BTA216-600BT,127 [NXP]
BTA216-600BT;
| 型号： | BTA216-600BT,127 |
| 厂家： | 
NXP |
| 描述： | BTA216-600BT 局域网 三端双向交流开关 |
| 文件： | 总13页 (文件大小：114K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
BTA216-600BT
O-220AB
T
Triacs high commutation
Rev. 2 — 9 November 2011
Product data sheet
1. Product profile
1.1 General description
Passivated high commutation triac in a plastic envelope. Featuring high maximum
junction temperature and high commutation capability. Intended for use in circuits where
high static and dynamic dV/dt and high dI/dt can occur. This device will commutate the full
rated RMS current at the maximum rated junction temperature, without the aid of a
snubber.
1.2 Features and benefits
High maximum junction temperature
High commutation capability
1.3 Quick reference data
VDRM 600 V
IGT 50 mA
Tj 150 C
IT(RMS) 16 A
ITSM 140 A
dI /dt = 18 A/ms
com
2. Pinning information
Table 1:
Pinning
Pin
1
Description
Simplified outline
Symbol
main terminal 1 (T1)
main terminal 2 (T2)
gate (G)
mb
T2
T1
G
2
3
sym051
[1]
mb
mounting base
1
2 3
SOT78 (TO-220AB)
[1] Connected to main terminal 2 (T2)
BTA216-600BT
NXP Semiconductors
Triacs high commutation
3. Ordering information
Table 2:
Ordering information
Type number
Package
Name
Description
Version
BTA216-600BT
TO-220AB plastic single-ended package; heatsink mounted; 3 leads; 1 mounting SOT78
hole
4. Limiting values
Table 3:
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter
Conditions
Min
Max Unit
[1]
VDRM
repetitive peak off-state voltage
-
-
600
16
V
A
IT(RMS)
RMS on-state current
full sine wave; Tmb 124 C;
see Figure 4 and 5
ITSM
non-repetitive peak on-state current
full sine wave; Tj = 25 C prior to surge;
see Figure 2 and 3
t = 20 ms
-
140
150
98
100
2
A
t = 16.7 ms
-
A
I2t
I2t for fusing
t = 10 ms
-
A2s
A/s
A
dIT/dt
IGM
rate of rise of on-state current
peak gate current
ITM = 20 A; IG = 0.2 A; dIG/dt = 0.2 A/s
-
-
VGM
PGM
PG(AV)
Tstg
Tj
peak gate voltage
peak gate power
-
5
V
-
5
W
W
average gate power
storage temperature
junction temperature
over any 20 ms period
-
0.5
40
+150 C
150 C
-
[1] Although not recommended, off-state voltages up to 800 V may be applied without damage, but the triac may switch to the on-state. The
rate of rise of current should not exceed 15 A/s.
BTA216-600BT
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 2 — 9 November 2011
2 of 13
BTA216-600BT
NXP Semiconductors
Triacs high commutation
003aab068
25
120
P
(W)
T
tot
mb(max)
α = 180°
(°C)
α
20
126
120°
α
90°
15
132
60°
30°
10
5
138
144
150
0
0
4
8
12
16
20
I
(A)
T(RMS)
= conduction angle
Fig 1. On-state power dissipation as a function of RMS on-state current; maximum values
003aab070
150
I
TSM
(A)
100
50
0
2
3
1
10
10
10
n
f = 50 Hz
Fig 2. Non-repetitive peak on-state current as a function of number of half cycles; sinusoidal currents; maximum
values
BTA216-600BT
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© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 2 — 9 November 2011
3 of 13
BTA216-600BT
NXP Semiconductors
Triacs high commutation
003aab069
3
10
I
TSM
(A)
(1)
2
10
I
I
TSM
t
T
T
T
= 25 °C max
j(init)
10
10
−5
−4
−3
−2
−1
10
10
10
10
t
(s)
p
tp 20 ms
(1) dIT/dt limit
Fig 3. Non-repetitive peak on-state current as a function of pulse width; sinusoidal currents; maximum values
003aab071
003aab072
50
20
I
T(RMS)
(A)
I
124 °C
T(RMS)
(A)
40
30
20
10
0
15
10
5
0
−50
−2
−1
0
50
100
150
(°C)
10
10
1
10
T
surge duration (s)
mb
f = 50 Hz; Tmb 131 C
Fig 4. RMS on-state current as a function of surge
duration; sinusoidal currents; maximum values
Fig 5. RMS on-state current as a function of mounting
base temperature; maximum values
BTA216-600BT
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© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 2 — 9 November 2011
4 of 13
BTA216-600BT
NXP Semiconductors
Triacs high commutation
5. Thermal characteristics
Table 4:
Thermal characteristics
Symbol Parameter
Conditions
Min
Typ
Max Unit
Rth(j-mb) thermal resistance from junction
to mounting base
full cycle; see Figure 6
half cycle; see Figure 6
in free air
-
-
-
-
1.2
1.7
-
K/W
K/W
K/W
-
Rth(j-a)
thermal resistance from junction to
ambient
60
003aab078
10
Z
th(j-mb)
(K/W)
1
(1)
(2)
−1
−2
−3
10
10
10
P
1
D
t
t
p
−5
−4
−3
−2
−1
10
10
10
10
10
10
t
(s)
p
(1) half cycle
(2) full cycle
Fig 6. Transient thermal impedance from junction to mounting base as a function of pulse width
BTA216-600BT
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© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 2 — 9 November 2011
5 of 13
BTA216-600BT
NXP Semiconductors
Triacs high commutation
6. Static characteristics
Table 5:
Static characteristics
Tj = 25 C unless otherwise specified.
