BSR57,215 [NXP]

BSR56; BSR57; BSR58 - N-channel FETs TO-236 3-Pin;


型号：	BSR57,215
厂家：	NXP
描述：	BSR56; BSR57; BSR58 - N-channel FETs TO-236 3-Pin 开关光电二极管晶体管
文件：	总10页 (文件大小：441K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

BSR56; BSR57; BSR58

N-channel FETs

Rev. 3 — 25 June 2014

Product data sheet

1. Product profile

1.1 General description

Symmetrical silicon N-channel depletion type junction field-effect transistors (FETs) in a

plastic microminiature envelope designed for application in thick and thin-film circuits. The

transistors are intended for low-power, chopper or switching applications in industrial

service.

1.2 Features and benefits

 Interchangeable drain and source connections

 Small package

1.3 Applications

 Low-power, chopper or switching applications

 Thick and thin-film circuits

1.4 Quick reference data

Table 1.

Quick reference data

Symbol Parameter

Conditions

BSR56

BSR57

BSR58

Unit

Min

Max

40

>50

Min

Max

40

Min

Max

40

V_DS

I_DSS

drain-source voltage

drain leakage current

V_DS= 15 V; V_GS= 0 V;

>20

T_mb= 40 C

<100

<80 mA

V_GSoff

gate-source cut-off

voltage

V_DS= 15 V;

I_D= 0.5 nA

<10

>0.8

C_rs

feedback capacitance

V_DS= 0 V; V_GS= 10 V;

f = 1 MHz

Switching time (V_DD= 10 V; V_GS= 0 V)

t_off

turn-off time

I_D= 20 mA; V_GSM= 10 V

I_D= 10 mA; V_GSM= 6 V

I_D= 5 mA; V_GSM= 4 V

<25

<50

<100 ns

P_tot

total power dissipation T_mb= 40 °C

250

250 mW

Static characteristics

R_DSondrain-source on-state

resistance

V_GS= 0 V; I_D= 0 A; f = 1 kHz

<25

<40

<60



BSR56; BSR57; BSR58

NXP Semiconductors

N-channel FETs

2. Pinning information

Table 2.

Pinning

Description

drain

Simplified outline

Graphic symbol

[1]

source

gate

sym054

[1] Drain and source are interchangeable.

3. Ordering information

Table 3.

Ordering information

Type number

Package

Name

Description

Version

BSR56

BSR57

BSR58

TO-236AB plastic surface-mounted package; 3 leads

SOT23

4. Marking

Table 4.

Type number

BSR56

Marking codes

Marking code

M4P

BSR57

M5P

BSR58

M6P

BSR56_57_58

All information provided in this document is subject to legal disclaimers.

Product data sheet

Rev. 3 — 25 June 2014

2 of 10

BSR56; BSR57; BSR58

NXP Semiconductors

N-channel FETs

5. Limiting values

Table 5.

Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol

V_DS

V_GS

V_DG

I_G

Parameter

Conditions

Min

Max

40

40

Unit

drain-source voltage

gate-source voltage

drain-gate voltage

gate current

C

[1]

P_tot

total power dissipation

storage temperature

junction temperature

T_amb= 40 C

250

+150

150

T_stg

T_j

65

[1] Mounted on a ceramic substrate, 8 mm  10 mm  0.7 mm.

aaa-013766

300

tot

(mW)

200

100

120

160

200

(°C)

amb

Fig 1. Power derating curve

6. Thermal characteristics

Table 6.

Symbol

R_th(j-a)

Thermal characteristics

Parameter

Conditions

Typ

Unit

K/W

[1]

thermal resistance from junction to

ambient

430

[1] Mounted on a ceramic substrate, 8 mm  10 mm  0.7 mm.

BSR56_57_58

All information provided in this document is subject to legal disclaimers.

Product data sheet

Rev. 3 — 25 June 2014

3 of 10

BSR56; BSR57; BSR58

NXP Semiconductors

N-channel FETs

7. Characteristics

Table 7.

Characteristics

T_amb= 25 C unless otherwise specified.

