BU4507AF [NXP]

Silicon Diffused Power Transistor; 硅扩散型功率晶体管
BU4507AF
型号: BU4507AF
厂家: NXP    NXP
描述:

Silicon Diffused Power Transistor
硅扩散型功率晶体管

晶体 晶体管
文件: 总7页 (文件大小:66K)
中文:  中文翻译
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Philips Semiconductors  
Product specification  
Silicon Diffused Power Transistor  
BU4507AF  
GENERAL DESCRIPTION  
Enhanced performance, new generation, high-voltage, high-speed switching npn transistor in a plastic full-pack  
envelope intended for use in horizontal deflection circuits of colour television receivers and computer monitors.  
Features exceptional tolerance to base drive and collector current load variations resulting in a very low worst case  
dissipation.  
QUICK REFERENCE DATA  
SYMBOL PARAMETER  
CONDITIONS  
TYP. MAX. UNIT  
VCESM  
VCEO  
IC  
Collector-emitter voltage peak value  
VBE = 0 V  
-
1500  
800  
8
V
V
Collector-emitter voltage (open base)  
Collector current (DC)  
-
-
A
ICM  
Collector current peak value  
Total power dissipation  
Collector-emitter saturation voltage  
Collector saturation current  
-
-
15  
45  
3.0  
-
A
Ptot  
VCEsat  
ICsat  
Ths 25 ˚C  
W
V
IC = 4 A; IB = 1 A  
f = 16kHz  
-
4
A
A
f = 56kHz  
4
-
tf  
Fall time  
ICsat = 4 A; f = 16kHz  
0.3  
0.21  
0.45  
-
µs  
µs  
ICsat = 4 A; f = 56kHz  
PINNING - SOT199  
PIN CONFIGURATION  
SYMBOL  
PIN  
1
DESCRIPTION  
c
case  
base  
2
collector  
emitter  
b
3
case isolated  
1
2
3
e
LIMITING VALUES  
Limiting values in accordance with the Absolute Maximum Rating System (IEC 134)  
SYMBOL PARAMETER  
CONDITIONS  
MIN. MAX. UNIT  
VCESM  
VCEO  
IC  
Collector-emitter voltage peak value  
VBE = 0 V  
-
1500  
800  
8
V
V
Collector-emitter voltage (open base)  
Collector current (DC)  
-
-
A
ICM  
IB  
Collector current peak value  
Base current (DC)  
