BYV29-600 [NXP]

Rectifier diode ultrafast; 整流器器超快二极管
BYV29-600
型号: BYV29-600
厂家: NXP    NXP
描述:

Rectifier diode ultrafast
整流器器超快二极管

整流二极管 局域网 软恢复二极管
文件: 总6页 (文件大小:50K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
Philips Semiconductors  
Product specification  
Rectifier diodes  
ultrafast  
BYV29-600  
FEATURES  
SYMBOL  
QUICK REFERENCE DATA  
• Low forward volt drop  
• Fast switching  
VR = 600V  
• Soft recovery characteristic  
• High thermal cycling performance  
• Low thermal resistance  
k
1
a
2
VF 1.03 V  
IF(AV) = 9 A  
trr 60 ns  
GENERAL DESCRIPTION  
PINNING  
SOD59 (TO220AC)  
Ultra-fast, epitaxial rectifier diodes  
intended for use as output rectifiers  
in high frequency switched mode  
power supplies.  
PIN  
DESCRIPTION  
cathode  
anode  
cathode  
tab  
1
2
The BYV29-600 is supplied in the  
conventional  
leaded  
SOD59  
tab  
(TO220AC) package.  
1
2
LIMITING VALUES  
Limiting values in accordance with the Absolute Maximum System (IEC 134).  
SYMBOL PARAMETER  
CONDITIONS  
MIN.  
MAX.  
UNIT  
VRRM  
VRWM  
VR  
Peak repetitive reverse voltage  
-
-
-
600  
600  
600  
V
V
V
Crest working reverse voltage  
Continuous reverse voltage  
IF(AV)  
IFRM  
IFSM  
Average forward current1  
square wave; δ = 0.5;  
-
-
9
A
A
T
mb 120 ˚C  
Repetitive peak forward current t = 25 µs; δ = 0.5;  
18  
T
mb 120 ˚C  
Non-repetitive peak forward  
current.  
t = 10 ms  
-
-
70  
77  
A
A
t = 8.3 ms  
sinusoidal; with reapplied  
VRRM(max)  
Tstg  
Tj  
Storage temperature  
Operating junction temperature  
-40  
-
150  
150  
˚C  
˚C  
THERMAL RESISTANCES  
SYMBOL PARAMETER  
CONDITIONS  
MIN. TYP. MAX. UNIT  
Rth j-mb  
Rth j-a  
Thermal resistance junction to  
mounting base  
Thermal resistance junction to in free air.  
ambient  
-
-
-
2.5  
-
K/W  
K/W  
60  
1 Neglecting switching and reverse current losses.  
February 2000  
1
Rev 1.100  
Philips Semiconductors  
Product specification  
Rectifier diodes  
ultrafast  
BYV29-600  
ELECTRICAL CHARACTERISTICS  
Tj = 25 ˚C unless otherwise stated  
SYMBOL PARAMETER  
CONDITIONS  
MIN. TYP. MAX. UNIT  
VF  
Forward voltage  
IF = 8 A; Tj = 150˚C  
IF = 8 A  
-
-
-
-
-
-
0.90  
1.05  
1.30  
2.0  
1.03  
1.25  
1.45  
50  
V
V
IF = 20 A  
V
IR  
Reverse current  
VR = VRRM  
µA  
mA  
nC  
VR = VRRM; Tj = 100 ˚C  
IF = 2 A to VR 30 V;  
dIF/dt = 20 A/µs  
IF = 1 A to VR 30 V;  
dIF/dt = 100 A/µs  
0.1  
0.35  
70  
Qs  
trr  
Reverse recovery charge  
Reverse recovery time  
40  
-
-
-
50  
3.0  
3.2  
60  
5.5  
-
ns  
A
Irrm  
Vfr  
Peak reverse recovery current IF = 10 A to VR 30 V;  
dIF/dt = 50 A/µs; Tj = 100˚C  
Forward recovery voltage  
IF = 10 A; dIF/dt = 10 A/µs  
V
February 2000  
2
Rev 1.100  
Philips Semiconductors  
Product specification  
Rectifier diodes  
ultrafast  
BYV29-600  
dI  
I
F
Forward dissipation, PF (W)  
Ths(max) (C)  
a = 1.57  
F
18  
16  
14  
12  
10  
8
dt  
1.9  
110  
120  
2.2  
t
2.8  
rr  
4
time  
130  
140  
150  
6
4
Q
100%  
10%  
s
2
I
0
I
R
0
2
4
6
8
10  
12  
rrm  
Average forward current, IF(AV) (A)  
Fig.1. Definition of trr, Qs and Irrm  
Fig.4. Maximum forward dissipation PF = f(IF(AV));  
sinusoidal current waveform where a = form  
factor = IF(RMS) / IF(AV)  
.
I
F
F
trr / ns  
1000  
100  
10  
10A  
time  
V
1A  
Tj = 25 C  
Tj = 150 C  
V
fr  
V
F
time  
10  
-diF/dt  
100  
Fig.2. Definition of Vfr  
Fig.5. Maximum trr at Tj = 25˚C and 100˚C  
Forward dissipation, PF (W)  
Ths(max) (C)  
Irrm / A  
10  
20  
IF=10A  
D = 1.0  
15  
10  
5
112.5  
1
0.5  
IF=1A  
0.2  
0.1  
125  
D = tp/T  
tp  
T
0.1  
137.5  
Tj = 25 C  
Tj = 100C  
150  
0
0.01  
0
2
4
6
8
10  
12  
14  
10  
100  
1
Average forward current, IF(AV) (A)  
