GTL2002DP [NXP]

2-bit bi-directional low voltage translator; 2位双向低电压转换
GTL2002DP
型号: GTL2002DP
厂家: NXP    NXP
描述:

2-bit bi-directional low voltage translator
2位双向低电压转换

驱动程序和接口 接口集成电路 光电二极管
文件: 总14页 (文件大小:115K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
INTEGRATED CIRCUITS  
GTL2002  
2-bit bi-directional low voltage translator  
Product data sheet  
2004 Sep 29  
Supersedes data of 2003 Apr 01  
Philips  
Semiconductors  
Philips Semiconductors  
Product data sheet  
2-bit bi-directional low voltage translator  
GTL2002  
FEATURES  
DESCRIPTION  
The Gunning Transceiver Logic — Transceiver Voltage Clamps  
2-bit bi-directional low voltage translator  
(GTL–TVC) provide high-speed voltage translation with low  
ON-state resistance and minimal propagation delay. The GTL2002  
provides 2 NMOS pass transistors (Sn and Dn) with a common gate  
Allows voltage level translation between 1.0 V, 1.2 V, 1.5 V, 1.8 V,  
2.5 V, 3.3 V, and 5 V buses which allows direct interface with GTL,  
GTL+, LVTTL/TTL and 5 V CMOS levels  
(G  
) and a reference transistor (S  
REF  
and D ). The device  
REF  
REF  
allows bi-directional voltage translations between 1.0 V and 5.0 V  
without use of a direction pin.  
Provides bi-directional voltage translation with no direction pin  
Low 6.5 RDS resistance between input and output pins  
ON  
When the Sn or Dn port is LOW the clamp is in the ON-state and a  
low resistance connection exists between the Sn and Dn ports.  
Assuming the higher voltage is on the Dn port, when the Dn port is  
high, the voltage on the Sn port is limited to the voltage set by the  
(Sn/Dn)  
Supports hot insertion  
No power supply required - Will not latch up  
5 V tolerant inputs  
reference transistor (S  
). When the Sn port is high, the Dn port is  
REF  
pulled to V by the pull up resistors. This functionality allows a  
CC  
seamless translation between higher and lower voltages selected by  
the user, without the need for directional control.  
Low stand-by current  
All transistors have the same electrical characteristics and there is  
minimal deviation from one output to another in voltage or  
propagation delay. This is a benefit over discrete transistor voltage  
translation solutions, since the fabrication of the transistors is  
symmetrical. Because all transistors in the device are identical,  
Flow-through pinout for ease of printed circuit board trace routing  
ESD protection exceeds 2000 V HBM per JESD22-A114,  
200 V MM per JESD22-A115, and 1000 V per JESD22-C101  
Packages offered: SO8, TSSOP8 (MSOP8), VSSOP8  
S
REF  
and D  
can be located on any of the other two matched  
REF  
Sn/Dn transistors, allowing for easier board layout. The translator’s  
transistors provides excellent ESD protection to lower voltage  
devices and at the same time protect less ESD resistant devices.  
APPLICATIONS  
Any application that requires bi-directional or unidirectional  
voltage level translation from any voltage between 1.0 V and 5.0 V  
to any voltage between 1.0 V and 5.0 V  
The open drain construction with no direction pin is ideal for  
bi-directional low voltage (e.g., 1.0 V, 1.2 V, 1.5 V, or 1.8 V)  
processor I C port translation to the normal 3.3 V or 5.0 V I C-bus  
signal levels or GTL/GTL+ translation to LVTTL/TTL signal levels.  
2
2
ORDERING INFORMATION  
PACKAGES  
8-Pin Plastic SO  
TEMPERATURE RANGE  
–40 °C to +85 °C  
ORDER CODE  
GTL2002D  
TOPSIDE MARK  
GTL2002  
2002  
DWG NUMBER  
SOT96–1  
8-Pin Plastic TSSOP (MSOP)  
8-Pin Plastic VSSOP  
–40 °C to +85 °C  
GTL2002DP  
GTL2002DC  
SOT505–1  
SOT765–1  
–40 °C to +85 °C  
2002  
Standard packing quantities and other packaging data is available at www.standardproducts.philips.com/packaging.  
