CBT3306PW-T_技术文档

CBT3306

Dual bus switch

Rev. 02 — 17 November 2005

Product data sheet

1. General description

The CBT3306 dual FET bus switch features independent line switches. Each switch is

disabled when the associated output enable (OE) input is HIGH.

The CBT3306 is characterized for operation from −40 °C to +85 °C.

2. Features

■ 5 Ω switch connection between two ports

■ TTL-compatible input levels

■ Package options include plastic small outline (SO) and thin shrink small outline

(TSSOP)

■ Latch-up protection exceeds 100 mA per JESD78

■ ESD protection exceeds 2000 V HBM per JESD22-A114 and 1000 V CDM per

JESD22-C101

3. Quick reference data

Table 1:

Quick reference data

T_amb= 25 °C; GND = 0 V

Symbol Parameter

Conditions

Min

Typ

Max

Unit

t_PD

propagation delay

from input (nA or nB) to

output (nB or nA);

C_L= 50 pF;

-

0.25

ns

V_CC= 5.0 V ± 0.5 V

C_io(off)

I_CC

off-state input/output V_I= 3 V or 0 V; OE = V_CC

capacitance

-

6.45

-

pF

quiescent supply

current

V_CC= 5.5 V; I_O= 0 mA;

V_I= V_CCor GND

3

µA

4. Ordering information

Table 2:

Ordering information

Type number

Package

Name

SO8

Description

Version

CBT3306D

plastic small outline package; 8 leads;

body width 3.9 mm

SOT96-1

CBT3306PW

TSSOP8

plastic thin shrink small outline package; 8 leads;

body width 4.4 mm

SOT530-1

CBT3306

Philips Semiconductors

Dual bus switch

5. Functional diagram

2

1

5

7

3

6

1A

1OE

2A

1B

2B

2OE

002aab985

Fig 1. Logic diagram of CBT3306 (positive logic)

6. Pinning information

6.1 Pinning

1

2

3

4

8

7

6

5

1OE

V

CC

1

2

3

4

8

7

6

5

1OE

1A

V

CC

1A

1B

2OE

2B

CBT3306D

2OE

2B

CBT3306PW

1B

GND

2A

GND

2A

002aab983

002aab984

Fig 2. Pin conﬁguration for SO8

Fig 3. Pin conﬁguration for TSSOP8

6.2 Pin description

Table 3:

Pin description

Symbol

1OE

1A

1

Description

output enable 1

A port input 1

B port output 1

ground (0 V)

2

1B

3

GND

2A

4

5

A port input 2

B port output 2

output enable 2

2B

6

2OE

V_CC

7

8

positive supply voltage

CBT3306_2

Product data sheet

Rev. 02 — 17 November 2005

2 of 13

CBT3306

Philips Semiconductors

Dual bus switch

7. Functional description

Refer to Figure 1 “Logic diagram of CBT3306 (positive logic)”.

7.1 Function selection

Table 4:

Function selection

Input

OE

L

Function

A port = B port

disconnect

H

8. Limiting values

Table 5:

Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134). ^[1]

T_amb= −40 °C to +85 °C, unless otherwise speciﬁed.

Symbol

V_CC

V_I

Parameter

Conditions

Min

−0.5

−0.5^[2]

-

Max

+7.0

128

Unit

V

supply voltage

input voltage

V

I_O

output current

mA

°C

I_IK

input clamping current

storage temperature

V_I/O= 0 V

-

−50

T_stg

−65

+150

[1] Stresses beyond those listed may cause permanent damage to the device. These are stress ratings only

and functional operation of the device at these or any other conditions beyond those indicated under

Section 9 “Recommended operating conditions” is not implied. Exposure to absolute-maximum-rated

conditions for extended periods may affect device reliability.

[2] The input and output negative-voltage ratings may be exceeded if the input and output clamp-current

ratings are observed.

9. Recommended operating conditions

Table 6:

Operating conditions

All unused control inputs of the device must be held at V_CCor GND to ensure proper device

operation.

