概述
数据手册CBTU0808 概述
Dual lane PCI Express port multiplexer 双通道PCI Express端口多路复用器
CBTU0808 数据手册
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PDF下载CBTU0808
Dual lane PCI Express port multiplexer
Rev. 01 — 2 June 2006
Product data sheet
1. General description
The CBTU0808 is a dual lane port multiplexer designed to provide convenient and reliable
path switching for PCI Express signals. It is organized as two PCI Express lanes, each
consisting of a Transmit and Receive channel. Each channel has four ports, two (A and B)
on the source (or host) side and two (A and B) on the destination (or device) side. Each
port provides a pair of signal lines to support PCIe differential signaling.
Using specially designed high-bandwidth and high off-isolation switch elements, source
and destination ports can be connected or isolated in three possible configurations:
source A and B to destinations A and B respectively; or source A to destination B
(remaining ports isolated), or all ports isolated.
The switch elements are controlled by internal control logic to set switch positions in
accordance with these three configurations, selectable by CMOS inputs CTRL0 and
CTRL1 for lanes 0 and 1 respectively. Within a lane, the switch configuration is always
applied identically to both transmit and receive channels.
The CBTU0808 is packaged in a 48-ball, depopulated 9 × 9 grid, 0.5 mm ball pitch, thin
profile fine-pitch ball grid array (TFBGA) package, which (while requiring a minimum
5 mm × 5 mm of board space) allows for adequate signal routing and escape using
conventional board technology.
2. Features
I 2-lane wide PCI Express port multiplexer
I One transmit and one receive differential channel per lane
I Four ports per channel
I PCI Express signaling compliant
I High bandwidth: > 1 GHz
I Low OFF-feedthrough of < −35 dB at 1.25 GHz
I Low channel crosstalk of < −35 dB at 1.25 GHz
I Designed to match characteristic impedance of PCIe signaling environment
I Single 1.8 V supply operation
I ESD resilience of 2 kV HBM
I Available in 48-ball, 5 mm × 5 mm, 0.5 mm ball pitch TFBGA package, Pb-free/Green
3. Applications
I High-performance computing applications
I Port switching and docking applications
CBTU0808
Philips Semiconductors
Dual lane PCI Express port multiplexer
4. Ordering information
Table 1.
Ordering information
Solder process
Type number
Package
Name
Description
Version
CBTU0808EE/G Pb-free (SnAgCu solder ball TFBGA48
compound)
plastic thin fine-pitch ball grid array package;
48 balls; body 5 × 5 × 0.8 mm
SOT918-1
5. Functional diagram
CBTU0808
CTRL[1:0]
CONTROL AND CONFIGURATION
TEST[1:0]
TXSA0P
TXSA0N
TXDA0P
TXDA0N
channel Tx0
TXSB0P
TXSB0N
TXDB0P
TXDB0N
LANE 0
RXSA0P
RXSA0N
RXDA0P
RXDA0N
channel Rx0
RXSB0P
RXSB0N
RXDB0P
RXDB0N
TXSA1P
TXSA1N
TXDA1P
TXDA1N
channel Tx1
TXSB1P
TXSB1N
TXDB1P
TXDB1N
LANE 1
RXSA1P
RXSA1N
RXDA1P
RXDA1N
channel Rx1
RXSB1P
RXSB1N
RXDB1P
RXDB1N
002aac139
Fig 1. Functional diagram
CBTU0808_1
© Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet
Rev. 01 — 2 June 2006
2 of 16
CBTU0808
Philips Semiconductors
Dual lane PCI Express port multiplexer
6. Pinning information
6.1 Pinning
ball A1
index area
CBTU0808EE/G
1
2 3 4 5 6 7 8 9
A
B
C
D
E
F
G
H
J
002aac213
Transparent top view
Fig 2. Pin configuration for TFBGA48
1
2
3
4
5
6
7
8
9
CTRL0
A
B
C
D
E
F
TXSB0P
TXSA0P
TXSA0N
GND
TXDA0P
TXDB0P
TEST1
RXSA0P
GND
TXSB0N
V
TXDA0N
TXDB0N
GND
RXDA0P
DD
RXSA0N
RXSB0N
RXDA0N
RXSB0P
GND
RXDB0N RXDB0P
V
V
GND
DD
DD
TXSA1P
TXSA1N
TXSB1N
GND
TXDA1N
TXDB1N
GND
TXDA1P
G
H
J
TXSB1P
TEST0
RXSA1N RXSB1N
RXSB1P
V
RXDB1N RXDA1N
RXDB1P
TXDB1P
DD
RXSA1P
GND
RXDA1P
CTRL1
002aac212
48-ball, 9 × 9 grid; top view. An empty cell indicates no ball is populated at that grid point.
