BYW29-150 [NXP]

Rectifier diodes ultrafast; 整流二极管超快
BYW29-150
型号: BYW29-150
厂家: NXP    NXP
描述:

Rectifier diodes ultrafast
整流二极管超快

整流二极管
文件: 总6页 (文件大小:36K)
中文:  中文翻译
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Philips Semiconductors  
Product specification  
Rectifier diodes  
ultrafast  
BYW29 series  
GENERAL DESCRIPTION  
QUICK REFERENCE DATA  
Glass passivated high efficiency  
rectifier diodes in a plastic envelope,  
featuring low forward voltage drop,  
ultra-fast recovery times and soft  
recovery characteristic. They are  
intended for use in switched mode  
power supplies and high frequency  
circuits in general where low  
conduction and switching losses are  
essential.  
SYMBOL  
PARAMETER  
MAX. MAX. MAX. UNIT  
BYW29-  
100  
100  
150  
150  
200  
200  
VRRM  
Repetitive peak reverse  
voltage  
Forward voltage  
Forward current  
Reverse recovery time  
V
VF  
0.895 0.895 0.895  
V
A
ns  
IF(AV)  
8
8
8
trr  
25  
25  
25  
PINNING - TO220AC  
PIN CONFIGURATION  
SYMBOL  
PIN  
1
DESCRIPTION  
cathode (k)  
anode (a)  
tab  
a
k
2
tab cathode (k)  
1
2
LIMITING VALUES  
Limiting values in accordance with the Absolute Maximum System (IEC 134).  
SYMBOL PARAMETER  
CONDITIONS  
MIN.  
MAX.  
UNIT  
-100  
100  
100  
100  
-150  
150  
150  
150  
-200  
200  
200  
200  
VRRM  
VRWM  
VR  
Repetitive peak reverse voltage  
-
-
-
V
V
V
Crest working reverse voltage  
Continuous reverse voltage  
IF(AV)  
Average forward current1  
square wave; δ = 0.5;  
-
8
A
Tmb 128 ˚C  
sinusoidal; a = 1.57;  
mb 130 ˚C  
-
7.3  
A
T
IF(RMS)  
IFRM  
RMS forward current  
Repetitive peak forward current t = 25 µs; δ = 0.5;  
-
-
11.3  
16  
A
A
T
mb 128 ˚C  
IFSM  
Non-repetitive peak forward  
current  
t = 10 ms  
-
-
80  
88  
A
A
t = 8.3 ms  
sinusoidal; with reapplied  
VRWM(max)  
t = 10 ms  
I2t  
Tstg  
Tj  
I2t for fusing  
Storage temperature  
Operating junction temperature  
-
-40  
-
32  
150  
150  
A2s  
˚C  
˚C  
1 Neglecting switching and reverse current losses  
October 1994  
1
Rev 1.100  
Philips Semiconductors  
Product specification  
Rectifier diodes  
ultrafast  
BYW29 series  
THERMAL RESISTANCES  
SYMBOL PARAMETER  
CONDITIONS  
MIN. TYP. MAX. UNIT  
Rth j-mb  
Thermal resistance junction to  
mounting base  
Thermal resistance junction to in free air  
ambient  
-
-
2.7  
K/W  
Rth j-a  
-
60  
-
K/W  
STATIC CHARACTERISTICS  
Tj = 25 ˚C unless otherwise stated  
SYMBOL PARAMETER  
CONDITIONS  
MIN. TYP. MAX. UNIT  
VF  
Forward voltage  
IF = 8 A; Tj = 150˚C  
IF = 8 A  
-
-
-
-
-
0.80 0.895  
V
V
0.92  
1.1  
0.3  
2
1.05  
1.3  
0.6  
10  
IF = 20 A  
V
IR  
Reverse current  
VR = VRWM; Tj = 100 ˚C  
VR = VRWM  
mA  
µA  
DYNAMIC CHARACTERISTICS  
Tj = 25 ˚C unless otherwise stated  
SYMBOL PARAMETER  
CONDITIONS  
MIN. TYP. MAX. UNIT  
Qs  
trr  
Reverse recovery charge  
Reverse recovery time  
IF = 2 A; VR 30 V; -dIF/dt = 20 A/µs  
IF = 1 A; VR 30 V;  
-
-
4
11  
25  
nC  
ns  
20  
-dIF/dt = 100 A/µs  
Irrm  
Vfr  
Peak reverse recovery current IF = 10 A; VR 30 V; Tj = 100 ˚C;  
-dIF/dt = 50 A/µs  
Forward recovery voltage  
-
-
1
1
2
-
A
V
IF = 1 A; dIF/dt = 10 A/µs  
October 1994  
2
Rev 1.100  
Philips Semiconductors  
Product specification  
Rectifier diodes  
ultrafast  
BYW29 series  
Tmb(max) / C  
PF / W  
Vo = 0.791 V  
dI  
8
7
6
5
4
3
2
1
0
128.4  
I
a = 1.57  
F
F
Rs = 0.013 Ohms  
131.1  
1.9  
dt  
2.2  
133.8  
t
rr  
2.8  
136.5  
139.2  
time  
4
141.9  
Q
s
100%  
144.6  
147.3  
150  
10%  
I
I
R
rrm  
0
1
2
3
4
5
6
7
8
IF(AV) / A  
Fig.1. Definition of trr, Qs and Irrm  
Fig.4. Maximum forward dissipation PF = f(IF(AV));  
sinusoidal current waveform where a = form  
factor = IF(RMS) / IF(AV)  
.
trr / ns  
I
F
1000  