Symbol

V_CC

Parameter

Conditions

Min

4.5

2.0

-

Typ

Max

5.5

-

Unit

V

supply voltage

-

V_IH

HIGH-state input voltage

LOW-state input voltage

ambient temperature

V

V_IL

0.8

+85

V

T_amb

operating in free air

−40

°C

CBT3306_2

Product data sheet

Rev. 02 — 17 November 2005

3 of 13

CBT3306

Philips Semiconductors

Dual bus switch

10. Static characteristics

Table 7:

Static characteristics

T_amb= −40 °C to +85 °C, unless otherwise speciﬁed.

Symbol Parameter

Conditions

Min

Typ ^[1]

Max

−1.2

±1

Unit

V

V_IK

I_LI

input clamping voltage

input leakage current

V_CC= 4.5 V; I_I= −18 mA

V_CC= 5.5 V; V_I= GND or 5.5 V

-

µA

I_CC

quiescent supply current V_CC= 5.5 V; I_O= 0 mA;

V_I= V_CCor GND

3

V_pass

pass voltage

output HIGH; V_I= V_CC= 5.0 V;

I_O= −100 µA

3.4

-

3.6

-

3.9

2.5

V

∆I_CC

additional quiescent

supply current^[2]

per input pin; V_CC= 5.5 V;

one input at 3.4 V, other inputs at

mA

V_CCor GND

C_i

input capacitance

control pin; V_I= 3 V or 0 V

-

3.15

6.45

-

pF

C_io(off)

off-state input/output

capacitance

port off; V_I= 3 V or 0 V; OE = V_CC

[3]

R_on

ON-state resistance

V_CC= 4.5 V; V_I= 0 V; I_I= 64 mA

V_CC= 4.5 V; V_I= 0 V; I_I= 30 mA

V_CC= 4.5 V; V_I= 2.4 V; I_I= 15 mA

-

3.4

6.8

5

Ω

5

15

[1] All typical values are at V_CC= 5 V, T_amb= 25 °C.

[2] This is the increase in supply current for each input that is at the speciﬁed TTL voltage level rather than V_CCor GND.

[3] Measured by the voltage drop between the A and the B terminals at the indicated current through the switch. ON-state resistance is

determined by the lowest voltage of the two (A or B) terminals.

11. Dynamic characteristics

Table 8:

Dynamic characteristics

V_CC= +5.0 V ± 0.5 V; T_amb= −40 °C to +85 °C; C_L= 50 pF; unless otherwise speciﬁed.

Symbol Parameter

Conditions

Min

-

Typ

Max

0.25

5

Unit

ns

[1]

t_PD

t_en

t_dis

propagation delay

from input (nA or nB) to output (nB or nA)

from input (nOE) to output (nA or nB)

-

enable time^[2]

disable time^[3]

1.8

1

ns

5

ns

[1] The propagation delay is the calculated RC time constant of the typical ON-state resistance of the switch and the speciﬁed load

capacitance, when driven by an ideal voltage source (zero output impedance).

[2] Output enable time to HIGH and LOW level.

[3] Output disable time from HIGH and LOW level.

CBT3306_2

Product data sheet

Rev. 02 — 17 November 2005

4 of 13

CBT3306

Philips Semiconductors

Dual bus switch

11.1 AC waveforms

V_I= GND to 3.0 V.

t_PLZand t_PHZare the same as t_dis.

t_PZLand t_PZHare the same as t_en.

t_PLHand t_PHLare the same as t_PD

.

3.0 V

0 V

input

1.5 V

t

PHL

PLH

V

OH

OL

1.5 V

output

1.5 V

002aab665

Fig 4. Input to output propagation delay

3 V

0 V

output control

1.5 V

(LOW-level enabling)

t

PZL

PLZ

3.5 V

output

1.5 V

waveform 1

S1 at 7 V

V

+ 0.3 V

(1)

OL

V

OL

t

PZH

PHZ

OH

output

− 0.3 V

waveform 2

(2)

S1 open

0 V

002aab666

(1) Waveform 1 is for an output with internal conditions such that the output is LOW except when

disabled by the output control.

(2) Waveform 2 is for an output with internal conditions such that the output is HIGH except when

disabled by the output control.

Fig 5. 3-state output enable and disable times

CBT3306_2

Product data sheet

Rev. 02 — 17 November 2005

5 of 13

CBT3306

Philips Semiconductors

Dual bus switch

12. Test information

R

L

7 V

S1

from output under test

open

GND

500 Ω

C

50 pF

R

L

500 Ω

L

002aab667

Test data are given in Table 9.

