BYV98 [NXP]
Fast soft-recovery rectifier; 快速软恢复整流器
| 型号： | BYV98 |
| 厂家： | 
NXP |
| 描述： | Fast soft-recovery rectifier |
| 文件： | 总8页 (文件大小：60K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
DISCRETE SEMICONDUCTORS
DATA SHEET
BYV98
Fast soft-recovery rectifier
1996 Jun 07
Product specification
Supersedes data of May 1993
Philips Semiconductors
Product specification
Fast soft-recovery rectifier
BYV98
construction. This package is
FEATURES
DESCRIPTION
hermetically sealed and fatigue free
as coefficients of expansion of all
used parts are matched.
• Glass passivated
Rugged glass SOD57 package,
using a high temperature alloyed
• High maximum operating
temperature
• Low leakage current
• Excellent stability
k
a
• Available in ammo-pack.
MAM047
Fig.1 Simplified outline (SOD57) and symbol.
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
2100
UNIT
VRSM
VRRM
IF(AV)
non-repetitive peak reverse voltage
repetitive peak reverse voltage
average forward current
−
−
−
V
V
A
2000
1.00
Ttp = 55 °C; lead length = 10 mm
see Fig. 2;
averaged over any 20 ms period;
see also Fig. 6
IF(AV)
average forward current
Tamb = 60 °C; PCB mounting (see
Fig.11); see Fig. 3;
−
0.43
A
averaged over any 20 ms period;
see also Fig. 6
IFRM
repetitive peak forward current
Ttp = 55 °C; see Fig. 4
Tamb = 60 °C; see Fig. 5
−
−
−
9.0
4.5
15
A
A
A
IFSM
non-repetitive peak forward current
t = 10 ms half sine wave;
Tj = Tj max prior to surge;
VR = VRRMmax
Tstg
Tj
storage temperature
junction temperature
−65
−65
+175
+175
°C
°C
see Fig.7
1996 Jun 07
2
Philips Semiconductors
Product specification
Fast soft-recovery rectifier
BYV98
ELECTRICAL CHARACTERISTICS
Tj = 25 °C unless otherwise specified.
SYMBOL
PARAMETER
forward voltage
CONDITIONS
MIN.
TYP.
MAX.
2.2
2.4
5
UNIT
VF
IF = 2 A; Tj = Tj max; see Fig. 8
IF = 2 A; see Fig. 8
−
−
−
−
−
−
−
−
V
V
IR
reverse current
VR = VRRMmax; see Fig. 9
µA
µA
VR = VRRMmax; Tj = 125 °C;
50
see Fig. 9
trr
reverse recovery time
diode capacitance
when switched from IF = 0.5 A
to IR = 1 A; measured at
IR = 0.25 A; see Fig. 12
−
−
300
ns
Cd
f = 1 MHz; VR = 0 V; see Fig 10
−
−
30
−
pF
when switched from IF = 1 A to
VR ≥ 30 V and dIF/dt = −1 A/µs;
see Fig.13
−
5
A/µs
maximum slope of
reverse recovery current
dIR
--------
dt
THERMAL CHARACTERISTICS
SYMBOL
PARAMETER
CONDITIONS
VALUE
UNIT
Rth j-tp
Rth j-a
thermal resistance from junction to tie-point
thermal resistance from junction to ambient
lead length = 10 mm
note 1
46
K/W
K/W
100
Note
1. Device mounted on an epoxy-glass printed-circuit board, 1.5 mm thick; thickness of Cu-layer ≥40 µm, see Fig.11.
For more information please refer to the “General Part of associated Handbook”.
1996 Jun 07
3
Philips Semiconductors
Product specification
Fast soft-recovery rectifier
BYV98
GRAPHICAL DATA
MGC601
MGC600
1.6
0.6
handbook, halfpage
handbook, halfpage
I
F(AV)
I
F(AV)
(A)
(A)
1.2
0.4
0.8
0.4
0
0.2
0
0
0
100
200
100
200
o
o
T
( C)
T
( C)
amb
tp
a = 1.42; VR = VRRMmax; δ = 0.5.
Device mounted as shown in Fig.11.
Switched mode application.
a = 1.42; VR = VRRMmax; δ = 0.5.
Switched mode application.
