BRY62-T [NXP]

Silicon Controlled Switch, SILICON CONTROLLED SWITCH;
BRY62-T
型号: BRY62-T
厂家: NXP    NXP
描述:

Silicon Controlled Switch, SILICON CONTROLLED SWITCH

可控硅 开关 可控硅开关
文件: 总12页 (文件大小:70K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
DISCRETE SEMICONDUCTORS  
DATA SHEET  
BRY62  
Silicon controlled switch  
Product specification  
1999 Apr 22  
Supersedes data of 1997 Jul 21  
Philips Semiconductors  
Product specification  
Silicon controlled switch  
BRY62  
DESCRIPTION  
PINNING  
Silicon planar PNPN switch in a  
SOT143B plastic package. It is an  
integrated PNP/NPN transistor pair,  
with all electrodes accessible.  
PIN  
DESCRIPTION  
1
2
3
4
anode gate  
anode  
cathode  
cathode gate  
APPLICATIONS  
Switching applications.  
MARKING  
4
3
TYPE  
NUMBER  
MARKING  
CODE  
a
k
ag  
BRY62  
A51  
kg  
1
2
MBB068  
Top view  
MSB014  
Fig.1 Simplified outline (SOT143B) and symbol.  
LIMITING VALUES  
In accordance with the Absolute Maximum Rating System (IEC 134).  
SYMBOL  
PARAMETER  
CONDITIONS  
MIN.  
MAX.  
UNIT  
NPN transistor  
VCBO  
VCER  
VEBO  
IC  
collector-base voltage  
collector-emitter voltage  
emitter-base voltage  
open emitter  
70  
V
V
V
RBE = 10 kΩ  
open collector  
note 1  
70  
5
collector current (DC)  
peak collector current  
emitter current (DC)  
175  
175  
175  
2.5  
mA  
mA  
mA  
A
ICM  
note 2  
IE  
IERM  
repetitive peak emitter current  
tp = 10 µs; δ = 0.01  
PNP transistor  
VCBO  
VCEO  
VEBO  
IE  
collector-base voltage  
open emitter  
open base  
70  
70  
70  
175  
2.5  
V
collector-emitter voltage  
emitter-base voltage  
V
open collector  
V
emitter current (DC)  
mA  
A
IERM  
repetitive peak emitter current  
tp = 10 µs; δ = 0.01  
1999 Apr 22  
2
Philips Semiconductors  
Product specification  
Silicon controlled switch  
BRY62  
SYMBOL  
PARAMETER  
CONDITIONS  
MIN.  
MAX.  
UNIT  
Combined device  
Ptot  
Tstg  
Tj  
total power dissipation  
storage temperature  
T
amb 25 °C  
250  
mW  
65  
+150  
150  
°C  
°C  
°C  
junction temperature  
Tamb  
operating ambient temperature  
see Fig.14  
65  
+150  
Notes  
1. Provided the IE rating is not exceeded.  
2. During switching on, the device can withstand the discharge of a capacitor of a maximum value of 500 pF. This  
capacitor is charged when the transistor is in cut-off condition, with a collector supply voltage of 160 V and a series  
resistance of 100 k.  
THERMAL CHARACTERISTICS  
SYMBOL  
PARAMETER  
CONDITIONS  
VALUE  
UNIT  
Rth j-a  
thermal resistance from junction to ambient in free air  
500  
K/W  
CHARACTERISTICS  
Tamb = 25 °C unless otherwise specified.  
SYMBOL  
PARAMETER  
CONDITIONS  
MIN.  
MAX.  