All input pulses are supplied by generators having the following characteristics:

PRR ≤ 10 MHz; Z_o= 50 Ω; t_r≤ 2.5 ns; t_f≤ 2.5 ns.

The outputs are measured one at a time with one transition per measurement.

C_L= load capacitance includes jig and probe capacitance.

R_L= load resistance.

Fig 6. Test circuit

Table 9:

Test

Test data

Load

C_L

Switch

R_L

t_PD

50 pF

500 Ω

open

7 V

t_PLZ, t_PZL

t_PHZ, t_PZH

open

CBT3306_2

Product data sheet

Rev. 02 — 17 November 2005

6 of 13

CBT3306

Philips Semiconductors

Dual bus switch

13. Package outline

SO8: plastic small outline package; 8 leads; body width 3.9 mm

SOT96-1

D

E

A

X

v

c

y

H

M

A

E

Z

5

8

Q

A

2

A

(A )

3

A

1

pin 1 index

θ

L

p

L

1

4

e

w

M

detail X

b

p

0

2.5

5 mm

scale

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

A

(1)

(2)

UNIT

A

b

c

D

E

e

H

L

p

Q

v

w

y

Z

θ

1

2

3

p

E

max.

0.25

0.10

1.45

1.25

0.49

0.36

0.25

0.19

5.0

4.8

4.0

3.8

6.2

5.8

1.0

0.4

0.7

0.6

0.7

0.3

mm

1.27

0.05

1.05

0.041

1.75

0.25

0.01

0.25

0.01

0.25

0.1

8^o

0^o

0.010 0.057

0.004 0.049

0.019 0.0100 0.20

0.014 0.0075 0.19

0.16

0.15

0.244

0.228

0.039 0.028

0.016 0.024

0.028

0.012

inches 0.069

0.01 0.004

Notes

1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.

2. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.

REFERENCES

OUTLINE

EUROPEAN

PROJECTION

ISSUE DATE

VERSION

IEC

JEDEC

JEITA

99-12-27

03-02-18

SOT96-1

076E03

MS-012

Fig 7. Package outline SOT96-1 (SO8)

CBT3306_2

Product data sheet

Rev. 02 — 17 November 2005

7 of 13

CBT3306

Philips Semiconductors

Dual bus switch

TSSOP8: plastic thin shrink small outline package; 8 leads; body width 4.4 mm

SOT530-1

E

A

D

X

c

y

H

E

v

M

A

Z

8

5

A

2

(A )

A

3

A

1

pin 1 index

θ

L

p

L

detail X

1

4

e

w M

b

p

0

2.5

5 mm

scale

DIMENSIONS (mm are the original dimensions)

A

(1)

(2)

(1)

A

b

c

D

E

e

H

L

UNIT

v

w

y

Z

θ

1

2

3

p

E

p

max.

0.15

0.05

0.95

0.85

0.30

0.19

0.20

0.13

3.1

2.9

4.5

4.3

6.5

6.3

0.7

0.5

0.70

0.35

8°

0°

mm

1.1

0.65

0.25

0.94

0.1

Notes

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

REFERENCES

OUTLINE

EUROPEAN

PROJECTION

ISSUE DATE

VERSION

IEC

JEDEC

JEITA

00-02-24

03-02-18

SOT530-1

MO-153

Fig 8. Package outline SOT530-1 (TSSOP8)

CBT3306_2

Product data sheet

Rev. 02 — 17 November 2005

8 of 13

CBT3306

Philips Semiconductors

Dual bus switch

14. Soldering

14.1 Introduction to soldering surface mount packages

This text gives a very brief insight to a complex technology. A more in-depth account of

soldering ICs can be found in our Data Handbook IC26; Integrated Circuit Packages

(document order number 9398 652 90011).

There is no soldering method that is ideal for all surface mount IC packages. Wave

soldering can still be used for certain surface mount ICs, but it is not suitable for ﬁne pitch

SMDs. In these situations reﬂow soldering is recommended.

