BZV85-C9V1T/R [NXP]

DIODE 9.1 V, 1 W, SILICON, UNIDIRECTIONAL VOLTAGE REGULATOR DIODE, DO-41, ROHS COMPLIANT, HERMETIC SEALED, GLASS PACKAGE-2, Voltage Regulator Diode;
BZV85-C9V1T/R
型号: BZV85-C9V1T/R
厂家: NXP    NXP
描述:

DIODE 9.1 V, 1 W, SILICON, UNIDIRECTIONAL VOLTAGE REGULATOR DIODE, DO-41, ROHS COMPLIANT, HERMETIC SEALED, GLASS PACKAGE-2, Voltage Regulator Diode

测试 二极管
文件: 总9页 (文件大小:75K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
DISCRETE SEMICONDUCTORS  
DATA SHEET  
book, halfpage  
BZV85 series  
Voltage regulator diodes  
Product data sheet  
1999 May 11  
Supersedes data of 1996 Apr 26  
NXP Semiconductors  
Product data sheet  
Voltage regulator diodes  
BZV85 series  
FEATURES  
DESCRIPTION  
Total power dissipation:  
max. 1.3 W  
Medium-power voltage regulator diodes in hermetically sealed leaded glass  
SOD66 (DO-41) packages. The diodes are available in the normalized E24  
approx. ±5% tolerance range. The series consists of 33 types with nominal  
working voltages from 3.6 to 75 V (BZV85-C3V6 to BZV85-C75).  
Tolerance series: approx. ±5%  
Working voltage range:  
nom. 3.6 to 75 V (E24 range)  
handbook, halfpage  
Non-repetitive peak reverse power  
k
a
dissipation: max. 60 W.  
MAM241  
The diodes are type branded.  
APPLICATIONS  
Fig.1 Simplified outline (SOD66; DO-41) and symbol.  
Stabilization purposes.  
LIMITING VALUES  
In accordance with the Absolute Maximum Rating System (IEC 134).  
SYMBOL  
IF  
PARAMETER  
CONDITIONS  
MIN.  
MAX.  
500  
UNIT  
mA  
continuous forward current  
IZSM  
non-repetitive peak reverse current tp = 100 μs; square wave;  
see Table  
Tj = 25 °C prior to surge; see Fig.3 “Per type”  
tp = 10 ms; half sinewave;  
Tj = 25 °C prior to surge  
see Table  
“Per type”  
Ptot  
total power dissipation  
Tamb = 25 °C; lead length 10 mm;  
1
W
note 1  
note 2  
1.3  
60  
W
W
PZSM  
non-repetitive peak reverse power tp = 100 μs; square wave;  
dissipation  
Tj = 25 °C prior to surge  
Tstg  
Tj  
storage temperature  
junction temperature  
65  
+200  
200  
°C  
°C  
Notes  
1. Device mounted on a printed circuit-board with 1 cm2 copper area per lead.  
2. If the leads are kept at Ttp = 55 °C at 4 mm from body.  
ELECTRICAL CHARACTERISTICS  
Total series  
Tj = 25 °C unless otherwise specified.  
SYMBOL  
VF  
PARAMETER  
forward voltage  
CONDITIONS  
MAX.  
UNIT  
IF = 50 mA; see Fig.4  
1
V
1999 May 11  
2
 
