CBT3244APW,118 [NXP]
CBT3244A - Octal bus switch with quad output enables TSSOP2 20-Pin;型号: | CBT3244APW,118 |
厂家: | NXP |
描述: | CBT3244A - Octal bus switch with quad output enables TSSOP2 20-Pin 驱动 光电二极管 逻辑集成电路 |
文件: | 总18页 (文件大小:98K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
CBT3244A
Octal bus switch with quad output enables
Rev. 02 — 15 September 2005
Product data sheet
1. General description
The CBT3244A provides eight bits of high-speed TTL-compatible bus switching in a
standard '244 device pinout. The low ON-state resistance of the switch allows connections
to be made with minimal propagation delay.
The CBT3244A device is organized as two 4-bit low-impedance switches with separate
output-enable (OE) inputs. When OE is LOW, the switch is on and data can flow from
port A to port B, or vice versa. When OE is HIGH, the switch is open and high-impedance
state exists between the two ports.
The CBT3244A is characterized for operation from −40 °C to +85 °C.
2. Features
■ Standard '244-type pinout
■ 5 Ω switch connection between two ports
■ TTL compatible control input levels
■ Package options include:
◆ plastic small outline (SO20)
◆ shrink small outline (SSOP20)
◆ shrink small outline, QSOP (SSOP20)
◆ thin shrink small outline (TSSOP20)
◆ depopulated heatsink very thin quad flat package, no leads (DHVQFN20)
■ Latch-up protection exceeds 500 mA per JESD78
■ ESD protection exceeds 2000 V HBM per JESD22-A114, 200 V MM per
JESD22-A115 and 1000 V CDM per JESD22-C101
CBT3244A
Philips Semiconductors
Octal bus switch with quad output enables
3. Ordering information
Table 1:
Ordering information
Tamb = −40 °C to +85 °C
Type number Topside
mark
Package
Name
Description
Version
CBT3244ABQ CT3244A
CBT3244APW CT3244A
DHVQFN20 plastic dual in-line compatible thermal enhanced very thin quad flat SOT764-1
package; no leads; 20 terminals; body 2.5 × 4.5 × 0.85 mm
TSSOP20
plastic thin shrink small outline package; 20 leads;
body width 4.4 mm
SOT360-1
CBT3244ADS CT3244ADS SSOP20[1] plastic shrink small outline package; 20 leads; body width 3.9 mm; SOT724-1
lead pitch 0.635 mm
CBT3244ADB CT3244A
SSOP20
plastic shrink small outline package; 20 leads; body width 5.3 mm SOT339-1
CBT3244AD
CBT3244AD SO20
plastic small outline package; 20 leads; body width 7.5 mm
SOT163-1
[1] Also known as QSOP20.
Standard packing quantities and other packaging data are available at
www.standardics.philips.com/packaging.
4. Functional diagram
CBT3244A
1A1
1A4
1B1
1B4
1OE
2A1
2B1
2B4
2A4
2OE
002aab655
Fig 1. Logic diagram of CBT3244A
9397 750 13362
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet
Rev. 02 — 15 September 2005
2 of 18
CBT3244A
Philips Semiconductors
Octal bus switch with quad output enables
5. Pinning information
5.1 Pinning
1
2
20
19
18
17
16
15
14
13
12
11
1
2
20
19
18
17
16
15
14
13
12
11
1OE
1A1
2B4
1A2
2B3
1A3
2B2
1A4
2B1
GND
V
1OE
1A1
2B4
1A2
2B3
1A3
2B2
1A4
2B1
GND
V
CC
CC
2OE
1B1
2A4
1B2
2A3
1B3
2A2
1B4
2A1
2OE
1B1
2A4
1B2
2A3
1B3
2A2
1B4
2A1
3
3
4
4
5
5
CBT3244APW
CBT3244AD
6
6
7
7
8
8
9
9
10
10
002aab651
002aab654
Fig 2. Pin configuration for TSSOP20
Fig 3. Pin configuration for SO20
1
2
20
19
18
17
16
15
14
13
12
11
1OE
1A1
2B4
1A2
2B3
1A3
2B2
1A4
2B1
GND
V
CC
2OE
1B1
2A4
1B2
2A3
1B3
2A2
1B4
2A1
1
2
20
19
18
17
16
15
14
13
12
11
1OE
1A1
2B4
1A2
2B3
1A3
2B2
1A4
2B1
GND
V
CC
3
2OE
1B1
2A4
1B2
2A3
1B3
2A2
1B4
2A1
4
3
5
4
CBT3244ADS
6
5
CBT3244ADB
7
6
8
7
9
8
10
9
10
002aab652
002aab653
Fig 4. Pin configuration for SSOP20
(QSOP)
Fig 5. Pin configuration for SSOP20
9397 750 13362
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet
Rev. 02 — 15 September 2005
3 of 18
CBT3244A
Philips Semiconductors
Octal bus switch with quad output enables
CBT3244ABQ
terminal 1
index area
2
3
4
5
6
7
8
9
19
18
17
16
15
14
13
12
1A1
2OE
1B1
2A4
1B2
2A3
1B3
2A2
1B4
2B4
1A2
2B3
1A3
2B2
1A4
2B1
(1)
GND
002aab650
Transparent top view
(1) The die substrate is attached to this pad using conductive die attach material. It cannot be
used as a supply pin or input.