14.2 Reﬂow soldering

Reﬂow soldering requires solder paste (a suspension of ﬁne solder particles, ﬂux and

binding agent) to be applied to the printed-circuit board by screen printing, stencilling or

pressure-syringe dispensing before package placement. Driven by legislation and

environmental forces the worldwide use of lead-free solder pastes is increasing.

Several methods exist for reﬂowing; for example, convection or convection/infrared

heating in a conveyor type oven. Throughput times (preheating, soldering and cooling)

vary between 100 seconds and 200 seconds depending on heating method.

Typical reﬂow peak temperatures range from 215 °C to 270 °C depending on solder paste

material. The top-surface temperature of the packages should preferably be kept:

• below 225 °C (SnPb process) or below 245 °C (Pb-free process)

– for all BGA, HTSSON..T and SSOP..T packages

– for packages with a thickness ≥ 2.5 mm

– for packages with a thickness < 2.5 mm and a volume ≥ 350 mm³so called

thick/large packages.

• below 240 °C (SnPb process) or below 260 °C (Pb-free process) for packages with a

thickness < 2.5 mm and a volume < 350 mm³so called small/thin packages.

Moisture sensitivity precautions, as indicated on packing, must be respected at all times.

14.3 Wave soldering

Conventional single wave soldering is not recommended for surface mount devices

(SMDs) or printed-circuit boards with a high component density, as solder bridging and

non-wetting can present major problems.

To overcome these problems the double-wave soldering method was speciﬁcally

developed.

If wave soldering is used the following conditions must be observed for optimal results:

• Use a double-wave soldering method comprising a turbulent wave with high upward

pressure followed by a smooth laminar wave.

• For packages with leads on two sides and a pitch (e):

– larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be

parallel to the transport direction of the printed-circuit board;

CBT3306_2

Product data sheet

Rev. 02 — 17 November 2005

9 of 13

CBT3306

Philips Semiconductors

Dual bus switch

– smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the

transport direction of the printed-circuit board.

The footprint must incorporate solder thieves at the downstream end.

• For packages with leads on four sides, the footprint must be placed at a 45° angle to

the transport direction of the printed-circuit board. The footprint must incorporate

solder thieves downstream and at the side corners.

During placement and before soldering, the package must be ﬁxed with a droplet of

adhesive. The adhesive can be applied by screen printing, pin transfer or syringe

dispensing. The package can be soldered after the adhesive is cured.

Typical dwell time of the leads in the wave ranges from 3 seconds to 4 seconds at 250 °C

or 265 °C, depending on solder material applied, SnPb or Pb-free respectively.

A mildly-activated ﬂux will eliminate the need for removal of corrosive residues in most

applications.

14.4 Manual soldering

Fix the component by ﬁrst soldering two diagonally-opposite end leads. Use a low voltage

(24 V or less) soldering iron applied to the ﬂat part of the lead. Contact time must be

limited to 10 seconds at up to 300 °C.

When using a dedicated tool, all other leads can be soldered in one operation within

2 seconds to 5 seconds between 270 °C and 320 °C.

14.5 Package related soldering information

Table 10: Suitability of surface mount IC packages for wave and reﬂow soldering methods

Package ^[1]

Soldering method

Wave

Reﬂow^[2]

BGA, HTSSON..T^[3], LBGA, LFBGA, SQFP,

SSOP..T^[3], TFBGA, VFBGA, XSON

not suitable

suitable

DHVQFN, HBCC, HBGA, HLQFP, HSO, HSOP,

HSQFP, HSSON, HTQFP, HTSSOP, HVQFN,

HVSON, SMS

not suitable^[4]

suitable

PLCC^[5], SO, SOJ

suitable

LQFP, QFP, TQFP

not recommended^{[5] [6]}

not recommended^[7]

not suitable

suitable

SSOP, TSSOP, VSO, VSSOP

CWQCCN..L^[8], PMFP^[9], WQCCN..L^[8]

suitable

not suitable

[1] For more detailed information on the BGA packages refer to the (LF)BGA Application Note (AN01026);

order a copy from your Philips Semiconductors sales ofﬁce.

[2] All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the

maximum temperature (with respect to time) and body size of the package, there is a risk that internal or

external package cracks may occur due to vaporization of the moisture in them (the so called popcorn

effect). For details, refer to the Drypack information in the Data Handbook IC26; Integrated Circuit

Packages; Section: Packing Methods.