Symbol

Parameter

Conditions

BSR56

BSR57

BSR58

Min Max

Unit

Min

Max

Min

Max

I_GSS

gate-source cut-off

current

V_DS= 0 V;

V_GS= 20 V

1.0

1.0 nA

I_DSX

drain cut-off current

V_DS= 15 V;

V_GS= 10 V

1.0

1.0 nA

V_(BR)GSS

V_GSoff

gate-source breakdown I_G= 1 A;

voltage

>40

V_DS= 0 V

gate-source cut-off

voltage

V_DS= 15 V;

I_D= 0.5 nA

>0.8

<10

I_D

drain current

V_DS= 15 V; V_GS= 0 V

>50

>20

<100

<80 mA

C_rs

feedback capacitance

V_DS= 0 V; V_GS= 10 V;

f = 1 MHz

R_DSon

V_DSon

drain-source on-state

resistance

V_GS= 0 V; I_D= 0 A;

f = 1 kHz

<25

<40

<60



drain-source on-state

voltage

V_GS= 0 V; I_D= 20 mA

V_GS= 0 V; I_D= 10 mA

V_GS= 0 V; I_D= 5 mA

<750

<500

<400 mV

Switching times (V_DD= 10 V; V_GS= 0 V)

t_d

delay time

I_D= 20 mA; V_GSM= 10 V

I_D= 10 mA; V_GSM= 6 V

I_D= 5 mA; V_GSM= 4 V

I_D= 20 mA; V_GSM= 10 V

I_D= 10 mA; V_GSM= 6 V

I_D= 5 mA; V_GSM= 4 V

I_D= 20 mA; V_GSM= 10 V

I_D= 10 mA; V_GSM= 6 V

I_D= 5 mA; V_GSM= 4 V

<10 ns

t_r

rise time

<10 ns

t_off

turn-off time

<25

<50

<100 ns

BSR56_57_58

All information provided in this document is subject to legal disclaimers.

Product data sheet

Rev. 3 — 25 June 2014

4 of 10

BSR56; BSR57; BSR58

NXP Semiconductors

N-channel FETs

GSM

200 ns

off

10%

90%

aaa-013765

Fig 2. Switching times waveforms

TUT

50 Ω

aaa-013764

(1) BSR56; R = 464 

(2) BSR57; R = 953 

(3) BSR58; R = 1910 

Fig 3. Test circuit

Table 8.

Type

Test data

Pulse generator

Oscilloscope



t_r, t_f

Z_o

C_i

t_r

R_i

BSR56

BSR57

BSR58

0.02

 1 ns

50 

 2.5 pF

 0.75 ns

 1 M

 2.5 pF

BSR56_57_58

All information provided in this document is subject to legal disclaimers.

Product data sheet

Rev. 3 — 25 June 2014

5 of 10

BSR56; BSR57; BSR58

NXP Semiconductors

N-channel FETs

8. Package outline

Plastic surface-mounted package; 3 leads

SOT023

detail X

2 mm

scale

Dimensions (mm are the original dimensions)

Unit

max 1.1 0.1 0.48 0.15 3.0 1.4

2.5 0.45 0.55

2.1 0.15 0.45

mm nom

min

1.9 0.95

0.2 0.1

0.9

0.38 0.09 2.8 1.2

sot023_po

References

Outline

version

European

projection

Issue date

IEC

JEDEC

JEITA

06-03-16

14-06-19

SOT023

TO-236AB

Fig 4. Package outline SOT23 (TO-236AB)

BSR56_57_58

All information provided in this document is subject to legal disclaimers.

Product data sheet

Rev. 3 — 25 June 2014

6 of 10

BSR56; BSR57; BSR58

NXP Semiconductors

N-channel FETs

9. Revision history

Table 9.

Revision history

Document ID

BSR56_57_58 v.3

Modifications:

Release date

Data sheet status

Change notice

Supersedes

20140625

Product data sheet

BSR56_57_58_CNV_2

• The format of this data sheet has been redesigned to comply with the new identity

guidelines of NXP Semiconductors.

• Legal texts have been adapted to the new company name where appropriate.

BSR56_57_58_CNV_2

19910401

Product specification

BSR56_57_58

All information provided in this document is subject to legal disclaimers.

