BYV44-300 [NXP]

Dual rectifier diodes ultrafast; 双整流二极管超快
BYV44-300
型号: BYV44-300
厂家: NXP    NXP
描述:

Dual rectifier diodes ultrafast
双整流二极管超快

整流二极管
文件: 总5页 (文件大小:48K)
中文:  中文翻译
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Philips Semiconductors  
Product specification  
Dual rectifier diodes  
ultrafast  
BYV44 series  
FEATURES  
SYMBOL  
QUICK REFERENCE DATA  
• Low forward volt drop  
• Fast switching  
• Soft recovery characteristic  
• High thermal cycling performance  
• Low thermal resistance  
VR = 300 V/ 400 V/ 500 V  
a1  
1
a2  
3
VF 1.12 V  
IO(AV) = 30 A  
trr 60 ns  
k
2
GENERAL DESCRIPTION  
PINNING  
SOT78 (TO220AB)  
Dual, common cathode, ultra-fast,  
epitaxial rectifier diodes intended  
for use as output rectifiers in high  
frequency switched mode power  
supplies.  
PIN  
DESCRIPTION  
anode 1  
cathode  
tab  
1
2
The BYV44 series is supplied in the  
3
anode 2  
cathode  
conventional  
leaded  
SOT78  
(TO220AB) package.  
tab  
1 2 3  
LIMITING VALUES  
Limiting values in accordance with the Absolute Maximum System (IEC 134).  
SYMBOL PARAMETER CONDITIONS  
MIN.  
MAX.  
UNIT  
BYV44  
-300  
300  
300  
300  
-400  
400  
400  
400  
-500  
500  
500  
500  
VRRM  
VRWM  
VR  
Peak repetitive reverse voltage  
Crest working reverse voltage  
Continuous reverse voltage  
-
-
-
V
V
V
Tmb 136˚C  
IO(AV)  
IFRM  
IFSM  
Average rectified output current square wave; δ = 0.5;  
-
30  
A
(both diodes conducting)1  
Tmb 94 ˚C  
Repetitive peak forward current t = 25 µs; δ = 0.5;  
-
30  
A
per diode  
Non-repetitive peak forward  
current per diode.  
Tmb 94 ˚C  
t = 10 ms  
-
-
150  
160  
A
A
t = 8.3 ms  
sinusoidal; with reapplied  
VRRM(max)  
Tstg  
Tj  
Storage temperature  
Operating junction temperature  
-40  
-
150  
150  
˚C  
˚C  
THERMAL RESISTANCES  
SYMBOL PARAMETER  
CONDITIONS  
MIN. TYP. MAX. UNIT  
Rth j-hs  
Thermal resistance junction to per diode  
-
-
-
-
-
60  
2.4  
1.4  
-
K/W  
K/W  
K/W  
heatsink  
both diodes conducting  
Rth j-a  
Thermal resistance junction to in free air.  
ambient  
1 Neglecting switching and reverse current losses.  
For output currents in excess of 20 A, the cathode connection should be made to the metal mounting tab.  
October 1998  
1
Rev 1.400  
Philips Semiconductors  
Product specification  
Dual rectifier diodes  
ultrafast  
BYV44 series  
ELECTRICAL CHARACTERISTICS  
characteristics are per diode at Tj = 25 ˚C unless otherwise stated  
SYMBOL PARAMETER  
CONDITIONS  
MIN. TYP. MAX. UNIT  
VF  
Forward voltage  
IF = 15 A; Tj = 150˚C  
IF = 15 A  
-
-
-
-
-
-
0.95  
1.08  
1.15  
10  
1.12  
1.25  
1.36  
50  
V
V
IF = 30 A  
V
IR  
Reverse current  
VR = VRRM  
µA  
mA  
nC  
VR = VRRM; Tj = 100 ˚C  
IF = 2 A to VR 30 V;  
dIF/dt = 20 A/µs  
IF = 1 A to VR 30 V;  
dIF/dt = 100 A/µs  
0.3  
0.8  
Qs  
trr  
Reverse recovery charge  
Reverse recovery time  
40  
60  
-
-
-
50  
4.2  
2.5  
60  
5.2  
-
ns  
A
Irrm  
Vfr  
Peak reverse recovery current IF = 10 A to VR 30 V;  
dIF/dt = 50 A/µs; Tj = 100˚C  
Forward recovery voltage  
IF = 10 A; dIF/dt = 10 A/µs  
V
Tmb(max) / C  
D = 1.0  
PF / W  
30  
dI  
F
88  
I
Vo = 0.8900 V  
F
Rs = 0.0137 Ohms  
dt  
90  
25  
20  
15  
10  
5
t
0.5  
102  
114  
126  
rr  
time  
0.2  
0.1  
t
p
p
t
I
D =  
T
Q
s
100%  
10%  
138  
150  
t
I
T
I
R
rrm  
0
0
5
10  
IF(AV) / A  
15  
20  
25  
Fig.1. Definition of trr, Qs and Irrm  
Fig.3. Maximum forward dissipation PF = f(IF(AV)) per  
diode; square wave where IF(AV) =IF(RMS) x D.  
2.8  
PF / W  
Tmb(max) / C  
a = 1.57  
I
20  
15  
10  
5
102  
114  
126  
F
F
Vo = 0.89  
Rs = 0.0137  
