CBT16212DL,112 [NXP]
CBT16212 - 24-bit bus exchange switch with 12-bit output enables SSOP 56-Pin;
| 型号： | CBT16212DL,112 |
| 厂家： | 
NXP |
| 描述： | CBT16212 - 24-bit bus exchange switch with 12-bit output enables SSOP 56-Pin 光电二极管 逻辑集成电路 |
| 文件： | 总12页 (文件大小：72K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
CBT16212
24-bit bus exchange switch with 12-bit output enables
Rev. 02 — 3 November 2008
Product data sheet
1. General description
The CBT16212 provides 24 bits of high-speed TTL-compatible bus switching or
exchanging. The low ON resistance of the switch allows connections to be made with
minimal propagation delay.
The CBT16212 operates either as a 24-bit bus switch or as a 12-bit bus exchanger,
providing data exchange between four signal ports using the port select inputs (S0, S1
and S2).
The CBT16212 is characterized for operation from –40 °C to +85 °C.
2. Features
I 5 Ω switch connection between two ports
I TTL compatible input levels
I ESD protection:
N HBM JESD22-A114E Class 1C exceeds 1500 V
N CDM JESD22-C101C exceeds 1000 V
I Latch-up performance:
N JESD78 exceeds 100 mA
3. Ordering information
Table 1.
Ordering information
Type number
Package
Temperature range Name
Description
Version
CBT16212DGG
CBT16212DL
−40 °C to 85 °C
TSSOP56 plastic thin shrink small outline package; 56 leads;
body width 6.1 mm
SOT364-1
−40 °C to 85 °C
SSOP56
plastic shrink small outline package; 56 leads; body
width 7.5 mm
SOT371-1
CBT16212
NXP Semiconductors
24-bit bus exchange switch with 12-bit output enables
4. Functional diagram
1B1
54
1A1
2
1A2
3
1B2
2B1
53
52
2A1
4
2A2
5
2B2
3B1
51
50
3A1
6
3A2
7
3B2
4B1
48
47
4A1
9
4A2
10
4B2
5B1
46
45
5A1
11
5A2
12
5B2
6B1
44
43
6A1
13
6A2
14
6B2
7B1
42
41
7A1
15
7A2
16
7B2
8B1
40
39
8A1
18
8A2
20
8B2
9B1
37
36
9A1
21
1 of 12 channels
2
54
9A2
22
1A1
1B1
9B2
10B1
35
34
10A1
10A2
23
24
10B2
11B1
33
32
11A1
11A2
25
26
3
53
11B2
12B1
1A2
1B2
31
30
12A1
12A2
27
28
FLOW CONTROL
12B2
1
29
S0
S1
S2
S0
S1
S2
1
56
55
56
55
001aai356
001aai357
Fig 1. Functional diagram
Fig 2. Logic diagram
CBT16212_2
© NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 02 — 3 November 2008
2 of 12
CBT16212
NXP Semiconductors
24-bit bus exchange switch with 12-bit output enables
5. Pinning information
5.1 Pinning
1
56
55
54
53
52
51
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
S0
S1
2
1A1
1A2
2A1
2A2
3A1
3A2
GND
4A1
4A2
5A1
5A2
6A1
6A2
7A1
7A2
S2
3
1B1
1B2
2B1
2B2
3B1
GND
3B2
4B1
4B2
5B1
5B2
6B1
6B2
7B1
7B2
8B1
GND
8B2
9B1
9B2
10B1
10B2
11B1
11B2
12B1
12B2
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
CBT16212
V
CC
8A1
GND
8A2
9A1
9A2
10A1
10A2
11A1
11A2
12A1
12A2
001aai358
Fig 3. Pin configuration SOT364-1 (TSSOP56) and SOT371-1 (SSOP56)
5.2 Pin description
Table 2.
Pin description
Pin
Symbol
Description
S0, S1, S2
1, 56, 55
port select input
A1 port
1A1 to 12A1
1A2 to 12A2
GND
2, 4, 6, 9, 11, 13, 15, 18, 21, 23, 25, 27
3, 5, 7, 10, 12, 14, 16, 20, 22, 24, 26, 28
8, 19, 38, 49
A2 port
ground (0 V)
supply voltage
B1 port
VCC
17
1B1 to 12B1
1B2 to 12B2
54, 52, 50, 47, 45, 43, 41, 39, 36, 34, 32, 30
53, 51, 48, 46, 44, 42, 40, 37, 35, 33, 31, 29
B2 port
CBT16212_2
© NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 02 — 3 November 2008
3 of 12
CBT16212
NXP Semiconductors
24-bit bus exchange switch with 12-bit output enables
6. Functional description
Table 3.
