BT132-600D,412 [NXP]
BT132-600D;
| 型号： | BT132-600D,412 |
| 厂家： | 
NXP |
| 描述： | BT132-600D 三端双向交流开关 |
| 文件： | 总8页 (文件大小：98K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
DISCRETE SEMICONDUCTORS
BT132 series D
Triacs
logic levelꢀ
Product specification
January 1998
NXP Semiconductors
Product specification
Triacs
logic level
BT132 series D
GENERAL DESCRIPTION
QUICK REFERENCE DATA
Glass passivated, sensitive gate
triacs in a plastic envelope, intended
for use in general purpose
bidirectional switching and phase
control applications. These devices
are intended to be interfaced directly
to microcontrollers, logic integrated
circuits and other low power gate
trigger circuits.
SYMBOL PARAMETER
MAX. MAX. UNIT
BT132- 500D 600D
Repetitive peak off-state voltages 500 600
RMS on-state current
Non-repetitive peak on-state current
VDRM
IT(RMS)
ITSM
V
A
A
1
16
1
16
PINNING - TO92
PIN CONFIGURATION
SYMBOL
PIN
1
DESCRIPTION
main terminal 2
T2
T1
2
gate
3
main terminal 1
G
3
2 1
LIMITING VALUES
Limiting values in accordance with the Absolute Maximum System (IEC 134).
SYMBOL PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
V
-500
5001
-600
6001
VDRM
Repetitive peak off-state
voltages
-
-
IT(RMS)
ITSM
RMS on-state current
Non-repetitive peak
on-state current
full sine wave; Tlead ≤51 ˚C
full sine wave; Tj = 25 ˚C prior to
surge
1
A
t = 20 ms
t = 16.7 ms
t = 10 ms
ITM = 1.5 A; IG = 0.2 A;
dIG/dt = 0.2 A/μs
T2+ G+
-
-
-
16
17.6
1.28
A
A
I2t
dIT/dt
I2t for fusing
Repetitive rate of rise of
on-state current after
triggering
A2s
-
-
-
-
-
-
-
-
50
50
50
10
2
5
5
0.5
150
125
A/μs
A/μs
A/μs
A/μs
A
V
W
W
˚C
T2+ G-
T2- G-
T2- G+
IGM
Peak gate current
Peak gate voltage
Peak gate power
Average gate power
Storage temperature
Operating junction
temperature
VGM
PGM
PG(AV)
Tstg
Tj
over any 20 ms period
-40
-
˚C
1 Although not recommended, off-state voltages up to 800V may be applied without damage, but the triac may
switch to the on-state. The rate of rise of current should not exceed 3 A/μs.
January 1998
1
Rev 1.000
ꢁꢂꢃ Semiconductorsꢀ
Product specification
Triacs
logic level
BT132 series D
THERMAL RESISTANCES
SYMBOL PARAMETER
CONDITIONS
MIN. TYP. MAX. UNIT
Rth j-lead
Rth j-a
Thermal resistance
junction to lead
Thermal resistance
junction to ambient
full cycle
half cycle
pcb mounted;lead length = 4mm
-
-
-
-
-
60
80
-
K/W
K/W
K/W
150
STATIC CHARACTERISTICS
Tj = 25 ˚C unless otherwise stated
SYMBOL PARAMETER
CONDITIONS
MIN. TYP. MAX. UNIT
IGT
Gate trigger current
VD = 12 V; IT = 0.1 A
T2+ G+
-
-
-
-
2.0
2.5
2.5
5.0
5
5
5
10
mA
mA
mA
mA
T2+ G-
T2- G-
T2- G+
IL
Latching current
VD = 12 V; IGT = 0.1 A
T2+ G+
T2+ G-
T2- G-
T2- G+
-
-
-
-
-
-
1.6
4.5
1.2
2.2
1.2
1.4
0.7
0.4
0.1
10
15
10
15
mA
mA
mA
mA
mA
V
V
V
mA
IH
VT
VGT
Holding current
On-state voltage
Gate trigger voltage
VD = 12 V; IGT = 0.1 A
IT = 5 A
VD = 12 V; IT = 0.1 A
10
1.70
1.5
-
-
0.25
-
VD = 400 V; IT = 0.1 A; Tj = 125 ˚C
Off-state leakage current VD = VDRM(max); Tj = 125 ˚C
ID
0.5
DYNAMIC CHARACTERISTICS
Tj = 25 ˚C unless otherwise stated
SYMBOL PARAMETER
CONDITIONS
MIN. TYP. MAX. UNIT
dVD/dt
tgt
Critical rate of rise of
off-state voltage
Gate controlled turn-on
time
VDM = 67% VDRM(max); Tj = 125 ˚C;
exponential waveform; RGK = 1 kΩ
ITM = 6 A; VD = VDRM(max); IG = 0.1 A;
dIG/dt = 5 A/μs
-
-
5
2
-
-
V/μs
μs
January 1998
2
Rev 1.000
ꢁꢂꢃ Semiconductors
Product specification
Triacs
logic level
BT132 series D
IT(RMS) / A
Ptot / W
1.4
Tmb(max) / C
=180
41
53
65
77
89
101
1.2
1
51 C
1.2
1
120
90
1
0.8
0.6
0.4
0.2
0
0.8
0.6
0.4
0.2
60
30
113
125
0
0
-50
0
50
100
150
0
0
0.2
0.4
0.6
IT(RMS) / A
0.8
1
1.2
Tmb / C
Fig.1. Maximum on-state dissipation, Ptot, versus rms
on-state current, IT(RMS), where α = conduction angle.