1.9  
2.2  
4
time  
V
138  
150  
V
fr  
V
F
0
0
5
10  
15  
IF(AV) / A  
time  
Fig.2. Definition of Vfr  
Fig.4. Maximum forward dissipation PF = f(IF(AV)) per  
diode; sinusoidal current waveform where a = form  
factor = IF(RMS) / IF(AV)  
.
October 1998  
2
Rev 1.400  
Philips Semiconductors  
Product specification  
Dual rectifier diodes  
ultrafast  
BYV44 series  
Qs / nC  
trr / ns  
1000  
1000  
100  
IF=20 A  
IF = 20 A  
100  
10  
1A  
2 A  
10  
Tj = 25 C  
Tj = 100 C  
1
1
100  
1
10  
dIF/dt (A/us)  
1.0  
10  
-dIF/dt (A/us)  
100  
Fig.5. Maximum trr at Tj = 25˚C and 100˚C; per diode  
Fig.8. Maximum Qs at Tj = 25˚C; per diode  
Irrm / A  
10  
Transient thermal impedance, Zth j-mb (K/W)  
10  
1
IF= 20 A  
1
IF=1A  
0.1  
0.1  
p
t
p
t
P
0.01  
D
D =  
T
Tj = 25 C  
Tj = 100 C  
t
T
0.01  
0.001  
1us  
10us 100us 1ms  
10ms 100ms  
1s  
10s  
10  
100  
1
pulse width, tp (s)  
-dIF/dt (A/us)  
Fig.6. Maximum Irrm at Tj = 25˚C and 100˚C; per  
diode  
Fig.9. Transient thermal impedance per diode  
Zth j-mb= f(tp)  
IF / A  
50  
40  
30  
20  
10  
0
Tj = 25 C  
Tj = 150 C  
typ  
max  
0
0.5  
1
1.5  
2
VF / V  
Fig.7. Typical and maximum forward characteristic  
IF = f(VF); parameter Tj  
October 1998  
3
Rev 1.400  
Philips Semiconductors  
Product specification  
Dual rectifier diodes  
ultrafast  
BYV44 series  
MECHANICAL DATA  
Dimensions in mm  
Net Mass: 2 g  
4,5  
max  
10,3  
max  
1,3  
3,7  
2,8  
5,9  
min  
15,8  
max  
3,0 max  
not tinned  
3,0  
13,5  
min  
1,3  
1 2 3  
max  
(2x)  
0,9 max (3x)  
0,6  
2,4  
2,54 2,54  
Fig.10. SOT78 (TO220AB); pin 2 connected to mounting base.  
Notes  
1. Refer to mounting instructions for SOT78 (TO220) envelopes.  
2. Epoxy meets UL94 V0 at 1/8".  
October 1998  
4
Rev 1.400  
Philips Semiconductors  
Product specification  
Dual rectifier diodes  
ultrafast  
BYV44 series  
DEFINITIONS  
Data sheet status  
Objective specification  
This data sheet contains target or goal specifications for product development.  
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.  
Product specification  
This data sheet contains final product specifications.  
Limiting values  
Limiting values are given in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one  
or more of the limiting values may cause permanent damage to the device. These are stress ratings only and  
operation of the device at these or at any other conditions above those given in the Characteristics sections of  
this specification is not implied. Exposure to limiting values for extended periods may affect device reliability.  
Application information  
Where application information is given, it is advisory and does not form part of the specification.  
Philips Electronics N.V. 1998  
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the  
copyright owner.  
The information presented in this document does not form part of any quotation or contract, it is believed to be  
accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any  
consequence of its use. Publication thereof does not convey nor imply any license under patent or other  
industrial or intellectual property rights.  
LIFE SUPPORT APPLICATIONS  
These products are not designed for use in life support appliances, devices or systems where malfunction of these  
products can be reasonably expected to result in personal injury. Philips customers using or selling these products  
for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting  
from such improper use or sale.  
October 1998  
5
Rev 1.400  

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