Fig 3. Ball mapping
CBTU0808_1
© Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet
Rev. 01 — 2 June 2006
3 of 16
CBTU0808
Philips Semiconductors
Dual lane PCI Express port multiplexer
6.2 Pin description
Table 2.
Pin description
Signal group Symbol
Pin
A1
J9
Type
Description
Test and
control
CTRL0
CTRL1
TEST0
CMOS Switch configuration control inputs. See
input
Table 3 “Switch configuration truth table”.
J1
CMOS Test input. Used for test purposes only.
input
Should be left open-circuit during normal
operation. An internal pull-down resistor
will default this pin to a LOW state.
TEST1
A9
output Test output. Used for test purposes only.
Should be left open-circuit in normal
application.
Signal ports
TXSA0P, TXSA0N, A4, B4, signal Transmit ports A and B differential signal
TXSB0P, TXSB0N A2, B3 port terminals for Lane 0, Source side.
RXSA0P, RXSA0N, B1, C2, signal Receive ports A and B differential signal
RXSB0P, RXSB0N D1, D2 port terminals for Lane 0, Source side.
TXSA1P, TXSA1N, F1, F2, signal Transmit ports A and B differential signal
TXSB1P, TXSB1N H1, G2 port terminals for Lane 1, Source side.
RXSA1P, RXSA1N, J2, H3, signal Receive ports A and B differential signal
RXSB1P, RXSB1N J4, H4 port terminals for Lane 1, Source side.
TXDA0P, TXDA0N, A6, B6, signal Transmit ports A and B differential signal
TXDB0P, TXDB0N A8, B7 port terminals for Lane 0, Destination side.
RXDA0P, RXDA0N, B9, C8, signal Receive ports A and B differential signal
RXDB0P, RXDB0N D9, D8 port terminals for Lane 0, Destination side.
TXDA1P, TXDA1N, F9, F8, signal Transmit ports A and B differential signal
TXDB1P, TXDB1N H9, G8 port terminals for Lane 1, Destination side.
RXDA1P, RXDA1N, J8, H7, signal Receive ports A and B differential signal
RXDB1P, RXDB1N J6, H6 port terminals for Lane 1, Destination side.
Power
VDD
B5, E2, power power supply pins
E8, H5
GND
A5, B2, power ground pins
B8, E1,
E9, H2,
H8, J5
CBTU0808_1
© Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet
Rev. 01 — 2 June 2006
4 of 16
CBTU0808
Philips Semiconductors
Dual lane PCI Express port multiplexer
7. Functional description
7.1 Functional description
7.1.1 General information
The CBTU0808 Dual lane PCI Express port multiplexer is designed to allow port switching
of up to two PCI Express lanes (each including a Transmit and Receive channel)
according to three switch configuration settings (described in Section 7.1.2.1). The basic
switch element of the CBTU0808 is designed integrally with its package and chip
interconnect to present an optimum characteristic on-impedance when used in a
PCI Express signaling environment, and to provide high off-port isolation and low
crosstalk.
7.1.2 Functional information
The following paragraphs describe the control and configuration possibilities available in
the CBTU0808.
7.1.2.1 Switch configuration
The position of the port switches is controlled by CMOS input signals CTRL[1:0] and can
be overridden by CMOS input TEST0 to disconnect (open) all ports between source and
destination. For a given lane, the switch positions are always identical between transmit
and receive channels. Lane 0 is controlled by CTRL0 and Lane 1 is controlled by CTRL1.
