CBT3257AD,118 [NXP]

CBT3257A - Quad 1-of-2 multiplexer/demultiplexer SOP 16-Pin;
CBT3257AD,118
型号: CBT3257AD,118
厂家: NXP    NXP
描述:

CBT3257A - Quad 1-of-2 multiplexer/demultiplexer SOP 16-Pin

光电二极管 逻辑集成电路
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CBT3257A  
Quad 1-of-2 multiplexer/demultiplexer  
Rev. 5 — 4 April 2013  
Product data sheet  
1. General description  
The CBT3257A is a quad 1-of-2 high-speed TTL-compatible multiplexer/demultiplexer.  
The low ON resistance of the switch allows inputs to be connected to outputs without  
adding propagation delay or generating additional ground bounce noise.  
Output enable (OE) and select-control (S) inputs select the appropriate nB1 and nB2  
outputs for the nA input data.  
The CBT3257A is characterized for operation from 40 C to +85 C.  
2. Features and benefits  
5 switch connection between two ports  
TTL-compatible input levels  
Minimal propagation delay through the switch  
Latch-up protection exceeds 100 mA per JEDEC standard JESD78 class II level A  
ESD protection:  
HBM JESD22-A114F exceeds 2000 V  
MM JESD22-A115-A exceeds 200 V  
CDM JESD22-C101E exceeds 1000 V  
Multiple package options  
Specified from 40 C to +85 C  
 
 
CBT3257A  
NXP Semiconductors  
Quad 1-of-2 multiplexer/demultiplexer  
3. Ordering information  
Table 1.  
Ordering information  
Type number  
Temperature range Package  
Name  
Description  
Version  
CBT3257AD  
40 C to +85 C  
40 C to +85 C  
40 C to +85 C  
40 C to +85 C  
40 C to +85 C  
SO16  
plastic small outline package; 16 leads;  
body width 3.9 mm  
SOT109-1  
SOT338-1  
SOT519-1  
CBT3257ADB  
CBT3257ADS  
CBT3257APW  
CBT3257ABQ  
SSOP16  
SSOP16[1]  
TSSOP16  
plastic shrink small outline package; 16 leads;  
body width 5.3 mm  
plastic shrink small outline package; 16 leads;  
body width 3.9 mm; lead pitch 0.635 mm  
plastic thin shrink small outline package; 16 leads; SOT403-1  
body width 4.4 mm  
DHVQFN16 plastic dual in-line compatible thermal enhanced  
very thin quad flat package; no leads; 16 terminals;  
body 2.5 3.5 0.85 mm  
SOT763-1  
[1] Also known as QSOP16.  
4. Functional diagram  
4
7
2
1A  
2A  
3A  
4A  
1B1  
3
1B2  
5
2B1  
6
2B2  
9
11  
3B1  
10  
3B2  
12  
14  
4B1  
13  
4B2  
1
S
15  
OE  
002aab779  
Fig 1. Logic diagram  
CBT3257A  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2013. All rights reserved.  
Product data sheet  
Rev. 5 — 4 April 2013  
2 of 17  
 
 
 
CBT3257A  
NXP Semiconductors  
Quad 1-of-2 multiplexer/demultiplexer  
5. Pinning information  
5.1 Pinning  
CBT3257A  
1
2
3
4
5
6
7
8
16  
15  
14  
13  
12  
11  
10  
9
S
1B1  
1B2  
1A  
V
CC  
OE  
4B1  
4B2  
4A  
CBT3257A  
1
2
3
4
5
6
7
8
16  
15  
14  
13  
S
1B1  
1B2  
1A  
V
CC  
OE  
4B1  
4B2  
2B1  
2B2  
2A  
12 4A  
3B1  
3B2  
3A  
2B1  
2B2  
2A  
11  
10  
9
3B1  
3B2  
3A  
GND  
GND  
001aai364  
001aai365  
Fig 2. Pin configuration SOT109-1 (SO16) and  
SOT519-1 (SSOP16)  
Fig 3. Pin configuration SOT338-1 (SSOP16) and  
SOT403-1 (TSSOP16)  
CBT3257A  
terminal 1  
index area  
2
3
4
5
6
7
15  
14  
13  
12  
11  
10  
1B1  
OE  
1B2  
1A  
4B1  
4B2  
4A  
2B1  
2B2  
2A  
(1)  
3B1  
3B2  
GND  
001aai366  
Transparent top view  
(1) This is not a supply pin. The substrate is attached to this pad using conductive die attach material. There is no electrical or  
mechanical requirement to solder this pad. However, if it is soldered, the solder land should remain floating or be connected to  
GND.  
Fig 4. Pin configuration SOT763-1 (DHVQFN16)  
CBT3257A  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2013. All rights reserved.  
Product data sheet  
Rev. 5 — 4 April 2013  
3 of 17  
 