Fig 6. Pin configuration for DHVQFN20
5.2 Pin description
Table 2:
Pin description
Symbol
Pin
Description
1OE
1
output enable (active LOW)
inputs
1A1, 1A2, 1A3, 1A4
2A1, 2A2, 2A3, 2A4
1B1, 1B2, 1B3, 1B4
2B1, 2B2, 2B3, 2B4
GND
2, 4, 6, 8
11, 13, 15, 17 inputs
18, 16, 14, 12 outputs
9, 7, 5, 3
outputs
10
19
20
ground (0 V)
2OE
output enable (active LOW)
positive supply voltage
VCC
9397 750 13362
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet
Rev. 02 — 15 September 2005
4 of 18
CBT3244A
Philips Semiconductors
Octal bus switch with quad output enables
6. Functional description
Refer to Figure 1 “Logic diagram of CBT3244A”.
6.1 Function table
Table 3:
Function selection
H = HIGH voltage level; L = LOW voltage level; Z = high-impedance OFF state
Inputs
Outputs
1An, 1Bn
1An = 1Bn
1An = 1Bn
Z
1OE
L
2OE
L
2An, 2Bn
2An = 2Bn
L
H
Z
H
L
2An = 2Bn
Z
H
H
Z
7. Limiting values
Table 4:
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134). [1]
Symbol Parameter
Conditions
Min
Max
+7.0
−18
Unit
V
VCC
IIK
supply voltage
−0.5
-
input clamping current
input voltage
VI < 0 V
mA
V
[2]
[2]
VI
−1.2
-
+7.0
−50
IOK
VO
IO
output clamping current VO < 0 V
mA
V
output voltage
output in OFF or HIGH state
output in LOW state
−0.5
-
+7.0
128
output current
mA
°C
Tstg
storage temperature
−65
+150
[1] The performance capability of a high-performance integrated circuit in conjunction with its thermal
environment can create junction temperatures which are detrimental to reliability. The maximum junction
temperature of this integrated circuit should not exceed 150 °C.
[2] The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
8. Recommended operating conditions
Table 5:
Operating conditions
Symbol Parameter
Conditions
Min
4.5
2.0
-
Typ
Max
5.5
-
Unit
V
VCC
VIH
supply voltage
-
-
-
-
HIGH-state input voltage
LOW-state input voltage
ambient temperature
V
VIL
0.8
+85
V
Tamb
operating in free-air
−40
°C
9397 750 13362
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet
Rev. 02 — 15 September 2005
5 of 18
CBT3244A
Philips Semiconductors
Octal bus switch with quad output enables
9. Static characteristics
Table 6:
Static characteristics
Tamb = −40 °C to +85 °C
Symbol Parameter
Conditions
Min
Typ [1] Max
Unit
V
VIK
ILI
input clamping voltage
VCC = 4.5 V; II = −18 mA
VCC = 5.5 V; VI = GND or 5.5 V
-
-
-
-
−1.2
±1
3
input leakage current
-
µA
µA
ICC
quiescent supply current
VCC = 5.5 V; IO = 0 mA;
VI = VCC or GND
1
[2]
∆ICC
additional quiescent supply current VCC = 5.5 V; one input at 3.4 V,
-
-
2.5
mA
(per input)
other inputs at VCC or GND
VI = 3 V or 0 V; nOE = VCC
nOE = VCC = 5.0 V
Ci
input capacitance (control pins)
input/output capacitance
ON-state resistance
-
-
-
-
-
3
3
4
4
8
-
pF
pF
Ω
Cio
-
[3]
Ron
VCC = 4.5 V; VI = 0 V; II = 64 mA
VCC = 4.5 V; VI = 0 V; II = 30 mA
VCC = 4.5 V; VI = 2.4 V; II = 15 mA
7
7
15
Ω
Ω
[1] All typical values are at VCC = 5 V; Tamb = 25 °C.
