BTA201W-800E [NXP]
1 A Three-quadrant triacs high commutation; 1三象限三端双向可控硅整流高
| 型号： | BTA201W-800E |
| 厂家： | 
NXP |
| 描述： | 1 A Three-quadrant triacs high commutation |
| 文件： | 总13页 (文件大小：80K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
BTA201W series E
1 A Three-quadrant triacs high commutation
Rev. 02 — 17 September 2007
Product data sheet
1. Product profile
1.1 General description
Passivated guaranteed commutation triacs in a surface-mounted plastic package,
intended for interfacing with low-power drivers, including microcontrollers.
1.2 Features
I Suitable for interfacing with low-power
drivers, including microcontrollers
I SOT223 surface mounted
I Solenoid drivers
1.3 Applications
I Motor control
1.4 Quick reference data
I ITSM ≤ 12.5 A
I IT(RMS) ≤ 1 A
I IGT ≤ 10 mA
I VDRM ≤ 600 V (BTA201W-600E)
I VDRM ≤ 800 V (BTA201W-800E)
2. Pinning information
Table 1.
Pinning
Pin
1
Description
Simplified outline
Symbol
main terminal 1 (T1)
main terminal 2 (T2)
gate (G)
4
T2
T1
G
2
3
sym051
4
main terminal 2 (T2)
1
2
3
SOT223
BTA201W series E
NXP Semiconductors
1 A Three-quadrant triacs high commutation
3. Ordering information
Table 2.
Ordering information
Type number
Package
Name
Description
plastic surface-mounted package with increased heatsink; 4 leads
Version
BTA201W-600E SC-73
BTA201W-800E
SOT223
4. Limiting values
Table 3.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
Min
Max
600
800
1
Unit
[1]
VDRM
repetitive peak off-state voltage
BTA201W-600E
BTA201W-800E
-
-
-
V
V
A
IT(RMS)
ITSM
RMS on-state current
full sine wave; Tsp ≤ 106 °C;
see Figure 4 and 5
non-repetitive peak on-state current full sine wave; Tj = 25 °C prior to
surge; see Figure 2 and 3
t = 20 ms
-
-
-
-
12.5
13.7
0.78
100
A
t = 16.7 ms
A
A2s
I2t
I2t for fusing
t = 10 ms
dIT/dt
rate of rise of on-state current
ITM = 1.5 A; IG = 0.2 A;
A/µs
dIG/dt = 0.2 A/µs
IGM
peak gate current
peak gate power
-
2
A
PGM
PG(AV)
Tstg
Tj
-
5
W
W
°C
°C
average gate power
storage temperature
junction temperature
over any 20 ms period
-
0.1
+150
125
−40
-
[1] Although not recommended, off-state voltages up to 800 V may be applied without damage, but the triac may switch to the on-state. The
rate of rise of current should not exceed 6 A/µs.
BTA201W_SER_E_2
© NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 02 — 17 September 2007
2 of 13
BTA201W series E
NXP Semiconductors
1 A Three-quadrant triacs high commutation
003aab299
1.5
α
Ptot
(W)
α = 180°
α
120°
90°
1.0
0.5
0.0
60°
30°
0
0.2
0.4
0.6
0.8
1
1.2
IT(RMS) (A)
α = conduction angle
Fig 1. Total power dissipation as a function of RMS on-state current; maximum values
001aag959
16
I
TSM
(A)
12
8
4
0
I
I
TSM
t
T
T
T
= 25 °C max
j(init)
2
3
1
10
10
10
number of cycles (n)
f = 50 Hz
Fig 2. Non-repetitive peak on-state current as a function of the number of sinusoidal current cycles; maximum
values
BTA201W_SER_E_2
© NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 02 — 17 September 2007
3 of 13
BTA201W series E
NXP Semiconductors
1 A Three-quadrant triacs high commutation
001aag958
3
10
I
I
TSM
t
T
I
TSM
(A)
T
T
= 25 °C max
j(init)
(1)
2
10
10
10
−5
−4
−3
−2
−1
10
10
10
10
t
(s)
p
tp ≤ 20 ms
(1) dIT/dt limit
Fig 3. Non-repetitive peak on-state current as a function of pulse width; maximum values
001aag964
001aag963
1.2
6
I
T(RMS)
(A)
I
T(RMS)
(A)
1.0
0.8
0.6
0.4
0.2
0
4
2
0
−2
−1
−50
0
50
100
150
10
10
1
10
T
(°C)
surge duration (s)
sp
f = 50 Hz; Tsp = 106 °C
Fig 4. RMS on-state current as a function of surge
duration; maximum values
Fig 5. RMS on-state current as a function of solder
point temperature; maximum values
BTA201W_SER_E_2
© NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 02 — 17 September 2007
4 of 13
BTA201W series E
NXP Semiconductors
1 A Three-quadrant triacs high commutation
5. Thermal characteristics
Table 4.