Function selection[1]
Port select input
Input/output
Function
S2
L
S1
L
S0
L
nA1
Z
nA2
Z
disconnect
L
L
H
L
nB1
nB2
Z
Z
nA1 = nB1
L
H
H
L
Z
nA1 = nB2
L
H
L
nB1
nB2
Z
nA2 = nB1
H
H
H
H
Z
nA2 = nB2
L
H
L
Z
disconnect
H
H
nB1
nB2
nB2
nB1
nA1 = nB1 and nA2 = nB2
nA1 = nB2 and nA2 = nB1
H
[1] H = HIGH voltage level; L = LOW voltage level; Z = high-impedance OFF-state.
7. Limiting values
Table 4.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
VCC
VI
Parameter
Conditions
Min
−0.5
−0.5
−50
−0.5
-
Max
+7.0
+7.0
-
Unit
V
supply voltage
[1]
input voltage
V
IIK
input clamping current
output voltage
VI < 0 V
mA
V
VO
output at HIGH level or OFF-state
output at LOW level
+5.5
128
+150
IO
output current
mA
°C
Tstg
Ptot
storage temperature
total power dissipation
−65
Tamb = −40 °C to +125 °C
SSOP56 package
[3]
[4]
-
-
850
600
mW
mW
TSSOP56 package
[1] The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
[2] The performance capability of a high-performance integrated circuit in conjunction with its thermal environment can create junction
temperatures which are detrimental to reliability. The maximum junction temperature of this integrated circuit should not exceed 150 °C.
[3] Above 55 °C the value of Ptot derates linearly with 11.3 mW/K.
[4] Above 55 °C the value of Ptot derates linearly with 8 mW/K.
8. Recommended operating conditions
Table 5.
Operating conditions
All unused control inputs of the device must be held at VCC or GND to ensure proper device operation.
Symbol
VCC
Parameter
Conditions
Min
4.0
2.0
-
Max
5.5
-
Unit
V
supply voltage
VIH
HIGH-level input voltage
LOW-level input voltage
ambient temperature
V
VIL
0.8
+85
V
Tamb
CBT16212_2
operating in free-air
−40
°C
© NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 02 — 3 November 2008
4 of 12
CBT16212
NXP Semiconductors
24-bit bus exchange switch with 12-bit output enables
9. Static characteristics
Table 6.
Static characteristics
Tamb = −40 °C to +85 °C.
Symbol Parameter
Conditions
Min
Typ[1]
Max Unit
VIK
II
input clamping voltage
VCC = 4.5 V; II = −18 mA
VCC = 0 V; VI = 5.5 V
VCC = 5.5 V; VI = VCC or GND
-
-
-
-
-
-
-
-
−1.2
10
±1
3
V
input leakage current
µA
µA
µA
ICC
supply current
VCC = 5.5 V; IO = 0 A;
VI = VCC or GND
[2]
∆ICC
additional supply current
per port select input pin; VCC = 5.5 V;
one input at 3.4 V, other inputs at VCC
or GND
-
-
2.5
mA
CI
input capacitance
port select input pins; VI = 3 V or 0 V;
-
-
4.7
-
-
pF
pF
VCC = 5.0 V;
Cio(off)
RON
off-state input/output capacitance VO = 3 V or 0 V; VCC = 0 V
11.5
[3]
[3]
ON resistance
VCC = 4.0 V
VI = 2.4 V; II = 15 mA
VCC = 4.5 V
-
-
21
Ω
VI = 0 V; II = 64 mA
VI = 0 V; II = 30 mA
VI = 2.4 V; II = 15 mA
-
-
-
4
4
6
7
7
Ω
Ω
Ω
12
[1] All typical values are measured at Tamb = 25 °C.
[2] This is the increase in supply current for each input that is at the specified TTL voltage level rather than VCC or GND.
[3] Measured by the voltage drop between the A and the B terminals at the indicated current through the switch. ON resistance is
determined by the lowest voltage of the two (A or B) terminals.
10. Dynamic characteristics
Table 7.