[2] This is the increase in supply current for each input that is at the specified TTL voltage level rather than VCC or GND.
[3] Measured by the voltage drop between the A and the B terminals at the indicated current through the switch. ON-state resistance is
determined by the lowest voltage of the two (A or B) terminals.
10. Dynamic characteristics
Table 7:
Dynamic characteristics
Tamb = −40 °C to +85 °C; VCC = 5.0 V ± 0.5 V; GND = 0 V; CL = 50 pF; unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
tPD
propagation delay[1]
from nAn input to nBn output, or
from nBn input to nAn output
-
-
0.25
ns
ten
enable time[2]
disable time[3]
from nOE input to nAn or nBn output
from nOE input to nAn or nBn output
1.0
1.0
-
-
5.6
6.0
ns
ns
tdis
[1] This parameter is warranted but not production tested. The propagation delay is based on the RC time constant of the typical ON-state
resistance of the switch and a load capacitance of 50 pF, when driven by an ideal voltage source (zero output impedance).
[2] Output enable time to HIGH and LOW level.
[3] Output disable time from HIGH and LOW level.
9397 750 13362
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet
Rev. 02 — 15 September 2005
6 of 18
CBT3244A
Philips Semiconductors
Octal bus switch with quad output enables
10.1 AC waveforms
VM = 1.5 V; VI = GND to 3.0 V
tPLZ and tPHZ are the same as tdis.
tPZL and tPZH are the same as ten.
tPLH and tPHL are the same as tPD
.
3.0 V
input
1.5 V
1.5 V
0 V
t
t
PHL
PLH
V
V
OH
OL
1.5 V
output
1.5 V
002aab665
Fig 7. Input to output propagation delays
3 V
0 V
output control
1.5 V
1.5 V
(LOW-level enabling)
t
t
PZL
PLZ
3.5 V
output
1.5 V
1.5 V
waveform 1
S1 at 7 V
V
V
+ 0.3 V
(1)
OL
OL
V
V
OL
t
t
PZH
PHZ
OH
output
− 0.3 V
waveform 2
(2)
S1 open
0 V
002aab666
(1) Waveform 1 is for an output with internal conditions such that the output is LOW except when
disabled by the output control.
(2) Waveform 2 is for an output with internal conditions such that the output is HIGH except when
disabled by the output control.
Fig 8. 3-state output enable and disable times
9397 750 13362
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet
Rev. 02 — 15 September 2005
7 of 18
CBT3244A
Philips Semiconductors
Octal bus switch with quad output enables
11. Test information
7 V
open
GND
500 Ω
S1
from output under test
C
50 pF
L
500 Ω
002aab667
Test data are given inTable 8.
All input pulses are supplied by generators having the following characteristics:
PRR ≤ 10 MHz; Zo = 50 Ω; tr ≤ 2.5 ns; tf ≤ 2.5 ns.
The outputs are measured one at a time with one transition per measurement.
CL = load capacitance includes jig and probe capacitance.
RL = load resistance.