 
CBT3257A  
NXP Semiconductors  
Quad 1-of-2 multiplexer/demultiplexer  
5.2 Pin description  
Table 2.  
Pin description  
Symbol  
Pin  
Description  
S
1
select control input  
B1 outputs/inputs  
B2 outputs/inputs  
A inputs/outputs  
1B1, 2B1, 3B1, 4B1,  
2, 5, 11, 14  
1B2, 2B2, 3B2, 4B2  
3, 6, 10, 13  
1A, 2A, 3A, 4A  
4, 7, 9, 12  
GND  
OE  
8
ground (0 V)  
15  
16  
output enable (active LOW)  
positive supply voltage  
VCC  
6. Functional description  
Table 3.  
Function selection  
H = HIGH voltage level; L = LOW voltage level; X = Don’t care.  
Inputs  
Switch  
OE  
L
S
L
nA to nB1  
nA to nB2  
switch off  
L
H
X
H
7. Limiting values  
Table 4.  
Limiting values  
In accordance with the Absolute Maximum Rating System (IEC 60134).  
Symbol Parameter  
Conditions  
Min  
0.5  
0.5  
-
Max  
+7.0  
+7.0  
128  
Unit  
V
VCC  
VI  
supply voltage  
[1]  
input voltage  
V
ISW  
IIK  
switch current  
continuous current through each switch  
VI < 0 V  
mA  
mA  
C  
input clamping current  
storage temperature  
total power dissipation  
50  
65  
Tstg  
Ptot  
+150  
Tamb = 40 C to +85 C  
SO16 package  
[2]  
[3]  
[3]  
[4]  
-
-
-
-
500  
500  
500  
500  
mW  
mW  
mW  
mW  
SSOP16 package  
TSSOP16 package  
DHVQFN16 package  
[1] The input and output negative voltage ratings may be exceeded if the input and output clamp current ratings are observed.  
[2] For SO16 package: Ptot derates linearly with 8 mW/K above 70 C.  
[3] For SSOP16 and TSSOP16 package: Ptot derates linearly with 5.5 mW/K above 70 C.  
[4] For DHVQFN16 package: Ptot derates linearly with 4.5 mW/K above 70 C.  
CBT3257A  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2013. All rights reserved.  
Product data sheet  
Rev. 5 — 4 April 2013  
4 of 17  
 
 
 
 
 
 
 