Dynamic characteristics
Tamb = −40 °C to +85 °C; VCC = 4.5 V to 5.5 V; for test circuit see Figure 6.
Symbol Parameter
Conditions
Min
-
Max Unit
[1][2]
[3]
tpd
ten
tdis
propagation delay
input A or B to output B or A; see Figure 4
port select input to output A or B; Figure 5
port select input to output A or B; Figure 5
0.25 ns
enable time
disable time
2.4
2.4
8.0
8.0
ns
ns
[4]
[1] This parameter is warranted but not production tested. The propagation delay is based on the RC time constant of the typical
ON resistance of the switch and a load capacitance of 50 pF, when driven by an ideal voltage source (zero output impedance).
[2] tpd is the same as tPLH and tPHL
.
[3] ten is the same as tPZL and tPZH
.
[4] tdis is the same as tPLZ and tPHZ
.
CBT16212_2
© NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 02 — 3 November 2008
5 of 12
CBT16212
NXP Semiconductors
24-bit bus exchange switch with 12-bit output enables
11. Waveforms
V
I
input
GND
V
V
M
M
t
t
PHL
PLH
V
OH
output
V
V
M
M
V
OL
001aah986
Measurement points are given in Table 8.
VOL and VOH are typical output voltage levels that occur with the output load.
Fig 4. Input to output propagation delays
V
I
V
V
Sn input
M
M
GND
3.5 V
t
t
PLZ
PZL
output
V
V
OFF to LOW
LOW to OFF
M
M
V
V
+ 0.3 V
OL
V
OL
t
t
PHZ
PZH
V
OH
output
OFF to HIGH
HIGH to OFF
− 0.3 V
OH
GND
001aaj055
Measurement points are given in Table 8.
VOL and VOH are typical output voltage levels that occur with the output load.
Fig 5. Enable and disable times
Table 8. Measurement points
Supply voltage
VCC
Input
VM
Output
VM
4.5 V to 5.5 V
1.5 V
1.5 V
CBT16212_2
© NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 02 — 3 November 2008
6 of 12
CBT16212
NXP Semiconductors
24-bit bus exchange switch with 12-bit output enables
V
EXT
V
CC
R
L
V
V
O
I
G
DUT
R
T
C
L
R
L
mna616
Test data is given in Table 9.
Definitions for test circuit:
RL = Load resistance.
CL = Load capacitance including jig and probe capacitance.
RT = Termination resistance should be equal to the output impedance Zo of the pulse generator.
VEXT = External voltage for measuring switching times.
Fig 6. Test circuit
Table 9. Test data
Supply voltage
VCC
Input
Load
CL
VEXT
VI
tr = tf
RL
tPLH, tPHL
open
tPZH, tPHZ
tPZL, tPLZ
4.5 V to 5.5 V
GND to 3.0 V
≤ 2.5 ns
50 pF
500 Ω
open
7.0 V
CBT16212_2
© NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 02 — 3 November 2008
7 of 12
CBT16212
NXP Semiconductors
24-bit bus exchange switch with 12-bit output enables
12. Package outline
TSSOP56: plastic thin shrink small outline package; 56 leads; body width 6.1 mm
SOT364-1
E
D
A
X
c
H
v
M
A
y
E
Z
56
29
Q
A
2
(A )
3
A
A
1
pin 1 index
θ
L
p
L
detail X
1
28
w
M
b
e
p
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions).
A
(1)
(2)
UNIT
A
A
A
b
c
D
E
e
H
L
L
p
Q
v
w
y
Z
θ
1
2
3
p
E
max.
8o
0o
0.15
0.05
1.05
0.85
0.28
0.17
0.2
0.1
14.1
13.9
6.2
6.0
8.3
7.9
0.8
0.4
0.50
0.35
0.5
0.1
mm
1.2
0.5
1
0.25
0.25
0.08
0.1
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
JEITA
99-12-27
03-02-19
SOT364-1
MO-153
Fig 7. Package outline SOT364-1 (TSSOP56)
CBT16212_2
© NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 02 — 3 November 2008
8 of 12
CBT16212
NXP Semiconductors
24-bit bus exchange switch with 12-bit output enables
SSOP56: plastic shrink small outline package; 56 leads; body width 7.5 mm
SOT371-1
D
E
A
X
c
y
H
v
M
A
E
Z
29
56
Q
A
2
A
A
(A )
3
1
θ
pin 1 index
L
p
L
28
1
detail X
w
M
b
p
e
0
5
10 mm
scale
DIMENSIONS (mm are the original dimensions)
A
(1)
(1)
(1)
UNIT
A
A
A
b
c
D
E
e
H
E
L
L
Q
v
w
y
Z
θ
p
p
1
2
3
max.
