BTA204-600C/DG [NXP]

600V, 4A, SNUBBERLESS TRIAC, TO-220AB, PLASTIC, SC-46, 3 PIN;
BTA204-600C/DG
型号: BTA204-600C/DG
厂家: NXP    NXP
描述:

600V, 4A, SNUBBERLESS TRIAC, TO-220AB, PLASTIC, SC-46, 3 PIN

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BTA204-600C  
-220AB  
O
T
3Q Hi-Com Triac  
Rev. 03 — 9 May 2011  
Product data sheet  
1. Product profile  
1.1 General description  
Planar passivated high commutation three quadrant triac in a SOT78 (TO-220AB) plastic  
package intended for use in circuits where high static and dynamic dV/dt and high dI/dt  
can occur. This "series C" triac will commutate the full rated RMS current at the maximum  
rated junction temperature without the aid of a snubber.  
1.2 Features and benefits  
„ 3Q technology for improved noise  
„ Less sensitive gate for high noise  
immunity  
immunity  
„ High blocking voltage capability  
„ Planar passivated for voltage  
ruggedness and reliability  
„ High commutation capability with  
maximum false trigger immunity  
„ Triggering in three quadrants only  
„ High immunity to false turn-on by dV/dt  
1.3 Applications  
„ General purpose motor control circuits  
„ Home appliances  
„ Rectifier-fed DC inductive loads e.g.  
DC motors and solenoids  
1.4 Quick reference data  
Table 1.  
Symbol Parameter  
VDRM repetitive peak off-state  
Quick reference data  
Conditions  
Min Typ Max Unit  
-
-
600  
V
voltage  
ITSM  
non-repetitive peak  
on-state current  
full sine wave; Tj(init) = 25 °C;  
tp = 20 ms; see Figure 4;  
see Figure 5  
-
-
25  
A
IT(RMS)  
RMS on-state current  
full sine wave; Tmb 107 °C;  
see Figure 1; see Figure 2;  
see Figure 3  
-
-
4
A
BTA204-600C  
NXP Semiconductors  
3Q Hi-Com Triac  
Table 1.  
Quick reference data …continued  
Symbol Parameter  
Static characteristics  
Conditions  
Min Typ Max Unit  
IGT  
gate trigger current  
VD = 12 V; IT = 0.1 A; T2+ G+;  
Tj = 25 °C; see Figure 7  
-
-
-
-
-
-
35  
35  
35  
mA  
mA  
mA  
VD = 12 V; IT = 0.1 A; T2+ G-;  
Tj = 25 °C; see Figure 7  
VD = 12 V; IT = 0.1 A; T2- G-;  
Tj = 25 °C; see Figure 7  
2. Pinning information  
Table 2.  
Pinning information  
Symbol Description  
Pin  
1
Simplified outline  
Graphic symbol  
T1  
T2  
G
main terminal 1  
main terminal 2  
gate  
mb  
T2  
T1  
G
2
3
sym051  
mb  
T2  
mounting base; main terminal 2  
1
2 3  
SOT78 (TO-220AB)  
3. Ordering information  
Table 3.  
Ordering information  
Type number  
Package  
Name  
Description  
Version  
BTA204-600C  
TO-220AB  
plastic single-ended package; heatsink mounted; 1 mounting  
hole; 3-lead TO-220AB  
SOT78  
BTA204-600C/DG  
TO-220AB  
plastic single-ended package; heatsink mounted; 1 mounting  
hole; 3-lead TO-220AB  
SOT78  
BTA204-600C  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2011. All rights reserved.  
Product data sheet  
Rev. 03 — 9 May 2011  
2 of 14  
BTA204-600C  
NXP Semiconductors  
3Q Hi-Com Triac  
4. Limiting values  
Table 4.  
Limiting values  
In accordance with the Absolute Maximum Rating System (IEC 60134).  