Fig 9. Test circuit
Table 8:
Test
Test data
Load
CL
Switch
RL
tPD
50 pF
50 pF
50 pF
500 Ω
500 Ω
500 Ω
open
7 V
tPLZ/tPZL
tPHZ/tPZH
open
9397 750 13362
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet
Rev. 02 — 15 September 2005
8 of 18
CBT3244A
Philips Semiconductors
Octal bus switch with quad output enables
12. Package outline
DHVQFN20: plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads;
20 terminals; body 2.5 x 4.5 x 0.85 mm
SOT764-1
B
A
D
A
A
1
E
c
detail X
terminal 1
index area
C
terminal 1
index area
e
1
y
y
e
b
v
M
C
C
A
B
C
1
w
M
2
9
L
1
10
E
h
e
20
11
19
12
D
h
X
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
(1)
A
(1)
(1)
UNIT
A
b
c
E
e
e
1
y
D
D
E
L
v
w
y
1
1
h
h
max.
0.05 0.30
0.00 0.18
4.6
4.4
3.15
2.85
2.6
2.4
1.15
0.85
0.5
0.3
mm
0.05
0.1
1
0.2
0.5
3.5
0.1
0.05
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
JEITA
02-10-17
03-01-27
SOT764-1
- - -
MO-241
- - -
Fig 10. Package outline SOT764-1 (DHVQFN20)
9397 750 13362
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet
Rev. 02 — 15 September 2005
9 of 18
CBT3244A
Philips Semiconductors
Octal bus switch with quad output enables
TSSOP20: plastic thin shrink small outline package; 20 leads; body width 4.4 mm
SOT360-1
D
E
A
X
c
H
v
M
A
y
E
Z
11
20
Q
A
2
(A )
3
A
A
1
pin 1 index
θ
L
p
L
1
10
detail X
w
M
b
p
e
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
A
(1)
(2)
(1)
UNIT
A
A
A
b
c
D
E
e
H
L
L
Q
v
w
y
Z
θ
1
2
3
p
E
p
max.
8o
0o
0.15
0.05
0.95
0.80
0.30
0.19
0.2
0.1
6.6
6.4
4.5
4.3
6.6
6.2
0.75
0.50
0.4
0.3
0.5
0.2
mm
1.1
0.65
0.25
1
0.2
0.13
0.1
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
JEITA
99-12-27
03-02-19
SOT360-1
MO-153
Fig 11. Package outline SOT360-1 (TSSOP20)
9397 750 13362
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet
Rev. 02 — 15 September 2005
10 of 18
CBT3244A
Philips Semiconductors
Octal bus switch with quad output enables
SSOP20: plastic shrink small outline package; 20 leads; body width 3.9 mm; lead pitch 0.635 mm
SOT724-1
D
E
A
X
c
y
H
v
M
A
E
Z
11
20
A
2
A
(A )
3
A
1
θ
L
p
L
10
1
detail X
1/2 e
w
M
e
b
p
0
2.5
scale
5 mm
DIMENSIONS (millimetre dimensions are derived from the original inch dimensions)
A
(1)
(1)
(1)
UNIT
A
A
A
b
c
D
E
e
H
L
L
p
v
w
y
Z
θ
1
2
3
p
E
max.
8o
0o
0.25
0.10
1.55
1.40
0.31
0.20
0.25
0.18
8.8
8.6
4.0
3.8
6.2
5.8
0.89
0.41
1.67
1.28
mm
1.73
0.25
0.635
1
0.25
0.18
0.1
Note
1. Plastic or metal protrusions of 0.2 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
JEITA
01-07-04
03-02-18
SOT724-1
MO-137
Fig 12. Package outline SOT724-1 (SSOP20) (QSOP20)
9397 750 13362
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet
Rev. 02 — 15 September 2005
11 of 18
CBT3244A
Philips Semiconductors
Octal bus switch with quad output enables
SSOP20: plastic shrink small outline package; 20 leads; body width 5.3 mm
SOT339-1
D
E
A
X
v
c
H
M
A
y
E
Z
20
11
Q
A
2
A
(A )
3
A
1
pin 1 index
θ
L
p
L
1
10
detail X
w
M
b
p
e
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
A
(1)
(1)
(1)
UNIT
A
A
A
b
c
D
E
e
H
L
L
Q
v
w
y
Z
θ
1
2
3
p
E
p
max.
