CBT3251DB,118 [NXP]
CBT3251 - 1-of-8 FET multiplexer/demultiplexer SSOP1 16-Pin;型号: | CBT3251DB,118 |
厂家: | NXP |
描述: | CBT3251 - 1-of-8 FET multiplexer/demultiplexer SSOP1 16-Pin 光电二极管 |
文件: | 总15页 (文件大小:117K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
CBT3251
1-of-8 FET multiplexer/demultiplexer
Rev. 2 — 16 September 2013
Product data sheet
1. General description
The CBT3251 is a 1-of-8 high-speed TTL-compatible FET multiplexer/demultiplexer. The
low ON-resistance of the switch allows inputs to be connected to outputs without adding
propagation delay or generating additional ground bounce noise.
When output enable (OE) is LOW, the CBT3251 is enabled. S0, S1 and S2 select one of
the Bn outputs for the A input data.
The CBT3251 is characterized for operation from 40 C to +85 C.
2. Features and benefits
5 switch connection between two ports
TTL-compatible input levels
Minimal propagation delay through the switch
Latch-up protection exceeds 100 mA per JEDEC standard JESD78 class II level A
ESD protection:
HBM JESD22-A114E exceeds 2000 V
MM JESD22-A115-A exceeds 200 V
CDM JESD22-C101C exceeds 1000 V
Multiple package options
Specified from 40 C to +85 C
3. Ordering information
Table 1.
Ordering information
Type number
Temperature range Package
Name
Description
Version
CBT3251D
40 C to +85 C
40 C to +85 C
40 C to +85 C
40 C to +85 C
SO16
plastic small outline package; 16 leads;
body width 3.9 mm
SOT109-1
CBT3251DB
CBT3251DS
CBT3251PW
SSOP16
SSOP16[1]
TSSOP16
plastic shrink small outline package; 16 leads;
body width 5.3 mm
SOT338-1
SOT519-1
plastic shrink small outline package; 16 leads;
body width 3.9 mm; lead pitch 0.635 mm
plastic thin shrink small outline package; 16 leads; SOT403-1
body width 4.4 mm
[1] Also known as QSOP16.
CBT3251
NXP Semiconductors
1-of-8 FET multiplexer/demultiplexer
4. Functional diagram
5
4
A
B1
3
B2
2
B3
1
B4
15
B5
14
B6
13
B7
12
B8
7
OE
11
S0
10
S1
9
S2
002aab820
Fig 1. Logic diagram
CBT3251
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© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 2 — 16 September 2013
2 of 15
CBT3251
NXP Semiconductors
1-of-8 FET multiplexer/demultiplexer
5. Pinning information
5.1 Pinning
CBT3251
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
B4
B3
V
CC
B5
B6
B7
B8
S0
S1
S2
CBT3251
B2
1
2
3
4
5
6
7
8
16
15
14
13
B4
B3
V
CC
B5
B6
B7
B1
B2
A
B1
12 B8
n.c.
OE
GND
A
11
10
9
n.c.
OE
GND
S0
S1
S2
002aab816
002aab819
Fig 2. Pin configuration SOT109-1 (SO16) and
SOT519-1 (SSOP16)
Fig 3. Pin configuration SOT338-1 (SSOP16) and
SOT403-1 (TSSOP16)
5.2 Pin description
Table 2.
Symbol
Pin description
Pin
Description
B1, B2, B3, B4, B5, B6, B7, B8 1, 2, 3, 4, 12, 13, 14, 15
B outputs/inputs
A input/output
A
5
n.c.
6
not connected
OE
7
output enable (active LOW)
select control input
ground (0 V)
S2, S1, S0
GND
VCC
9, 10, 11
8
16
positive supply voltage
CBT3251
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© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 2 — 16 September 2013
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CBT3251
NXP Semiconductors
1-of-8 FET multiplexer/demultiplexer
6. Functional description
Table 3.
Function selection
H = HIGH voltage level; L = LOW voltage level; X = Don’t care.
Inputs
Switch
OE
L
S2
L
S1
L
S0
L
A to B1
A to B2
A to B3
A to B4
A to B5
A to B6
A to B7
A to B8
switch off
L
L
L
H
L
L
L
H
H
L
L
L
H
L
L
H
H
H
H
X
L
L
H
L
L
H
H
X
L
H
X
H
7. Limiting values
Table 4.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter
Conditions
Min
0.5
0.5
-
Max
+7.0
+7.0
128
Unit
V
VCC
VI
supply voltage
[1]
input voltage
V
ISW
IIK
switch current
continuous current through each switch
VI < 0 V
mA
mA
C
input clamping current
storage temperature
total power dissipation
50
65
Tstg
Ptot
+150
Tamb = 40 C to +85 C
SO16 package
[2]
[3]
[3]
-
-
-
500
500
500
mW
mW
mW
SSOP16 package
TSSOP16 package
[1] The input and output negative voltage ratings may be exceeded if the input and output clamp current ratings are observed.