 
Per type  
Tj = 25 °C unless otherwise specified.  
WORKING  
VOLTAGE  
VZ (V)  
DIFFERENTIAL TEMP. COEFF.  
TEST  
CURRENT  
IZtest (mA) at f = 1 MHz;  
VR = 0 V  
DIODE CAP.  
Cd (pF)  
REVERSE  
CURRENT at  
REVERSE  
NON-REPETITIVE  
PEAK REVERSE CURRENT  
IZSM  
RESISTANCE  
SZ (mV/K)  
at IZtest  
rdif (Ω)  
at IZtest  
at IZtest  
see Figs 5 and 6  
VOLTAGE  
BZV85-  
CXXX  
at tp = 100 μs; at tp = 10 ms;  
IR (μA)  
VR  
(V)  
T
amb = 25 °C  
Tamb = 25 °C  
MIN. MAX.  
MAX.  
MIN.  
MAX.  
MAX.  
MAX.  
MAX. (A)  
MAX. (mA)  
3V6  
3V9  
4V3  
4V7  
5V1  
5V6  
6V2  
6V8  
7V5  
8V2  
9V1  
10  
3.4  
3.7  
3.8  
4.1  
15  
15  
13  
13  
10  
7
3.5  
3.5  
2.7  
2.0  
0.5  
0
1.0  
1.0  
0
60  
60  
50  
45  
45  
45  
35  
35  
35  
25  
25  
25  
20  
20  
20  
15  
15  
15  
10  
10  
10  
8
450  
450  
450  
300  
300  
300  
200  
200  
150  
150  
150  
90  
50  
1.0  
1.0  
1.0  
1.0  
2.0  
2.0  
3.0  
4.0  
4.5  
5.0  
6.5  
7.0  
7.7  
8.4  
9.1  
10.5  
11.0  
12.5  
14.0  
15.5  
17  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
7.0  
7.0  
5.0  
5.0  
4.0  
4.0  
3.0  
3.0  
3.0  
2.5  
1.75  
1.75  
1.75  
1.5  
1.5  
1.2  
1.2  
2000  
1950  
1850  
1800  
1750  
1700  
1620  
1550  
1500  
1400  
1340  
1200  
1100  
1000  
900  
10  
4.0  
4.6  
5
4.4  
5.0  
+0.7  
+2.2  
2.7  
3
4.8  
5.4  
3
5.2  
6.0  
2
5.8  
6.6  
4
0.6  
3.6  
2
6.4  
7.2  
3.5  
3
1.3  
4.3  
2
7.0  
7.9  
2.5  
5.5  
1
7.7  
8.7  
5
3.1  
6.1  
0.7  
0.7  
0.2  
0.2  
0.2  
0.2  
0.05  
0.05  
0.05  
0.05  
0.05  
0.05  
0.05  
0.05  
8.5  
9.6  
5
3.8  
7.2  
9.4  
10.6  
11.6  
12.7  
14.1  
15.6  
17.1  
19.1  
21.2  
23.3  
25.6  
28.9  
32.0  
8
4.7  
8.5  
11  
10.4  
11.4  
12.4  
13.8  
15.3  
16.8  
18.8  
20.8  
22.8  
25.1  
28.0  
10  
10  
10  
15  
15  
20  
24  
25  
30  
40  
45  
5.3  
9.3  
85  
12  
6.3  
10.8  
12.0  
13.6  
15.4  
17.1  
19.1  
22.1  
24.3  
27.5  
32.0  
85  
13  
7.4  
80  
15  
8.9  
75  
760  
16  
10.7  
11.8  
13.6  
16.6  
18.3  
20.1  
22.4  
75  
700  
18  
70  
600  
20  
60  
540  
22  
60  
500  
24  
55  
450  
27  
50  
19  
400  
30  
8
50  
21  
380  
 
