BYC10-600 [NXP]

Rectifier diode ultrafast, low switching loss; 整流二极管超快,低开关损耗
BYC10-600
型号: BYC10-600
厂家: NXP    NXP
描述:

Rectifier diode ultrafast, low switching loss
整流二极管超快,低开关损耗

整流二极管 开关 局域网 超快恢复二极管 快速恢复二极管
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Philips Semiconductors  
Product specification  
Rectifier diode  
ultrafast, low switching loss  
BYC10-600  
FEATURES  
SYMBOL  
QUICK REFERENCE DATA  
VR = 600 V  
• Extremely fast switching  
• Low reverse recovery current  
• Low thermal resistance  
• Reduces switching losses in  
associated MOSFET  
VF 1.8 V  
k
1
a
2
IF(AV) = 10 A  
trr = 19 ns (typ)  
APPLICATIONS  
PINNING  
SOD59 (TO220AC)  
• Active power factor correction  
• Half-bridge lighting ballasts  
• Half-bridge/ full-bridge switched  
mode power supplies.  
PIN  
DESCRIPTION  
cathode  
anode  
cathode  
tab  
1
2
The BYC10-600 is supplied in the  
SOD59 (TO220AC) conventional  
leaded package.  
tab  
1
2
LIMITING VALUES  
Limiting values in accordance with the Absolute Maximum System (IEC 134).  
SYMBOL PARAMETER CONDITIONS  
MIN.  
MAX.  
UNIT  
VRRM  
VRWM  
VR  
Peak repetitive reverse voltage  
-
-
-
-
600  
600  
500  
10  
V
V
V
A
Crest working reverse voltage  
Continuous reverse voltage  
Average forward current  
T
mb 114 ˚C  
δ = 0.5; with reapplied VRRM(max)  
mb 78 ˚C1  
IF(AV)  
;
;
T
IFRM  
IFSM  
Repetitive peak forward current δ = 0.5; with reapplied VRRM(max)  
-
20  
A
T
mb 78 ˚C1  
Non-repetitive peak forward  
current.  
t = 10 ms  
t = 8.3 ms  
-
-
65  
71  
A
A
sinusoidal; Tj = 150˚C prior to surge  
with reapplied VRWM(max)  
Tstg  
Tj  
Storage temperature  
Operating junction temperature  
-40  
-
150  
150  
˚C  
˚C  
THERMAL RESISTANCES  
SYMBOL PARAMETER  
CONDITIONS  
MIN. TYP. MAX. UNIT  
Rth j-mb  
Rth j-a  
Thermal resistance junction to  
mounting base  
Thermal resistance junction to in free air.  
ambient  
-
-
-
2
-
K/W  
K/W  
60  
September 1998  
1
Rev 1.100  
 