2
2004 Sep 29  
Philips Semiconductors  
Product data sheet  
2-bit bi-directional low voltage translator  
GTL2002  
PIN CONFIGURATION  
FUNCTION TABLE  
LOW-to-HIGH translation assuming Dn is at the higher voltage level  
G
D
S
REF  
In-Sn  
Out-Dn  
Transistor  
Off  
REF  
REF  
1
2
3
8
7
GND  
G
REF  
H
H
0 V  
X
X
S
D
REF  
REF  
1
H
H
L
H
H
L
V
V
TT  
H
nearly off  
On  
TT  
TT  
S
6
5
D
1
1
2
2
V
L
L
S
D
2
4
0 – V  
X
X
Off  
TT  
SA00640  
H
L
X
=
=
=
HIGH voltage level  
LOW voltage level  
Don’t Care  
Figure 1. SO8 and TSSOP8 pinning  
NOTES:  
1. Dn is pulled up to V through an external resistor.  
CC  
2. Dn follows the Sn input LOW.  
3. G  
should be at least 1.5 V higher than S  
for best  
REF  
REF  
1
2
3
8
7
S
G
D
REF  
REF  
translator operation.  
S
1
4. V is equal to the S  
voltage.  
REF  
TT  
REF  
S
2
6
5
D
1
GND  
D
2
4
CLAMP SCHEMATIC  
SA00658  
D
G
REF  
D1  
D2  
REF  
Figure 2. VSSOP8 pinning  
PIN DESCRIPTION  
PIN NUMBER  
SYMBOL  
NAME AND FUNCTION  
SO8 and  
TSSOP8  
VSSOP8  
1
2
4
1
GND  
Ground (0 V)  
S
REF  
Source of reference transistor  
S
S1  
S2  
REF  
3, 4  
5, 6  
7
2, 3  
5, 6  
7
S
Port S and Port S  
1 2  
n
D
Port D and Port D  
1 2  
SA00645  
n
D
Drain of reference transistor  
Gate of reference transistor  
REF  
REF  
Figure 3. Clamp schematic  
8
8
G
FUNCTION TABLE  
HIGH-to-LOW translation assuming Dn is at the higher voltage level  
G
D
S
REF  
In-Dn  
Out-Sn  
Transistor  
REF  
REF  
H
H
0 V  
X
H
L
X
Off  
On  
On  
Off  
1
H
H
L
H
H
L
V
TT  
V
TT  
V
TT  
2
L
0 – V  
X
X
TT  
H
L
X
=
=
=
HIGH voltage level  
LOW voltage level  
Don’t Care  
NOTES:  
1. Sn is not pulled up or pulled down.  
2. Sn follows the Dn input LOW.  
3. G  
should be at least 1.5 V higher than S  
for best  
REF  
REF  
translator operation.  
4. V is equal to the S  
voltage.  
TT  
REF  
3
2004 Sep 29  
Philips Semiconductors  
Product data sheet  
2-bit bi-directional low voltage translator  
GTL2002  
APPLICATIONS  
Bi-directional translation  
For the bi-directional clamping configuration, higher voltage to lower voltage or lower voltage to higher voltage, the G  
input must be  
REF  
connected to D  
and both pins pulled to HIGH side V through a pull-up resistor (typically 200 k). A filter capacitor on D  
is  
REF  
REF  
CC  
recommended. The processor output can be totem pole or open drain (pull-up resistors may be required) and the chipset output can be totem  
pole or open drain (pull-up resistors are required to pull the Dn outputs to V ). However, if either output is totem pole, data must be  
CC  
uni-directional or the outputs must be 3-statable and the outputs must be controlled by some direction control mechanism to prevent  
HIGH-to-LOW contentions in either direction. If both outputs are open drain, no direction control is needed. The opposite side of the reference  
transistor (S  
) is connected to the processor core power supply voltage. When D  
is connected through a 200 kresistor to a 3.3 V to  
REF  
REF  
5.5 V V supply and S  
is set between 1.0 V to V – 1.5 V, the output of each Sn has a maximum output voltage equal to S  
and the  
REF  
CC  
REF  
CC  
output of each Dn has a maximum output voltage equal to V  
.