Symbol
Rth(j-sp)
Thermal characteristics
Parameter
Conditions
Min
Typ
Max
Unit
thermal resistance from
junction to solder point
see Figure 6
-
-
15
K/W
[1]
[1]
Rth(j-a)
thermal resistance from
junction to ambient
minimum footprint; see Figure 14
for pad area; see Figure 15
-
-
156
70
-
-
K/W
K/W
[1] Mounted on a printed-circuit board.
001aag969
2
10
Z
th(j-sp)
(K/W)
10
(1)
1
(2)
P
−1
10
t
t
p
−2
10
−5
−4
−3
−2
−1
10
10
10
10
10
1
10
t
(s)
p
(1) Unidirectional
(2) Bidirectional
Fig 6. Transient thermal impedance from junction to solder point as a function of pulse width
BTA201W_SER_E_2
© NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 02 — 17 September 2007
5 of 13
BTA201W series E
NXP Semiconductors
1 A Three-quadrant triacs high commutation
6. Static characteristics
Table 5.
Static characteristics
Tj = 25 °C unless otherwise specified.
Symbol Parameter
BTA201W-600E and BTA201W-800E
Conditions
Min
Typ
Max
Unit
IGT
gate trigger current
latching current
VD = 12 V; IT = 0.1 A; see Figure 8
T2+ G+
-
-
-
-
-
-
10
10
10
mA
mA
mA
T2+ G−
T2− G−
IL
VD = 12 V; IGT = 0.1 A; see Figure 10
T2+ G+
-
-
12
20
12
12
1.5
1.5
-
mA
mA
mA
mA
V
T2+ G−
-
-
T2− G−
-
-
IH
holding current
VD = 12 V; IGT = 0.1 A; see Figure 11
IT = 1.4 A; see Figure 9
VD = 12 V; IT = 0.1 A; see Figure 7
VD = 400 V; IT = 0.1 A; Tj = 125 °C
VD = VDRM(max); Tj = 125 °C
-
-
VT
VGT
on-state voltage
gate trigger voltage
-
1.2
0.7
0.3
0.1
-
V
0.2
-
V
ID
off-state current
0.5
mA
BTA201W_SER_E_2
© NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 02 — 17 September 2007
6 of 13
BTA201W series E
NXP Semiconductors
1 A Three-quadrant triacs high commutation
7. Dynamic characteristics
Table 6.
Symbol
Dynamic characteristics
Parameter
Conditions
Min
Typ
Max
Unit
BTA201W-600E and BTA201W-800E
dVD/dt
rate of rise of off-state VDM = 0.67VDRM(max); Tj = 125 °C;
600
-
-
V/µs
voltage
exponential waveform; gate open circuit
dIcom/dt
rate of change of
VDM = 400 V; Tj = 125 °C; IT(RMS) = 4 A;
commutating current
gate open circuit
dVcom/dt = 20 V/µs
dVcom/dt = 10 V/µs
2.5
3.5
-
-
-
-
-
A/ms
A/ms
µs
-
tgt
gate-controlled turn-on ITM = 20 A; VD = VDRM(max); IG = 0.1 A;
2
time
dIG/dt = 5 A/µs
001aab101
003aaa959
1.6
3
V
GT
I
GT
V
GT(25°C)
I
GT(25°C)
1.2
2
(1)
(2)
(3)
0.8
0.4
1
(3)
(2)
(1)
0
−50
−50
0
50
100
150
50
0
150
100
T (°C)
j
T (°C)
j
(1) T2− G−
(2) T2+ G−
(3) T2+ G+
Fig 7. Normalized gate trigger voltage as a function of
junction temperature
Fig 8. Normalized gate trigger current as a function of
junction temperature
BTA201W_SER_E_2
© NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 02 — 17 September 2007
7 of 13
BTA201W series E
NXP Semiconductors
1 A Three-quadrant triacs high commutation
001aab100
003aaa960
3
2
I
T
I
L
(A)
1.6
I
L(25°C)
2
1.2
0.8
0.4
0
(1)
(2)
(3)
1
0
−50
0
50
100
150
2
0.4
0
0.8
1.2
1.6
T (°C)
j
V
(V)
T
Vo = 1.02 V; Rs = 358 mΩ
(1) Tj = 125 °C; typical values
(2) Tj = 125 °C; maximum values
(3) Tj = 25 °C; maximum values
Fig 9. On-state current as a function of on-state
voltage
Fig 10. Normalized latching current as a function of
junction temperature
001aab099
001aag740
4
3
10
dV /dt
D
I
H
(V/µs)
I
H(25°C)
3
2
10
2
1
10
0
−50
10
0
50
100
150
0
50
100
150
T (°C)
j
T (°C)
j
Gate open circuit
Fig 11. Normalized holding current as a function of
junction temperature
Fig 12. Critical rate of rise of off-state voltage as a
function of junction temperature; minimum
values
BTA201W_SER_E_2
© NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 02 — 17 September 2007
8 of 13
BTA201W series E
NXP Semiconductors
1 A Three-quadrant triacs high commutation
8. Package outline
Plastic surface-mounted package with increased heatsink; 4 leads
SOT223
D
B
E
A
X
c
y
H
v
M
A
E
b
1
4
Q
A
A
1
L
1
2
3
p
e
b
p
w
M
B
detail X
1
e
0
2
4 mm
scale
DIMENSIONS (mm are the original dimensions)
A
UNIT
A
b
b
c
D
E
e
e
H
L
p
Q
v
w
y
p
1
1
1
E
1.8
1.5
0.10 0.80
0.01 0.60
3.1
2.9
0.32
0.22
6.7
6.3
3.7
3.3
7.3
6.7
1.1
0.7
0.95
0.85
mm
4.6
2.3
0.2
0.1
0.1
REFERENCES
JEDEC JEITA
EUROPEAN
PROJECTION
OUTLINE
VERSION
ISSUE DATE
IEC
04-11-10
06-03-16
SOT223
SC-73
Fig 13. Package outline SOT223
BTA201W_SER_E_2
© NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 02 — 17 September 2007
9 of 13
BTA201W series E
NXP Semiconductors
1 A Three-quadrant triacs high commutation
9. Mounting
9.1 Mounting instructions
3.8 min
1.5
min
6.3
1.5
min
(3×)
2.3
1.5
min
4.6
001aab508
All dimensions are in mm
Fig 14. Minimum footprint SOT223
9.2 Printed-circuit board
36
18
4.5
4.6
60
9
10
7
15
50
001aab509
All dimensions are in mm
Printed-circuit board: FR4 epoxy glass (1.6 mm thick), copper laminate (35 µm thick)
Fig 15. Printed-circuit board pad area SOT223