Symbol  
VDRM  
Parameter  
Conditions  
Min  
Max  
600  
4
Unit  
V
repetitive peak off-state voltage  
RMS on-state current  
-
-
IT(RMS)  
full sine wave; Tmb 107 °C; see Figure 1;  
A
see Figure 2; see Figure 3  
ITSM  
non-repetitive peak on-state  
current  
full sine wave; Tj(init) = 25 °C; tp = 20 ms;  
see Figure 4; see Figure 5  
-
25  
A
full sine wave; Tj(init) = 25 °C; tp = 16.7 ms  
tp = 10 ms; sine-wave pulse  
-
27  
A
I2t  
I2t for fusing  
-
3.1  
100  
2
A2s  
A/µs  
A
dIT/dt  
IGM  
rate of rise of on-state current  
peak gate current  
IT = 6 A; IG = 0.2 A; dIG/dt = 0.2 A/µs  
-
-
PGM  
PG(AV)  
Tstg  
Tj  
peak gate power  
-
5
W
average gate power  
storage temperature  
junction temperature  
over any 20 ms period  
-
0.5  
150  
125  
W
-40  
-
°C  
°C  
003aad615  
003aag083  
5
12  
I
I
T(RMS)  
(A)  
T(RMS )  
(A)  
10  
107 °C  
4
3
2
1
0
8
6
4
2
0
-2  
-1  
-50  
0
50  
100  
150  
10  
10  
1
10  
surge duration (s)  
T
(°C)  
mb  
Fig 1. RMS on-state current as a function of mounting  
base temperature; maximum values  
Fig 2. RMS on-state current as a function of surge  
duration; maximum values  
BTA204-600C  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2011. All rights reserved.  
Product data sheet  
Rev. 03 — 9 May 2011  
3 of 14  
BTA204-600C  
NXP Semiconductors  
3Q Hi-Com Triac  
003aag081  
8
101  
T
conduction form  
mb(max)  
(°C)  
angle  
(degrees)  
factor  
a
P
tot  
104  
107  
110  
113  
116  
119  
122  
125  
(W)  
30  
60  
90  
120  
180  
4
a = 180°  
120°  
6
4
2
0
2.8  
2.2  
1.9  
1.57  
a
°
90  
60°  
30°  
0
1
2
3
4
5
I
(A)  
T(RMS)  
Fig 3. Total power dissipation as a function of RMS on-state current; maximum values  
003aag085  
3
10  
I
I
TSM  
T
I
TS M  
(A)  
t
t
p
T
= 25 °C max  
j(init)  
(1)  
2
10  
10  
10  
-5  
-4  
-3  
-2  
-1  
10  
10  
10  
10  
t
(s)  
p
Fig 4. Non-repetitive peak on-state current as a function of pulse width; maximum values  
BTA204-600C  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2011. All rights reserved.  
Product data sheet  
Rev. 03 — 9 May 2011  
4 of 14  
BTA204-600C  
NXP Semiconductors  
3Q Hi-Com Triac  
003aag086  
30  
I
TSM  
(A)  
20  
I
I
TSM  
T
10  
t
1/f  
= 25 °C max  
T
j(init)  
0
2
3
1
10  
10  
10  
number of cycles  
f = 50 Hz  
Fig 5. Non-repetitive peak on-state current as a function of the number of sinusoidal current cycles; maximum  
values  
BTA204-600C  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2011. All rights reserved.  
Product data sheet  
Rev. 03 — 9 May 2011  
5 of 14  
BTA204-600C  
NXP Semiconductors  
3Q Hi-Com Triac  
5. Thermal characteristics  
Table 5.  
Symbol  
Rth(j-mb)  
Thermal characteristics  
Parameter  
Conditions  
Min  
Typ  
Max  
3
Unit  
K/W  
K/W  
K/W  
thermal resistance from junction to  
mounting base  
full cycle; see Figure 6  
half cycle; see Figure 6  
in free air  
-
-
-
-
-
3.7  
-
Rth(j-a)  
thermal resistance from junction to  
ambient  
60  
003aag087  
10  
(1)  
(2)  
Z
th(j-mb)  
(K/W)  
1
-1  
10  
10  
P
t
t
p
-2  
-5  
-4  
-3  
-2  
-1  
10  
10  
10  
10  
10  
1
10  
t
(s)  
p
(1) Unidirectional (half cycle)  
(2) Bidirectional (full cycle)  
Fig 6. Transient thermal impedance from junction to mounting base as a function of pulse width  
BTA204-600C  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2011. All rights reserved.  