8o
0o
0.21
0.05
1.80
1.65
0.38
0.25
0.20
0.09
7.4
7.0
5.4
5.2
7.9
7.6
1.03
0.63
0.9
0.7
0.9
0.5
mm
2
0.65
0.25
1.25
0.2
0.13
0.1
Note
1. Plastic or metal protrusions of 0.2 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
JEITA
99-12-27
03-02-19
SOT339-1
MO-150
Fig 13. Package outline SOT339-1 (SSOP20)
9397 750 13362
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet
Rev. 02 — 15 September 2005
12 of 18
CBT3244A
Philips Semiconductors
Octal bus switch with quad output enables
SO20: plastic small outline package; 20 leads; body width 7.5 mm
SOT163-1
D
E
A
X
c
y
H
E
v
M
A
Z
20
11
Q
A
2
A
(A )
3
A
1
pin 1 index
θ
L
p
L
1
10
w
detail X
e
M
b
p
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
A
max.
(1)
(1)
(1)
UNIT
mm
A
A
A
b
c
D
E
e
H
L
L
Q
v
w
y
θ
1
2
3
p
E
p
Z
0.3
0.1
2.45
2.25
0.49
0.36
0.32
0.23
13.0
12.6
7.6
7.4
10.65
10.00
1.1
0.4
1.1
1.0
0.9
0.4
2.65
0.1
0.25
0.01
1.27
0.05
1.4
0.25
0.01
0.25
0.1
8o
0o
0.012 0.096
0.004 0.089
0.019 0.013 0.51
0.014 0.009 0.49
0.30
0.29
0.419
0.394
0.043 0.043
0.016 0.039
0.035
0.016
inches
0.055
0.01 0.004
Note
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
JEITA
99-12-27
03-02-19
SOT163-1
075E04
MS-013
Fig 14. Package outline SOT163-1 (SO20)
9397 750 13362
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet
Rev. 02 — 15 September 2005
13 of 18
CBT3244A
Philips Semiconductors
Octal bus switch with quad output enables
13. Soldering
13.1 Introduction to soldering surface mount packages
This text gives a very brief insight to a complex technology. A more in-depth account of
soldering ICs can be found in our Data Handbook IC26; Integrated Circuit Packages
(document order number 9398 652 90011).
There is no soldering method that is ideal for all surface mount IC packages. Wave
soldering can still be used for certain surface mount ICs, but it is not suitable for fine pitch
SMDs. In these situations reflow soldering is recommended.
13.2 Reflow soldering
Reflow soldering requires solder paste (a suspension of fine solder particles, flux and
binding agent) to be applied to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement. Driven by legislation and
environmental forces the worldwide use of lead-free solder pastes is increasing.
Several methods exist for reflowing; for example, convection or convection/infrared
heating in a conveyor type oven. Throughput times (preheating, soldering and cooling)
vary between 100 seconds and 200 seconds depending on heating method.
Typical reflow peak temperatures range from 215 °C to 270 °C depending on solder paste
material. The top-surface temperature of the packages should preferably be kept:
• below 225 °C (SnPb process) or below 245 °C (Pb-free process)
– for all BGA, HTSSON..T and SSOP..T packages
– for packages with a thickness ≥ 2.5 mm
– for packages with a thickness < 2.5 mm and a volume ≥ 350 mm3 so called
thick/large packages.
• below 240 °C (SnPb process) or below 260 °C (Pb-free process) for packages with a
thickness < 2.5 mm and a volume < 350 mm3 so called small/thin packages.
Moisture sensitivity precautions, as indicated on packing, must be respected at all times.
13.3 Wave soldering
Conventional single wave soldering is not recommended for surface mount devices
(SMDs) or printed-circuit boards with a high component density, as solder bridging and
non-wetting can present major problems.
To overcome these problems the double-wave soldering method was specifically
developed.
If wave soldering is used the following conditions must be observed for optimal results:
• Use a double-wave soldering method comprising a turbulent wave with high upward
pressure followed by a smooth laminar wave.
• For packages with leads on two sides and a pitch (e):
– larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be
parallel to the transport direction of the printed-circuit board;
9397 750 13362
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet
Rev. 02 — 15 September 2005
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– smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the
transport direction of the printed-circuit board.
The footprint must incorporate solder thieves at the downstream end.