Product data sheet

Rev. 3 — 25 June 2014

7 of 10

BSR56; BSR57; BSR58

NXP Semiconductors

N-channel FETs

10. Legal information

10.1 Data sheet status

Document status^[1][2]

Product status^[3]

Development

Definition

Objective [short] data sheet

This document contains data from the objective specification for product development.

This document contains data from the preliminary specification.

This document contains the product specification.

Preliminary [short] data sheet Qualification

Product [short] data sheet Production

[1]

[2]

[3]

Please consult the most recently issued document before initiating or completing a design.

The term ‘short data sheet’ is explained in section “Definitions”.

The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status

information is available on the Internet at URL http://www.nxp.com.

Suitability for use — NXP Semiconductors products are not designed,

10.2 Definitions

authorized or warranted to be suitable for use in life support, life-critical or

safety-critical systems or equipment, nor in applications where failure or

malfunction of an NXP Semiconductors product can reasonably be expected

to result in personal injury, death or severe property or environmental

damage. NXP Semiconductors and its suppliers accept no liability for

inclusion and/or use of NXP Semiconductors products in such equipment or

applications and therefore such inclusion and/or use is at the customer’s own

risk.

Draft — The document is a draft version only. The content is still under

internal review and subject to formal approval, which may result in

modifications or additions. NXP Semiconductors does not give any

representations or warranties as to the accuracy or completeness of

information included herein and shall have no liability for the consequences of

use of such information.

Short data sheet — A short data sheet is an extract from a full data sheet

with the same product type number(s) and title. A short data sheet is intended

for quick reference only and should not be relied upon to contain detailed and

full information. For detailed and full information see the relevant full data

sheet, which is available on request via the local NXP Semiconductors sales

office. In case of any inconsistency or conflict with the short data sheet, the

full data sheet shall prevail.

Applications — Applications that are described herein for any of these

products are for illustrative purposes only. NXP Semiconductors makes no

representation or warranty that such applications will be suitable for the

specified use without further testing or modification.

Customers are responsible for the design and operation of their applications

and products using NXP Semiconductors products, and NXP Semiconductors

accepts no liability for any assistance with applications or customer product

design. It is customer’s sole responsibility to determine whether the NXP

Semiconductors product is suitable and fit for the customer’s applications and

products planned, as well as for the planned application and use of

customer’s third party customer(s). Customers should provide appropriate

design and operating safeguards to minimize the risks associated with their

applications and products.

Product specification — The information and data provided in a Product

data sheet shall define the specification of the product as agreed between

NXP Semiconductors and its customer, unless NXP Semiconductors and

customer have explicitly agreed otherwise in writing. In no event however,

shall an agreement be valid in which the NXP Semiconductors product is

deemed to offer functions and qualities beyond those described in the

Product data sheet.

NXP Semiconductors does not accept any liability related to any default,

damage, costs or problem which is based on any weakness or default in the

customer’s applications or products, or the application or use by customer’s

third party customer(s). Customer is responsible for doing all necessary

testing for the customer’s applications and products using NXP

Semiconductors products in order to avoid a default of the applications and

the products or of the application or use by customer’s third party

customer(s). NXP does not accept any liability in this respect.

10.3 Disclaimers

Limited warranty and liability — Information in this document is believed to

be accurate and reliable. However, NXP Semiconductors does not give any

representations or warranties, expressed or implied, as to the accuracy or

completeness of such information and shall have no liability for the

consequences of use of such information. NXP Semiconductors takes no

responsibility for the content in this document if provided by an information

source outside of NXP Semiconductors.

Limiting values — Stress above one or more limiting values (as defined in

the Absolute Maximum Ratings System of IEC 60134) will cause permanent

damage to the device. Limiting values are stress ratings only and (proper)

operation of the device at these or any other conditions above those given in

the Recommended operating conditions section (if present) or the

Characteristics sections of this document is not warranted. Constant or

repeated exposure to limiting values will permanently and irreversibly affect

the quality and reliability of the device.

In no event shall NXP Semiconductors be liable for any indirect, incidental,

punitive, special or consequential damages (including - without limitation - lost

profits, lost savings, business interruption, costs related to the removal or

replacement of any products or rework charges) whether or not such

damages are based on tort (including negligence), warranty, breach of

contract or any other legal theory.