Product data sheet  
Rev. 03 — 9 May 2011  
6 of 14  
BTA204-600C  
NXP Semiconductors  
3Q Hi-Com Triac  
6. Characteristics  
Table 6.  
Symbol  
Characteristics  
Parameter  
Conditions  
Min  
Typ  
Max  
Unit  
Static characteristics  
IGT gate trigger current  
VD = 12 V; IT = 0.1 A; T2+ G+; Tj = 25 °C;  
see Figure 7  
-
-
-
-
-
-
-
-
-
-
-
-
35  
35  
35  
20  
30  
20  
mA  
mA  
mA  
mA  
mA  
mA  
VD = 12 V; IT = 0.1 A; T2+ G-; Tj = 25 °C;  
see Figure 7  
VD = 12 V; IT = 0.1 A; T2- G-; Tj = 25 °C;  
see Figure 7  
IL  
latching current  
VD = 12 V; IG = 0.1 A; T2+ G+;  
Tj = 25 °C; see Figure 8  
VD = 12 V; IG = 0.1 A; T2+ G-; Tj = 25 °C;  
see Figure 8  
VD = 12 V; IG = 0.1 A; T2- G-; Tj = 25 °C;  
see Figure 8  
IH  
holding current  
VD = 12 V; Tj = 25 °C; see Figure 9  
IT = 5 A; Tj = 25 °C; see Figure 10  
-
-
-
-
20  
mA  
V
VT  
VGT  
on-state voltage  
gate trigger voltage  
1.4  
0.7  
1.7  
1.5  
VD = 12 V; IT = 0.1 A; Tj = 25 °C;  
see Figure 11  
V
VD = 400 V; IT = 0.1 A; Tj = 125 °C;  
see Figure 11  
0.25  
-
0.4  
0.1  
-
V
ID  
off-state current  
VD = 600 V; Tj = 125 °C  
0.5  
mA  
Dynamic characteristics  
dVD/dt  
rate of rise of off-state  
voltage  
VDM = 402 V; Tj = 125 °C; exponential  
waveform; gate open circuit  
1000  
3
-
-
-
-
V/µs  
dIcom/dt  
rate of change of  
commutating current  
VD = 400 V; Tj = 125 °C; IT(RMS) = 4 A;  
dVcom/dt = 20 V/µs; snubberless  
condition; gate open circuit  
A/ms  
tgt  
gate-controlled turn-on time ITM = 12 A; VD = 600 V; IG = 0.1 A;  
dIG/dt = 5 A/µs  
-
2
-
µs  
BTA204-600C  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2011. All rights reserved.  
Product data sheet  
Rev. 03 — 9 May 2011  
7 of 14  
BTA204-600C  
NXP Semiconductors  
3Q Hi-Com Triac  
003aad600  
003aad604  
3
3
I
I
L
GT  
I
I
L(25°C)  
GT(25°C)  
(1)  
2
2
(2)  
(3)  
1
0
1
0
-50  
-50  
0
50  
100  
150  
0
50  
100  
150  
T (°C)  
j
T (°C)  
j
(1) T2- G-  
(2) T2+ G-  
(3) T2+ G+  
Fig 7. Normalized gate trigger current as a function of  
junction temperature  
Fig 8. Normalized latching current as a function of  
junction temperature  
003aad606  
003aad611  
3
12  
I
(1) (2) (3)  
H
I
T
(A)  
I
H(25°C)  
2
8
4
0
1
0
-50  
0
50  
100  
150  
0
1
2
3
T (°C)  
j
V (V)  
T
Vo = 1.27 V; Rs = 0.091 Ω  
(1) Tj = 125 °C; typical values  
(2) Tj = 125 °C; maximum values  
(3) Tj = 25 °C; maximum values  
Fig 9. Normalized holding current as a function of  
junction temperature  
Fig 10. On-state current as a function of on-state  
voltage  
BTA204-600C  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2011. All rights reserved.  
Product data sheet  
Rev. 03 — 9 May 2011  
8 of 14  
BTA204-600C  
NXP Semiconductors  
3Q Hi-Com Triac  
003aad596  
1.6  
V
GT  
V
GT(25°C)  
1.2  
0.8  
0.4  
-50  
0
50  
100  
150  
T (°C)  
j
Fig 11. Normalized gate trigger voltage as a function of junction temperature  
BTA204-600C  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2011. All rights reserved.  