WORKING  
VOLTAGE  
VZ (V)  
DIFFERENTIAL TEMP. COEFF.  
TEST  
CURRENT  
Ztest (mA) at f = 1 MHz;  
DIODE CAP.  
Cd (pF)  
REVERSE  
CURRENT at  
REVERSE  
NON-REPETITIVE  
PEAK REVERSE CURRENT  
IZSM  
RESISTANCE  
SZ (mV/K)  
at IZtest  
rdif (Ω)  
I
at IZtest  
at IZtest  
see Figs 5 and 6  
VR = 0 V  
VOLTAGE  
BZV85-  
CXXX  
at tp = 100 μs; at tp = 10 ms;  
IR (μA)  
VR  
(V)  
T
amb = 25 °C  
Tamb = 25 °C  
MIN. MAX.  
MAX.  
MIN.  
MAX.  
MAX.  
MAX.  
MAX. (A)  
MAX. (mA)  
33  
36  
39  
43  
47  
51  
56  
62  
68  
75  
31.0  
34.0  
37.0  
40.0  
44.0  
48.0  
52.0  
58.0  
64.0  
70.0  
35.0  
38.0  
41.0  
46.0  
50.0  
54.0  
60.0  
66.0  
72.0  
80.0  
45  
50  
24.8  
27.2  
29.6  
34.0  
37.4  
40.8  
46.8  
52.2  
60.5  
66.5  
35.0  
39.9  
43.0  
48.3  
52.5  
56.5  
63.0  
72.5  
81.0  
88.0  
8
8
6
6
4
4
4
4
4
4
45  
45  
45  
40  
40  
40  
40  
35  
35  
35  
0.05  
0.05  
0.05  
0.05  
0.05  
0.05  
0.05  
0.05  
0.05  
0.05  
23  
25  
27  
30  
33  
36  
39  
43  
48  
53  
1.0  
0.9  
0.8  
0.7  
0.6  
0.5  
0.4  
0.4  
0.35  
0.3  
350  
320  
296  
270  
246  
226  
208  
186  
171  
161  
60  
75  
100  
125  
150  
175  
200  
225  
NXP Semiconductors  
Product data sheet  
Voltage regulator diodes  
BZV85 series  
THERMAL CHARACTERISTICS  
SYMBOL  
Rth j-tp  
PARAMETER  
CONDITIONS  
VALUE  
110  
UNIT  
K/W  
K/W  
thermal resistance from junction to tie-point  
thermal resistance from junction to ambient  
lead length 4 mm; see Fig.2  
lead length10 mm; note 1  
Rth j-a  
175  
Note  
1. Device mounted on a printed circuit-board with 1 cm2 copper area per lead.  
GRAPHICAL DATA  
MBG929  
3
10  
R
th j-tp  
(K/W)  
δ = 1  
2
10  
0.75  
0.50  
0.33  
0.20  
0.10  
0.05  
10  
0.02  
0.01  
0
t
t
p
p
δ
=
T
T
1
10  
2  
1  
2
3
4
10  
1
10  
10  
10  
10  
t
(ms)  
p
Fig.2 Thermal resistance from junction to tie-point with a lead length of 4 mm.  
1999 May 11  
5
 