CBT3257A  
NXP Semiconductors  
Quad 1-of-2 multiplexer/demultiplexer  
8. Recommended operating conditions  
Table 5.  
Operating conditions  
All unused control inputs of the device must be held at VCC or GND to ensure proper device operation.  
Symbol  
VCC  
Parameter  
Conditions  
Min  
4.5  
2.0  
-
Max  
5.5  
-
Unit  
V
supply voltage  
VIH  
HIGH-level input voltage  
LOW-level input voltage  
ambient temperature  
V
VIL  
0.8  
+85  
V
Tamb  
operating in free-air  
40  
C  
9. Static characteristics  
Table 6.  
Static characteristics  
Tamb = 40 C to +85 C.  
Symbol  
VIK  
Parameter  
Conditions  
Min  
Typ[1] Max  
Unit  
input clamping voltage  
pass voltage  
VCC = 4.5 V; II = 18 mA  
-
-
1.2  
4.2  
1  
V
Vpass  
II  
VI = VCC = 5.0 V; IO = 100 A  
VCC = 5.5 V; VI = GND or 5.5 V  
3.6  
3.9  
V
input leakage current  
supply current  
-
-
-
-
A  
A  
ICC  
VCC = 5.5 V; IO = 0 mA;  
VI = VCC or GND  
3
[2]  
ICC  
additional supply current  
per input; VCC = 5.5 V; one input at  
3.4 V, other inputs at VCC or GND  
-
-
2.5  
mA  
CI  
input capacitance  
control pins; VI = 3 V or 0 V  
-
-
-
3.3  
9.9  
6.4  
-
-
-
pF  
pF  
pF  
Cio(off)  
off-state input/output capacitance A port; VO = 3 V or 0 V; OE = VCC  
B port; VO = 3 V or 0 V; OE = VCC  
[3]  
RON  
ON resistance  
VCC = 4.5 V  
VI = 0 V; II = 64 mA  
VI = 0 V; II = 30 mA  
VI = 2.4 V; II = 15 mA  
-
-
-
5
7
5
7
10  
15  
[1] All typical values are measured at VCC = 5 V; Tamb = 25 C.  
[2] This is the increase in supply current for each input that is at the specified TTL voltage level rather than VCC or GND.  
[3] Measured by the voltage drop between the nA and the nBn terminals at the indicated current through the switch. The lowest voltage of  
the two (nA or nBn) terminals determines the ON resistance.  
CBT3257A  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2013. All rights reserved.  
Product data sheet  
Rev. 5 — 4 April 2013  
5 of 17  
 
 
 
 
 
 
CBT3257A  
NXP Semiconductors  
Quad 1-of-2 multiplexer/demultiplexer  
10. Dynamic characteristics  
Table 7.  
Dynamic characteristics  
Tamb = 40 C to +85 C; VCC = 4.5 V to 5.5 V; for test circuit see Figure 7.  
Symbol  
Parameter  
Conditions  
Min  
-
Max  
0.25  
5.0  
Unit  
ns  
[1][2]  
[1][2]  
[2]  
tpd  
ten  
tdis  
propagation delay  
nA to nBn or nBn to nA; see Figure 5  
S to nA; see Figure 5  
1.4  
1.5  
1.4  
2.2  
1.0  
ns  
enable time  
disable time  
OE to nA or nBn; see Figure 6  
S to nBn; see Figure 6  
5.1  
ns  
[2]  
5.2  
ns  
[2]  
OE to nA or nBn; see Figure 6  
S to nBn; see Figure 6  
5.5  
ns  
[2]  
5.0  
ns  
[1] This parameter is warranted but not production tested. The propagation delay is based on the RC time constant of the typical ON  
resistance of the switch and a load capacitance, when driven by an ideal voltage source (zero output impedance).  
[2] tPLH and tPHL are the same as tpd  
.
tPZL and tPZH are the same as ten  
.
tPLZ and tPHZ are the same as tdis  
.
11. AC waveforms  
V
I
V
V
M
input  
0 V  
M
t
t
PLH  
PHL  
V
OH  
V
V
M
output  
M
V
OL  
001aai367  
Measurement points are given in Table 8.  
OL and VOH are typical voltage output levels that occur with the output load.  
V
Fig 5. The input (nA; nBn) to output (nBn; nA) or input (S) to output (nA) propagation delay times  
CBT3257A  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2013. All rights reserved.  
Product data sheet  
Rev. 5 — 4 April 2013  
6 of 17  
 
 
 
 
 