The truth table for the switch position as a function of these inputs is shown in Table 3.
Table 3.
Inputs
Switch configuration truth table
Function
CTRLn[1] TEST0
Source ports[1] Destination ports
Comment
A
B
LOW
LOW
LOW
HIGH
HIGH
An
Bn
An
Bn
An
Bn
Ron
high-Z
Ron
SA:DA/SB:DB
(Dual Through mode)
high-Z
high-Z
high-Z
high-Z
high-Z
HIGH[2]
LOW
Ron
SA:DB
(Single Cross mode)
high-Z
high-Z
high-Z
All ports open-circuit
(Disconnect mode)
> LOW
Test mode for internal use only
do not use
[1] n is the Lane number (0 or 1).
[2] CTRL1 or CTRL0 = HIGH.
CBTU0808_1
© Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet
Rev. 01 — 2 June 2006
5 of 16
CBTU0808
Philips Semiconductors
Dual lane PCI Express port multiplexer
8. Limiting values
Table 4.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
VDD
VI
Parameter
Conditions
Min
Max
+2.5
+2.5
−50
Unit
V
supply voltage
−0.5
[1]
input voltage
−0.5
V
IIK
input clamping current
output clamping current
output current
VI < 0 V or VI > VDD
-
-
-
-
mA
mA
mA
mA
IOK
VO < 0 V or VO > VDD
continuous; 0 V < VO < VDD
±50
IO
±50
ICCC
continuous current through each
±100
V
DD or GND pin
Tstg
storage temperature
−65
>2
+150
°C
kV
V
Vesd
electrostatic discharge voltage
Human Body Model; 1.5 kΩ; 100 pF
Machine Model; 0 Ω; 200 pF
-
-
>200
[1] The input and output negative-voltage ratings may be exceeded if the input and output current ratings are observed.
9. Recommended operating conditions
Table 5.
Symbol
VDD
Recommended operating conditions
Parameter
Conditions
Min
Typ
Max
Unit
supply voltage
1.7
-
-
-
-
-
1.9
V
V
V
V
V
VI
input voltage
TXn and RXn ports
−0.25
+1.75
VDD
[1]
[1]
VIH
HIGH-level input voltage
LOW-level input voltage
CTRL[1:0], TEST inputs
CTRL[1:0], TEST[1:0] inputs
0.65 × VDD
VIL
-
0.35 × VDD
1.5
VICR
common mode input voltage TXn and RXn ports
range
0
[2]
VI(dif)(p-p)
Tamb
peak-to-peak differential
input voltage
TXn and RXn ports
-
-
-
1.2
V
ambient temperature
operating in free air
0
+85
°C
[1] The CTRL[1:0] inputs of the device must be held at valid levels (not floating) to ensure proper device operation.
[2] VI(dif)(p-p) = 2 × |VTX_D+ − VTX_D−|. See Paragraph 4.3.3, Table 4-5 of Ref. 1.
CBTU0808_1
© Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet
Rev. 01 — 2 June 2006
6 of 16
CBTU0808
Philips Semiconductors
Dual lane PCI Express port multiplexer
10. Static characteristics
Table 6.
Static characteristics
Over recommended operating conditions, unless otherwise noted.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
[1]
IDD
supply current
-
-
1
mA
Digital inputs CTRL[1:0] and TEST0
ILI
Ci
input leakage current
input capacitance
VI = VDD or GND
VI = VDD or GND
-
-
-
-
±5
µA
5
pF
Signal ports TXSA0P … RXDB1N
ILI
input leakage current
VI = VDD or GND; TEST0 = HIGH
(Disconnect mode)
−100
-
+100
µA
Ron(sw)
switch on-state resistance
8
-
10
12
Ω
Ω
∆Ron(sw)
switch on-state resistance
variation
over recommended VID (input
voltage) range
0.5
0.75
CS(ON)
ON-state capacitance
VI = 0.9 V
switch; simulated value of the
silicon switch only, excluding
package parasitics
-
3.6
4.75
pF
[1] Static operating current.
CBTU0808_1
© Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet
Rev. 01 — 2 June 2006
7 of 16
CBTU0808
Philips Semiconductors
Dual lane PCI Express port multiplexer
11. Dynamic characteristics
Table 7.