8o
0o
0.4
0.2
2.35
2.20
0.3
0.2
0.22 18.55
0.13 18.30
7.6
7.4
10.4
10.1
1.0
0.6
1.2
1.0
0.85
0.40
mm
2.8
0.25
0.635
1.4
0.25
0.18
0.1
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
JEITA
99-12-27
03-02-18
SOT371-1
MO-118
Fig 8. Package outline SOT371-1 (SSOP56)
CBT16212_2
© NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 02 — 3 November 2008
9 of 12
CBT16212
NXP Semiconductors
24-bit bus exchange switch with 12-bit output enables
13. Abbreviations
Table 10. Abbreviations
Acronym
CDM
DUT
Description
Charged Device Model
Device Under Test
ESD
ElectroStatic Discharge
Human Body Model
HBM
TTL
Transistor-Transistor Logic
14. Revision history
Table 11. Revision history
Document ID
CBT16212_2
Modifications:
Release date
03112008
Data sheet status
Change notice
Supersedes
Product data sheet
-
CBT16212_1
• The format of this data sheet has been redesigned to comply with the new identity
guidelines of NXP Semiconductors.
• Legal texts have been adapted to the new company name where appropriate.
• Table 7 “Dynamic characteristics”:
–
Enable time: min value changed from 3.6 into 2.4.
–
Disable time: min value changed from 4.5 into 2.4.
CBT16212_1
20010928
Product data
-
-
CBT16212_2
© NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 02 — 3 November 2008
10 of 12
CBT16212
NXP Semiconductors
24-bit bus exchange switch with 12-bit output enables
15. Legal information
15.1 Data sheet status
Document status[1][2]
Product status[3]
Development
Definition
Objective [short] data sheet
This document contains data from the objective specification for product development.
This document contains data from the preliminary specification.
This document contains the product specification.
Preliminary [short] data sheet Qualification
Product [short] data sheet Production
[1]
[2]
[3]
Please consult the most recently issued document before initiating or completing a design.
The term ‘short data sheet’ is explained in section “Definitions”.
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
malfunction of an NXP Semiconductors product can reasonably be expected
15.2 Definitions
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.nxp.com/profile/terms, including those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between information in this document and such
terms and conditions, the latter will prevail.
15.3 Disclaimers
General — Information in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give any representations or
warranties, expressed or implied, as to the accuracy or completeness of such
information and shall have no liability for the consequences of use of such
information.
No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or the
grant, conveyance or implication of any license under any copyrights, patents
or other industrial or intellectual property rights.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
15.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
16. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
CBT16212_2
© NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 02 — 3 November 2008
11 of 12
CBT16212
NXP Semiconductors
24-bit bus exchange switch with 12-bit output enables
17. Contents
1
2
3
4
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Ordering information. . . . . . . . . . . . . . . . . . . . . 1
Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2
5
5.1
5.2
Pinning information. . . . . . . . . . . . . . . . . . . . . . 3
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3
6
Functional description . . . . . . . . . . . . . . . . . . . 4
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4
Recommended operating conditions. . . . . . . . 4
Static characteristics. . . . . . . . . . . . . . . . . . . . . 5
Dynamic characteristics . . . . . . . . . . . . . . . . . . 5
Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 8
Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 10
Revision history. . . . . . . . . . . . . . . . . . . . . . . . 10
7
8
9
10
11
12
13
14
15
Legal information. . . . . . . . . . . . . . . . . . . . . . . 11
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 11
Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 11
15.1
15.2
15.3
15.4
16
17
Contact information. . . . . . . . . . . . . . . . . . . . . 11
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2008.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 3 November 2008
Document identifier: CBT16212_2
相关型号：
CBT16212DL-T
IC CBT/FST/QS/5C/B SERIES, 12-BIT EXCHANGER, TRUE OUTPUT, PDSO56, 7.50 MM, PLASTIC, MO-118, SOT-371-1, SSOP-56, Bus Driver/Transceiver
NXP
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