[2] For SO16 package: Ptot derates linearly with 8 mW/K above 70 C.
[3] For SSOP16 and TSSOP16 package: Ptot derates linearly with 5.5 mW/K above 70 C.
8. Recommended operating conditions
Table 5.
Operating conditions
All unused control inputs of the device must be held at VCC or GND to ensure proper device operation.
Symbol
VCC
Parameter
Conditions
Min
4.5
2.0
-
Max
5.5
-
Unit
supply voltage
V
VIH
HIGH-level input voltage
LOW-level input voltage
ambient temperature
V
VIL
0.8
+85
V
Tamb
operating in free-air
40
C
CBT3251
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Product data sheet
Rev. 2 — 16 September 2013
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CBT3251
NXP Semiconductors
1-of-8 FET multiplexer/demultiplexer
9. Static characteristics
Table 6.
Static characteristics
Tamb = 40 C to +85 C.
Symbol
Parameter
Conditions
Min
Typ
Max
1.2
4.2
1
Unit
V
VIK
Vpass
II
input clamping voltage
pass voltage
VCC = 4.5 V; II = 18 mA
VI = VCC = 5.0 V; IO = 100 A
VCC = 5.5 V; VI = GND or 5.5 V
-
-
[1]
[3]
3.6
3.9
V
input leakage current
supply current
-
-
-
-
A
A
ICC
VCC = 5.5 V; IO = 0 mA;
VI = VCC or GND
3
ICC
additional supply current
input capacitance
per input; VCC = 5.5 V; one input at
3.4 V, other inputs at VCC or GND
-
-
2.5
mA
[1]
[1]
[1]
[4]
[2]
[4]
[1]
[1]
[1]
CI
control pins; VI = 3 V or 0 V
-
-
-
3.5
-
-
-
pF
pF
pF
Cio(off)
off-state input/output capacitance A port; VO = 3 V or 0 V; OE = VCC
B port; VO = 3 V or 0 V; OE = VCC
17.5
4.0
RON
ON resistance
VCC = 4 V
VI = 2.4 V; II = 15 mA
VCC = 4.5 V
-
5
20
VI = 0 V; II = 64 mA
VI = 0 V; II = 30 mA
VI = 2.4 V; II = 15 mA
-
-
-
5
7
5
7
10
15
[1] Typical value is measured at VCC = 5 V; Tamb = 25 C.
[2] Typical value is measured at VCC = 4 V; Tamb = 25 C.
[3] This is the increase in supply current for each input that is at the specified TTL voltage level rather than VCC or GND.
[4] Measured by the voltage drop between the A and the Bn terminals at the indicated current through the switch. The lowest voltage of the
two (A or Bn) terminals determines the ON resistance.
10. Dynamic characteristics
Table 7.
Dynamic characteristics
Tamb = 40 C to +85 C; VCC = 4.5 V to 5.5 V; for test circuit, see Figure 6.
Symbol
Parameter
Conditions
Min
-
Max
0.25
5.5
Unit
ns
[1][2]
[1][2]
[2]
tpd
propagation delay
A to Bn or Bn to A; see Figure 4
Sn to A; see Figure 4
1.5
1.5
1.6
1.9
2.3
ns
ten
enable time
disable time
OE to A or Bn; see Figure 5
Sn to Bn; see Figure 5
OE to A or Bn; see Figure 5
Sn to Bn; see Figure 5
5.6
ns
[2]
5.8
ns
[2]
tdis
6.4
ns
[2]
6.2
ns
[1] This parameter is warranted but not production tested. The propagation delay is based on the RC time constant of the typical ON
resistance of the switch and a load capacitance, when driven by an ideal voltage source (zero output impedance).
[2]
t
PLH and tPHL are the same as tpd
.
tPZL and tPZH are the same as ten
.
tPLZ and tPHZ are the same as tdis
.
CBT3251
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© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 2 — 16 September 2013
5 of 15
CBT3251
NXP Semiconductors
1-of-8 FET multiplexer/demultiplexer
11. AC waveforms
V
I
V
V
M
input
0 V
M
t
t
PLH
PHL
V
OH
V
V
M
output
M
V
OL
001aai367
Measurement points are given in Table 8.
VOL and VOH are typical voltage output levels that occur with the output load.