100  
10  
IF=10A  
time  
IF=1A  
V
F
V
fr  
V
F
1
1
10  
100  
time  
dIF/dt (A/us)  
Fig.2. Definition of Vfr  
Fig.5. Maximum trr at Tj = 25 ˚C.  
trr / ns  
Tmb(max) / C  
D = 1.0  
PF / W  
Vo = 0.791 V  
12  
10  
8
120.3  
123  
1000  
100  
10  
Rs = 0.013 Ohms  
IF=10A  
IF=1A  
0.5  
128.4  
133.8  
139.2  
0.2  
6
0.1  
4
t
p
t
p
I
D =  
T
2
144.6  
150  
t
T
0
1
0
2
4
6
8
10  
12  
1
10  
dIF/dt (A/us)  
100  
IF(AV) / A  
Fig.3. Maximum forward dissipation PF = f(IF(AV));  
square current waveform where IF(AV) =IF(RMS) x D.  
Fig.6. Maximum trr at Tj = 100 ˚C.  
October 1994  
3
Rev 1.100  
Philips Semiconductors  
Product specification  
Rectifier diodes  
ultrafast  
BYW29 series  
Irrm / A  
10  
Qs / nC  
100  
IF=10A  
5A  
IF=10A  
2A  
1
1A  
IF=1A  
10  
0.1  
0.01  
1
1.0  
1.0  
10  
-dIF/dt (A/us)  
100  
10  
-dIF/dt (A/us)  
100  
Fig.7. Maximum Irrm at Tj = 25 ˚C.  
Fig.10. Maximum Qs at Tj = 25 ˚C.  
Irrm / A  
Zth (K/W)  
10  
1
10  
IF=10A  
1
0.1  
IF=1A  
0.1  
0.01  
t
p
P
D
t
0.01  
1
10  
100  
10 us  
1 ms  
0.1 s  
10 s  
-dIF/dt (A/us)  
tp / s  
Fig.8. Maximum Irrm at Tj = 100 ˚C.  
Fig.11. Transient thermal impedance; Zth j-mb = f(tp).  
IF / A  
30  
20  
10  
0
Tj=150 C  
Tj=25 C  
typ  
max  
0.5  
1.5  
0
1
2
VF / V  
Fig.9. Typical and maximum forward characteristic  
IF = f(VF); parameter Tj  
October 1994  
4
Rev 1.100  
Philips Semiconductors  
Product specification  
Rectifier diodes  
ultrafast  
BYW29 series  
MECHANICAL DATA  
Dimensions in mm  
Net Mass: 2 g  
4,5  
max  
10,3  
max  
1,3  
3,7  
2,8  
5,9  
min  
15,8  
max  
3,0 max  
not tinned  
3,0  
13,5  
min  
1,3  
max  
(2x)  
1
2
0,9 max (2x)  
0,6  
2,4  
5,08  
Fig.12. TO220AC; pin 1 connected to mounting base.  
Notes  
1. Accessories supplied on request: refer to mounting instructions for TO220 envelopes.  
2. Epoxy meets UL94 V0 at 1/8".  
October 1994  
5
Rev 1.100  
Philips Semiconductors  
Product specification  
Rectifier diodes  
ultrafast  
BYW29 series  
DEFINITIONS  
Data sheet status  
Objective specification  
This data sheet contains target or goal specifications for product development.  
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.  
Product specification  
This data sheet contains final product specifications.  
Limiting values  
Limiting values are given in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one  
or more of the limiting values may cause permanent damage to the device. These are stress ratings only and  
operation of the device at these or at any other conditions above those given in the Characteristics sections of  
this specification is not implied. Exposure to limiting values for extended periods may affect device reliability.  
Application information  
Where application information is given, it is advisory and does not form part of the specification.  
Philips Electronics N.V. 1994  
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the  
copyright owner.  
The information presented in this document does not form part of any quotation or contract, it is believed to be  
accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any  
consequence of its use. Publication thereof does not convey nor imply any license under patent or other  
industrial or intellectual property rights.  
LIFE SUPPORT APPLICATIONS  
These products are not designed for use in life support appliances, devices or systems where malfunction of these  
products can be reasonably expected to result in personal injury. Philips customers using or selling these products  
for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting  
from such improper use or sale.  
October 1994  
6
Rev 1.100  

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