-dIF/dt (A/us)  
Fig.3. Maximum forward dissipation PF = f(IF(AV));  
Fig.6. Maximum Irrm at Tj = 25˚C and 100˚C.  
square wave where IF(AV) =IF(RMS) x D.  
February 2000  
3
Rev 1.100  
Philips Semiconductors  
Product specification  
Rectifier diodes  
ultrafast  
BYV29-600  
Qs / nC  
IF / A  
30  
1000  
100  
10  
Tj=150 C  
Tj=25 C  
10A  
2A  
10A  
20  
10  
0
IF=2A  
typ  
max  
25 C  
150 C  
1
0.5  
1.5  
0
1
2
1
10  
100  
-diF / dt  
VF / V  
Fig.7. Typical and maximum forward characteristic  
IF = f(VF); parameter Tj  
Fig.9. Maximum Qs at Tj = 25˚C  
Cd / pF  
100  
Transient thermal impedance, Zth j-mb (K/W)  
10  
1
0.1  
10  
p
t
p
t
P
0.01  
D
D =  
T
1
t
T
1
10  
VR / V  
100  
1000  
0.001  
1us  
10us 100us 1ms  
10ms 100ms  
1s  
10s  
Fig.8. Typical junction capacitance Cd at f = 1 MHz;  
Tj = 25˚C  
pulse width, tp (s)  
Fig.10. Transient thermal impedance Zth j-mb= f(tp)  
February 2000  
4
Rev 1.100  
Philips Semiconductors  
Product specification  
Rectifier diodes  
ultrafast  
BYV29-600  
MECHANICAL DATA  
Dimensions in mm  
Net Mass: 2 g  
Plastic single-ended package; heatsink mounted; 1 mounting hole; 2-lead TO-220  
SOD59  
E
P
A
A
1
q
D
1
D
(1)  
L
1
L
2
Q
b
1
L
1
2
b
c
e
0
5
10 mm  
scale  
DIMENSIONS (mm are the original dimensions)  
(1)  
2
b
e
A
b
D
E
L
D
1
L
1
A
1
c
UNIT  
P
q
Q
L
1
4.5  
4.1  
1.39  
1.27  
0.9  
0.7  
1.3  
1.0  
0.7  
0.4  
15.8  
15.2  
6.4  
5.9  
10.3  
9.7  
15.0  
13.5  
3.30  
2.79  
3.8  
3.6  
3.0  
2.7  
2.6  
2.2  
mm  
3.0  
5.08  
Note  
1. Terminals in this zone are not tinned.  
REFERENCES  
JEDEC  
EUROPEAN  
PROJECTION  
OUTLINE  
VERSION  
ISSUE DATE  
IEC  
EIAJ  
SOD59  
2-lead TO-220  
97-06-11  
Fig.11. TO220AC; pin 1 connected to mounting base.  
Notes  
1. Refer to mounting instructions for TO220 envelopes.  
2. Epoxy meets UL94 V0 at 1/8".  
February 2000  
5
Rev 1.100  
Philips Semiconductors  
Product specification  
Rectifier diodes  
ultrafast  
BYV29-600  
DEFINITIONS  
Data sheet status  
Objective specification  
This data sheet contains target or goal specifications for product development.  
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.  
Product specification  
This data sheet contains final product specifications.  
Limiting values  
Limiting values are given in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one  
or more of the limiting values may cause permanent damage to the device. These are stress ratings only and  
operation of the device at these or at any other conditions above those given in the Characteristics sections of  
this specification is not implied. Exposure to limiting values for extended periods may affect device reliability.  
Application information  
Where application information is given, it is advisory and does not form part of the specification.  
Philips Electronics N.V. 2000  
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the  
copyright owner.  
The information presented in this document does not form part of any quotation or contract, it is believed to be  
accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any  
consequence of its use. Publication thereof does not convey nor imply any license under patent or other  
industrial or intellectual property rights.  
LIFE SUPPORT APPLICATIONS  
These products are not designed for use in life support appliances, devices or systems where malfunction of these  
products can be reasonably expected to result in personal injury. Philips customers using or selling these products  
for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting  
from such improper use or sale.  
February 2000  
6
Rev 1.100  

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