Fig 4. The input (A; Bn) to output (Bn; A) or input (Sn) to output (A) propagation delay times
V
I
V
V
M
OE, Sn input
M
GND
t
t
PZL
PLZ
V
CC
output
LOW-to-OFF
OFF-to-LOW
V
M
V
X
V
OL
t
t
PZH
PHZ
V
OH
V
Y
output
HIGH-to-OFF
OFF-to-HIGH
V
M
GND
switch
enabled
switch
disabled
switch
enabled
001aan455
Measurement points are given in Table 8.
OL and VOH are typical voltage output levels that occur with the output load.
V
Fig 5. Enable and disable times
Table 8. Measurement points
Supply voltage
VCC
Input
Output
VM
VI
VM
VX
VOL + 0.3 V
VY
4.5 V to 5.5 V
GND to 3.0 V
1.5 V
1.5 V
VOH 0.3 V
CBT3251
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© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 2 — 16 September 2013
6 of 15
CBT3251
NXP Semiconductors
1-of-8 FET multiplexer/demultiplexer
12. Test information
t
W
V
I
90 %
negative
pulse
V
V
V
M
M
10 %
0 V
t
t
r
f
t
t
f
r
V
I
90 %
positive
pulse
V
M
M
10 %
0 V
t
W
V
EXT
V
CC
R
L
V
V
O
I
G
DUT
R
T
C
L
R
L
001aae331
Test data is given in Table 9.
Definitions for test circuit:
RL = Load resistance.
CL = Load capacitance including jig and probe capacitance.
RT = Termination resistance should be equal to the output impedance Zo of the pulse generator.
VEXT = External voltage for measuring switching times.
Fig 6. Test circuit for measuring switching times
Table 9.
Test data
Supply voltage Input
Load
CL
VEXT
VCC
VI
tr, tf
RL
tPLH, tPHL
open
tPLZ, tPZL
tPHZ, tPZH
4.5 V to 5.5 V
GND to 3.0 V
2.5 ns
50 pF
500
7.0 V
open
CBT3251
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© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 2 — 16 September 2013
7 of 15
CBT3251
NXP Semiconductors
1-of-8 FET multiplexer/demultiplexer
13. Package outline
SO16: plastic small outline package; 16 leads; body width 3.9 mm
SOT109-1
D
E
A
X
v
c
y
H
M
A
E
Z
16
9
Q
A
2
A
(A )
3
A
1
pin 1 index
θ
L
p
L
1
8
e
w
M
detail X
b
p
0
2.5
scale
5 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
A
(1)
(1)
(1)
UNIT
A
A
A
b
c
D
E
e
H
L
L
p
Q
v
w
y
Z
θ
1
2
3
p
E
max.
0.25
0.10
1.45
1.25
0.49
0.36
0.25
0.19
10.0
9.8
4.0
3.8
6.2
5.8
1.0
0.4
0.7
0.6
0.7
0.3
mm
1.27
0.05
1.05
0.041
1.75
0.25
0.01
0.25
0.01
0.25
0.1
8o
0o
0.010 0.057
0.004 0.049
0.019 0.0100 0.39
0.014 0.0075 0.38
0.16
0.15
0.244
0.228
0.039 0.028
0.016 0.020
0.028
0.012
inches
0.069
0.01 0.004
Note
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
JEITA
99-12-27
03-02-19
SOT109-1
076E07
MS-012
Fig 7. Package outline SOT109-1 (SO16)
CBT3251
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© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 2 — 16 September 2013
8 of 15
CBT3251
NXP Semiconductors
1-of-8 FET multiplexer/demultiplexer
SSOP16: plastic shrink small outline package; 16 leads; body width 5.3 mm
SOT338-1
D
E
A
X
c
y
H
v
M
A
E
Z
9
16
Q
A
2
A
(A )
3
A
1
pin 1 index
θ
L
p
L
8
1
detail X
w
M
b
p
e
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
A
(1)
(1)
(1)
UNIT
A
A
A
b
c
D
E
e
H
L
L
Q
v
w
y
Z
θ
p
p
1
2
3
E
max.
8o
0o
0.21
0.05
1.80
1.65
0.38
0.25
0.20
0.09
6.4
6.0
5.4
5.2
7.9
7.6
1.03
0.63
0.9
0.7
1.00
0.55
mm
2
0.25
0.65
1.25
0.2
0.13
0.1
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
JEITA
99-12-27
03-02-19
SOT338-1
MO-150
Fig 8. Package outline SOT338-1 (SSOP16)
CBT3251
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© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 2 — 16 September 2013
9 of 15
CBT3251
NXP Semiconductors
1-of-8 FET multiplexer/demultiplexer
SSOP16: plastic shrink small outline package; 16 leads; body width 3.9 mm; lead pitch 0.635 mm
SOT519-1
D
E
A
X
c
y
H
v
M
A
E
Z
9
16
A
2
A
(A )
3
A
1
θ
L
p
L
8
1
detail X
w
M
e
b
p
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
A
(1)
(1)
(1)
UNIT
A
A
A
b
c
D
E
e
H
L
L
v
w
y
Z
θ
p
p
1
2
3
E
max.