[3] These transparent plastic packages are extremely sensitive to reﬂow soldering conditions and must on no

account be processed through more than one soldering cycle or subjected to infrared reﬂow soldering with

peak temperature exceeding 217 °C ± 10 °C measured in the atmosphere of the reﬂow oven. The package

body peak temperature must be kept as low as possible.

CBT3306_2

Product data sheet

Rev. 02 — 17 November 2005

10 of 13

CBT3306

Philips Semiconductors

Dual bus switch

[4] These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the

solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink

on the top side, the solder might be deposited on the heatsink surface.

[5] If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave

direction. The package footprint must incorporate solder thieves downstream and at the side corners.

[6] Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is

deﬁnitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.

[7] Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger

than 0.65 mm; it is deﬁnitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.

[8] Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered

pre-mounted on ﬂex foil. However, the image sensor package can be mounted by the client on a ﬂex foil by

using a hot bar soldering process. The appropriate soldering proﬁle can be provided on request.

[9] Hot bar soldering or manual soldering is suitable for PMFP packages.

15. Abbreviations

Table 11: Abbreviations

Acronym

CDM

ESD

Description

Charged Device Model

ElectroStatic Discharge

Field Effect Transistor

Human Body Model

FET

HBM

PRR

Pulse Rate Repetition

Transistor-Transistor Logic

TTL

16. Revision history

Table 12: Revision history

Document ID

CBT3306_2

Release date Data sheet status

20051117 Product data sheet

Change notice

Doc. number

Supersedes

-

CBT3306_2

CBT3306_1

Modiﬁcations:

• The format of this data sheet has been redesigned to comply with the new presentation and

information standard of Philips Semiconductors.

• Table 1 “Quick reference data”:

–

added Min and Max columns; moved t_PDand I_CCvalues to Max column

–

under ‘Conditions’ for C_io(off): changed “V_O” to “V_I”

• Table 5 “Limiting values”:

–

changed parameter description for I_IKfrom “diode current” to “input clamping current”

–

deleted old table note [3]

• Table 7 “Static characteristics”:

–

changed symbol for input leakage current from “I_I” to “I_LI”

under ‘Conditions’ for C_io(off): changed “V_O” to “V_I”

R_onmaximum value for condition V_CC= 4.5 V; V_I= 2.4 V; I_I= 15 mA: changed from “7.5 Ω” to

“15 Ω”

CBT3306_1

20011108

Product data

853-2304 27313 9397 750 09115

-

CBT3306_2

Product data sheet

Rev. 02 — 17 November 2005

11 of 13

CBT3306

Philips Semiconductors

Dual bus switch

17. Data sheet status

Level Data sheet status^[1]Product status^{[2] [3]}

Deﬁnition

I

Objective data

Development

This data sheet contains data from the objective speciﬁcation for product development. Philips

Semiconductors reserves the right to change the speciﬁcation in any manner without notice.

II

Preliminary data

Qualiﬁcation

This data sheet contains data from the preliminary speciﬁcation. Supplementary data will be published

at a later date. Philips Semiconductors reserves the right to change the speciﬁcation without notice, in

order to improve the design and supply the best possible product.

III

Product data

Production

This data sheet contains data from the product speciﬁcation. Philips Semiconductors reserves the

right to make changes at any time in order to improve the design, manufacturing and supply. Relevant

changes will be communicated via a Customer Product/Process Change Notiﬁcation (CPCN).

[1]

[2]

Please consult the most recently issued data sheet before initiating or completing a design.

The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at

URL http://www.semiconductors.philips.com.

[3]

For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.

customers using or selling these products for use in such applications do so

at their own risk and agree to fully indemnify Philips Semiconductors for any

damages resulting from such application.

18. Deﬁnitions

Short-form speciﬁcation — The data in a short-form speciﬁcation is

extracted from a full data sheet with the same type number and title. For

detailed information see the relevant data sheet or data handbook.