Symbol Parameter
Conditions
Min
Typ
Max Unit
[1]
IGT
gate trigger current
VD = 12 V; IT = 0.1 A; see Figure 8
T2+ G+
2
2
2
18
21
34
50
50
50
mA
mA
mA
T2+ G
T2 G
IL
latching current
VD = 12 V; IGT = 0.1 A; see Figure 10
T2+ G+
-
-
-
-
-
-
31
34
30
31
1.2
0.7
60
90
60
60
1.5
1.5
-
mA
mA
mA
mA
V
T2+ G
T2 G
IH
holding current
VD = 12 V; IGT = 0.1 A; see Figure 11
IT = 20 A; see Figure 9
VD = 12 V; IT = 0.1 A; see Figure 7
VD = 400 V; IT = 0.1 A; Tj = 150 C
VD = VDRM(max); Tj = 150 C
VT
VGT
on-state voltage
gate trigger voltage
V
0.25 0.4
0.5
V
ID
off-state current
-
3
mA
[1] Device does not trigger in the T2 G+ quadrant.
BTA216-600BT
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 2 — 9 November 2011
6 of 13
BTA216-600BT
NXP Semiconductors
Triacs high commutation
7. Dynamic characteristics
Table 6:
Dynamic characteristics
Tj = 25 C unless otherwise specified.
Symbol Parameter
Conditions
Min
Typ
Max Unit
dVD/dt
rate of rise of off-state voltage
VDM = 0.67VDRM(max); Tj = 150 C;
500
1500
-
V/s
exponential waveform; gate open circuit
dIcom/dt rate of change of commutating
current
VDM = 400 V; Tj = 150 C; IT(RMS) = 16 A;
without snubber; gate open circuit;
see Figure 12
9
-
18
2
-
A/ms
tgt
gate-controlled turn-on time
ITM = 20 A; VD = VDRM(max); IG = 0.1 A;
-
s
dIG/dt = 5 A/s
001aab073
003aab074
1.6
3
I
(T )
j
V
(T )
j
GT
GT
(1)
(2)
I
(25°C)
V
(25°C)
GT
GT
1.2
2
(3)
0.8
1
0
0.4
−50
0
50
100
150
-50
0
50
100
150
T (°C)
j
T (°C)
j
(1) T2 G
(2) T2+ G
(3) T2+ G+
Fig 7. Normalized gate trigger voltage as a function of
junction temperature
Fig 8. Normalized gate trigger current as a function of
junction temperature
BTA216-600BT
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© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 2 — 9 November 2011
7 of 13
BTA216-600BT
NXP Semiconductors
Triacs high commutation
003aab075
003aab077
3
50
I
T
(A)
I
L(Tj)
(1)
(2)
(3)
I
40
L(25°C)
2
30
20
10
0
1
0
−50
0
50
100
150
0
0.5
1
1.5
2
2.5
T (°C)
j
V
(V)
T
VO = 1.195 V; RS = 18 m
(1) Tj = 150 C; typical values
(2) Tj = 25 C; maximum values
(3) Tj = 150 C; maximum values
Fig 9. On-state characteristic
Fig 10. Normalized latching current as a function of
junction temperature
003aab076
003aab079
3
3
10
dI
/dt
I
COMM
H(Tj)
(A/ms)
I
H(25°C)
2
2
10
1
0
10
1
20
180
60
100
140
−50
0
50
100
150
T (°C)
j
T (°C)
j
Fig 11. Normalized holding current as a function of
junction temperature
Fig 12. Rate of change of commutating current as a
function of junction temperature; typical values
8. Package information
Plastic meets UL94 V-0 at 1⁄8 inch.
