BZG03-C30-T [NXP]
DIODE 30 V, 1.25 W, SILICON, UNIDIRECTIONAL VOLTAGE REGULATOR DIODE, DO-214AC, PLASTIC PACKAGE-2, Voltage Regulator Diode;型号: | BZG03-C30-T |
厂家: | NXP |
描述: | DIODE 30 V, 1.25 W, SILICON, UNIDIRECTIONAL VOLTAGE REGULATOR DIODE, DO-214AC, PLASTIC PACKAGE-2, Voltage Regulator Diode 测试 光电二极管 |
文件: | 总8页 (文件大小:52K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
DISCRETE SEMICONDUCTORS
DATA SHEET
k, halfpage
BZG03 series
Voltage regulator diodes
Product specification
2002 Jul 04
Supersedes data of 1996 Jun 07
Philips Semiconductors
Product specification
Voltage regulator diodes
BZG03 series
FEATURES
DESCRIPTION
The well-defined void-free case is of a
transfer-moulded thermo-setting
plastic.
• Glass passivated
DO-214AC surface mountable
package with glass passivated chip.
• High maximum operating
temperature
• Low leakage current
• Excellent stability
cathode
band
handbook, 4 columns
k
a
• UL 94V-O classified plastic
package
• Zener working voltage range:
10 to 270 V for 35 types
• Supplied in 12 mm embossed tape.
Top view
Side view
MSA473
Fig.1 Simplified outline (DO-214AC; SOD106) and symbol.
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).
SYMBOL
PARAMETER
total power dissipation
total power dissipation
CONDITIONS
MIN.
MAX.
3.00
1.25
UNIT
Ptot
Ptot
Ttp = 100 °C; see Fig.2
−
−
W
Tamb = 50 °C; see Fig.2; device
W
mounted on an Al2O3 PCB (see Fig.5)
PZSM
non-repetitive peak reverse power tp = 100 µs; square pulse;
−
600
W
dissipation
Tj = 25 °C prior to surge; see Fig.3
Tstg
Tj
storage temperature
junction temperature
−65
−65
+175 °C
+175 °C
2002 Jul 04
2
Philips Semiconductors
Product specification
Voltage regulator diodes
BZG03 series
ELECTRICAL CHARACTERISTICS
Total series
Tj = 25 °C unless otherwise specified.
SYMBOL
PARAMETER
forward voltage
CONDITIONS
IF = 0.5 A; see Fig.4
MAX.
UNIT
VF
1.2
V
Per type
Tj = 25 °C unless otherwise specified.
DIFFERENTIAL TEMPERATURE
TEST
REVERSE CURRENT at
REVERSE VOLTAGE
WORKING VOLTAGE
VZ (V) at IZ
TYPE
No.
RESISTANCE
COEFFICIENT CURRENT
SUFFIX
rdif (Ω) at IZ
SZ (%/K) at IZ
IZ (mA)
IR (µA)
VR (V)
MAX.
(1)
MIN.
NOM.
MAX.
TYP.
MAX.
MIN.
MAX.
C10
C11
C12
C13
C15
C16
C18
C20
C22
C24
C27
C30
C33
C36
C39
C43
C47
C51
C56
C62
C68
C75
C82
C91
C100
C110
C120
C130
C150
9.4
10.4
11.4
12.4
13.8
15.3
16.8
18.8
20.8
22.8
25.1
28
10
11
10.6
11.6
12.7
14.1
15.6
17.1
19.1
21.2
23.3
25.6
28.9
32
2
4
4
7
0.05
0.05
0.05
0.05
0.05
0.06
0.06
0.06
0.06
0.06
0.06
0.06
0.06
0.06
0.06
0.07
0.07
0.07
0.07
0.08
0.08
0.08
0.08
0.09
0.09
0.09
0.09
0.09
0.09
0.09
0.10
0.10
0.10
0.10
0.11
0.11
0.11
0.11
0.11
0.11
0.11
0.11
0.11
0.11
0.12
0.12
0.12
0.12
0.13
0.13
0.13
0.13
0.13
0.13
0.13
0.13
0.13
0.13
50
50
50
50
50
25
25
25
25
25
25
25
25
10
10
10
10
10
10
10
10
10
10
5
7
4
3
2
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
7.5
8.2
9.1
12
4
7
13
5
10
10
15
5
10
11
12
13
15
16
18
20
22
24
27
30
33
36
39
43
47
51
56
62
68
75
82
91
100
110
16
6
15
18
6
15
20
6
15
22
6
15
24
7
15
27
7
15
30
8
15
31
33
35
8
15
34
36
38
21
21
24
24
25
25
25
25
30
30
60
60
80
80
110
130
40
37
39
41
40
40
43
46
45
44
47
50
45
48
51
54
60
52
56
60
60
58
62
66
80
64
68
72
80
70
75
79
100
100
200
200
250
250
300
300
77
82
87
85
91
96
94
100
110
120
130
150
106
116
127
141
156
5
104
5
114
124
138
5
5
5
2002 Jul 04
3
Philips Semiconductors
Product specification
Voltage regulator diodes
BZG03 series
DIFFERENTIAL TEMPERATURE
TEST
REVERSE CURRENT at
REVERSE VOLTAGE
WORKING VOLTAGE
VZ (V) at IZ
TYPE
No.
RESISTANCE
COEFFICIENT CURRENT
SUFFIX
rdif (Ω) at IZ
SZ (%/K) at IZ
IZ (mA)
IR (µA)
VR (V)
MAX.
(1)
MIN.
153
NOM.
160
180
200
220
240
270
MAX.
171
191
212
233
256
289
TYP.
150
180
200
350
400
450
MAX.