UNIT  
NPN transistor  
ICER  
collector cut-off current  
VCE = 70 V; RBE = 10 kΩ  
100  
10  
10  
500  
900  
nA  
µA  
µA  
mV  
mV  
VCE = 70 V; RBE = 10 k; Tj = 150 °C  
IC = 0; VEB = 5 V; Tj = 150 °C  
IC = 10 mA; IB = 1 mA  
IEBO  
VCEsat  
VBEsat  
hFE  
emitter cut-off current  
collector-emitter saturation voltage  
base-emitter saturation voltage  
DC current gain  
IC = 10 mA; IB = 1 mA  
IC = 10 mA; VCE = 2 V  
50  
100  
fT  
transition frequency  
IC = 10 mA; VCE = 2 V; f = 100 MHz  
IE = ie = 0; VCB = 20 V; f = 1 MHz  
IC = ic = 0; VEB = 1 V; f = 1 MHz  
MHz  
pF  
Cc  
collector capacitance  
5
Ce  
emitter capacitance  
25  
pF  
PNP transistor  
ICEO  
IEBO  
hFE  
collector cut-off current  
IB = 0; VCE = 70 V; Tj = 150 °C  
IC = 0; VEB = 70 V; Tj = 150 °C  
IE = 1 mA; VCB = 5 V  
3
10  
10  
15  
µA  
µA  
emitter cut-off current  
DC current gain  
Combined device  
VAK  
forward on-state voltage  
RKG-K = 10 kΩ  
IA = 50 mA; IAG = 0  
1.4  
1.9  
1.2  
1
V
IA = 50 mA; IAG = 0; Tj = 55 °C  
IA = 1 mA; IAG = 10 mA  
V
V
IH  
holding current  
RKG-K = 10 k; IAG = 10 mA;  
VBB = 2 V; (see Fig.5)  
mA  
1999 Apr 22  
3
Philips Semiconductors  
Product specification  
Silicon controlled switch  
BRY62  
SYMBOL  
PARAMETER  
CONDITIONS  
MIN.  
MAX.  
UNIT  
Switching times  
ton  
turn-on time  
VKG-K = 0.5 to 4.5 V; RKG-K = 1 k;  
0.25  
µs  
see Figs 6 and 7  
V
KG-K = 0.5 to 0.5 V; RKG-K = 10 kΩ  
1.5  
15  
µs  
µs  
toff  
turn-off time  
RKG-K = 10 k; see Figs 8 and 9  
a (anode)  
(e )  
2
e
2
handbook, halfpage  
ag (anode gate)  
(c ,b )  
PNP transistor  
P
N
P
1
2
c ,b  
N
P
N
1
2
b ,c  
1
2
kg (cathode gate)  
(b ,c )  
NPN transistor  
1
2
MBB681  
e
1
k (cathode)  
(e )  
MBB680  
1
Fig.2 Two transistor equivalent circuit.  
Fig.3 PNPN silicon controlled switch structure.  
1999 Apr 22  
4
Philips Semiconductors  
Product specification  
Silicon controlled switch  
BRY62  
handbook, halfpage  
a
I
handbook, halfpage  
A
I
I
A
AG  
I
AG  
ag  
DUT  
a
ag  
I
V
KG  
AK  
R
KG-K  
kg  
k
I  
kg  
K
V
BB  
k
MBB683  
MBB682  
Fig.4 Silicon controlled switch symbol.  
Fig.5 Equivalent test circuit for holding current.  
V
MBB687  
i
handbook, halfpage  
(V)  
4.5  
90 %  
2.7 kΩ  
handbook, halfpage  
V
10 %  
+12 V  
AK  
0
–0.5  
16 kΩ  
time  
+50 V  
R
KG-K  
V
I
V
AG-K  
MBB685  
time  
t
on  
Fig.7 Pulse duration increased until dashed curve  
disappears.  
Fig.6 Test circuit for turn-on time.  
1999 Apr 22  
5
Philips Semiconductors  
Product specification  
Silicon controlled switch  
BRY62  
V
MBB686  
handbAooKk, halfpage  
(V)  
+12 V  
+50 V  
16 kΩ  
12  
handbook, halfpage  
C = C  
opt  
1 kΩ  
2.7 kΩ  
C
V
AK  
t
q
C < C  
mercury  
wetted  
contact  
opt  
0
time  
R
KG-K  
MBB684  
– 12  
Fig.9 Capacitance increased until C = Copt  
dashed curve disappears.  
Fig.8 Test circuit for turn-off time.  
MBB584  
MBB583  
1.2  
1.8  
handbook, halfpage  
handbook, halfpage  
h
FE  
X
h
FE  
X
V
= 5 V  
AG-K  
0.8  
1.4  
2 V  
0.4  
1.0  
0.6  
0
0
50  
100  
0
50  
100  
150  
I
(mA)  
AG  
o
( C)  
T
amb  
X is the value of hFE at IC = 10 mA; VAG-K = 2 V; Tamb = 25 °C.  
X is the value of hFE at IAG = 10 mA; VAG-K = 2 V; Tamb = 25 °C.  
Fig.10 Normalized DC current gain as a function of  
anode gate current.  
Fig.11 Normalized DC current gain as a function of  
ambient temperature.  