Terms and conditions of commercial sale — NXP Semiconductors

products are sold subject to the general terms and conditions of commercial

sale, as published at http://www.nxp.com/profile/terms, unless otherwise

agreed in a valid written individual agreement. In case an individual

agreement is concluded only the terms and conditions of the respective

agreement shall apply. NXP Semiconductors hereby expressly objects to

applying the customer’s general terms and conditions with regard to the

purchase of NXP Semiconductors products by customer.

Notwithstanding any damages that customer might incur for any reason

whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards

customer for the products described herein shall be limited in accordance

with the Terms and conditions of commercial sale of NXP Semiconductors.

Right to make changes — NXP Semiconductors reserves the right to make

changes to information published in this document, including without

limitation specifications and product descriptions, at any time and without

notice. This document supersedes and replaces all information supplied prior

to the publication hereof.

No offer to sell or license — Nothing in this document may be interpreted or

construed as an offer to sell products that is open for acceptance or the grant,

conveyance or implication of any license under any copyrights, patents or

other industrial or intellectual property rights.

BSR56_57_58

All information provided in this document is subject to legal disclaimers.

Product data sheet

Rev. 3 — 25 June 2014

8 of 10

BSR56; BSR57; BSR58

NXP Semiconductors

N-channel FETs

Quick reference data — The Quick reference data is an extract of the

product data given in the Limiting values and Characteristics sections of this

document, and as such is not complete, exhaustive or legally binding.

product for such automotive applications, use and specifications, and (b)

whenever customer uses the product for automotive applications beyond

NXP Semiconductors’ specifications such use shall be solely at customer’s

own risk, and (c) customer fully indemnifies NXP Semiconductors for any

liability, damages or failed product claims resulting from customer design and

use of the product for automotive applications beyond NXP Semiconductors’

standard warranty and NXP Semiconductors’ product specifications.

Export control — This document as well as the item(s) described herein

may be subject to export control regulations. Export might require a prior

authorization from competent authorities.

Non-automotive qualified products — Unless this data sheet expressly

states that this specific NXP Semiconductors product is automotive qualified,

the product is not suitable for automotive use. It is neither qualified nor tested

in accordance with automotive testing or application requirements. NXP

Semiconductors accepts no liability for inclusion and/or use of

Translations — A non-English (translated) version of a document is for

reference only. The English version shall prevail in case of any discrepancy

between the translated and English versions.

non-automotive qualified products in automotive equipment or applications.

10.4 Trademarks

Notice: All referenced brands, product names, service names and trademarks

are the property of their respective owners.

In the event that customer uses the product for design-in and use in

automotive applications to automotive specifications and standards, customer

(a) shall use the product without NXP Semiconductors’ warranty of the

11. Contact information

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

BSR56_57_58

All information provided in this document is subject to legal disclaimers.

Product data sheet

Rev. 3 — 25 June 2014

9 of 10

BSR56; BSR57; BSR58

NXP Semiconductors

N-channel FETs

12. Contents

Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1

1.1

1.2

1.3

1.4

General description . . . . . . . . . . . . . . . . . . . . . 1

Features and benefits. . . . . . . . . . . . . . . . . . . . 1

Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

Quick reference data . . . . . . . . . . . . . . . . . . . . 1

Pinning information. . . . . . . . . . . . . . . . . . . . . . 2

Ordering information. . . . . . . . . . . . . . . . . . . . . 2

Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3

Thermal characteristics . . . . . . . . . . . . . . . . . . 3

Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 4

Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 6

Revision history. . . . . . . . . . . . . . . . . . . . . . . . . 7

Legal information. . . . . . . . . . . . . . . . . . . . . . . . 8

Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 8

Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

10.1

10.2

10.3

10.4

Contact information. . . . . . . . . . . . . . . . . . . . . . 9

Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

Please be aware that important notices concerning this document and the product(s)

described herein, have been included in section ‘Legal information’.

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

Date of release: 25 June 2014

Document identifier: BSR56_57_58

BSR57,215 [NXP]

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