Fig.4. Maximum permissible rms current IT(RMS) ,
versus lead temperature Tlead.
ITSM / A
IT(RMS) / A
1000
3
2.5
24
1.5
1
I
TSM
time
I
T
T
Tj initial = 25 C max
100
dIT/dt limit
T2- G+ quadrant
0.5
10
10us
0
0.01
100us
1ms
T / s
10ms
100ms
0.1
surge duration / s
1
10
Fig.2. Maximum permissible non-repetitive peak
on-state current ITSM, versus pulse width tp, for
sinusoidal currents, tp ≤ 20ms.
Fig.5. Maximum permissible repetitive rms on-state
current IT(RMS), versus surge duration, for sinusoidal
currents, f = 50 Hz; Tlead ≤ 51˚C.
VGT(Tj)
VGT(25 C)
ITSM / A
20
15
10
1.6
1.4
1.2
1
I
TSM
time
I
T
T
Tj initial = 25 C max
0.8
0.6
0.4
5
0
10 100
Number of cycles at 50Hz
1000
-50
0
50
Tj / C
100
150
Fig.3. Maximum permissible non-repetitive peak
on-state current ITSM, versus number of cycles, for
sinusoidal currents, f = 50 Hz.
Fig.6. Normalised gate trigger voltage
VGT(Tj)/ VGT(25˚C), versus junction temperature Tj.
January 1998
3
Rev 1.000
ꢁꢂꢃ Semiconductors
Product specification
Triacs
logic level
BT132 series D
IGT(Tj)
IGT(25 C)
3
IT / A
12
10
8
Tj = 125 C
Tj = 25 C
T2+ G+
T2+ G-
typ
max
2.5
2
Vo = 1.27 V
Rs = 0.091 ohms
T2- G-
T2- G+
6
1.5
1
4
2
0.5
0
0
0
0.5
1
1.5
VT / V
2
2.5
3
-50
0
50
Tj / C
100
150
Fig.7. Normalised gate trigger current
IGT(Tj)/ IGT(25˚C), versus junction temperature Tj.
Fig.10. Typical and maximum on-state characteristic.
IL(Tj)
IL(25 C)
Zth j-sp (K/W)
100
10
3
2.5
2
unidirectional
bidirectional
1
1.5
1
t
P
D
p
0.1
0.01
t
0.5
0
10us
0.1ms
1ms
10ms
tp / s
0.1s
1s
10s
-50
0
50
Tj / C
100
150
Fig.8. Normalised latching current IL(Tj)/ IL(25˚C),
versus junction temperature Tj.
Fig.11. Transient thermal impedance Zth j-lead, versus
pulse width tp.
dVD/dt (V/us)
1000
IH(Tj)
IH(25C)
3
2.5
2
100
10
1
1.5
1
0.5
0
-50
0
50
Tj / C
100
150
0
50
100
150
Tj / C
Fig.9. Normalised holding current IH(Tj)/ IH(25˚C),
versus junction temperature Tj.
Fig.12. Typical, critical rate of rise of off-state voltage,
dVD/dt versus junction temperature Tj.
January 1998
4
Rev 1.000
ꢁꢂꢃ Semiconductors
ꢀꢀProduct specification
Triacs
logic level
BT132 series D
MECHANICAL DATA
Dimensions in mm
Net Mass: 0.2 g
2.54
0.66
0.56
1.6
4.2 max
4.8 max
5.2 max
12.7 min
0.48
0.40
0.40
min
3 2 1
Fig.13. TO92 Variant; plastic envelope.
Notes
1. Epoxy meets UL94 V0 at 1/8".
January 1998
5
Rev 1.000
NXP Semiconductors
Legal information
DATA SHEET STATUS
DOCUMENT
STATUS(1)
PRODUCT
STATUS(2)
DEFINITION
Objective data sheet
Development
This document contains data from the objective specification for product
development.
Preliminary data sheet
Product data sheet
Qualification
Production
This document contains data from the preliminary specification.
This document contains the product specification.
Notes
1. Please consult the most recently issued document before initiating or completing a design.
2. The product status of device(s) described in this document may have changed since this document was published
and may differ in case of multiple devices. The latest product status information is available on the Internet at
URL http://www.nxp.com.
DEFINITIONS
Right to make changes ⎯ NXP Semiconductors
reserves the right to make changes to information
published in this document, including without limitation
specifications and product descriptions, at any time and
without notice. This document supersedes and replaces all
information supplied prior to the publication hereof.