1999 Apr 22  
6
Philips Semiconductors  
Product specification  
Silicon controlled switch  
BRY62  
MBB581  
MBB587  
1.2  
1.2  
handbook, halfpage  
handbook, halfpage  
I
H
V
X
AK  
X
1.1  
1
1
0.8  
0.6  
0.9  
0.8  
50  
0
50  
100  
150  
( C)  
50  
0
50  
100  
T
150  
o
o
( C)  
T
amb  
amb  
X is the value of VAK at IC = 10 mA; IAG = 10 mA; IA = 1 mA;  
VBB = 2 V; RKG-K = 10 kΩ; Tamb = 25 °C.  
X is the value of IH at IC = 10 mA; IAG = 10 mA; VBB = 2 V;  
Rkg-K = 10 kΩ; Tamb = 25 °C.  
Fig.12 Normalized anode-cathode voltage as a  
function of ambient temperature.  
Fig.13 Normalized holding current as a function of  
ambient temperature.  
MBB580  
300  
handbook, halfpage  
P
tot  
(mW)  
200  
100  
0
0
50  
150  
150  
o
( C)  
T
amb  
Fig.14 Power derating curve.  
1999 Apr 22  
7
Philips Semiconductors  
Product specification  
Silicon controlled switch  
BRY62  
PACKAGE OUTLINE  
Plastic surface mounted package; 4 leads  
SOT143B  
D
B
E
A
X
y
H
v
M
A
E
e
b
w
M
B
p
4
3
Q
A
A
1
c
1
2
L
p
b
1
e
1
detail X  
0
1
2 mm  
scale  
DIMENSIONS (mm are the original dimensions)  
A
1
max  
UNIT  
A
b
b
c
D
E
e
e
H
L
p
Q
v
w
y
p
1
1
E
1.1  
0.9  
0.48  
0.38  
0.88  
0.78  
0.15  
0.09  
3.0  
2.8  
1.4  
1.2  
2.5  
2.1  
0.45  
0.15  
0.55  
0.45  
0.1  
mm  
1.9  
1.7  
0.2  
0.1  
0.1  
REFERENCES  
JEDEC  
EUROPEAN  
PROJECTION  
OUTLINE  
VERSION  
ISSUE DATE  
IEC  
EIAJ  
97-02-28  
SOT143B  
1999 Apr 22  
8
Philips Semiconductors  
Product specification  
Silicon controlled switch  
BRY62  
DEFINITIONS  
Data Sheet Status  
Objective specification  
Preliminary specification  
Product specification  
This data sheet contains target or goal specifications for product development.  
This data sheet contains preliminary data; supplementary data may be published later.  
This data sheet contains final product specifications.  
Limiting values  
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or  
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation  
of the device at these or at any other conditions above those given in the Characteristics sections of the specification  
is not implied. Exposure to limiting values for extended periods may affect device reliability.  
Application information  
Where application information is given, it is advisory and does not form part of the specification.  
LIFE SUPPORT APPLICATIONS  
These products are not designed for use in life support appliances, devices, or systems where malfunction of these  
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for  
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such  
improper use or sale.  
1999 Apr 22  
9
Philips Semiconductors  
Product specification  
Silicon controlled switch  
BRY62  
NOTES  
1999 Apr 22  
10  
Philips Semiconductors  
Product specification  
Silicon controlled switch  
BRY62  
NOTES  
1999 Apr 22  
11  
Philips Semiconductors – a worldwide company  
Argentina: see South America  
Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB,  
Tel. +31 40 27 82785, Fax. +31 40 27 88399  
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Brazil: see South America  
Philippines: Philips Semiconductors Philippines Inc.,  
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Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474  
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Tel. +65 350 2538, Fax. +65 251 6500  
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Slovenia: see Italy  
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Hungary: see Austria  
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Uruguay: see South America  
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Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905,  
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Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,  
Middle East: see Italy  
Tel. +381 11 62 5344, Fax.+381 11 63 5777  
For all other countries apply to: Philips Semiconductors,  
Internet: http://www.semiconductors.philips.com  
International Marketing & Sales Communications, Building BE-p, P.O. Box 218,  
5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825  
© Philips Electronics N.V. 1999  
SCA63  
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.  
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed  
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license  
under patent- or other industrial or intellectual property rights.  
Printed in The Netherlands  
115002/00/03/pp12  
Date of release: 1999 Apr 22  
Document order number: 9397 750 05727  

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