Right to make changes — Philips Semiconductors reserves the right to

make changes in the products - including circuits, standard cells, and/or

software - described or contained herein in order to improve design and/or

performance. When the product is in full production (status ‘Production’),

relevant changes will be communicated via a Customer Product/Process

Change Notiﬁcation (CPCN). Philips Semiconductors assumes no

responsibility or liability for the use of any of these products, conveys no

license or title under any patent, copyright, or mask work right to these

products, and makes no representations or warranties that these products are

free from patent, copyright, or mask work right infringement, unless otherwise

speciﬁed.

Limiting values deﬁnition — Limiting values given are in accordance with

the Absolute Maximum Rating System (IEC 60134). Stress above one or

more of the limiting values may cause permanent damage to the device.

These are stress ratings only and operation of the device at these or at any

other conditions above those given in the Characteristics sections of the

speciﬁcation is not implied. Exposure to limiting values for extended periods

may affect device reliability.

Application information — Applications that are described herein for any

of these products are for illustrative purposes only. Philips Semiconductors

make no representation or warranty that such applications will be suitable for

the speciﬁed use without further testing or modiﬁcation.

20. Trademarks

Notice — All referenced brands, product names, service names and

19. Disclaimers

trademarks are the property of their respective owners.

Life support — These products are not designed for use in life support

appliances, devices, or systems where malfunction of these products can

reasonably be expected to result in personal injury. Philips Semiconductors

21. Contact information

For additional information, please visit: http://www.semiconductors.philips.com

For sales ofﬁce addresses, send an email to: sales.addresses@www.semiconductors.philips.com

CBT3306_2

Product data sheet

Rev. 02 — 17 November 2005

12 of 13

CBT3306

Philips Semiconductors

Dual bus switch

22. Contents

1

2

3

4

5

General description . . . . . . . . . . . . . . . . . . . . . . 1

Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

Quick reference data . . . . . . . . . . . . . . . . . . . . . 1

Ordering information. . . . . . . . . . . . . . . . . . . . . 1

Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2

6

6.1

6.2

Pinning information. . . . . . . . . . . . . . . . . . . . . . 2

Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 2

7

7.1

8

Functional description . . . . . . . . . . . . . . . . . . . 3

Function selection. . . . . . . . . . . . . . . . . . . . . . . 3

Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3

Recommended operating conditions. . . . . . . . 3

Static characteristics. . . . . . . . . . . . . . . . . . . . . 4

Dynamic characteristics . . . . . . . . . . . . . . . . . . 4

AC waveforms. . . . . . . . . . . . . . . . . . . . . . . . . . 5

Test information. . . . . . . . . . . . . . . . . . . . . . . . . 6

Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 7

9

10

11

11.1

12

13

14

14.1

Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Introduction to soldering surface mount

packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Reﬂow soldering . . . . . . . . . . . . . . . . . . . . . . . . 9

Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . . 9

Manual soldering . . . . . . . . . . . . . . . . . . . . . . 10

Package related soldering information . . . . . . 10

14.2

14.3

14.4

14.5

15

16

17

18

19

20

21

Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 11

Revision history. . . . . . . . . . . . . . . . . . . . . . . . 11

Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 12

Deﬁnitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

Contact information . . . . . . . . . . . . . . . . . . . . 12

All rights are reserved. Reproduction in whole or in part is prohibited without the prior

written consent of the copyright owner. The information presented in this document does

not form part of any quotation or contract, is believed to be accurate and reliable and may

be changed without notice. No liability will be accepted by the publisher for any

consequence of its use. Publication thereof does not convey nor imply any license under

patent- or other industrial or intellectual property rights.

Date of release: 17 November 2005

Document number: CBT3306_2

Published in The Netherlands


型号：	CBT3306PW-T
厂家：	NXP
描述：	IC CBT/FST/QS/5C/B SERIES, DUAL 1-BIT DRIVER, TRUE OUTPUT, PDSO8, 4.4, PLASTIC, MO-153, SOT-530-1, TSSOP-8, Bus Driver/Transceiver 驱动光电二极管输出元件逻辑集成电路
文件：	总13页 (文件大小：68K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

CBT3306PW-T [NXP]

相关型号：

CBT3345C

CBT3383C

CBT3384

CBT3384A

CBT3384D

CBT3384D,118

CBT3384D-T

CBT3384DB

CBT3384DB,112

CBT3384DB-T

CBT3384DK

CBT3384DK,118