Product data sheet  
Rev. 03 — 9 May 2011  
9 of 14  
BTA204-600C  
NXP Semiconductors  
3Q Hi-Com Triac  
7. Package outline  
Plastic single-ended package; heatsink mounted; 1 mounting hole; 3-lead TO-220AB  
SOT78  
E
p
A
A
1
q
mounting  
D
1
base  
D
(1)  
(1)  
L
1
L
2
Q
(2)  
b
1
L
(3×)  
(2)  
b
2
(2×)  
1
2
3
b(3×)  
c
e
e
0
5
10 mm  
scale  
DIMENSIONS (mm are the original dimensions)  
(1)  
L
2
(2)  
(2)  
(1)  
1
UNIT  
mm  
A
A
b
b
b
c
D
D
1
E
e
L
L
p
q
Q
1
1
2
max.  
4.7  
4.1  
1.40  
1.25  
0.9  
0.6  
1.6  
1.0  
1.3  
1.0  
0.7  
0.4  
16.0  
15.2  
6.6  
5.9  
10.3  
9.7  
15.0 3.30  
12.8 2.79  
3.8  
3.5  
3.0  
2.7  
2.6  
2.2  
2.54  
3.0  
Notes  
1. Lead shoulder designs may vary.  
2. Dimension includes excess dambar.  
REFERENCES  
OUTLINE  
VERSION  
EUROPEAN  
PROJECTION  
ISSUE DATE  
IEC  
JEDEC  
JEITA  
08-04-23  
08-06-13  
SOT78  
SC-46  
3-lead TO-220AB  
Fig 12. Package outline SOT78 (TO-220AB)  
BTA204-600C  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2011. All rights reserved.  
Product data sheet  
Rev. 03 — 9 May 2011  
10 of 14  
BTA204-600C  
NXP Semiconductors  
3Q Hi-Com Triac  
8. Revision history  
Table 7.  
Revision history  
Document ID  
BTA204-600C v.3  
Modifications:  
Release date  
Data sheet status  
Change notice  
Supersedes  
20110509  
Product data sheet  
-
BTA204_SERIES_B_C v.2  
The format of this data sheet has been redesigned to comply with the new identity  
guidelines of NXP Semiconductors.  
Legal texts have been adapted to the new company name where appropriate.  
Type number BTA204-600C separated from data sheet BTA204_SERIES_B_C v.2.  
BTA204_SERIES_B_C v.2 19981201  
Product specification  
-
BTA204_SERIES_B_C v.1  
BTA204-600C  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2011. All rights reserved.  
Product data sheet  
Rev. 03 — 9 May 2011  
11 of 14  
BTA204-600C  
NXP Semiconductors  
3Q Hi-Com Triac  
9. Legal information  
9.1 Data sheet status  
Document status [1] [2]  
Product status [3]  
Development  
Definition  
Objective [short] data sheet  
This document contains data from the objective specification for product development.  
This document contains data from the preliminary specification.  
This document contains the product specification.  
Preliminary [short] data sheet Qualification  
Product [short] data sheet Production  
[1]  
[2]  
[3]  
Please consult the most recently issued document before initiating or completing a design.  
The term 'short data sheet' is explained in section "Definitions".  
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product  
status information is available on the Internet at URL http://www.nxp.com.  
Right to make changes — NXP Semiconductors reserves the right to make  
9.2 Definitions  
changes to information published in this document, including without  
limitation specifications and product descriptions, at any time and without  
notice. This document supersedes and replaces all information supplied prior  
to the publication hereof.  
Preview — The document is a preview version only. The document is still  
subject to formal approval, which may result in modifications or additions.  
NXP Semiconductors does not give any representations or warranties as to  
the accuracy or completeness of information included herein and shall have  
no liability for the consequences of use of such information.  
