CBT6820DG [NXP]
IC CBT/FST/QS/5C/B SERIES, DUAL 10-BIT DRIVER, TRUE OUTPUT, PDSO48, PLASTIC, SOT-362, TSSOP-48, Bus Driver/Transceiver;
| 型号： | CBT6820DG |
| 厂家： | 
NXP |
| 描述： | IC CBT/FST/QS/5C/B SERIES, DUAL 10-BIT DRIVER, TRUE OUTPUT, PDSO48, PLASTIC, SOT-362, TSSOP-48, Bus Driver/Transceiver 开关 |
| 文件： | 总8页 (文件大小：56K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
INTEGRATED CIRCUITS
CBT6820
20-bit bus switch with precharged outputs
and Schottky undershoot protection for
live insertion
Product specification
1999 Apr 05
Philips
Semiconductors
Philips Semiconductors
Product specification
20-bit bus switch with precharged outputs and
Schottky undershoot protection for live insertion
CBT6820
FEATURES
PIN CONFIGURATION
• TTL compatible inputs and outputs
• 5Ω switch connection between two port A and port B
• Thin shrink small outline (TSSOP)
1OE
2OE
1B1
BIASV
1A1
1
2
3
48
47
• Undershoot protection included to prevent shoot through level
changes
1A2
46
• Bias voltage pre-charges the outputs to minimize signal distortion
1A3
4
5
45
44
1B2
1B3
during live insertion
1A4
6
1A5
43
42
41
1B4
1B5
GND
DESCRIPTION
7
1A6
The CBT6820 provides twenty bits of high-speed TTL-compatible
bus switching. The low on-state resistance of the switch allows
bi-directional connections to be made while adding near-zero
propagation delay. The device also precharges the B port to a
user-selectable bias voltage (BIASV) to minimize live-insertion
noise.
GND
8
1A7
1A8
9
40
39
1B6
1B7
1B8
1B9
1B10
10
11
12
13
14
15
16
17
18
19
20
21
1A9
38
37
36
35
34
33
32
31
30
29
28
1A10
The device is organized as two 10-bit switch with individual enable
(OE) input. When OE is low, the switch is on and port A is
connected to port B. When OE is high, the switch between port A
and port B is open and the B port is precharged to BIASV through
the equivalent of a 10-kΩ resistor.
2A1
2A2
2B1
V
2B2
2B3
GND
CC
2A3
Special clamp circuitry and Schottky diode clamps to ground are
used to prevent an under voltage on the A side (Vin < GND) from
causing the B side precharge voltage to drop below the ‘‘1” state.
GND
2A4
2A5
2B4
2B5
2B6
2B7
2A6
2A7
2A8
2A9
2B8
22
27
26
25
2B9
23
24
2B10
2A10
SA00520
QUICK REFERENCE DATA
CONDITIONS
= 25°C; GND = 0V
SYMBOL
PARAMETER
TYPICAL
UNIT
T
amb
Propagation delay
An to Bn or Bn to An
Input capacitance
t
/t
C = 50 pF, V = 5 V
0.25
ns
PLH PHL
L
CC
C
4.5
9.5
pF
pF
IN
C
Input/output capacitance
Outputs disabled; V = 0 V or V
O CC
I/O
ORDERING INFORMATION
PACKAGES
TEMPERATURE RANGE OUTSIDE NORTH AMERICA
–40°C to +85°C CBT6820 DGG
NORTH AMERICA
CBT6820 DGG
DWG NUMBER
48-Pin Plastic TSSOP Type II
SOT362–1
2
1999 Apr 05
853–2152 21177
Philips Semiconductors
Product specification
20-bit bus switch with precharged outputs and
Schottky undershoot protection for live insertion
CBT6820
PIN DESCRIPTION
LOGIC SYMBOL
PIN NUMBER
SYMBOL
NAME AND FUNCTION
1
BIASV
Bias voltage
1
2, 3, 4, 5, 6,
7, 9, 10, 11,12
1A1–1A10
GND
Port 1A1 to Port 1A10
Ground (V)
BIASV
8, 17, 32, 41