• For packages with leads on four sides, the footprint must be placed at a 45° angle to
the transport direction of the printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.
During placement and before soldering, the package must be fixed with a droplet of
adhesive. The adhesive can be applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the adhesive is cured.
Typical dwell time of the leads in the wave ranges from 3 seconds to 4 seconds at 250 °C
or 265 °C, depending on solder material applied, SnPb or Pb-free respectively.
A mildly-activated flux will eliminate the need for removal of corrosive residues in most
applications.
13.4 Manual soldering
Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage
(24 V or less) soldering iron applied to the flat part of the lead. Contact time must be
limited to 10 seconds at up to 300 °C.
When using a dedicated tool, all other leads can be soldered in one operation within
2 seconds to 5 seconds between 270 °C and 320 °C.
13.5 Package related soldering information
Table 9:
Package [1]
Suitability of surface mount IC packages for wave and reflow soldering methods
Soldering method
Wave
Reflow[2]
BGA, HTSSON..T[3], LBGA, LFBGA, SQFP,
SSOP..T[3], TFBGA, VFBGA, XSON
not suitable
suitable
DHVQFN, HBCC, HBGA, HLQFP, HSO, HSOP,
HSQFP, HSSON, HTQFP, HTSSOP, HVQFN,
HVSON, SMS
not suitable[4]
suitable
PLCC[5], SO, SOJ
suitable
suitable
LQFP, QFP, TQFP
not recommended[5] [6]
not recommended[7]
not suitable
suitable
SSOP, TSSOP, VSO, VSSOP
CWQCCN..L[8], PMFP[9], WQCCN..L[8]
suitable
not suitable
[1] For more detailed information on the BGA packages refer to the (LF)BGA Application Note (AN01026);
order a copy from your Philips Semiconductors sales office.
[2] All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the
maximum temperature (with respect to time) and body size of the package, there is a risk that internal or
external package cracks may occur due to vaporization of the moisture in them (the so called popcorn
effect). For details, refer to the Drypack information in the Data Handbook IC26; Integrated Circuit
Packages; Section: Packing Methods.
[3] These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no
account be processed through more than one soldering cycle or subjected to infrared reflow soldering with
peak temperature exceeding 217 °C ± 10 °C measured in the atmosphere of the reflow oven. The package
body peak temperature must be kept as low as possible.
9397 750 13362
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet
Rev. 02 — 15 September 2005
15 of 18
CBT3244A
Philips Semiconductors
Octal bus switch with quad output enables
[4] These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the
solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink
on the top side, the solder might be deposited on the heatsink surface.
[5] If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
[6] Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
[7] Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger
than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
[8] Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered
pre-mounted on flex foil. However, the image sensor package can be mounted by the client on a flex foil by
using a hot bar soldering process. The appropriate soldering profile can be provided on request.
[9] Hot bar soldering or manual soldering is suitable for PMFP packages.
14. Abbreviations
Table 10: Abbreviations
Acronym
CDM
ESD
Description
Charged Device Model
ElectroStatic Discharge
Human Body Model
Machine Model
HBM
MM
PRR
Pulse Rate Repetition
Transistor-Transistor Logic
TTL
15. Revision history
Table 11: Revision history
Document ID
CBT3244_2
Release date Data sheet status
20050915 Product data sheet
Change notice Doc. number
Supersedes
-
9397 750 13362 CBT3244A_1
Modifications:
• The format of this data sheet has been redesigned to comply with the new presentation and
information standard of Philips Semiconductors.
• added DHVQFN20 package option (affects Section 2 “Features”, Section 3 “Ordering
information”, Section 5 “Pinning information”, and Section 12 “Package outline”
• Section 2 “Features” on page 1, 6th bullet: changed from ‘exceeds 1000 V HBM ...’ to ‘exceeds
2000 V HBM ...’
• added Section 14 “Abbreviations” on page 16
CBT3244A_1
20040526
Product data sheet
-
9397 750 13281
-
9397 750 13362
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet
Rev. 02 — 15 September 2005
16 of 18
CBT3244A
Philips Semiconductors
Octal bus switch with quad output enables
16. Data sheet status
Level Data sheet status[1] Product status[2] [3]
Definition
I
Objective data
Development
This data sheet contains data from the objective specification for product development. Philips
Semiconductors reserves the right to change the specification in any manner without notice.