Suitability for use — NXP Semiconductors products are not designed,  
authorized or warranted to be suitable for use in life support, life-critical or  
safety-critical systems or equipment, nor in applications where failure or  
malfunction of an NXP Semiconductors product can reasonably be expected  
to result in personal injury, death or severe property or environmental  
damage. NXP Semiconductors accepts no liability for inclusion and/or use of  
NXP Semiconductors products in such equipment or applications and  
therefore such inclusion and/or use is at the customer’s own risk.  
Draft — The document is a draft version only. The content is still under  
internal review and subject to formal approval, which may result in  
modifications or additions. NXP Semiconductors does not give any  
representations or warranties as to the accuracy or completeness of  
information included herein and shall have no liability for the consequences of  
use of such information.  
Quick reference data — The Quick reference data is an extract of the  
product data given in the Limiting values and Characteristics sections of this  
document, and as such is not complete, exhaustive or legally binding.  
Short data sheet — A short data sheet is an extract from a full data sheet  
with the same product type number(s) and title. A short data sheet is intended  
for quick reference only and should not be relied upon to contain detailed and  
full information. For detailed and full information see the relevant full data  
sheet, which is available on request via the local NXP Semiconductors sales  
office. In case of any inconsistency or conflict with the short data sheet, the  
full data sheet shall prevail.  
Applications — Applications that are described herein for any of these  
products are for illustrative purposes only. NXP Semiconductors makes no  
representation or warranty that such applications will be suitable for the  
specified use without further testing or modification.  
Product specification — The information and data provided in a Product  
data sheet shall define the specification of the product as agreed between  
NXP Semiconductors and its customer, unless NXP Semiconductors and  
customer have explicitly agreed otherwise in writing. In no event however,  
shall an agreement be valid in which the NXP Semiconductors product is  
deemed to offer functions and qualities beyond those described in the  
Product data sheet.  
Customers are responsible for the design and operation of their applications  
and products using NXP Semiconductors products, and NXP Semiconductors  
accepts no liability for any assistance with applications or customer product  
design. It is customer’s sole responsibility to determine whether the NXP  
Semiconductors product is suitable and fit for the customer’s applications and  
products planned, as well as for the planned application and use of  
customer’s third party customer(s). Customers should provide appropriate  
design and operating safeguards to minimize the risks associated with their  
applications and products.  
9.3 Disclaimers  
Limited warranty and liability — Information in this document is believed to  
be accurate and reliable. However, NXP Semiconductors does not give any  
representations or warranties, expressed or implied, as to the accuracy or  
completeness of such information and shall have no liability for the  
consequences of use of such information.  
NXP Semiconductors does not accept any liability related to any default,  
damage, costs or problem which is based on any weakness or default in the  
customer’s applications or products, or the application or use by customer’s  
third party customer(s). Customer is responsible for doing all necessary  
testing for the customer’s applications and products using NXP  
Semiconductors products in order to avoid a default of the applications and  
the products or of the application or use by customer’s third party  
customer(s). NXP does not accept any liability in this respect.  
In no event shall NXP Semiconductors be liable for any indirect, incidental,  
punitive, special or consequential damages (including - without limitation - lost  
profits, lost savings, business interruption, costs related to the removal or  
replacement of any products or rework charges) whether or not such  
damages are based on tort (including negligence), warranty, breach of  
contract or any other legal theory.  
Limiting values — Stress above one or more limiting values (as defined in  
the Absolute Maximum Ratings System of IEC 60134) will cause permanent  
damage to the device. Limiting values are stress ratings only and (proper)  
operation of the device at these or any other conditions above those given in  
the Recommended operating conditions section (if present) or the  
Characteristics sections of this document is not warranted. Constant or  
repeated exposure to limiting values will permanently and irreversibly affect  
the quality and reliability of the device.  
Notwithstanding any damages that customer might incur for any reason  
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards  
customer for the products described herein shall be limited in accordance  
with the Terms and conditions of commercial sale of NXP Semiconductors.  
BTA204-600C  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2011. All rights reserved.  
Product data sheet  
Rev. 03 — 9 May 2011  
12 of 14  
BTA204-600C  
NXP Semiconductors  
3Q Hi-Com Triac  
Terms and conditions of commercial sale — NXP Semiconductors  
products are sold subject to the general terms and conditions of commercial  
sale, as published at http://www.nxp.com/profile/terms, unless otherwise  
agreed in a valid written individual agreement. In case an individual  
agreement is concluded only the terms and conditions of the respective  
agreement shall apply. NXP Semiconductors hereby expressly objects to  
applying the customer’s general terms and conditions with regard to the  
purchase of NXP Semiconductors products by customer.  