CBT3257A  
NXP Semiconductors  
Quad 1-of-2 multiplexer/demultiplexer  
V
I
OE, S input  
V
M
GND  
t
t
PZL  
PLZ  
V
CC  
output  
LOW-to-OFF  
OFF-to-LOW  
V
M
V
X
V
OL  
t
t
PHZ  
PZH  
V
OH  
V
Y
output  
HIGH-to-OFF  
OFF-to-HIGH  
V
M
GND  
outputs  
enabled  
outputs  
disabled  
outputs  
enabled  
001aai368  
Measurement points are given in Table 8.  
VOL and VOH are typical voltage output levels that occur with the output load.  
Fig 6. Enable and disable times  
Table 8. Measurement points  
Supply voltage  
VCC  
Input  
Output  
VM  
VI  
VM  
VX  
VY  
4.5 V to 5.5 V  
GND to 3.0 V  
1.5 V  
1.5 V  
VOL + 0.3 V  
VOH 0.3 V  
CBT3257A  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2013. All rights reserved.  
Product data sheet  
Rev. 5 — 4 April 2013  
7 of 17  
 
CBT3257A  
NXP Semiconductors  
Quad 1-of-2 multiplexer/demultiplexer  
12. Test information  
t
W
V
I
90 %  
negative  
pulse  
V
V
V
M
M
10 %  
0 V  
t
t
r
f
t
t
f
r
V
I
90 %  
positive  
pulse  
V
M
M
10 %  
0 V  
t
W
V
EXT  
R
V
CC  
L
V
V
O
I
G
DUT  
R
T
C
L
R
L
001aae331  
Test data is given in Table 9.  
Definitions for test circuit:  
RL = Load resistance.  
CL = Load capacitance including jig and probe capacitance.  
RT = Termination resistance should be equal to the output impedance Zo of the pulse generator.  
VEXT = External voltage for measuring switching times.  
Fig 7. Test circuit for measuring switching times  
Table 9.  
Test data  
Supply voltage Input  
Load  
CL  
VEXT  
VCC  
VI  
tr, tf  
RL  
tPLH, tPHL  
open  
tPLZ, tPZL  
tPHZ, tPZH  
4.5 V to 5.5 V  
GND to 3.0 V  
2.5 ns  
50 pF  
500   
7.0 V  
open  
CBT3257A  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2013. All rights reserved.  
Product data sheet  
Rev. 5 — 4 April 2013  
8 of 17  
 
 
CBT3257A  
NXP Semiconductors  
Quad 1-of-2 multiplexer/demultiplexer  
13. Package outline  
SO16: plastic small outline package; 16 leads; body width 3.9 mm  
SOT109-1  
D
E
A
X
v
c
y
H
M
A
E
Z
16  
9
Q
A
2
A
(A )  
3
A
1
pin 1 index  
θ
L
p
L
1
8
e
w
M
detail X  
b
p
0
2.5  
scale  
5 mm  
DIMENSIONS (inch dimensions are derived from the original mm dimensions)  
A
(1)  
(1)  
(1)  
UNIT  
A
A
A
b
c
D
E
e
H
L
L
p
Q
v
w
y
Z
θ
1
2
3
p
E
max.  
0.25  
0.10  
1.45  
1.25  
0.49  
0.36  
0.25  
0.19  
10.0  
9.8  
4.0  
3.8  
6.2  
5.8  
1.0  
0.4  
0.7  
0.6  
0.7  
0.3  
mm  
1.27  
0.05  
1.05  
0.041  
1.75  
0.25  
0.01  
0.25  
0.01  
0.25  
0.1  
8o  
0o  
0.010 0.057  
0.004 0.049  
0.019 0.0100 0.39  
0.014 0.0075 0.38  
0.16  
0.15  
0.244  
0.228  
0.039 0.028  
0.016 0.020  
0.028  
0.012  
inches  
0.069  
0.01 0.004  
Note  
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.  
REFERENCES  
OUTLINE  
EUROPEAN  
PROJECTION  
ISSUE DATE  
VERSION  
IEC  
JEDEC  
JEITA  
99-12-27  
03-02-19  
SOT109-1  
076E07  
MS-012  
Fig 8. Package outline SOT109-1 (SO16)  
CBT3257A  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2013. All rights reserved.  
Product data sheet  
Rev. 5 — 4 April 2013  
9 of 17  
 
