996 May 08  
4
Philips Semiconductors  
Product specification  
VHF power amplifier modules  
BGY135; BGY136  
MRC259  
MRC264  
60  
60  
handbook, halfpage  
handbook, halfpage  
η
η
(%)  
(%)  
40  
20  
40  
20  
0
140  
0
120  
150  
160  
170  
180  
130  
140  
150  
160  
f (MHz)  
f (MHz)  
VS1 = VS2 = 12.5 V; PL = 18 W.  
VS1 = VS2 = 12.5 V; PL = 18 W.  
Fig.5 Efficiency as a function of frequency;  
BGY135; typical values.  
Fig.6 Efficiency as a function of frequency;  
BGY136; typical values.  
MRC262  
MRC274  
30  
30  
handbook, halfpage  
handbook, halfpage  
V
= 12.5 V  
10.8 V  
S
P
P
L
(W)  
L
(W)  
V
= 12.5 V  
10.8 V  
S
20  
20  
10  
10  
0
140  
0
120  
150  
160  
170  
180  
130  
140  
150  
160  
f (MHz)  
f (MHz)  
PD = 150 mW.  
PD = 150 mW.  
Fig.7 Load power as a function of frequency;  
BGY135; typical values.  
Fig.8 Load power as a function of frequency;  
BGY136; typical values.  
1996 May 08  
5
Philips Semiconductors  
Product specification  
VHF power amplifier modules  
BGY135; BGY136  
MRC265  
MRC260  
–20  
–20  
handbook, halfpage  
handbook, halfpage  
H
H
3
H
H
3
2,  
(dBc)  
2,  
(dBc)  
–40  
–40  
H
H
H
H
2
2
3
–60  
–80  
–60  
–80  
3
120  
130  
140  
150  
160  
140  
150  
160  
170  
180  
f (MHz)  
f (MHz)  
VS1 = VS2 = 12.5 V; PL = 18 W.  
VS1 = VS2 = 12.5 V; PL = 18 W.  
Fig.9 Harmonics as a function of frequency;  
BGY135; typical values.  
Fig.10 Harmonics as a function of frequency;  
BGY136; typical values.  
MRC268  
MRC263  
30  
25  
handbook, halfpage  
handbook, halfpage  
P
L
146 MHz  
174 MHz  
P
132 MHz  
156 MHz  
L
(W)  
(W)  
20  
20  
15  
10  
5
10  
0
25  
0
–25  
0
50  
100  
0
25  
50  
75  
T
100  
(°C)  
T
(°C)  
mb  
mb  
PD = 150 mW; VS1 = VS2 = 12.5 V.  
PD = 150 mW; VS1 = VS2 = 12.5 V.  
Fig.11 Load power as a function of mounting base  
temperature; BGY135; typical values.  
Fig.12 Load power as a function of mounting base  
temperature; BGY136; typical values.  
1996 May 08  
6
Philips Semiconductors  
Product specification  
VHF power amplifier modules  
BGY135; BGY136  
Test circuit information  
pin  
numbers  
1
2
3
4
5
6
7
C1  
C2  
C5  
C6  
L1  
L2  
Z
1
Z
2
C3  
C4  
C7  
C8  
I
=
I
=
S2  
typ. 2.5 A  
S1  
typ. 0.5 A  
output  
input  
V
V
S2  
S1  
MRC273  
Fig.13 Test circuit.  
90  
50  
MLB068  
Dimensions in mm.  
Fig.14 Printed-circuit board layout.  
1996 May 08  
7
Philips Semiconductors  
Product specification  
VHF power amplifier modules  
BGY135; BGY136  
List of components (see Fig.13)  
COMPONENT  
C1, C5  
DESCRIPTION  
VALUE  
CATALOGUE NO  
multilayer chip capacitor  
tantalum capacitor  
1 nF  
4822 590 06614  
2022 001 00067  
2222 852 47103  
2222 852 47104  
3122 108 20153  
C2, C6  
C3, C7  
C4, C8  
L1, L2  
Z1, Z2  
6.8 µF, 35 V  
10 nF  
multilayer chip capacitor  
multilayer chip capacitor  
1 turn 0.5 mm copper wire on ferrite coil  
stripline; note 1  
100 nF  
1 µH  
50 Ω  
Note  
1. The striplines are on a double copper-clad printed-circuit board, with epoxy dielectric (εr = 4.7), thickness 116 inch.  
1996 May 08  
8
Philips Semiconductors  
Product specification  
VHF power amplifier modules  
BGY135; BGY136  
PACKAGE OUTLINE  
52.5  
50.0  
44.9  
17.0  
14.4  
8.1  
9.3  
6.8  
3.7  
0.25  
4.2  
7.65  
max  
7
6
1 2 3 4  
5
19.7  
3.3  
61.0  
A
8.5  
17.0 3.5  
0.5  
0.2 M A  
52.5  
67.5  
MBC876  
Dimensions in mm.  
Fig.15 SOT132B.  
1996 May 08  
9
Philips Semiconductors  
Product specification  
VHF power amplifier modules  
BGY135; BGY136  
DEFINITIONS  
Data sheet status  
Objective specification  
Preliminary specification  
Product specification  
This data sheet contains target or goal specifications for product development.  
This data sheet contains preliminary data; supplementary data may be published later.  
This data sheet contains final product specifications.  
Limiting values  
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or  
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation  
of the device at these or at any other conditions above those given in the Characteristics sections of the specification  
is not implied. Exposure to limiting values for extended periods may affect device reliability.  
Application information  
Where application information is given, it is advisory and does not form part of the specification.  
LIFE SUPPORT APPLICATIONS  
These products are not designed for use in life support appliances, devices, or systems where malfunction of these  
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for  
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such  
improper use or sale.  
1996 May 08  
10  

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