Philips Semiconductors  
Product specification  
Rectifier diode  
ultrafast, low switching loss  
BYC10-600  
ELECTRICAL CHARACTERISTICS  
Tj = 25 ˚C unless otherwise stated  
SYMBOL PARAMETER  
CONDITIONS  
MIN. TYP. MAX. UNIT  
VF  
Forward voltage  
IF = 10 A; Tj = 150˚C  
IF = 20 A; Tj = 150˚C  
IF = 10 A;  
-
-
-
-
-
-
1.4  
1.7  
2.0  
9
1.8  
2.3  
2.8  
200  
3.0  
-
V
V
V
IR  
Reverse current  
VR = 600 V  
µA  
mA  
ns  
VR = 500 V; Tj = 100 ˚C  
IF = 10 A to VR = 400 V;  
dIF/dt = 500 A/µs  
IF = 10 A to VR = 400 V;  
dIF/dt = 500 A/µs; Tj = 125˚C  
1.1  
19  
trr  
Reverse recovery time  
Reverse recovery time  
trr  
-
-
-
32  
9.5  
8
40  
12  
11  
ns  
A
Irrm  
Vfr  
Peak reverse recovery current IF = 10 A to VR = 400 V;  
dIF/dt = 500 A/µs; Tj = 125˚C  
IF = 10 A; dIF/dt = 100 A/µs  
Forward recovery voltage  
V
ID  
Vin = 400 V d.c.  
IL  
Vin  
Vin  
Vo = 400 V d.c.  
IR IF  
150 uH  
typ  
OUTPUT DIODE  
inductive load  
IL  
500 V MOSFET  
Fig.1. Typical application, output rectifier in boost  
converter power factor correction circuit. Continuous  
conduction, mode where the transistor turns on whilst  
forward current is still flowing in the diode.  
Fig.2. Typical application, freewheeling diode in half  
bridge converter. Continuous conduction mode, where  
each transistor turns on whilst forward current is still  
flowing in the other bridge leg diode.  
September 1998  
2
Rev 1.100  
Philips Semiconductors  
Product specification  
Rectifier diode  
ultrafast, low switching loss  
BYC10-600  
Irrm  
Forward dissipation, PF (W)  
Tmb(max) C  
D = 1.0  
30  
25  
20  
15  
10  
5
90  
ID  
Vo = 1.3 V  
Rs = 0.05 Ohms  
dIF/dt  
100  
ID = IL  
0.5  
losses due to  
diode reverse recovery  
110  
120  
130  
140  
150  
0.2  
0.1  
time  
p
t
t
p
I
D =  
VD  
T
t
T
0
0
5
10  
15  
Average forward current, IF(AV) (A)  
Fig.3. Maximum forward dissipation as a function of  
average forward current; rectangular current  
waveform where IF(AV) =IF(RMS) x D.  
Fig.6. Origin of switching losses in transistor due to  
diode reverse recovery.  
Reverse recovery time, trr (ns)  
Diode reverse recovery switching losses, Pdsw (W)  
0.25  
100  
f = 20 kHz  
Tj = 125 C  
0.2 VR = 400 V  
10 A  
20 A  
0.15  
10 A  
IF = 5 A  
20 A  
0.1  
Tj = 125 C  
VR = 400 V  
IF = 5 A  
0.05  
0
10  
100  
1000  
100  
1000  
Rate of change of current, dIF/dt (A/us)  
Rate of change of current, dIF/dt (A/us)  
Fig.4. Typical reverse recovery switching losses in  
diode, as a function of rate of change of current dIF/dt.  
Fig.7. Typical reverse recovery time trr, as a function  
of rate of change of current dIF/dt.  
Transistor losses due to diode reverse recovery, Ptsw (W)  
8
Peak reverse recovery current, Irrm (A)  
100  
10  
1
20 A  
7
6
f = 20 kHz  
Tj = 125 C  
5
10 A  
VR = 400 V  
4
3
2
1
0
20 A  
IF = 5 A  
IF = 5 A  
Tj = 125 C  
VR = 400 V  
100  
1000  
100  
1000  
Rate of change of current, dIF/dt (A/us)  
Rate of change of current, dIF/dt (A/us)  
Fig.5. Typical switching losses in transistor due to  
reverse recovery of diode, as a function of of change  
of current dIF/dt.  
Fig.8. Typical peak reverse recovery current, Irrm as a  
function of rate of change of current dIF/dt.  
September 1998  
3
Rev 1.100  
Philips Semiconductors  
Product specification  
Rectifier diode  
ultrafast, low switching loss  
BYC10-600  
Forward current, IF (A)  
Tj = 25 C  
dI  
20  
15  
10  
5
I
F
F
Tj = 150 C  
dt  
t
rr  
max  
time  
typ  
Q
100%  
10%  
s
I
I
R
rrm  
0
0
1
2
3
4
Forward voltage, VF (V)  
Fig.9. Definition of reverse recovery parameters trr, Irrm  
Fig.12. Typical and maximum forward characteristic  
IF = f(VF); Tj = 25˚C and 150˚C.  
Peak forward recovery voltage, Vfr (V)  
Reverse leakage current (A)  
20  
15  
10  
5
100mA  
10mA  
1mA  
Tj = 25 C  
IF = 10 A  
Tj = 125 C  
100 C  
typ  
75 C  
100uA  
10uA  
1uA  
50 C  
25 C  
0
0
50  
100  
150  
200  
0
100  
200  
300  
400  
500  
600  
Rate of change of current, dIF/dt (A/ s)  
Reverse voltage (V)  
Fig.10. Typical forward recovery voltage, Vfr as a  
function of rate of change of current dIF/dt.  
Fig.13. Typical reverse leakage current as a function  
of reverse voltage. IR = f(VR); parameter Tj  
Transient thermal impedance, Zth j-mb (K/W)  
10  
I
F
1
time  
0.1  
V
F
p
t
p
t
P
0.01  
D
D =  
T
V
fr  
t
T
V
0.001  
F
1us  
10us 100us 1ms  
10ms 100ms  
1s  
10s  
pulse width, tp (s)  
time  
Fig.11. Definition of forward recovery voltage Vfr  
Fig.14. Maximum thermal impedance Zth j-mb as a  
function of pulse width.  
September 1998  
4
Rev 1.100  
Philips Semiconductors  
Product specification  
Rectifier diode  
ultrafast, low switching loss  
BYC10-600  
MECHANICAL DATA  
Dimensions in mm  
Net Mass: 2 g  
4,5  
max  
10,3  
max  
1,3  
3,7  
2,8  
5,9  
min  
15,8  
max  
3,0 max  
not tinned  
3,0  
13,5  
min  
1,3  
max  
(2x)  
1
2
0,9 max (2x)  
0,6  
2,4  
5,08  
Fig.15. SOD59 (TO220AC). pin 1 connected to mounting base.  
Notes  
1. Refer to mounting instructions for TO220 envelopes.  
2. Epoxy meets UL94 V0 at 1/8".  
September 1998  
5
Rev 1.100  
Philips Semiconductors  
Product specification  
Rectifier diode  
ultrafast, low switching loss  
BYC10-600  
DEFINITIONS  
Data sheet status  
Objective specification  
This data sheet contains target or goal specifications for product development.  
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.  
Product specification  
This data sheet contains final product specifications.  
Limiting values  
Limiting values are given in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one  
or more of the limiting values may cause permanent damage to the device. These are stress ratings only and  
operation of the device at these or at any other conditions above those given in the Characteristics sections of  
this specification is not implied. Exposure to limiting values for extended periods may affect device reliability.  
Application information  
Where application information is given, it is advisory and does not form part of the specification.  
Philips Electronics N.V. 1998  
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the  
copyright owner.  
The information presented in this document does not form part of any quotation or contract, it is believed to be  
accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any  
consequence of its use. Publication thereof does not convey nor imply any license under patent or other  
industrial or intellectual property rights.  
LIFE SUPPORT APPLICATIONS  
These products are not designed for use in life support appliances, devices or systems where malfunction of these  
products can be reasonably expected to result in personal injury. Philips customers using or selling these products  
for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting  
from such improper use or sale.  
September 1998  
6
Rev 1.100  

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