CBT3257A  
NXP Semiconductors  
Quad 1-of-2 multiplexer/demultiplexer  
SSOP16: plastic shrink small outline package; 16 leads; body width 5.3 mm  
SOT338-1  
D
E
A
X
c
y
H
v
M
A
E
Z
9
16  
Q
A
2
A
(A )  
3
A
1
pin 1 index  
θ
L
p
L
8
1
detail X  
w M  
b
p
e
0
2.5  
5 mm  
scale  
DIMENSIONS (mm are the original dimensions)  
A
(1)  
(1)  
(1)  
UNIT  
A
A
A
b
c
D
E
e
H
L
L
Q
v
w
y
Z
θ
p
p
1
2
3
E
max.  
8o  
0o  
0.21  
0.05  
1.80  
1.65  
0.38  
0.25  
0.20  
0.09  
6.4  
6.0  
5.4  
5.2  
7.9  
7.6  
1.03  
0.63  
0.9  
0.7  
1.00  
0.55  
mm  
2
0.25  
0.65  
1.25  
0.2  
0.13  
0.1  
Note  
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.  
REFERENCES  
OUTLINE  
EUROPEAN  
PROJECTION  
ISSUE DATE  
VERSION  
IEC  
JEDEC  
JEITA  
99-12-27  
03-02-19  
SOT338-1  
MO-150  
Fig 9. Package outline SOT338-1 (SSOP16)  
CBT3257A  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2013. All rights reserved.  
Product data sheet  
Rev. 5 — 4 April 2013  
10 of 17  
CBT3257A  
NXP Semiconductors  
Quad 1-of-2 multiplexer/demultiplexer  
SSOP16: plastic shrink small outline package; 16 leads; body width 3.9 mm; lead pitch 0.635 mm  
SOT519-1  
D
E
A
X
c
y
H
v
M
A
E
Z
9
16  
A
2
A
(A )  
3
A
1
θ
L
p
L
8
1
detail X  
w M  
e
b
p
0
2.5  
5 mm  
scale  
DIMENSIONS (mm are the original dimensions)  
A
(1)  
(1)  
(1)  
UNIT  
A
A
A
b
c
D
E
e
H
L
L
v
w
y
Z
θ
p
p
1
2
3
E
max.  
8o  
0o  
0.25  
0.10  
1.55  
1.40  
0.31  
0.20  
0.25  
0.18  
5.0  
4.8  
4.0  
3.8  
6.2  
5.8  
0.89  
0.41  
0.18  
0.05  
mm  
1.73  
0.25  
0.635  
1
0.2  
0.18  
0.09  
Note  
1. Plastic or metal protrusions of 0.2 mm maximum per side are not included.  
REFERENCES  
OUTLINE  
EUROPEAN  
PROJECTION  
ISSUE DATE  
VERSION  
IEC  
JEDEC  
JEITA  
99-05-04  
03-02-18  
SOT519-1  
Fig 10. Package outline SOT519-1 (SSOP16)  
CBT3257A  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2013. All rights reserved.  
Product data sheet  
Rev. 5 — 4 April 2013  
11 of 17  
CBT3257A  
NXP Semiconductors  
Quad 1-of-2 multiplexer/demultiplexer  
TSSOP16: plastic thin shrink small outline package; 16 leads; body width 4.4 mm  
SOT403-1  
D
E
A
X
c
y
H
v
M
A
E
Z
9
16  
Q
(A )  
3
A
2
A
A
1
pin 1 index  
θ
L
p
L
1
8
detail X  
w
M
b
p
e
0
2.5  
5 mm  
scale  
DIMENSIONS (mm are the original dimensions)  
A
(1)  
(2)  
(1)  
UNIT  
A
A
A
b
c
D
E
e
H
L
L
Q
v
w
y
Z
θ
1
2
3
p
E
p
max.  
8o  
0o  
0.15  
0.05  
0.95  
0.80  
0.30  
0.19  
0.2  
0.1  
5.1  
4.9  
4.5  
4.3  
6.6  
6.2  
0.75  
0.50  
0.4  