Dynamic characteristics
Over recommended operating conditions, unless otherwise noted. Characterization bandwidth: 10 MHz < foper < 6 GHz.
Symbol Parameter
Conditions
Min
Typ
60
-
Max
-
Unit
ps
tPD
propagation delay
start-up time
Figure 5
-
-
tstartup
supply voltage valid to switch specified operating
characteristics
100
µs
trcfg
reconfiguration time CTRL[1:0], TEST0 setting change to switch specified
operating characteristics
-
-
-
-
-
-
-
-
100
40
40
5
µs
ps
ps
ps
tsk(o)
output skew time
difference in propagation delay between any two ‘ON’
paths within a channel; Figure 6
tsk(edge) edge skew time
difference of rising edge propagation delay to falling
edge propagation delay; Figure 7
tsk(dif)
s12
differential skew time difference in propagation delay between two
members of a differential pair; Figure 8
reverse transmission Differential mode ON insertion loss; ON-state
coefficient
f = 50 MHz
−0.8
−2
-
-
-
-
-
-
dB
dB
dB
f = 625 MHz
f ≤ 1.25 GHz
−3.3
s21
s11
s22
s12
forward transmission Differential mode ON insertion loss; ON-state
coefficient
f = 50 MHz
−0.8
−2
-
-
-
-
-
-
dB
dB
dB
f = 625 MHz
f ≤ 1.25 GHz
−3.3
input reflection
coefficient
Differential mode ON return loss; ON-state
f = 50 MHz
-
-
-
-
-
-
−20
−8
dB
dB
dB
f = 625 MHz
f ≤ 1.25 GHz
−6.0
output reflection
coefficient
Differential mode ON return loss; ON-state
f = 50 MHz
-
-
-
-
-
-
−20
−8
dB
dB
dB
f = 625 MHz
f ≤ 1.25 GHz
−6.0
reverse transmission Differential mode port-to-port crosstalk;
coefficient
ON/OFF-state
f = 50 MHz
-
-
-
-
-
-
−35
−35
−35
dB
dB
dB
f = 625 MHz
f = 1.25 GHz
s21
forward transmission Differential mode port-to-port crosstalk;
coefficient
ON/OFF-state
f = 50 MHz
-
-
-
-
-
-
−35
−35
−35
dB
dB
dB
f = 625 MHz
f = 1.25 GHz
CBTU0808_1
© Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet
Rev. 01 — 2 June 2006
8 of 16
CBTU0808
Philips Semiconductors
Dual lane PCI Express port multiplexer
Table 7.
Dynamic characteristics …continued
Over recommended operating conditions, unless otherwise noted. Characterization bandwidth: 10 MHz < foper < 6 GHz.
Symbol Parameter
Conditions
Min
Typ
Max
Unit
s12
reverse transmission Differential mode off-port feedthrough; OFF-state
coefficient
f = 50 MHz
-
-
-
-
-
-
−35
−35
−35
dB
dB
dB
f = 625 MHz
f = 1.25 GHz
s21
forward transmission Differential mode off-port feedthrough; OFF-state
coefficient
f = 50 MHz
-
-
-
-
-
-
−35
−35
−35
dB
dB
dB
f = 625 MHz
f = 1.25 GHz
002aac278
0
(1)
s , s
11 21
,
s
, s
12 22
(dB)
−6
(2)
−12
−18
−24
0
1.25
2.50
3.75
5.00
f (GHz)
(1) insertion loss
(2) return loss
Fig 4. S parameters
1.8 V
V
V
V
V
OH
OL
OH
OL
input
0.9 V
0.9 V
t
output
0 V
t
t
sk(o)
PLH
PHL
V
V
OH
output
V
V
output
ref
ref
OL
002aac274
002aac275
Fig 5. Propagation delay
Fig 6. Output skew
CBTU0808_1
© Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet
Rev. 01 — 2 June 2006
9 of 16
CBTU0808
Philips Semiconductors
Dual lane PCI Express port multiplexer
1.8 V
0 V
1.8 V
input
input
0.9 V
PLH
0.9 V
PHL
0.9 V
0.9 V
0 V
t
t
t
t
sk(dif)
sk(dif)
V
V
1.8 V
OH
output
0.9 V
0.9 V
input
0.9 V
0.9 V
0 V
OL
002aac277
002aac276
tsk(edge)
=
|tsk(edge) rising − tsk(edge) falling|
Fig 7. Edge skew
Fig 8. Differential skew
12. Test information
TXDx, RXDx
TXSx, RXSx
DUT
C
6 pF
L
50 Ω
002aac273
CL represents board and jig and does not indicate additional capacitance.
