BZG01-C22T/R [NXP]

DIODE 22 V, 1.5 W, SILICON, UNIDIRECTIONAL VOLTAGE REGULATOR DIODE, DO-214AC, PLASTIC, SMA, 2 PIN, Voltage Regulator Diode;
BZG01-C22T/R
型号: BZG01-C22T/R
厂家: NXP    NXP
描述:

DIODE 22 V, 1.5 W, SILICON, UNIDIRECTIONAL VOLTAGE REGULATOR DIODE, DO-214AC, PLASTIC, SMA, 2 PIN, Voltage Regulator Diode

测试 光电二极管
文件: 总8页 (文件大小:53K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
DISCRETE SEMICONDUCTORS  
DATA SHEET  
book, halfpage  
BZG01 series  
SMA voltage regulator diodes  
Product specification  
2003 Mar 06  
Supersedes data of 2000 Feb 17  
Philips Semiconductors  
Product specification  
SMA voltage regulator diodes  
BZG01 series  
FEATURES  
DESCRIPTION  
Glass passivated  
DO-214AC surface mountable package with glass  
passivated chip.  
High maximum operating temperature  
Ideal for surface mount automotive applications  
Low leakage current  
The well-defined void-free case is of a transfer-moulded  
thermo-setting plastic. The small rectangular package has  
two J bent leads.  
Excellent stability  
UL 94V-O classified plastic package  
Zener working voltage range: 10 to 270 V for 35 types  
cathode  
olumns  
Supplied in 12 mm embossed tape and reel, 1500 and  
7500 pieces  
band  
k
a
Marking: cathode, date code, type name  
Easy pick and place.  
MBL143  
Top view  
Side view  
Fig.1 Simplified outline (DO-214AC) and symbol.  
LIMITING VALUES  
In accordance with the Absolute Maximum Rating System (IEC 60134).  
SYMBOL  
PARAMETER  
CONDITIONS  
MIN.  
MAX.  
2.50  
UNIT  
Ptot  
total power dissipation  
Ttp = 100 °C; see Fig.2  
W
T
amb = 25 °C; see Fig.2; device  
1.50  
W
mounted on an Al2O3 printed-circuit  
board: see Fig.5  
PZSM  
non-repetitive peak reverse power tp = 100 µs; square pulse; Tj = 25 °C  
150  
W
dissipation  
prior to surge; see Fig.3  
Tstg  
Tj  
storage temperature  
junction temperature  
65  
65  
+175  
+175  
°C  
°C  
2003 Mar 06  
2
Philips Semiconductors  
Product specification  
SMA voltage regulator diodes  
BZG01 series  
ELECTRICAL CHARACTERISTICS  
Total series  
Tj = 25 °C unless otherwise specified.  
SYMBOL  
PARAMETER  
forward voltage  
CONDITIONS  
IF = 0.1 A; see Fig.4  
MAX.  
UNIT  
VF  
1.2  
V
Per type  
Tj = 25 °C unless otherwise specified.  
DIFFERENTIAL TEMPERATURE  
TEST  
REVERSE CURRENT  
WORKING VOLTAGE  
VZ (V) at IZ  
TYPE  
No.  
RESISTANCE  
COEFFICIENT CURRENT at REVERSE VOLTAGE  
SUFFIX  
rdif () at IZ  
SZ (%/K) at IZ  
IR (µA)  
(1)  
IZ (mA)  
VR (V)  
MIN.  
NOM.  
MAX.  
TYP.  
MAX.  
MIN.  
MAX.  
MAX.  