0.3  
0.40  
0.06  
mm  
1.1  
0.65  
0.25  
1
0.2  
0.13  
0.1  
Notes  
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.  
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.  
REFERENCES  
OUTLINE  
EUROPEAN  
PROJECTION  
ISSUE DATE  
VERSION  
IEC  
JEDEC  
JEITA  
99-12-27  
03-02-18  
SOT403-1  
MO-153  
Fig 11. Package outline SOT403-1 (TSSOP16)  
CBT3257A  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2013. All rights reserved.  
Product data sheet  
Rev. 5 — 4 April 2013  
12 of 17  
CBT3257A  
NXP Semiconductors  
Quad 1-of-2 multiplexer/demultiplexer  
DHVQFN16: plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads;  
16 terminals; body 2.5 x 3.5 x 0.85 mm  
SOT763-1  
B
A
D
A
A
1
E
c
detail X  
terminal 1  
index area  
C
terminal 1  
index area  
e
1
y
y
e
b
v
M
C
C
A
B
C
1
w
M
2
7
L
1
8
9
E
h
e
16  
15  
10  
D
h
X
0
2.5  
scale  
5 mm  
DIMENSIONS (mm are the original dimensions)  
(1)  
A
(1)  
(1)  
UNIT  
A
b
c
E
e
e
1
y
D
D
E
L
v
w
y
1
1
h
h
max.  
0.05 0.30  
0.00 0.18  
3.6  
3.4  
2.15  
1.85  
2.6  
2.4  
1.15  
0.85  
0.5  
0.3  
mm  
0.05  
0.1  
1
0.2  
0.5  
2.5  
0.1  
0.05  
Note  
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.  
REFERENCES  
OUTLINE  
EUROPEAN  
PROJECTION  
ISSUE DATE  
VERSION  
IEC  
JEDEC  
JEITA  
02-10-17  
03-01-27  
SOT763-1  
- - -  
MO-241  
- - -  
Fig 12. Package outline SOT763-1 (DHVQFN16)  
CBT3257A  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2013. All rights reserved.  
Product data sheet  
Rev. 5 — 4 April 2013  
13 of 17  
CBT3257A  
NXP Semiconductors  
Quad 1-of-2 multiplexer/demultiplexer  
14. Abbreviations  
Table 10. Abbreviations  
Acronym  
CDM  
ESD  
Description  
Charged Device Model  
ElectroStatic Discharge  
Human Body Model  
Machine Model  
HBM  
MM  
TTL  
Transistor-Transistor Logic  
15. Revision history  
Table 11. Revision history  
Document ID  
CBT3257A v.5  
Modifications:  
CBT3257A v.4  
CBT3257A v.3  
CBT3257A v.2  
CBT3257A v.1  
Release date  
20130404  
Data sheet status  
Change notice  
Supersedes  
Product data sheet  
-
CBT3257A v.4  
Table 6 “Static characteristics”: values for pass voltage modified.  
20090319  
20080704  
20070704  
20051027  
Product data sheet  
Product data sheet  
Product data sheet  
Product data sheet  
-
-
-
-
CBT3257A v.3  
CBT3257A v.2  
CBT3257A v.1  
-
CBT3257A  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2013. All rights reserved.  
Product data sheet  
Rev. 5 — 4 April 2013  
14 of 17  
 