8o
0o
0.25
0.10
1.55
1.40
0.31
0.20
0.25
0.18
5.0
4.8
4.0
3.8
6.2
5.8
0.89
0.41
0.18
0.05
mm
1.73
0.25
0.635
1
0.2
0.18
0.09
Note
1. Plastic or metal protrusions of 0.2 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
JEITA
99-05-04
03-02-18
SOT519-1
Fig 9. Package outline SOT519-1 (SSOP16)
CBT3251
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© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 2 — 16 September 2013
10 of 15
CBT3251
NXP Semiconductors
1-of-8 FET multiplexer/demultiplexer
TSSOP16: plastic thin shrink small outline package; 16 leads; body width 4.4 mm
SOT403-1
D
E
A
X
c
y
H
v
M
A
E
Z
9
16
Q
(A )
3
A
2
A
A
1
pin 1 index
θ
L
p
L
1
8
detail X
w
M
b
p
e
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
A
(1)
(2)
(1)
UNIT
A
A
A
b
c
D
E
e
H
L
L
Q
v
w
y
Z
θ
1
2
3
p
E
p
max.
8o
0o
0.15
0.05
0.95
0.80
0.30
0.19
0.2
0.1
5.1
4.9
4.5
4.3
6.6
6.2
0.75
0.50
0.4
0.3
0.40
0.06
mm
1.1
0.65
0.25
1
0.2
0.13
0.1
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
JEITA
99-12-27
03-02-18
SOT403-1
MO-153
Fig 10. Package outline SOT403-1 (TSSOP16)
CBT3251
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© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 2 — 16 September 2013
11 of 15
CBT3251
NXP Semiconductors
1-of-8 FET multiplexer/demultiplexer
14. Abbreviations
Table 10. Abbreviations
Acronym
CDM
ESD
Description
Charged Device Model
ElectroStatic Discharge
Human Body Model
Machine Model
HBM
MM
TTL
Transistor-Transistor Logic
15. Revision history
Table 11. Revision history
Document ID
CBT3251 v.2
Modifications:
Release date
20130916
Data sheet status
Change notice
Supersedes
Product data sheet
-
CBT3251 v.1
• The format of this data sheet has been redesigned to comply with the new identity guidelines of
NXP Semiconductors.
• Legal texts have been adapted to the new company name where appropriate.
• Table 6 pass voltage modified.
CBT3251 v.1
20051221
Product data sheet
-
-
CBT3251
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 2 — 16 September 2013
12 of 15
CBT3251
NXP Semiconductors
1-of-8 FET multiplexer/demultiplexer
16. Legal information
16.1 Data sheet status
Document status[1][2]
Product status[3]
Development
Definition
Objective [short] data sheet
This document contains data from the objective specification for product development.
This document contains data from the preliminary specification.
This document contains the product specification.
Preliminary [short] data sheet Qualification
Product [short] data sheet Production
[1]
[2]
[3]
Please consult the most recently issued document before initiating or completing a design.
The term ‘short data sheet’ is explained in section “Definitions”.
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
Suitability for use — NXP Semiconductors products are not designed,
16.2 Definitions
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer’s own
risk.
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
16.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
CBT3251
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 2 — 16 September 2013
13 of 15
CBT3251
NXP Semiconductors
1-of-8 FET multiplexer/demultiplexer
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
Translations — A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
16.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
17. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
CBT3251
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 2 — 16 September 2013
14 of 15
CBT3251
NXP Semiconductors
1-of-8 FET multiplexer/demultiplexer
18. Contents
1
2
3
4
General description. . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Ordering information. . . . . . . . . . . . . . . . . . . . . 1
Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2
5
5.1
5.2
Pinning information. . . . . . . . . . . . . . . . . . . . . . 3
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3
6
Functional description . . . . . . . . . . . . . . . . . . . 4
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4
Recommended operating conditions. . . . . . . . 4
Static characteristics. . . . . . . . . . . . . . . . . . . . . 5
Dynamic characteristics . . . . . . . . . . . . . . . . . . 5
AC waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Test information. . . . . . . . . . . . . . . . . . . . . . . . . 7
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 8
Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 12
Revision history. . . . . . . . . . . . . . . . . . . . . . . . 12
7
8
9
10
11
12
13
14
15
16
Legal information. . . . . . . . . . . . . . . . . . . . . . . 13
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 13
Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 14
16.1
16.2
16.3
16.4
17
18
Contact information. . . . . . . . . . . . . . . . . . . . . 14
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2013.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 16 September 2013
Document identifier: CBT3251
相关型号:
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