BTA216-600BT
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 2 — 9 November 2011
8 of 13
BTA216-600BT
NXP Semiconductors
Triacs high commutation
9. Package outline
Plastic single-ended package; heatsink mounted; 1 mounting hole; 3-lead TO-220AB
SOT78
E
p
A
A
1
q
mounting
D
1
base
D
(1)
(1)
L
1
L
2
Q
(2)
b
1
L
(3×)
(2)
b
2
(2×)
1
2
3
b(3×)
c
e
e
0
5
10 mm
scale
DIMENSIONS (mm are the original dimensions)
(1)
L
2
(2)
(2)
(1)
1
UNIT
mm
A
A
b
b
b
c
D
D
1
E
e
L
L
p
q
Q
1
1
2
max.
4.7
4.1
1.40
1.25
0.9
0.6
1.6
1.0
1.3
1.0
0.7
0.4
16.0
15.2
6.6
5.9
10.3
9.7
15.0 3.30
12.8 2.79
3.8
3.5
3.0
2.7
2.6
2.2
2.54
3.0
Notes
1. Lead shoulder designs may vary.
2. Dimension includes excess dambar.
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
JEITA
08-04-23
08-06-13
SOT78
SC-46
3-lead TO-220AB
Fig 13. Package outline SOT78 (TO-220AB)
BTA216-600BT
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 2 — 9 November 2011
9 of 13
BTA216-600BT
NXP Semiconductors
Triacs high commutation
10. Revision history
Table 7.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
BTA216-600BT v.2
Modifications:
20111109
Product data sheet
-
BTA216-600BT v.1
• The format of this data sheet has been redesigned to comply with the new identity
guidelines of NXP Semiconductors.
• Legal texts have been adapted to the new company name where appropriate.
BTA216-600BT v.1
20050825
Product data sheet
-
-
BTA216-600BT
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 2 — 9 November 2011
10 of 13
BTA216-600BT
NXP Semiconductors
Triacs high commutation
11. Legal information
11.1 Data sheet status
Document status[1][2]
Product status[3]
Development
Definition
Objective [short] data sheet
This document contains data from the objective specification for product development.
This document contains data from the preliminary specification.
This document contains the product specification.
Preliminary [short] data sheet Qualification
Product [short] data sheet Production
[1]
[2]
[3]
Please consult the most recently issued document before initiating or completing a design.
The term ‘short data sheet’ is explained in section “Definitions”.
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
malfunction of an NXP Semiconductors product can reasonably be expected
11.2 Definitions
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
11.3 Disclaimers
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
BTA216-600BT
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 2 — 9 November 2011
11 of 13
BTA216-600BT
NXP Semiconductors
Triacs high commutation
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in automotive equipment or applications.
11.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
12. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
BTA216-600BT
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© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 2 — 9 November 2011
12 of 13
BTA216-600BT
NXP Semiconductors
Triacs high commutation
13. Contents
1
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1
1.2
1.3
General description . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits. . . . . . . . . . . . . . . . . . . . 1
Quick reference data . . . . . . . . . . . . . . . . . . . . 1
2
Pinning information. . . . . . . . . . . . . . . . . . . . . . 1
Ordering information. . . . . . . . . . . . . . . . . . . . . 2
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2
Thermal characteristics . . . . . . . . . . . . . . . . . . 5
Static characteristics. . . . . . . . . . . . . . . . . . . . . 6
Dynamic characteristics . . . . . . . . . . . . . . . . . . 7
Package information . . . . . . . . . . . . . . . . . . . . . 8
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9
Revision history. . . . . . . . . . . . . . . . . . . . . . . . 10
3
4
5
6
7
8
9
10
11
Legal information. . . . . . . . . . . . . . . . . . . . . . . 11
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 11
Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 12
11.1
11.2
11.3
11.4
12
13
Contact information. . . . . . . . . . . . . . . . . . . . . 12
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2011.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 9 November 2011
Document identifier: BTA216-600BT
相关型号：
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