13, 14, 16, 18, 19,
20, 21, 22, 23, 24
2, 13
46, 35
xB1
2A1–2A10
Port 2A1 to Port 2A10
Positive supply voltage
Port 2B1 to Port 2B10
xA1
15
V
CC
35, 34, 33, 31, 30,
29, 28, 27, 26, 25
2B1–2B10
46, 45, 44, 43, 42,
40, 39, 38, 37, 36
1B1–1B10
1OE, 2OE
Port 1B1 to Port 1B10
Switch enables
12, 24
36, 25
xB10
48, 47
xA10
xOE
FUNCTION TABLE
OE
L
STATE
48, 47
A Port = B Port
A Port = Z
H
where x = 1 – 2
H
B Port = BIASV
H
L
Z
=
=
=
High voltage level
Low voltage level
High impedance “off” state
SA00506
ABSOLUTE MAXIMUM RATINGS
SYMBOL
PARAMETER
DC supply voltage
CONDITIONS
RATING
–0.5 to +7.0
–50
UNIT
V
V
CC
I
IK
DC clamp diode current
V < 0
I
mA
V
1
V
I
DC input voltage
–0.5 to +7.0
±128
I
DC continuous channel current
DC bias voltage
V
O
= 0 to V
CC
mA
V
SW
V
BIASV
–0.5 to +7.0
–65 to 150
T
stg
Storage temperature range
°C
Plastic thin shrink small outline package
(TSSOP)
øJA
104
°C/W
NOTE:
1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
RECOMMENDED OPERATING CONDITIONS
LIMITS
SYMBOL
PARAMETER
UNIT
Min
4.0
1.3
2.0
Max
V
CC
DC supply voltage
DC supply voltage
5.5
V
V
BIASV
V
CC
V
IH
High-level input voltage (control pin)
Low-level Input voltage (control pin)
Operating free-air temperature range
V
V
IL
0.8
V
T
amb
–40
+85
°C
3
1999 Apr 05
Philips Semiconductors
Product specification
20-bit bus switch with precharged outputs and
Schottky undershoot protection for live insertion
CBT6820
DC ELECTRICAL CHARACTERISTICS
LIMITS
SYMBOL
PARAMETER
TEST CONDITIONS
T
amb
= –40°C to +85°C
UNIT
1
Min
Typ
Max
V
IK
Input clamp voltage
V
CC
= 4.5V; I = –18mA
–1.2
V
I
I
Input leakage current (control pin)
Output bias current (B pins)
V
V
= 5.5V; V = GND or 5.5V
±5
µA
I
CC
I
I
O
= 4.5V; BiasV = 2.4V; V = 0, OE = V
CC
–0.25
mA
CC
O
I
Quiescent supply current
V
= 5.5V; I = 0, V = V or GND
2.5
2.5
mA
mA
CC
CC
O
I
CC
V
CC
= 5.5V, one input at 3.4V,
2
∆I
Control pins
CC
other inputs at V or GND
CC
C
Input capacitance per OE pin
V = 3V or 0
4.5
9.5
5
pF
pF
I
I
C
Capacitance per port (OFF-state)
V
V
V
V
V
V
= 3V or 0; switch off
O(OFF)
O
= 4.5V; V = 0V; I = 64mA
7
7
CC
CC
CC
I
I
3
r
On-resistance
= 4.5V; V = 0V; I = 30mA
5
Ω
on
I
I
= 4.5V; V = 2.4V; I = –15mA
10
3.6
15
3.9
I
I
V
P
Pass voltage
= V = 4.5V; I = –100µA
3.4
V
IN
CC
out
Undershoot static current
= 5.0V, V
= V
CC
CC
Bias
I
–10
mA
USP
4
protection
I = –5µA, V ≥ 3.0V
B B
NOTES:
1. All typical values are at VCC = 5V, TA = 25 C
2. This is the increase in supply current for each input that is at the specified TTL voltage level rather than V or GND
CC
3. Measured by the voltage drop between the A and the B terminals at the indicated current through the switch. On–state resistance is
determined by the lowest voltage of the two (A or B) terminals.
4. Force I , measure V ≥ 3V
USP B
4
1999 Apr 05
Philips Semiconductors
Product specification
20-bit bus switch with precharged outputs and
Schottky undershoot protection for live insertion
CBT6820
AC CHARACTERISTICS FOR V = 5.0V ±0.5V RANGE
CC
GND = 0V; t = t ≤ 2.5ns; C = 50pF.
