BYQ60EWSERIES [NXP]

Rectifier diodes ultrafast. rugged ; 整流二极管超快。崎岖\n
BYQ60EWSERIES
型号: BYQ60EWSERIES
厂家: NXP    NXP
描述:

Rectifier diodes ultrafast. rugged
整流二极管超快。崎岖\n

整流二极管
文件: 总6页 (文件大小:59K)
中文:  中文翻译
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Philips Semiconductors  
Product specification  
Rectifier diodes  
ultrafast, rugged  
BYQ60EW series  
FEATURES  
SYMBOL  
QUICK REFERENCE DATA  
VR = 150 V/ 200 V  
VF 0.85 V  
• Low forward volt drop  
• Fast switching  
• Soft recovery characteristic  
• Reverse surge capability  
• High thermal cycling performance  
• Low thermal resistance  
a1  
1
a2  
3
IO(AV) = 60 A  
IRRM 0.2 A  
k
2
trr 35 ns  
GENERAL DESCRIPTION  
PINNING  
SOT429 (TO247)  
Dual, common cathode, ultra-fast,  
epitaxial rectifier diodes intended  
for use as output rectifiers in high  
frequency switched mode power  
supplies.  
PIN  
DESCRIPTION  
anode 1  
cathode  
1
2
The BYQ60EW seriesis suppliedin  
the conventional leaded SOT429  
(TO247) package.  
3
anode 2  
cathode  
tab  
2
1
3
LIMITING VALUES  
Limiting values in accordance with the Absolute Maximum System (IEC 134).  
SYMBOL PARAMETER CONDITIONS  
MIN.  
MAX.  
UNIT  
BYQ60EW  
-150  
150  
150  
150  
-200  
200  
200  
200  
VRRM  
VRWM  
VR  
Peak repetitive reverse voltage  
Crest working reverse voltage  
Continuous reverse voltage  
-
-
-
V
V
V
IO(AV)  
IFRM  
IFSM  
Average rectified output current square wave  
(both diodes conducting) δ = 0.5; Tmb 82 ˚C  
-
-
60  
60  
A
A
Repetitive peak forward current t = 25 µs; δ = 0.5;  
per diode  
Non-repetitive peak forward  
current per diode  
Tmb 82 ˚C  
t = 10 ms  
-
-
380  
414  
A
A
t = 8.3 ms  
sinusoidal; with reapplied  
VRWM(max)  
Repetitive peak reverse current tp = 2 µs; δ = 0.001  
IRRM  
IRSM  
-
-
0.2  
0.2  
A
A
per diode  
Non-repetitive peak reverse  
current per diode  
tp = 100 µs  
Tstg  
Tj  
Storage temperature  
Operating junction temperature  
-40  
-
150  
150  
˚C  
˚C  
ESD LIMITING VALUE  
SYMBOL PARAMETER  
CONDITIONS  
MIN.  
MAX.  
UNIT  
VC  
Electrostatic discharge  
capacitor voltage  
Human body model;  
C = 250 pF; R = 1.5 kΩ  
-
8
kV  
December 1998  
1
Rev 1.000  
Philips Semiconductors  
Product specification  
Rectifier diodes  
ultrafast, rugged  
BYQ60EW series  
THERMAL RESISTANCES  
SYMBOL PARAMETER  
CONDITIONS  
MIN. TYP. MAX. UNIT  
Rth j-mb  
Thermal resistance junction to per diode  
-
-
-
-
-
45  
0.85  
0.6  
-
K/W  
K/W  
K/W  
mounting base  
both diodes conducting  
Rth j-a  
Thermal resistance junction to in free air  
ambient  
ELECTRICAL CHARACTERISTICS  
characteristics arre per diode at Tj = 25 ˚C unless otherwise stated  
SYMBOL PARAMETER  
CONDITIONS  
MIN. TYP. MAX. UNIT  
VF  
Forward voltage  
IF = 30 A; Tj = 150˚C  
IF = 30 A  
-
-
-
-
-
-
-
0.73  
0.95  
1.07  
10  
0.85  
1.1  
1.2  
200  
2
V
V
IF = 60 A  
V
IR  
Reverse current  
VR = VRWM  
µA  
mA  
nC  
ns  
VR = VRWM; Tj = 100 ˚C  
IF = 2 A; VR 30 V; -dIF/dt = 20 A/µs  
IF = 1 A; VR 30 V;  
-dIF/dt = 100 A/µs  
IF = 1 A; dIF/dt = 10 A/µs  
1
Qs  
trr  
Reverse recovery charge  
Reverse recovery time  
10  
27  
20  
35  
Vfr  
Forward recovery voltage  
-
0.7  
-
V
December 1998  
2
Rev 1.000  
Philips Semiconductors  
Product specification  
Rectifier diodes  
ultrafast, rugged  
BYQ60EW series  
dI  
I
F
Forward dissipation, PF (W)  
BYQ60EW  
Tmb(max) (C)  
120.25  
F
35  
30  
25  
20  
15  
10  
5
dt  
1.9  
124.5  
2.2  
a = 1.57  
t
128.75  
133  
rr  
2.8  
4
time  
137.25  
141.5  
145.75  
150  
Q
100%  
10%  
s
0
I
I
R
0
5
10  
15  
20  
25  
30  
rrm  
Average forward current, IF(AV) (A)  
Fig.1. Definition of trr, Qs and Irrm  
Fig.4. Maximum forward dissipation PF = f(IF(AV))per  
diode; sinusoidal current waveform where a = form  
factor = IF(RMS) / IF(AV)  
.
I
F
F
trr / ns  
BYQ60EW  
1000  
100  
10  