Fig.2 Maximum permissible average forward
current as a function of tie-point temperature
(including losses due to reverse leakage).
Fig.3 Maximum permissible average forward
current as a function of ambient temperature
(including losses due to reverse leakage).
MGC603
10
δ =
I
0.05
FRM
(A)
8
6
4
2
0
0.1
0.2
0.5
1.0
–2
–1
2
3
4
10
10
1
10
10
10
10
t
(ms)
p
Ttp = 55°C; Rth j-tp = 46 K/W.
VRRMmax during 1 − δ; curves include derating for Tj max at VRRM = 2000 V.
Fig.4 Maximum repetitive peak forward current as a function of pulse time (square pulse) and duty factor.
1996 Jun 07
4
Philips Semiconductors
Product specification
Fast soft-recovery rectifier
BYV98
MGC604
5
δ =
0.05
I
FRM
(A)
4
3
2
1
0
0.1
0.2
0.5
1.0
–2
–1
2
3
4
10
10
1
10
10
10
10
t
(ms)
p
Tamb = 60 °C; Rth j-a = 100 K/W.
VRRMmax during 1 − δ; curves include derating for Tj max at VRRM = 2000 V.
Fig.5 Maximum repetitive peak forward current as a function of pulse time (square pulse) and duty factor.
MGC599
MEA524 - 1
3
200
handbook, halfpage
handbook, halfpage
a=3
2.5
2
1.57
P
T
j
(W)
o
(
C)
1.42
2
1
100
0
0
0
0
1000
2000
0.5
1.0
V
(V)
I
(A)
R
F(AV)
a = IF(RMS)/IF(AV); VR = VRRMmax; δ = 0.5.
Solid line = VRRM; δ = 0.1.
Dotted line = VRRM; δ = 0.5.
Fig.6 Maximum steady state power dissipation
(forward plus leakage current losses,
excluding switching losses) as a function
of average forward current.
Fig.7 Maximum permissible junction temperature
as a function of reverse voltage.
1996 Jun 07
5
Philips Semiconductors
Product specification
Fast soft-recovery rectifier
BYV98
MEA523
MLC319
3
10
10
handbook, halfpage
handbook, halfpage
I
F
I
(A)
R
8
(µA)
2
10
6
4
10
2
0
1
0
100
200
o
0
1
2
3
4
5
T ( C)
j
V
(V)
F
Dotted line: Tj = 175 °C.
Solid line: Tj = 25 °C.
VR = VRRMmax
.
Fig.9 Reverse current as a function of junction
temperature; maximum values.
Fig.8 Forward current as a function of forward
voltage; maximum values.
MGC602
2
10
50
handbook, halfpage
handbook, halfpage
25
C
d
(pF)
7
50
10
2
3
1
3
2
MGA200
1
10
10
10
V
(V)
R
f = 1 MHz; Tj = 25 °C.
Dimensions in mm.
Fig.10 Diode capacitance as a function of reverse
voltage; typical values.
Fig.11 Device mounted on a printed-circuit board.
1996 Jun 07
6
Philips Semiconductors
Product specification
Fast soft-recovery rectifier
BYV98
DUT
I
F
(A)
+
0.5
t
rr
25 V
10 Ω
1 Ω
50 Ω
0
0.25
0.5
t
I
R
(A)
MAM057
1
Input impedance oscilloscope: 1 MΩ, 22 pF; tr ≤ 7 ns.
Source impedance: 50 Ω; tr ≤ 15 ns.
Fig.12 Test circuit and reverse recovery time waveform and definition.
I
ndbook, halfpage
F
dI
F
dt
t
rr
t
10%
dI
R
dt
100%
I
R
MGC499
Fig.13 Reverse recovery definitions.
1996 Jun 07
7
Philips Semiconductors
Product specification
Fast soft-recovery rectifier
BYV98
PACKAGE OUTLINE
k
a
0.81
max
3.81
max
4.57
max
MBC880
28 min
28 min
Dimensions in mm.
The marking band indicates the cathode.
Fig.14 SOD57.
DEFINITIONS
Data Sheet Status
Objective specification
Preliminary specification
Product specification
This data sheet contains target or goal specifications for product development.
This data sheet contains preliminary data; supplementary data may be published later.
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
1996 Jun 07
8
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