BTA201W_SER_E_2
© NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 02 — 17 September 2007
10 of 13
BTA201W series E
NXP Semiconductors
1 A Three-quadrant triacs high commutation
10. Revision history
Table 7.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
BTA201W_SER_E_2
Modifications:
20070917
Product data sheet
-
BTA201W_SER_E_1
• The format of this data sheet has been redesigned to comply with the new identity
guidelines of NXP Semiconductors.
• Legal texts have been adapted to the new company name where appropriate.
• Descriptive titles have been corrected.
• Table 3 “Limiting values” on page 2: dIT/dt uprated
• Table 6 “Dynamic characteristics” on page 7: dVD/dt uprated
• Figure 12 “Critical rate of rise of off-state voltage as a function of junction temperature;
minimum values” on page 8: graph updated
BTA201W_SER_E_1
20060207
Product data sheet
-
-
BTA201W_SER_E_2
© NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 02 — 17 September 2007
11 of 13
BTA201W series E
NXP Semiconductors
1 A Three-quadrant triacs high commutation
11. Legal information
11.1 Data sheet status
Document status[1][2]
Product status[3]
Development
Definition
Objective [short] data sheet
This document contains data from the objective specification for product development.
This document contains data from the preliminary specification.
This document contains the product specification.
Preliminary [short] data sheet Qualification
Product [short] data sheet Production
[1]
[2]
[3]
Please consult the most recently issued document before initiating or completing a design.
The term ‘short data sheet’ is explained in section “Definitions”.
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
malfunction of a NXP Semiconductors product can reasonably be expected to
11.2 Definitions
result in personal injury, death or severe property or environmental damage.
NXP Semiconductors accepts no liability for inclusion and/or use of NXP
Semiconductors products in such equipment or applications and therefore
such inclusion and/or use is at the customer’s own risk.
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.nxp.com/profile/terms, including those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between information in this document and such
terms and conditions, the latter will prevail.
11.3 Disclaimers
General — Information in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give any representations or
warranties, expressed or implied, as to the accuracy or completeness of such
information and shall have no liability for the consequences of use of such
information.
No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or the
grant, conveyance or implication of any license under any copyrights, patents
or other industrial or intellectual property rights.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
11.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
12. Contact information
For additional information, please visit: http://www.nxp.com
For sales office addresses, send an email to: salesaddresses@nxp.com
BTA201W_SER_E_2
© NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 02 — 17 September 2007
12 of 13
BTA201W series E
NXP Semiconductors
1 A Three-quadrant triacs high commutation
13. Contents
1
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1
1.2
1.3
1.4
General description. . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Quick reference data. . . . . . . . . . . . . . . . . . . . . 1
2
3
4
5
6
7
8
Pinning information. . . . . . . . . . . . . . . . . . . . . . 1
Ordering information. . . . . . . . . . . . . . . . . . . . . 2
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2
Thermal characteristics. . . . . . . . . . . . . . . . . . . 5
Static characteristics. . . . . . . . . . . . . . . . . . . . . 6
Dynamic characteristics . . . . . . . . . . . . . . . . . . 7
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9
9
9.1
9.2
Mounting. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Mounting instructions . . . . . . . . . . . . . . . . . . . 10
Printed-circuit board . . . . . . . . . . . . . . . . . . . . 10
10
Revision history. . . . . . . . . . . . . . . . . . . . . . . . 11
11
Legal information. . . . . . . . . . . . . . . . . . . . . . . 12
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 12
Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 12
11.1
11.2
11.3
11.4
12
13
Contact information. . . . . . . . . . . . . . . . . . . . . 12
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2007.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 17 September 2007
Document identifier: BTA201W_SER_E_2
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