 
CBT3257A  
NXP Semiconductors  
Quad 1-of-2 multiplexer/demultiplexer  
16. Legal information  
16.1 Data sheet status  
Document status[1][2]  
Product status[3]  
Development  
Definition  
Objective [short] data sheet  
This document contains data from the objective specification for product development.  
This document contains data from the preliminary specification.  
This document contains the product specification.  
Preliminary [short] data sheet Qualification  
Product [short] data sheet Production  
[1]  
[2]  
[3]  
Please consult the most recently issued document before initiating or completing a design.  
The term ‘short data sheet’ is explained in section “Definitions”.  
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status  
information is available on the Internet at URL http://www.nxp.com.  
Suitability for use — NXP Semiconductors products are not designed,  
16.2 Definitions  
authorized or warranted to be suitable for use in life support, life-critical or  
safety-critical systems or equipment, nor in applications where failure or  
malfunction of an NXP Semiconductors product can reasonably be expected  
to result in personal injury, death or severe property or environmental  
damage. NXP Semiconductors and its suppliers accept no liability for  
inclusion and/or use of NXP Semiconductors products in such equipment or  
applications and therefore such inclusion and/or use is at the customer’s own  
risk.  
Draft — The document is a draft version only. The content is still under  
internal review and subject to formal approval, which may result in  
modifications or additions. NXP Semiconductors does not give any  
representations or warranties as to the accuracy or completeness of  
information included herein and shall have no liability for the consequences of  
use of such information.  
Short data sheet — A short data sheet is an extract from a full data sheet  
with the same product type number(s) and title. A short data sheet is intended  
for quick reference only and should not be relied upon to contain detailed and  
full information. For detailed and full information see the relevant full data  
sheet, which is available on request via the local NXP Semiconductors sales  
office. In case of any inconsistency or conflict with the short data sheet, the  
full data sheet shall prevail.  
Applications — Applications that are described herein for any of these  
products are for illustrative purposes only. NXP Semiconductors makes no  
representation or warranty that such applications will be suitable for the  
specified use without further testing or modification.  
Customers are responsible for the design and operation of their applications  
and products using NXP Semiconductors products, and NXP Semiconductors  
accepts no liability for any assistance with applications or customer product  
design. It is customer’s sole responsibility to determine whether the NXP  
Semiconductors product is suitable and fit for the customer’s applications and  
products planned, as well as for the planned application and use of  
customer’s third party customer(s). Customers should provide appropriate  
design and operating safeguards to minimize the risks associated with their  
applications and products.  
Product specification — The information and data provided in a Product  
data sheet shall define the specification of the product as agreed between  
NXP Semiconductors and its customer, unless NXP Semiconductors and  
customer have explicitly agreed otherwise in writing. In no event however,  
shall an agreement be valid in which the NXP Semiconductors product is  
deemed to offer functions and qualities beyond those described in the  
Product data sheet.  
NXP Semiconductors does not accept any liability related to any default,  
damage, costs or problem which is based on any weakness or default in the  
customer’s applications or products, or the application or use by customer’s  
third party customer(s). Customer is responsible for doing all necessary  
testing for the customer’s applications and products using NXP  
Semiconductors products in order to avoid a default of the applications and  
the products or of the application or use by customer’s third party  
customer(s). NXP does not accept any liability in this respect.  
16.3 Disclaimers  
Limited warranty and liability — Information in this document is believed to  
be accurate and reliable. However, NXP Semiconductors does not give any  
representations or warranties, expressed or implied, as to the accuracy or  
completeness of such information and shall have no liability for the  
consequences of use of such information. NXP Semiconductors takes no  
responsibility for the content in this document if provided by an information  
source outside of NXP Semiconductors.  
Limiting values — Stress above one or more limiting values (as defined in  
the Absolute Maximum Ratings System of IEC 60134) will cause permanent  
damage to the device. Limiting values are stress ratings only and (proper)  
operation of the device at these or any other conditions above those given in  
the Recommended operating conditions section (if present) or the  
Characteristics sections of this document is not warranted. Constant or  
repeated exposure to limiting values will permanently and irreversibly affect  
the quality and reliability of the device.  
In no event shall NXP Semiconductors be liable for any indirect, incidental,  
punitive, special or consequential damages (including - without limitation - lost  
profits, lost savings, business interruption, costs related to the removal or  
replacement of any products or rework charges) whether or not such  
damages are based on tort (including negligence), warranty, breach of  
contract or any other legal theory.  
Terms and conditions of commercial sale — NXP Semiconductors  
products are sold subject to the general terms and conditions of commercial  
sale, as published at http://www.nxp.com/profile/terms, unless otherwise  
agreed in a valid written individual agreement. In case an individual  
agreement is concluded only the terms and conditions of the respective  
agreement shall apply. NXP Semiconductors hereby expressly objects to  
applying the customer’s general terms and conditions with regard to the  
purchase of NXP Semiconductors products by customer.  
Notwithstanding any damages that customer might incur for any reason  
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards  
customer for the products described herein shall be limited in accordance  
with the Terms and conditions of commercial sale of NXP Semiconductors.  
Right to make changes — NXP Semiconductors reserves the right to make  
changes to information published in this document, including without  
limitation specifications and product descriptions, at any time and without  
notice. This document supersedes and replaces all information supplied prior  
to the publication hereof.  
No offer to sell or license — Nothing in this document may be interpreted or  
construed as an offer to sell products that is open for acceptance or the grant,  
conveyance or implication of any license under any copyrights, patents or  
other industrial or intellectual property rights.  
CBT3257A  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2013. All rights reserved.  
Product data sheet  
Rev. 5 — 4 April 2013  
15 of 17  
 