All input pulses are supplied by generators having the following characteristics:
PRR ≤ 10 MHz; Zo = 50 Ω; slew rate = 2.5 V/ns
Fig 9. Test circuit
CBTU0808_1
© Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet
Rev. 01 — 2 June 2006
10 of 16
CBTU0808
Philips Semiconductors
Dual lane PCI Express port multiplexer
13. Package outline
TFBGA48: plastic thin fine-pitch ball grid array package; 48 balls; body 5 x 5 x 0.8 mm
SOT918-1
B
A
D
ball A1
index area
A
2
E
A
A
1
detail X
e
1
C
M
M
v
C
C
A
B
e
b
y
y
w
C
1
J
H
G
F
e
2
E
D
C
B
A
e
ball A1
index area
1
2
3
4
5
6
7
8
9
X
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
A
UNIT
A
1
A
2
b
D
E
e
e
1
e
2
v
w
y
y
1
max
0.25 0.90 0.35
0.15 0.75 0.25
5.1
4.9
5.1
4.9
mm
1.15
0.5
4
4
0.15 0.05 0.08
0.1
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
JEITA
05-09-21
05-10-13
SOT918-1
- - -
MO-195
- - -
Fig 10. Package outline SOT918-1 (TFBGA48)
CBTU0808_1
© Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet
Rev. 01 — 2 June 2006
11 of 16
CBTU0808
Philips Semiconductors
Dual lane PCI Express port multiplexer
14. Soldering
14.1 Introduction to soldering surface mount packages
There is no soldering method that is ideal for all surface mount IC packages. Wave
soldering can still be used for certain surface mount ICs, but it is not suitable for fine pitch
SMDs. In these situations reflow soldering is recommended.
14.2 Reflow soldering
Reflow soldering requires solder paste (a suspension of fine solder particles, flux and
binding agent) to be applied to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement. Driven by legislation and
environmental forces the worldwide use of lead-free solder pastes is increasing.
Several methods exist for reflowing; for example, convection or convection/infrared
heating in a conveyor type oven. Throughput times (preheating, soldering and cooling)
vary between 100 seconds and 200 seconds depending on heating method.
Typical reflow temperatures range from 215 °C to 260 °C depending on solder paste
material. The peak top-surface temperature of the packages should be kept below:
Table 8.
SnPb eutectic process - package peak reflow temperatures (from J-STD-020C
July 2004)
Package thickness
< 2.5 mm
Volume mm3 < 350
240 °C + 0/−5 °C
225 °C + 0/−5 °C
Volume mm3 ≥ 350
225 °C + 0/−5 °C
225 °C + 0/−5 °C
≥ 2.5 mm
Table 9.
Pb-free process - package peak reflow temperatures (from J-STD-020C July
2004)
Package thickness
Volume mm3 < 350
Volume mm3 350 to
2000
Volume mm3 > 2000
< 1.6 mm
260 °C + 0 °C
260 °C + 0 °C
250 °C + 0 °C
260 °C + 0 °C
250 °C + 0 °C
245 °C + 0 °C
260 °C + 0 °C
245 °C + 0 °C
245 °C + 0 °C
1.6 mm to 2.5 mm
≥ 2.5 mm
Moisture sensitivity precautions, as indicated on packing, must be respected at all times.
14.3 Wave soldering
Conventional single wave soldering is not recommended for surface mount devices
(SMDs) or printed-circuit boards with a high component density, as solder bridging and
non-wetting can present major problems.
To overcome these problems the double-wave soldering method was specifically
developed.