C10  
C11  
C12  
C13  
C15  
C16  
C18  
C20  
C22  
C24  
C27  
C30  
C33  
C36  
C39  
C43  
C47  
C51  
C56  
C62  
C68  
C75  
C82  
C91  
C100  
C110  
C120  
C130  
C150  
9.4  
10.4  
11.4  
12.4  
13.8  
15.3  
16.8  
18.8  
20.8  
22.8  
25.1  
28  
10  
11  
12  
13  
15  
16  
18  
20  
22  
24  
27  
30  
33  
36  
39  
43  
47  
51  
56  
62  
68  
75  
82  
91  
100  
110  
120  
130  
150  
10.6  
11.6  
12.7  
14.1  
15.6  
17.1  
19.1  
21.2  
23.3  
25.6  
28.9  
32  
2
3
7
8
0.05  
0.05  
0.05  
0.05  
0.05  
0.06  
0.06  
0.06  
0.06  
0.06  
0.06  
0.06  
0.06  
0.06  
0.06  
0.07  
0.07  
0.07  
0.07  
0.08  
0.08  
0.08  
0.08  
0.09  
0.09  
0.09  
0.09  
0.09  
0.09  
0.09  
0.10  
0.10  
0.10  
0.10  
0.11  
0.11  
0.11  
0.11  
0.11  
0.11  
0.11  
0.11  
0.11  
0.11  
0.12  
0.12  
0.12  
0.12  
0.13  
0.13  
0.13  
0.13  
0.13  
0.13  
0.13  
0.13  
0.13  
0.13  
25  
20  
20  
20  
15  
15  
15  
10  
10  
10  
8
80  
40  
20  
10  
5
7.5  
8.2  
9.1  
10  
11  
12  
13  
15  
16  
18  
20  
22  
24  
27  
30  
33  
36  
39  
43  
47  
51  
56  
62  
68  
75  
82  
91  
100  
110  
3
9
3
10  
5
15  
5
15  
2
7
20  
1
8
24  
1
8
25  
1
8
25  
1
10  
10  
12  
13  
17  
17  
30  
40  
40  
40  
40  
40  
70  
80  
120  
150  
200  
250  
300  
30  
1
30  
8
1
31  
35  
35  
8
1
34  
38  
40  
8
1
37  
41  
50  
6
1
40  
46  
50  
6
1
44  
50  
90  
4
1
48  
54  
115  
120  
125  
130  
135  
200  
250  
350  
450  
550  
700  
1000  
4
1
52  
60  
4
1
58  
66  
4
1
64  
72  
4
1
70  
79  
4
1
77  
87  
2.7  
2.7  
2.7  
2.7  
2
1
85  
96  
1
94  
106  
116  
127  
141  
156  
1
104  
114  
124  
138  
1
1
2
1
2
1
2003 Mar 06  
3
Philips Semiconductors  
Product specification  
SMA voltage regulator diodes  
BZG01 series  
DIFFERENTIAL TEMPERATURE  
TEST  
REVERSE CURRENT  
WORKING VOLTAGE  
VZ (V) at IZ  
TYPE  
No.  
RESISTANCE  
COEFFICIENT CURRENT at REVERSE VOLTAGE  
SUFFIX  
rdif () at IZ  
SZ (%/K) at IZ  
IR (µA)  
(1)  
IZ (mA)  
VR (V)  
MIN.  
153  
168  
188  
208  
228  
251  
NOM.  
160  
180  
200  
220  
240  
270  
MAX.  
171  
191  
212  
233  
256  
289  
TYP.  
350  
MAX.  
1100  
1200  
1500  
2250  
2550  
3000  
MIN.  
0.09  
0.09  
0.09  
0.09  
0.09  
0.09  
MAX.  
0.13  
0.13  
0.13  
0.13  
0.13  
0.13  
MAX.  
C160  
C180  
C200  
C220  
C240  
C270  
1.5  
1.5  
1.5  
1
1
1
1
1
1
1
120  
130  
150  
160  
180  
200  
400  
500  
700  
800  
1
1000  
1
Note  
1. To complete the type number the suffix is added to the basic type number, e.g. BZG01-C130.  
THERMAL CHARACTERISTICS  
SYMBOL  
PARAMETER  
CONDITIONS  
VALUE  
30  
UNIT  
K/W  
K/W  
K/W  
Rth j-tp  
Rth j-a  
thermal resistance from junction to tie-point  
thermal resistance from junction to ambient  
note 1  
note 2  
100  
150  
Notes  
1. Device mounted on an Al2O3 printed-circuit board, 0.7 mm thick; thickness of Cu-layer 35 µm, see Fig.5.  
2. Device mounted on an epoxy-glass printed-circuit board, 1.5 mm thick; thickness of Cu-layer 40 µm, see Fig.5. For  
more information please refer to the ‘General Part of associated Handbook’.  
2003 Mar 06  
4
Philips Semiconductors  
Product specification  
SMA voltage regulator diodes  
BZG01 series  
GRAPHICAL DATA  
MCD826  
MCD825  
3
10  
3
handbook, halfpage  
handbook, halfpage  
P
P
tot  
ZSM  
(W)  
(W)  
2
10  
2
10  
1
1
10  
0
0
2  
1  
10  
1
10  
40  
80  
120  
160  
200  
T (°C)  
t
(ms)  
p
Solid line: tie-point temperature.  
Tj = 25 °C prior to surge.  
Dotted line: ambient temperature; device mounted on an Al2O3  
printed-circuit board as shown in Fig.5.  
Fig.3 Maximum non-repetitive peak reverse  
power dissipation as a function of pulse  
duration (square pulse).  
Fig.2 Maximum total power dissipation as a  
function of temperature.  