r
f
L
LIMITS
SYMBOL
PARAMETER
WAVEFORM
T
amb
= –40 to +85°C
UNIT
1
MIN
TYP
MAX
0.25
2
t
Propagation delay; An to Bn; Bn to An
1
2
ns
ns
pd
3-State output enable time
OE to An; OE to Bn; BIASV = GND
t
1.3
1.4
1.7
2.8
3.1
2.9
2.8
4.4
5.3
4.6
4.5
6.6
PZH
3-State output enable time
OE to An; OE to Bn; BIASV = 3.0V
t
2
2
2
ns
ns
ns
PZL
PHZ
3-State output enable time
OE to An; OE to Bn; BIASV = GND
t
3-State output enable time
OE to An; OE to Bn; BIASV = 3.0V
t
PLZ
NOTE:
1. All typical values are measured at T
= 25°C and V = 5.0V
CC
amb
2. Warranted but not production tested. The propagation delay is based on the RC time constant of the typical ON-state resistance of the
switch and a load capacitance of 50pF, when driven by an ideal voltage source (zero output impedance)
AC WAVEFORMS
TEST CIRCUIT AND WAVEFORMS
V
= 1.5V, V = GND to 3.0V
M
IN
7 V
3 V
0 V
500 Ω
S1
From Output
Under Test
Open
GND
1.5V
1.5V
INPUT
500 Ω
C
= 50 pF
L
t
t
PHL
PLH
Load Circuit
V
OH
1.5V
1.5V
TEST
S1
OUTPUT
t
open
7 V
pd
V
OL
t
/t
PLZ PZL
SA00028
t
/t
open
PHZ PZH
Waveform 1. Waveforms Showing the Input (An) to Output (Bn)
Propagation Delays
DEFINITIONS
C
=
Load capacitance includes jig and probe capacitance;
see AC CHARACTERISTICS for value.
L
3V
SA00012
Output Control
NOTES:
1. All input pulses are supplied by generators having the following
characteristics: PRR ≤ 10MHz, Z = 50 Ω, t ≤ 2.5 ns, t ≤ 2.5 ns.
(Low-level
enabling
1.5 V
1.5 V
O
r
f
0V
t
t
2. The outputs are measured one at a time with one transition per
PLZ
PZL
3.5V
measurement.
Output
Waveform 1
S1 at 7 V
1.5 V
1.5 V
V
V
+ 0.3V
– 0.3V
OL
(see Note)
V
V
OL
t
t
PHZ
PZH
OH
Output
Waveform 2
S1 at Open
(see Note)
OH
0V
Note:
Waveform 1 is for an output with internal conditions such that
the output is low except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that
the output is high except when disabled by the output control.
SA00029
Waveform 2. Waveforms Showing the 3-State Output Enable
and Disable Times
5
1999 Apr 05
Philips Semiconductors
Product specification
20–bit bus switch with precharged outputs and
Schottky undershoot protection for live insertion
CBT6820
TSSOP48: plastic thin shrink small outline package; 48 leads; body width 6.1mm
SOT362-1
6
1999 Apr 05
Philips Semiconductors
Product specification
20–bit bus switch with precharged outputs and
Schottky undershoot protection for live insertion
CBT6820
NOTES
7
1999 Apr 05
Philips Semiconductors
Product specification
20–bit bus switch with precharged outputs and
Schottky undershoot protection for live insertion
CBT6820
DEFINITIONS
Data Sheet Identification
Product Status
Definition
This data sheet contains the design target or goal specifications for product development. Specifications
may change in any manner without notice.
Objective Specification
Formative or in Design
This data sheet contains preliminary data, and supplementary data will be published at a later date. Philips
Semiconductors reserves the right to make changes at any time without notice in order to improve design
and supply the best possible product.
Preliminary Specification
Product Specification
Preproduction Product
Full Production
This data sheet contains Final Specifications. Philips Semiconductors reserves the right to make changes
at any time without notice, in order to improve design and supply the best possible product.
Philips Semiconductors and Philips Electronics North America Corporation reserve the right to make changes, without notice, in the products,
including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips
Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright,
or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask
work right infringement, unless otherwise specified. Applications that are described herein for any of these products are for illustrative purposes
only. PhilipsSemiconductorsmakesnorepresentationorwarrantythatsuchapplicationswillbesuitableforthespecifiedusewithoutfurthertesting
or modification.
LIFE SUPPORT APPLICATIONS
Philips Semiconductors and Philips Electronics North America Corporation Products are not designed for use in life support appliances, devices,
orsystemswheremalfunctionofaPhilipsSemiconductorsandPhilipsElectronicsNorthAmericaCorporationProductcanreasonablybeexpected
to result in a personal injury. Philips Semiconductors and Philips Electronics North America Corporation customers using or selling Philips
Semiconductors and Philips Electronics North America Corporation Products for use in such applications do so at their own risk and agree to fully
indemnify Philips Semiconductors and Philips Electronics North America Corporation for any damages resulting from such improper use or sale.
Philips Semiconductors
811 East Arques Avenue
P.O. Box 3409
Sunnyvale, California 94088–3409
Telephone 800-234-7381
Philips Semiconductors and Philips Electronics North America Corporation
register eligible circuits under the Semiconductor Chip Protection Act.
Copyright Philips Electronics North America Corporation 1998
All rights reserved. Printed in U.S.A.
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