-
15  
4
A
-
A
IBM  
Base current peak value  
Reverse base current peak value 1  
Total power dissipation  
-
6
5
45  
150  
150  
A
-IBM  
Ptot  
Tstg  
Tj  
-
-
A
Ths 25 ˚C  
W
˚C  
˚C  
Storage temperature  
Junction temperature  
-55  
-
THERMAL RESISTANCES  
SYMBOL PARAMETER  
CONDITIONS  
TYP. MAX. UNIT  
Rth j-hs  
Rth j-a  
Junction to heatsink  
Junction to ambient  
with heatsink compound  
in free air  
-
2.8  
-
K/W  
K/W  
35  
1 Turn-off current.  
August 1998  
1
Rev 1.100  
Philips Semiconductors  
Product specification  
Silicon Diffused Power Transistor  
BU4507AF  
ISOLATION LIMITING VALUE & CHARACTERISTIC  
Ths = 25 ˚C unless otherwise specified  
SYMBOL PARAMETER  
CONDITIONS  
MIN. TYP. MAX. UNIT  
Visol  
Cisol  
Repetitive peak voltage from all R.H. 65 % ; clean and dustfree  
-
-
2500  
V
three terminals to external  
heatsink  
Capacitance from T2 to external f = 1 MHz  
heatsink  
-
22  
-
pF  
STATIC CHARACTERISTICS  
Ths = 25 ˚C unless otherwise specified  
SYMBOL PARAMETER  
CONDITIONS  
MIN. TYP. MAX. UNIT  
ICES  
ICES  
Collector cut-off current 2  
VBE = 0 V; VCE = VCESMmax  
VBE = 0 V; VCE = VCESMmax  
Tj = 125 ˚C  
-
-
-
-
1.0  
2.0  
mA  
mA  
IEBO  
VCEOsust  
Emitter cut-off current  
VEB = 6 V; IC = 0 A  
-
-
-
100  
-
µA  
V
Collector-emitter sustaining voltage IB = 0 A; IC = 100 mA;  
L = 25 mH  
800  
BVEBO  
VCEsat  
VBEsat  
hFE  
Emitter-base breakdown voltage  
IB = 1 mA  
7.5  
-
13.5  
-
-
3.0  
1.01  
-
V
V
V
Collector-emitter saturation voltages IC = 4 A; IB = 1 A  
Base-emitter saturation voltage  
DC current gain  
IC = 4 A; IB = 1 A  
IC = 100 mA; VCE = 5 V  
IC = 4 A; VCE = 5 V  
0.84  
-
0.92  
12  
hFE  
4.2  
5.7  
7.3  
DYNAMIC CHARACTERISTICS  
Ths = 25 ˚C unless otherwise specified  
SYMBOL PARAMETER  
CONDITIONS  
TYP. MAX. UNIT  
Cc  
Collector capacitance  
IE = 0 A; VCB = 10 V; f = 1 MHz  
68  
-
pF  
Switching times (16 kHz line  
deflection circuit)  
ICsat = 4.0 A;IB1 = 0.8 A  
(IB2 = -2.0 A)  
ts  
tf  
Turn-off storage time  
Turn-off fall time  
3.8  
0.30  
4.6  
0.45  
µs  
µs  
Switching times (56 kHz line  
deflection circuit)  
ICsat = 4.0 A;IB1 = 0.8 A  
(IB2 = -2.1 A)  
ts  
tf  
Turn-off storage time  
Turn-off fall time  
2.4  
0.21  
-
-
µs  
µs  
2 Measured with half sine-wave voltage (curve tracer).  
August 1998  
2
Rev 1.100  
Philips Semiconductors  
Product specification  
Silicon Diffused Power Transistor  
BU4507AF  
ICsat  
90 %  
+ 50v  
100-200R  
IC  
IB  
10 %  
Horizontal  
tf  
t
Oscilloscope  
ts  
IB1  
Vertical  
1R  
t
100R  
6V  
30-60 Hz  
- IB2  
Fig.1. Test circuit for VCEOsust  
.
Fig.4. Switching times definitions.  
IC / mA  
+ 150 v nominal  
adjust for ICsat  
Lc  
250  
200  
LB  
T.U.T.  
IBend  
-VBB  
100  
0
Cfb  
min  
VCE / V  
VCEOsust  
Fig.2. Oscilloscope display for VCEOsust  
.
Fig.5. Switching times test circuit.  
ICsat  
hFE  
TRANSISTOR  
100  
IC  
IB  
DIODE  
VCE = 1V  
Ths = 25 C  
Ths = 85 C  
t
t
IB1  
10  
20us  
26us  
64us  
IB2  
VCE  
1
0.001  
0.01  
0.1  
1
10  
t
IC / A  
Fig.3. Switching times waveforms (16 kHz).  
Fig.6. High and low DC current gain.  
August 1998  
3
Rev 1.100  
Philips Semiconductors  
Product specification  
Silicon Diffused Power Transistor  
BU4507AF  
hFE  
VCEsat / V  
100  
10  
1
10  
1
VCE = 5V  
Ths = 25 C  
Ths = 85 C  
Ths = 25 C  
Ths = 85 C  
IC/IB = 5  
0.1  
0.01  
0.001  
0.01  
0.1  
1
10  
0.1  
1
10  
100  
IC / A  
IC / A  
Fig.7. High and low DC current gain.  