MCD824  
3
handbook, halfpage  
50  
I
F
(A)  
2
4.5  
50  
1
0
2.5  
1
1.1  
1.2  
1.3  
1.4  
1.5  
(V)  
1.25  
MSB213  
V
F
Tj = 25 °C.  
Dimensions in mm.  
Fig.4 Forward current as a function of forward  
voltage; typical values.  
Fig.5 Printed-circuit board for surface mounting.  
2003 Mar 06  
5
Philips Semiconductors  
Product specification  
SMA voltage regulator diodes  
BZG01 series  
PACKAGE OUTLINE  
Transfer-moulded thermo-setting plastic small rectangular surface mounted package;  
2 connectors  
SOD124  
H
D
A
A
1
c
Q
E
b
(1)  
0
2.5  
5 mm  
scale  
DIMENSIONS (mm are the original dimensions)  
UNIT  
A
A
b
c
D
E
H
Q
1
1.6  
1.4  
2.3  
2.0  
4.5  
4.3  
2.8  
2.4  
5.5  
5.1  
3.3  
2.7  
mm  
0.05  
0.2  
Note  
1. The marking band indicates the cathode.  
REFERENCES  
EUROPEAN  
PROJECTION  
OUTLINE  
VERSION  
ISSUE DATE  
IEC  
JEDEC  
EIAJ  
SOD124  
DO-214AC  
99-10-22  
2003 Mar 06  
6
Philips Semiconductors  
Product specification  
SMA voltage regulator diodes  
BZG01 series  
DATA SHEET STATUS  
DATA SHEET  
STATUS(1)  
PRODUCT  
STATUS(2)(3)  
LEVEL  
DEFINITION  
I
Objective data  
Development This data sheet contains data from the objective specification for product  
development. Philips Semiconductors reserves the right to change the  
specification in any manner without notice.  
II  
Preliminary data Qualification  
This data sheet contains data from the preliminary specification.  
Supplementary data will be published at a later date. Philips  
Semiconductors reserves the right to change the specification without  
notice, in order to improve the design and supply the best possible  
product.  
III  
Product data  
Production  
This data sheet contains data from the product specification. Philips  
Semiconductors reserves the right to make changes at any time in order  
to improve the design, manufacturing and supply. Relevant changes will  
be communicated via a Customer Product/Process Change Notification  
(CPCN).  
Notes  
1. Please consult the most recently issued data sheet before initiating or completing a design.  
2. The product status of the device(s) described in this data sheet may have changed since this data sheet was  
published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com.  
3. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.  
DEFINITIONS  
DISCLAIMERS  
Short-form specification  
The data in a short-form  
Life support applications  
These products are not  
specification is extracted from a full data sheet with the  
same type number and title. For detailed information see  
the relevant data sheet or data handbook.  
designed for use in life support appliances, devices, or  
systems where malfunction of these products can  
reasonably be expected to result in personal injury. Philips  
Semiconductors customers using or selling these products  
for use in such applications do so at their own risk and  
agree to fully indemnify Philips Semiconductors for any  
damages resulting from such application.  
Limiting values definition Limiting values given are in  
accordance with the Absolute Maximum Rating System  
(IEC 60134). Stress above one or more of the limiting  
values may cause permanent damage to the device.  
These are stress ratings only and operation of the device  
at these or at any other conditions above those given in the  
Characteristics sections of the specification is not implied.  
Exposure to limiting values for extended periods may  
affect device reliability.  
Right to make changes  
Philips Semiconductors  
reserves the right to make changes in the products -  
including circuits, standard cells, and/or software -  
described or contained herein in order to improve design  
and/or performance. When the product is in full production  
(status ‘Production’), relevant changes will be  
Application information  
Applications that are  
communicated via a Customer Product/Process Change  
Notification (CPCN). Philips Semiconductors assumes no  
responsibility or liability for the use of any of these  
products, conveys no licence or title under any patent,  
copyright, or mask work right to these products, and  
makes no representations or warranties that these  
products are free from patent, copyright, or mask work  
right infringement, unless otherwise specified.  
described herein for any of these products are for  
illustrative purposes only. Philips Semiconductors make  
no representation or warranty that such applications will be  
suitable for the specified use without further testing or  
modification.  
2003 Mar 06  
7
Philips Semiconductors – a worldwide company  
Contact information  
For additional information please visit http://www.semiconductors.philips.com.  
Fax: +31 40 27 24825  
For sales offices addresses send e-mail to: sales.addresses@www.semiconductors.philips.com.  
© Koninklijke Philips Electronics N.V. 2003  
SCA75  
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.  
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed  
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license  
under patent- or other industrial or intellectual property rights.  
Printed in The Netherlands  
613510/02/pp8  
Date of release: 2003 Mar 06  
Document order number: 9397 750 10974  

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