Product specification ⎯ The information and data
provided in a Product data sheet shall define the
specification of the product as agreed between NXP
Semiconductors and its customer, unless NXP
Semiconductors and customer have explicitly agreed
otherwise in writing. In no event however, shall an
agreement be valid in which the NXP Semiconductors
product is deemed to offer functions and qualities beyond
those described in the Product data sheet.
Suitability for use ⎯ NXP Semiconductors products are
not designed, authorized or warranted to be suitable for
use in life support, life-critical or safety-critical systems or
equipment, nor in applications where failure or malfunction
of an NXP Semiconductors product can reasonably be
expected to result in personal injury, death or severe
property or environmental damage. NXP Semiconductors
accepts no liability for inclusion and/or use of NXP
Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at
the customer’s own risk.
DISCLAIMERS
Limited warranty and liability ⎯ Information in this
document is believed to be accurate and reliable.
However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to
the accuracy or completeness of such information and
shall have no liability for the consequences of use of such
information.
Applications ⎯ Applications that are described herein for
any of these products are for illustrative purposes only.
NXP Semiconductors makes no representation or
warranty that such applications will be suitable for the
specified use without further testing or modification.
In no event shall NXP Semiconductors be liable for any
indirect, incidental, punitive, special or consequential
damages (including - without limitation - lost profits, lost
savings, business interruption, costs related to the
removal or replacement of any products or rework
charges) whether or not such damages are based on tort
(including negligence), warranty, breach of contract or any
other legal theory.
Customers are responsible for the design and operation of
their applications and products using NXP
Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or
customer product design. It is customer’s sole
responsibility to determine whether the NXP
Notwithstanding any damages that customer might incur
for any reason whatsoever, NXP Semiconductors’
aggregate and cumulative liability towards customer for
the products described herein shall be limited in
accordance with the Terms and conditions of commercial
sale of NXP Semiconductors.
Semiconductors product is suitable and fit for the
customer’s applications and products planned, as well as
for the planned application and use of customer’s third
party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks
associated with their applications and products.
NXP Semiconductors
Legal information
NXP Semiconductors does not accept any liability related
to any default, damage, costs or problem which is based
on any weakness or default in the customer’s applications
or products, or the application or use by customer’s third
party customer(s). Customer is responsible for doing all
necessary testing for the customer’s applications and
products using NXP Semiconductors products in order to
avoid a default of the applications and the products or of
the application or use by customer’s third party
customer(s). NXP does not accept any liability in this
respect.
that is open for acceptance or the grant, conveyance or
implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Export control ⎯ This document as well as the item(s)
described herein may be subject to export control
regulations. Export might require a prior authorization from
national authorities.
Quick reference data ⎯ The Quick reference data is an
extract of the product data given in the Limiting values and
Characteristics sections of this document, and as such is
not complete, exhaustive or legally binding.
Limiting values ⎯ Stress above one or more limiting
values (as defined in the Absolute Maximum Ratings
System of IEC 60134) will cause permanent damage to
the device. Limiting values are stress ratings only and
(proper) operation of the device at these or any other
conditions above those given in the Recommended
operating conditions section (if present) or the
Characteristics sections of this document is not warranted.
Constant or repeated exposure to limiting values will
permanently and irreversibly affect the quality and
reliability of the device.
Non-automotive qualified products ⎯ Unless this data
sheet expressly states that this specific NXP
Semiconductors product is automotive qualified, the
product is not suitable for automotive use. It is neither
qualified nor tested in accordance with automotive testing
or application requirements. NXP Semiconductors accepts
no liability for inclusion and/or use of non-automotive
qualified products in automotive equipment or
applications.
In the event that customer uses the product for design-in
and use in automotive applications to automotive
specifications and standards, customer (a) shall use the
product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and
specifications, and (b) whenever customer uses the
product for automotive applications beyond NXP
Semiconductors’ specifications such use shall be solely at
customer’s own risk, and (c) customer fully indemnifies
NXP Semiconductors for any liability, damages or failed
product claims resulting from customer design and use of
the product for automotive applications beyond NXP
Semiconductors’ standard warranty and NXP
Terms and conditions of commercial sale ⎯ NXP
Semiconductors products are sold subject to the general
terms and conditions of commercial sale, as published at
http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an
individual agreement is concluded only the terms and
conditions of the respective agreement shall apply. NXP
Semiconductors hereby expressly objects to applying the
customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
No offer to sell or license ⎯ Nothing in this document
may be interpreted or construed as an offer to sell products
Semiconductors’ product specifications.
Customer notification
This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal definitions
and disclaimers. No changes were made to the content, except for the legal definitions and disclaimers.
Contact information
For additional information please visit: http://www.nxp.com
For sales offices addresses send e-mail to: salesaddresses@nxp.com
© NXP B.V. 2011
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without
notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or
other industrial or intellectual property rights.
Printed in The Netherlands
相关型号：
©2020 ICPDF网 联系我们和版权申明