Fig.10. Typical collector-emitter saturation voltage.  
VBEsat / V  
1.2  
1.1  
1
VCC  
Ths = 25 C  
Ths = 85 C  
LC  
0.9  
0.8  
0.7  
0.6  
VCL  
IBend  
-VBB  
LB  
IC = 4 A  
CFB  
T.U.T.  
0
0.5  
1
1.5  
2
2.5  
3
IB / A  
Fig.11. Typical base-emitter saturation voltage.  
Fig.8. Test Circuit RBSOA.  
ts/tf / us  
10  
IC / A  
30  
ICsat = 4 A  
Ths = 85 C  
Freq = 16 kHz  
8
ts  
20  
10  
0
6
4
2
tf  
100  
1500  
1000  
VCE / V  
0
IB / A  
3
0
0.5  
1
1.5  
2
2.5  
Fig.9. Reverse bias safe operating area. Tj Tjmax  
Fig.12. Typical collector storage and fall time.  
IC =4 A; Tj = 85˚C; f = 16kHz  
August 1998  
4
Rev 1.100  
Philips Semiconductors  
Product specification  
Silicon Diffused Power Transistor  
BU4507AF  
Normalised Power Derating  
Zth K/W  
PD%  
120  
10  
1
with heatsink compound  
110  
100  
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
0.5  
0.2  
0.1  
0.05  
0.1  
0.02  
t
p
T
t
p
P
0.01  
D =  
D
0
t
T
0.001  
0
20  
40  
60  
80  
Ths /  
100  
120  
140  
1.0E-07  
1.0E-05  
1.0E-03  
t / s  
1.0E-01  
1.0E+01  
C
Fig.13. Normalised power dissipation.  
PD% = 100 PD/PD 25˚C  
Fig.14. Transient thermal impedance.  
August 1998  
5
Rev 1.100  
Philips Semiconductors  
Product specification  
Silicon Diffused Power Transistor  
BU4507AF  
MECHANICAL DATA  
Dimensions in mm  
15.3 max  
5.2 max  
Net Mass: 5.5 g  
3.1  
3.3  
0.7  
7.3  
3.2  
o
45  
6.2  
5.8  
21.5  
max  
seating  
plane  
3.5 max  
not tinned  
3.5  
15.7  
min  
1
2
3
1.2  
1.0  
0.7 max  
2.0  
2.1 max  
M
0.4  
5.45  
5.45  
Fig.15. SOT199; The seating plane is electrically isolated from all terminals.  
Notes  
1. Refer to mounting instructions for F-pack envelopes.  
2. Epoxy meets UL94 V0 at 1/8".  
August 1998  
6
Rev 1.100  
Philips Semiconductors  
Product specification  
Silicon Diffused Power Transistor  
BU4507AF  
DEFINITIONS  
Data sheet status  
Objective specification  
This data sheet contains target or goal specifications for product development.  
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.  
Product specification  
This data sheet contains final product specifications.  
Limiting values  
Limiting values are given in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one  
or more of the limiting values may cause permanent damage to the device. These are stress ratings only and  
operation of the device at these or at any other conditions above those given in the Characteristics sections of  
this specification is not implied. Exposure to limiting values for extended periods may affect device reliability.  
Application information  
Where application information is given, it is advisory and does not form part of the specification.  
Philips Electronics N.V. 1998  
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the  
copyright owner.  
The information presented in this document does not form part of any quotation or contract, it is believed to be  
accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any  
consequence of its use. Publication thereof does not convey nor imply any license under patent or other  
industrial or intellectual property rights.  
LIFE SUPPORT APPLICATIONS  
These products are not designed for use in life support appliances, devices or systems where malfunction of these  
products can be reasonably expected to result in personal injury. Philips customers using or selling these products  
for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting  
from such improper use or sale.  
August 1998  
7
Rev 1.100  

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