II
Preliminary data
Qualification
This data sheet contains data from the preliminary specification. Supplementary data will be published
at a later date. Philips Semiconductors reserves the right to change the specification without notice, in
order to improve the design and supply the best possible product.
III
Product data
Production
This data sheet contains data from the product specification. Philips Semiconductors reserves the
right to make changes at any time in order to improve the design, manufacturing and supply. Relevant
changes will be communicated via a Customer Product/Process Change Notification (CPCN).
[1]
[2]
Please consult the most recently issued data sheet before initiating or completing a design.
The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at
URL http://www.semiconductors.philips.com.
[3]
For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.
customers using or selling these products for use in such applications do so
at their own risk and agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.
17. Definitions
Short-form specification — The data in a short-form specification is
extracted from a full data sheet with the same type number and title. For
detailed information see the relevant data sheet or data handbook.
Right to make changes — Philips Semiconductors reserves the right to
make changes in the products - including circuits, standard cells, and/or
software - described or contained herein in order to improve design and/or
performance. When the product is in full production (status ‘Production’),
relevant changes will be communicated via a Customer Product/Process
Change Notification (CPCN). Philips Semiconductors assumes no
responsibility or liability for the use of any of these products, conveys no
license or title under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that these products are
free from patent, copyright, or mask work right infringement, unless otherwise
specified.
Limiting values definition — Limiting values given are in accordance with
the Absolute Maximum Rating System (IEC 60134). Stress above one or
more of the limiting values may cause permanent damage to the device.
These are stress ratings only and operation of the device at these or at any
other conditions above those given in the Characteristics sections of the
specification is not implied. Exposure to limiting values for extended periods
may affect device reliability.
Application information — Applications that are described herein for any
of these products are for illustrative purposes only. Philips Semiconductors
make no representation or warranty that such applications will be suitable for
the specified use without further testing or modification.
19. Trademarks
Notice — All referenced brands, product names, service names and
18. Disclaimers
trademarks are the property of their respective owners.
Life support — These products are not designed for use in life support
appliances, devices, or systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips Semiconductors
20. Contact information
For additional information, please visit: http://www.semiconductors.philips.com
For sales office addresses, send an email to: sales.addresses@www.semiconductors.philips.com
9397 750 13362
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet
Rev. 02 — 15 September 2005
17 of 18
CBT3244A
Philips Semiconductors
Octal bus switch with quad output enables
21. Contents
1
2
3
4
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Ordering information. . . . . . . . . . . . . . . . . . . . . 2
Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2
5
5.1
5.2
Pinning information. . . . . . . . . . . . . . . . . . . . . . 3
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4
6
6.1
7
Functional description . . . . . . . . . . . . . . . . . . . 5
Function table . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 5
Recommended operating conditions. . . . . . . . 5
Static characteristics. . . . . . . . . . . . . . . . . . . . . 6
Dynamic characteristics . . . . . . . . . . . . . . . . . . 6
AC waveforms. . . . . . . . . . . . . . . . . . . . . . . . . . 7
Test information. . . . . . . . . . . . . . . . . . . . . . . . . 8
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9
8
9
10
10.1
11
12
13
13.1
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Introduction to soldering surface mount
packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 14
Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 14
Manual soldering . . . . . . . . . . . . . . . . . . . . . . 15
Package related soldering information . . . . . . 15
13.2
13.3
13.4
13.5
14
15
16
17
18
19
20
Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 16
Revision history. . . . . . . . . . . . . . . . . . . . . . . . 16
Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 17
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Contact information . . . . . . . . . . . . . . . . . . . . 17
© Koninklijke Philips Electronics N.V. 2005
All rights are reserved. Reproduction in whole or in part is prohibited without the prior
written consent of the copyright owner. The information presented in this document does
not form part of any quotation or contract, is believed to be accurate and reliable and may
be changed without notice. No liability will be accepted by the publisher for any
consequence of its use. Publication thereof does not convey nor imply any license under
patent- or other industrial or intellectual property rights.
Date of release: 15 September 2005
Document number: 9397 750 13362
Published in The Netherlands
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