 
NXP Semiconductors  
Product data sheet  
Voltage regulator diodes  
BZV85 series  
MBG925  
300  
handbook, halfpage  
MBG802  
2
I
10  
F
handbook, halfpage  
(mA)  
I
ZSM  
(A)  
200  
(1)  
10  
(1)  
(2)  
100  
(2)  
1
0
0
0.5  
1.0  
V
(V)  
F
1  
10  
2
1
10  
V
(V)  
10  
Znom  
(1) Tj = 200 °C.  
(2) Tj = 25 °C.  
(1) tp = 10 μs; half sinewave; Tamb = 25 °C.  
(2) tp = 10 ms; half sinewave; Tamb = 25 °C.  
Fig.4 Forward current as a function of forward  
voltage; typical values.  
Fig.3 Non-repetitive peak reverse current as a  
function of the nominal working voltage.  
MBG800  
MBG926  
100  
10  
handbook, halfpage  
handbook, halfpage  
S
Z
(1)  
(mV/K)  
S
Z
(mV/K)  
80  
10  
(2)  
(3)  
9V1  
5
8V2  
7V5  
6V8  
60  
40  
6V2  
5V6  
5V1  
0
4V7  
4V3  
20  
0
3V6  
3V9  
5  
2
1
10  
V
(V)  
10  
0
25  
50  
Znom  
I
(mA)  
Z
IZ = IZtest; Tj = 25 to 150 °C.  
(1) Maximum values.  
(2) Typical values.  
BZV85-C3V6 to C10.  
Tj = 25 to 150 °C.  
For types above 7.5 V the temperature coefficient is independent  
of current; see Table “Per type”.  
(3) Minimum values.  
Fig.6 Temperature coefficient as a function of  
nominal working voltage.  
Fig.5 Temperature coefficient as a function of  
working current; typical values.  
1999 May 11  
6
NXP Semiconductors  
Product data sheet  
Voltage regulator diodes  
BZV85 series  
PACKAGE OUTLINE  
Hermetically sealed glass package; axial leaded; 2 leads  
SOD66  
(1)  
k
a
b
G
D
L
L
1
DIMENSIONS (mm are the original dimensions)  
0
2
4 mm  
G
D
L
b
1
UNIT  
max.  
min.  
max.  
max.  
scale  
mm  
0.81  
2.6  
4.8  
28  
Note  
1. The marking band indicates the cathode.  
REFERENCES  
EUROPEAN  
PROJECTION  
OUTLINE  
VERSION  
ISSUE DATE  
IEC  
JEDEC  
DO-41  
EIAJ  
97-06-20  
SOD66  
1999 May 11  
7
NXP Semiconductors  
Product data sheet  
Voltage regulator diodes  
BZV85 series  
DATA SHEET STATUS  
DOCUMENT  
STATUS(1)  
PRODUCT  
STATUS(2)  
DEFINITION  
Objective data sheet  
Development  
This document contains data from the objective specification for product  
development.  
Preliminary data sheet  
Product data sheet  
Qualification  
Production  
This document contains data from the preliminary specification.  
This document contains the product specification.  
Notes  
1. Please consult the most recently issued document before initiating or completing a design.  
2. The product status of device(s) described in this document may have changed since this document was published  
and may differ in case of multiple devices. The latest product status information is available on the Internet at  
URL http://www.nxp.com.  
DISCLAIMERS  
above those given in the Characteristics sections of this  
document is not implied. Exposure to limiting values for  
extended periods may affect device reliability.  
General Information in this document is believed to be  
accurate and reliable. However, NXP Semiconductors  
does not give any representations or warranties,  
expressed or implied, as to the accuracy or completeness  
of such information and shall have no liability for the  
consequences of use of such information.  
Terms and conditions of sale NXP Semiconductors  
products are sold subject to the general terms and  
conditions of commercial sale, as published at  
http://www.nxp.com/profile/terms, including those  
pertaining to warranty, intellectual property rights  
infringement and limitation of liability, unless explicitly  
otherwise agreed to in writing by NXP Semiconductors. In  
case of any inconsistency or conflict between information  
in this document and such terms and conditions, the latter  
will prevail.  
Right to make changes NXP Semiconductors  
reserves the right to make changes to information  
published in this document, including without limitation  
specifications and product descriptions, at any time and  
without notice. This document supersedes and replaces all  
information supplied prior to the publication hereof.  
No offer to sell or license Nothing in this document  
may be interpreted or construed as an offer to sell products  
that is open for acceptance or the grant, conveyance or  
implication of any license under any copyrights, patents or  
other industrial or intellectual property rights.  
Suitability for use NXP Semiconductors products are  
not designed, authorized or warranted to be suitable for  
use in medical, military, aircraft, space or life support  
equipment, nor in applications where failure or malfunction  
of an NXP Semiconductors product can reasonably be  
expected to result in personal injury, death or severe  
property or environmental damage. NXP Semiconductors  
accepts no liability for inclusion and/or use of NXP  
Semiconductors products in such equipment or  
applications and therefore such inclusion and/or use is at  
the customer’s own risk.  
Export control This document as well as the item(s)  
described herein may be subject to export control  
regulations. Export might require a prior authorization from  
national authorities.  
Quick reference data The Quick reference data is an  
extract of the product data given in the Limiting values and  
Characteristics sections of this document, and as such is  
not complete, exhaustive or legally binding.  
Applications Applications that are described herein for  
any of these products are for illustrative purposes only.  
NXP Semiconductors makes no representation or  
warranty that such applications will be suitable for the  
specified use without further testing or modification.  
Limiting values Stress above one or more limiting  
values (as defined in the Absolute Maximum Ratings  
System of IEC 60134) may cause permanent damage to  
the device. Limiting values are stress ratings only and  
operation of the device at these or any other conditions  
1999 May 11  
8
 
 
NXP Semiconductors  
Customer notification  
This data sheet was changed to reflect the new company name NXP Semiconductors. No changes were  
made to the content, except for the legal definitions and disclaimers.  
Contact information  
For additional information please visit: http://www.nxp.com  
For sales offices addresses send e-mail to: salesaddresses@nxp.com  
© NXP B.V. 2009  
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.  
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed  
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license  
under patent- or other industrial or intellectual property rights.  
Printed in The Netherlands  
115002/00/02/pp9  
Date of release: 1999 May 11  
Document order number: 9397 750 05929  

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