IF = 1 A  
time  
V
V
fr  
V
F
1
10  
100  
dIF/dt (A/us)  
time  
Fig.2. Definition of Vfr  
Fig.5. Typical trr at Tj = 25 ˚C.  
Forward dissipation, PF (W)  
BYQ60EW  
Tmb(max) (C)  
Irrm / A  
BYQ60EW  
45  
111.75  
10  
1
40  
35  
30  
25  
20  
15  
10  
5
116  
D = 1.0  
0.5  
120.25  
124.5  
0.2  
0.1  
IF = 1 A  
128.75  
133  
D = tp/T  
tp  
T
137.25  
141.5  
0.1  
0.01  
145.75  
150  
0
0
10  
20  
30  
40  
50  
1
10  
-dIF/dt (A/us)  
100  
Average forward current, IF(AV) (A)  
Fig.3. Maximum forward dissipation PF = f(IF(AV)) per  
diode; square current waveform where  
IF(AV) =IF(RMS) x D.  
Fig.6. Typical Irrm at Tj = 25 ˚C.  
December 1998  
3
Rev 1.000  
Philips Semiconductors  
Product specification  
Rectifier diodes  
ultrafast, rugged  
BYQ60EW series  
Forward Current, IF (A)  
BYQ60EW  
max  
60  
Tj = 150 C  
55  
Tj = 25 C  
50  
typ  
45  
40  
35  
30  
25  
20  
15  
10  
5
0
0
0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9  
Forward Voltage, VF (V)  
1
1.1 1.2 1.3  
Fig.7. Typical and maximum forward characteristic  
IF = f(VF); parameter Tj  
Qs / nC  
BYQ60EW  
100  
10  
1
IF=5A  
IF=2A  
IF=1A  
1
10  
100  
-dIF/dt (A/us)  
Fig.8. Typical Qs at Tj = 25 ˚C.  
Transient Thermal Impedance, Zth j-mb (K/W)  
Single pulse  
BYQ60EW  
1
0.1  
P
D
tp  
0.01  
t
0.001  
1E-06 1E-05 1E-04 1E-03 1E-02 1E-01 1E+00 1E+01  
pulse width, tp (s)  
Fig.9. Transient thermal impedance; Zth j-hs = f(tp).  
December 1998  
4
Rev 1.000  
Philips Semiconductors  
Product specification  
Rectifier diodes  
ultrafast, rugged  
BYQ60EW series  
MECHANICAL DATA  
Dimensions in mm  
Net Mass: 5 g  
5.3 max  
16 max  
1.8  
o
3.5  
max  
5.3  
7.3  
3.5  
21  
max  
seating  
plane  
15.5  
max  
2.5  
4.0  
max  
15.5  
min  
1
2
3
0.9 max  
2.2 max  
3.2 max  
1.1  
0.4 M  
5.45 5.45  
Fig.10. SOT429 (TO247); pin 2 connected to mounting base.  
Notes  
1. Refer to mounting instructions for SOT429 envelope.  
2. Epoxy meets UL94 V0 at 1/8".  
December 1998  
5
Rev 1.000  
Philips Semiconductors  
Product specification  
Rectifier diodes  
ultrafast, rugged  
BYQ60EW series  
DEFINITIONS  
Data sheet status  
Objective specification  
This data sheet contains target or goal specifications for product development.  
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.  
Product specification  
This data sheet contains final product specifications.  
Limiting values  
Limiting values are given in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one  
or more of the limiting values may cause permanent damage to the device. These are stress ratings only and  
operation of the device at these or at any other conditions above those given in the Characteristics sections of  
this specification is not implied. Exposure to limiting values for extended periods may affect device reliability.  
Application information  
Where application information is given, it is advisory and does not form part of the specification.  
Philips Electronics N.V. 1999  
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the  
copyright owner.  
The information presented in this document does not form part of any quotation or contract, it is believed to be  
accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any  
consequence of its use. Publication thereof does not convey nor imply any license under patent or other  
industrial or intellectual property rights.  
LIFE SUPPORT APPLICATIONS  
These products are not designed for use in life support appliances, devices or systems where malfunction of these  
products can be reasonably expected to result in personal injury. Philips customers using or selling these products  
for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting  
from such improper use or sale.  
December 1998  
6
Rev 1.000  

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