If wave soldering is used the following conditions must be observed for optimal results:
• Use a double-wave soldering method comprising a turbulent wave with high upward
pressure followed by a smooth laminar wave.
• For packages with leads on two sides and a pitch (e):
CBTU0808_1
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Product data sheet
Rev. 01 — 2 June 2006
12 of 16
CBTU0808
Philips Semiconductors
Dual lane PCI Express port multiplexer
– larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be
parallel to the transport direction of the printed-circuit board;
– smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the
transport direction of the printed-circuit board.
The footprint must incorporate solder thieves at the downstream end.
• For packages with leads on four sides, the footprint must be placed at a 45° angle to
the transport direction of the printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.
During placement and before soldering, the package must be fixed with a droplet of
adhesive. The adhesive can be applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the adhesive is cured.
Typical dwell time of the leads in the wave ranges from 3 seconds to 4 seconds at 250 °C
or 265 °C, depending on solder material applied, SnPb or Pb-free respectively.
A mildly-activated flux will eliminate the need for removal of corrosive residues in most
applications.
14.4 Manual soldering
Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage
(24 V or less) soldering iron applied to the flat part of the lead. Contact time must be
limited to 10 seconds at up to 300 °C.
When using a dedicated tool, all other leads can be soldered in one operation within
2 seconds to 5 seconds between 270 °C and 320 °C.
14.5 Package related soldering information
Table 10. Suitability of surface mount IC packages for wave and reflow soldering methods
Package[1]
Soldering method
Wave
Reflow[2]
BGA, HTSSON..T[3], LBGA, LFBGA, SQFP,
SSOP..T[3], TFBGA, VFBGA, XSON
not suitable
suitable
DHVQFN, HBCC, HBGA, HLQFP, HSO, HSOP,
HSQFP, HSSON, HTQFP, HTSSOP, HVQFN,
HVSON, SMS
not suitable[4]
suitable
PLCC[5], SO, SOJ
suitable
suitable
LQFP, QFP, TQFP
not recommended[5][6]
not recommended[7]
not suitable
suitable
SSOP, TSSOP, VSO, VSSOP
CWQCCN..L[8], PMFP[9], WQCCN..L[8]
suitable
not suitable
[1] For more detailed information on the BGA packages refer to the (LF)BGA Application Note (AN01026);
order a copy from your Philips Semiconductors sales office.
[2] All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the
maximum temperature (with respect to time) and body size of the package, there is a risk that internal or
external package cracks may occur due to vaporization of the moisture in them (the so called popcorn
effect). For details, refer to the Drypack information in the Data Handbook IC26; Integrated Circuit
Packages; Section: Packing Methods.
CBTU0808_1
© Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet
Rev. 01 — 2 June 2006
13 of 16
CBTU0808
Philips Semiconductors
Dual lane PCI Express port multiplexer
[3] These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no
account be processed through more than one soldering cycle or subjected to infrared reflow soldering with
peak temperature exceeding 217 °C ± 10 °C measured in the atmosphere of the reflow oven. The package
body peak temperature must be kept as low as possible.
[4] These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the
solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink
on the top side, the solder might be deposited on the heatsink surface.
[5] If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
[6] Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
[7] Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger
than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
[8] Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered
pre-mounted on flex foil. However, the image sensor package can be mounted by the client on a flex foil by
using a hot bar soldering process. The appropriate soldering profile can be provided on request.
[9] Hot bar soldering or manual soldering is suitable for PMFP packages.
15. Abbreviations
Table 11. Abbreviations
Acronym
CMOS
PCI
Description
Complementary Metal Oxide Semiconductor
Peripheral Component Interconnect
PCI Express
PCIe
DUT
Device Under Test
ESD
ElectroStatic Discharge
Human Body Model
HBM
PRR
Pulse Repetition Rate
Machine Model
MM
16. References
[1] PCI Express Base Specification, Rev 1.1 — Revision 1.1, March 2005.