In the event that customer uses the product for design-in and use in  
automotive applications to automotive specifications and standards, customer  
(a) shall use the product without NXP Semiconductors’ warranty of the  
product for such automotive applications, use and specifications, and (b)  
whenever customer uses the product for automotive applications beyond  
NXP Semiconductors’ specifications such use shall be solely at customer’s  
own risk, and (c) customer fully indemnifies NXP Semiconductors for any  
liability, damages or failed product claims resulting from customer design and  
use of the product for automotive applications beyond NXP Semiconductors’  
standard warranty and NXP Semiconductors’ product specifications.  
No offer to sell or license — Nothing in this document may be interpreted or  
construed as an offer to sell products that is open for acceptance or the grant,  
conveyance or implication of any license under any copyrights, patents or  
other industrial or intellectual property rights.  
9.4 Trademarks  
Notice: All referenced brands, product names, service names and trademarks  
are the property of their respective owners.  
Export control — This document as well as the item(s) described herein may  
be subject to export control regulations. Export might require a prior  
authorization from national authorities.  
Adelante, Bitport, Bitsound, CoolFlux, CoReUse, DESFire, EZ-HV,  
FabKey, GreenChip, HiPerSmart, HITAG, I²C-bus logo, ICODE, I-CODE,  
ITEC, Labelution, MIFARE, MIFARE Plus, MIFARE Ultralight, MoReUse,  
QLPAK, Silicon Tuner, SiliconMAX, SmartXA, STARplug, TOPFET,  
TrenchMOS, TriMedia and UCODE — are trademarks of NXP B.V.  
Non-automotive qualified products — Unless this data sheet expressly  
states that this specific NXP Semiconductors product is automotive qualified,  
the product is not suitable for automotive use. It is neither qualified nor tested  
in accordance with automotive testing or application requirements. NXP  
Semiconductors accepts no liability for inclusion and/or use of  
HD Radio and HD Radio logo — are trademarks of iBiquity Digital  
Corporation.  
non-automotive qualified products in automotive equipment or applications.  
10. Contact information  
For more information, please visit: http://www.nxp.com  
For sales office addresses, please send an email to: salesaddresses@nxp.com  
BTA204-600C  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2011. All rights reserved.  
Product data sheet  
Rev. 03 — 9 May 2011  
13 of 14  
BTA204-600C  
NXP Semiconductors  
3Q Hi-Com Triac  
11. Contents  
1
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . .1  
1.1  
1.2  
1.3  
1.4  
General description . . . . . . . . . . . . . . . . . . . . . .1  
Features and benefits. . . . . . . . . . . . . . . . . . . . .1  
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . .1  
Quick reference data . . . . . . . . . . . . . . . . . . . . .1  
2
3
4
5
6
7
8
Pinning information. . . . . . . . . . . . . . . . . . . . . . .2  
Ordering information. . . . . . . . . . . . . . . . . . . . . .2  
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . .3  
Thermal characteristics . . . . . . . . . . . . . . . . . . .6  
Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . .7  
Package outline . . . . . . . . . . . . . . . . . . . . . . . . .10  
Revision history. . . . . . . . . . . . . . . . . . . . . . . . .11  
9
Legal information. . . . . . . . . . . . . . . . . . . . . . . .12  
Data sheet status . . . . . . . . . . . . . . . . . . . . . . .12  
Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . .12  
Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . .12  
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . .13  
9.1  
9.2  
9.3  
9.4  
10  
Contact information. . . . . . . . . . . . . . . . . . . . . .13  
Please be aware that important notices concerning this document and the product(s)  
described herein, have been included in section ‘Legal information’.  
© NXP B.V. 2011.  
All rights reserved.  
For more information, please visit: http://www.nxp.com  
For sales office addresses, please send an email to: salesaddresses@nxp.com  
Date of release: 9 May 2011  
Document identifier: BTA204-600C  

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