350
MIN.
0.09
0.09
0.09
0.09
0.09
0.09
MAX.
0.13
0.13
0.13
0.13
0.13
0.13
C160
C180
C200
C220
C240
C270
5
5
5
2
2
2
1
1
1
1
1
1
120
130
150
160
180
200
168
188
208
228
251
400
500
750
850
1000
Note
1. To complete the type number the suffix is added to the basic type number, e.g. BZG03-C130.
THERMAL CHARACTERISTICS
SYMBOL
PARAMETER
CONDITIONS
VALUE
25
UNIT
K/W
K/W
K/W
Rth j-tp
Rth j-a
thermal resistance from junction to tie-point
thermal resistance from junction to ambient
note 1
note 2
100
150
Notes
1. Device mounted on an Al2O3 printed-circuit board, 0.7 mm thick; thickness of Cu-layer ≥35 µm, see Fig.5.
2. Device mounted on an epoxy-glass printed-circuit board, 1.5 mm thick; thickness of Cu-layer ≥40 µm, see Fig.5.
For more information please refer to the “General Part of associated Handbook”.
2002 Jul 04
4
Philips Semiconductors
Product specification
Voltage regulator diodes
BZG03 series
GRAPHICAL DATA
MBH451
MBH452
4
10
4
handbook, halfpage
handbook, halfpage
P
tot
P
(W)
ZSM
(W)
3
3
10
2
1
0
2
10
10
10
−2
−1
0
100
200
10
1
t (ms) 10
p
T (°C)
Solid line: tie-point temperature.
Tj = 25 °C prior to surge.
Dotted line: ambient temperature; device mounted on an Al2O3 PCB
as shown in Fig.5.
Fig.3 Maximum non-repetitive peak reverse
power dissipation as a function of pulse
duration (square pulse).
Fig.2 Maximum total power dissipation as a
function of temperature.
MBH453
3
handbook, halfpage
50
I
F
(A)
2
4.5
50
2.5
1
0
1.25
MSB213
0
1
2
V
(V)
F
Tj = 25 °C.
Dimensions in mm.
Fig.4 Forward current as a function of forward
voltage; typical values.
Fig.5 Printed-circuit board for surface mounting.
2002 Jul 04
5
Philips Semiconductors
Product specification
Voltage regulator diodes
BZG03 series
PACKAGE OUTLINE
Transfer-moulded thermo-setting plastic small rectangular surface mounted package;
2 connectors
SOD106
H
D
A
A
1
c
Q
E
b
(1)
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
A
b
c
D
E
H
Q
1
1.6
1.4
2.3
2.0
4.5
4.3
2.8
2.4
5.5
5.1
3.3
2.7
mm
0.05
0.2
Note
1. The marking band indicates the cathode.
REFERENCES
EUROPEAN
PROJECTION
OUTLINE
VERSION
ISSUE DATE
IEC
JEDEC
EIAJ
SOD106
DO-214AC
97-06-09
2002 Jul 04
6
Philips Semiconductors
Product specification
Voltage regulator diodes
BZG03 series
DATA SHEET STATUS
PRODUCT
DATA SHEET STATUS(1)
STATUS(2)
DEFINITIONS
Objective data
Development This data sheet contains data from the objective specification for product
development. Philips Semiconductors reserves the right to change the
specification in any manner without notice.
Preliminary data
Qualification
This data sheet contains data from the preliminary specification.
Supplementary data will be published at a later date. Philips
Semiconductors reserves the right to change the specification without
notice, in order to improve the design and supply the best possible
product.
Product data
Production
This data sheet contains data from the product specification. Philips
Semiconductors reserves the right to make changes at any time in order
to improve the design, manufacturing and supply. Changes will be
communicated according to the Customer Product/Process Change
Notification (CPCN) procedure SNW-SQ-650A.
Notes
1. Please consult the most recently issued data sheet before initiating or completing a design.
2. The product status of the device(s) described in this data sheet may have changed since this data sheet was
published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com.
DEFINITIONS
DISCLAIMERS
Short-form specification
The data in a short-form
Life support applications
These products are not
specification is extracted from a full data sheet with the
same type number and title. For detailed information see
the relevant data sheet or data handbook.
designed for use in life support appliances, devices, or
systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips
Semiconductors customers using or selling these products
for use in such applications do so at their own risk and
agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.
Limiting values definition Limiting values given are in
accordance with the Absolute Maximum Rating System
(IEC 60134). Stress above one or more of the limiting
values may cause permanent damage to the device.
These are stress ratings only and operation of the device
at these or at any other conditions above those given in the
Characteristics sections of the specification is not implied.
Exposure to limiting values for extended periods may
affect device reliability.
Right to make changes
Philips Semiconductors
reserves the right to make changes, without notice, in the
products, including circuits, standard cells, and/or
software, described or contained herein in order to
improve design and/or performance. Philips
Semiconductors assumes no responsibility or liability for
the use of any of these products, conveys no licence or title
under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that
these products are free from patent, copyright, or mask
work right infringement, unless otherwise specified.
Application information
Applications that are
described herein for any of these products are for
illustrative purposes only. Philips Semiconductors make
no representation or warranty that such applications will be
suitable for the specified use without further testing or
modification.
2002 Jul 04
7
Philips Semiconductors – a worldwide company
Contact information
For additional information please visit http://www.semiconductors.philips.com.
Fax: +31 40 27 24825
For sales offices addresses send e-mail to: sales.addresses@www.semiconductors.philips.com.
© Koninklijke Philips Electronics N.V. 2002
SCA74
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
613514/03/pp8
Date of release: 2002 Jul 04
Document order number: 9397 750 09764
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