17. Revision history
Table 12. Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
CBTU0808_1
20060602
Product data sheet
-
-
CBTU0808_1
© Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet
Rev. 01 — 2 June 2006
14 of 16
CBTU0808
Philips Semiconductors
Dual lane PCI Express port multiplexer
18. Legal information
18.1 Data sheet status
Document status[1][2]
Product status[3]
Development
Definition
Objective [short] data sheet
This document contains data from the objective specification for product development.
This document contains data from the preliminary specification.
This document contains the product specification.
Preliminary [short] data sheet Qualification
Product [short] data sheet Production
[1]
[2]
[3]
Please consult the most recently issued document before initiating or completing a design.
The term ‘short data sheet’ is explained in section “Definitions”.
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.semiconductors.philips.com.
malfunction of a Philips Semiconductors product can reasonably be expected
18.2 Definitions
to result in personal injury, death or severe property or environmental
damage. Philips Semiconductors accepts no liability for inclusion and/or use
of Philips Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is for the customer’s own risk.
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. Philips Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. Philips Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local Philips Semiconductors
sales office. In case of any inconsistency or conflict with the short data sheet,
the full data sheet shall prevail.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and and
operation of the device at these or any other conditions above those given in
the Characteristics sections of this document is not implied. Exposure to
limiting values for extended periods may affect device reliability.
Terms and conditions of sale — Philips Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.semiconductors.philips.com/profile/terms, including those
pertaining to warranty, intellectual property rights infringement and limitation
of liability, unless explicitly otherwise agreed to in writing by Philips
18.3 Disclaimers
General — Information in this document is believed to be accurate and
reliable. However, Philips Semiconductors does not give any representations
or warranties, expressed or implied, as to the accuracy or completeness of
such information and shall have no liability for the consequences of use of
such information.
Semiconductors. In case of any inconsistency or conflict between information
in this document and such terms and conditions, the latter will prevail.
No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or the
grant, conveyance or implication of any license under any copyrights, patents
or other industrial or intellectual property rights.
Right to make changes — Philips Semiconductors reserves the right to
make changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
18.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
Suitability for use — Philips Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
19. Contact information
For additional information, please visit: http://www.semiconductors.philips.com
For sales office addresses, send an email to: sales.addresses@www.semiconductors.philips.com
CBTU0808_1
© Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet
Rev. 01 — 2 June 2006
15 of 16
CBTU0808
Philips Semiconductors
Dual lane PCI Express port multiplexer
20. Contents
1
2
3
4
5
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Ordering information. . . . . . . . . . . . . . . . . . . . . 2
Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2
6
6.1
6.2
Pinning information. . . . . . . . . . . . . . . . . . . . . . 3
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4
7
7.1
7.1.1
7.1.2
7.1.2.1
Functional description . . . . . . . . . . . . . . . . . . . 5
Functional description. . . . . . . . . . . . . . . . . . . . 5
General information . . . . . . . . . . . . . . . . . . . . . 5
Functional information . . . . . . . . . . . . . . . . . . . 5
Switch configuration . . . . . . . . . . . . . . . . . . . . . 5
8
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 6
Recommended operating conditions. . . . . . . . 6
Static characteristics. . . . . . . . . . . . . . . . . . . . . 7
Dynamic characteristics . . . . . . . . . . . . . . . . . . 8
Test information. . . . . . . . . . . . . . . . . . . . . . . . 10
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 11
9
10
11
12
13
14
14.1
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Introduction to soldering surface mount
packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 12
Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 12
Manual soldering . . . . . . . . . . . . . . . . . . . . . . 13
Package related soldering information . . . . . . 13
14.2
14.3
14.4
14.5
15
16
17
Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 14
References . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Revision history. . . . . . . . . . . . . . . . . . . . . . . . 14
18
Legal information. . . . . . . . . . . . . . . . . . . . . . . 15
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 15
Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 15
18.1
18.2
18.3
18.4
19
20
Contact information. . . . . . . . . . . . . . . . . . . . . 15
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© Koninklijke Philips Electronics N.V. 2006.
All rights reserved.
For more information, please visit: http://www.semiconductors.philips.com.
For sales office addresses, email to: sales.addresses@www.semiconductors.philips.com.
Date of release: 2 June 2006
Document identifier: CBTU0808_1
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