 
 
 
CBT3257A  
NXP Semiconductors  
Quad 1-of-2 multiplexer/demultiplexer  
Export control — This document as well as the item(s) described herein  
may be subject to export control regulations. Export might require a prior  
authorization from competent authorities.  
NXP Semiconductors’ specifications such use shall be solely at customer’s  
own risk, and (c) customer fully indemnifies NXP Semiconductors for any  
liability, damages or failed product claims resulting from customer design and  
use of the product for automotive applications beyond NXP Semiconductors’  
standard warranty and NXP Semiconductors’ product specifications.  
Non-automotive qualified products — Unless this data sheet expressly  
states that this specific NXP Semiconductors product is automotive qualified,  
the product is not suitable for automotive use. It is neither qualified nor tested  
in accordance with automotive testing or application requirements. NXP  
Semiconductors accepts no liability for inclusion and/or use of  
Translations — A non-English (translated) version of a document is for  
reference only. The English version shall prevail in case of any discrepancy  
between the translated and English versions.  
non-automotive qualified products in automotive equipment or applications.  
In the event that customer uses the product for design-in and use in  
automotive applications to automotive specifications and standards, customer  
(a) shall use the product without NXP Semiconductors’ warranty of the  
product for such automotive applications, use and specifications, and (b)  
whenever customer uses the product for automotive applications beyond  
16.4 Trademarks  
Notice: All referenced brands, product names, service names and trademarks  
are the property of their respective owners.  
17. Contact information  
For more information, please visit: http://www.nxp.com  
For sales office addresses, please send an email to: salesaddresses@nxp.com  
CBT3257A  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2013. All rights reserved.  
Product data sheet  
Rev. 5 — 4 April 2013  
16 of 17  
 
 
CBT3257A  
NXP Semiconductors  
Quad 1-of-2 multiplexer/demultiplexer  
18. Contents  
1
2
3
4
General description. . . . . . . . . . . . . . . . . . . . . . 1  
Features and benefits . . . . . . . . . . . . . . . . . . . . 1  
Ordering information. . . . . . . . . . . . . . . . . . . . . 2  
Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2  
5
5.1  
5.2  
Pinning information. . . . . . . . . . . . . . . . . . . . . . 3  
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3  
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4  
6
Functional description . . . . . . . . . . . . . . . . . . . 4  
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4  
Recommended operating conditions. . . . . . . . 5  
Static characteristics. . . . . . . . . . . . . . . . . . . . . 5  
Dynamic characteristics . . . . . . . . . . . . . . . . . . 6  
AC waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . 6  
Test information. . . . . . . . . . . . . . . . . . . . . . . . . 8  
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9  
Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 14  
Revision history. . . . . . . . . . . . . . . . . . . . . . . . 14  
7
8
9
10  
11  
12  
13  
14  
15  
16  
Legal information. . . . . . . . . . . . . . . . . . . . . . . 15  
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 15  
Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 15  
Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 15  
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 16  
16.1  
16.2  
16.3  
16.4  
17  
18  
Contact information. . . . . . . . . . . . . . . . . . . . . 16  
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17  
Please be aware that important notices concerning this document and the product(s)  
described herein, have been included in section ‘Legal information’.  
© NXP B.V. 2013.  
All rights reserved.  
For more information, please visit: http://www.nxp.com  
For sales office addresses, please send an email to: salesaddresses@nxp.com  
Date of release: 4 April 2013  
Document identifier: CBT3257A  
 

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