CC  
TYPICAL BI-DIRECTIONAL VOLTAGE TRANSLATION  
1.8 V  
1.5 V  
5 V  
200 k  
1.2 V  
1.0 V  
GTL2002  
TOTEM POLE OR  
OPEN DRAIN I/O  
GND  
G
D
REF  
S
V
REF  
CORE  
V
REF  
D1  
CC  
S1  
S2  
CPU I/O  
CHIPSET I/O  
D2  
3.3 V  
INCREASE BIT  
SIZE BY USING  
10 BIT GTL2010 OR  
22 BIT GTL2000  
V
CC  
S3  
D3  
D4  
CHIPSET I/O  
S4  
S5  
D5  
Dn  
Sn  
SA00642  
2
Figure 4. Bi-directional translation to multiple higher voltage levels such as an I C-bus application  
4
2004 Sep 29  
Philips Semiconductors  
Product data sheet  
2-bit bi-directional low voltage translator  
GTL2002  
Uni-directional down translation  
For uni-directional clamping, higher voltage to lower voltage, the G  
input must be connected to D  
and both pins pulled to the higher side  
REF  
REF  
V
CC  
through a pull-up resistor (typically 200 k). A filter capacitor on D  
is recommended. Pull-up resistors are required if the chipset I/O are  
REF  
open drain. The opposite side of the reference transistor (S  
) is connected to the processor core supply voltage. When D  
is connected  
REF  
REF  
through a 200 kresistor to a 3.3 V to 5.5 V V supply and S  
is set between 1.0 V to V – 1.5 V, the output of each Sn has a maximum  
CC  
CC  
REF  
output voltage equal to S  
.
REF  
TYPICAL UNI-DIRECTIONAL – HIGH TO LOW VOLTAGE TRANSLATION  
1.8 V  
1.5 V  
5 V  
200 kΩ  
1.2 V  
1.0 V  
GTL2002  
GND  
G
D
REF  
EASY MIGRATION TO  
LOWER VOLTAGE AS PRO-  
CESSOR GEOMETRY  
SHRINKS.  
S
V
REF  
REF  
V
CORE  
CC  
S1  
S2  
D1  
D2  
CPU I/O  
CHIPSET I/O  
TOTEM POLE I/O  
SA00643  
Figure 5. Uni-directional down translation, to protect low voltage processor pins  
Uni-directional up translation  
For uni-directional up translation, lower voltage to higher voltage, the reference transistor is connected the same as for a down translation.  
A pull-up resistor is required on the higher voltage side (Dn or Sn) to get the full HIGH level, since the GTL–TVC device will only pass the  
reference source (S  
open drain.  
) voltage as a HIGH when doing an up translation. The driver on the lower voltage side only needs pull-up resistors if it is  
REF  
TYPICAL UNI-DIRECTIONAL – LOW TO HIGH VOLTAGE TRANSLATION  
1.8 V  
5 V  
1.5 V  
200 kΩ  
1.2 V  
GTL2002  
1.0 V  
GND  
G
D
REF  
EASY MIGRATION TO  
LOWER VOLTAGE AS PRO-  
CESSOR GEOMETRY  
SHRINKS.  
S
V
REF  
REF  
V
CORE  
CC  
S1  
S2  
D1  
D2  
CPU I/O  
CHIPSET I/O  
TOTEM POLE I/O  
OR OPEN DRAIN  
SA00644  
Figure 6. Uni-directional up translation, to higher voltage chip sets  
5
2004 Sep 29  
Philips Semiconductors  
Product data sheet  
2-bit bi-directional low voltage translator  
GTL2002  
Sizing pull-up resistor  
The pull-up resistor value needs to limit the current through the pass transistor when it is in the “on” state to about 15 mA. This will guarantee a  
pass voltage of 260 mV to 350 mV. If the current through the pass transistor is higher than 15 mA, the pass voltage will also be higher in the  
“on” state. To set the current through each pass transistor at 15 mA, the pull-up resistor value is calculated as follows:  
Pull–up voltage (V)*0.35 V  
Resistor value (W) +  
0.015 A  
The table below summarizes resistor values for various reference voltages and currents at 15 mA and also at 10 mA and 3 mA. The resistor  
value shown in the +10 % column or a larger value should be used to ensure that the pass voltage of the transistor would be 350 mV or less.  
The external driver must be able to sink the total current from the resistors on both sides of the GTL–TVC device at 0.175 V, although the 15 mA  
only applies to current flowing through the GTL–TVC device. See Application Note AN10145-01 Bi-Directional Voltage Translators for more  
information.  
PULL-UP RESISTOR VALUES  
PULL-UP RESISTOR VALUE ()  
15 mA  
10 mA  
3 mA  
VOLTAGE  
NOMINAL  
310  
+ 10 %  
341  
217  
158  
106  
85  
NOMINAL  
465  
+ 10 %  
512  
325  
237  
160  
127  
94  
NOMINAL  
1550  
983  
+ 10 %  
1705  
1082  
788  
5.0 V  
3.3 V  
2.5 V  
1.8 V  
1.5 V  
1.2 V  
197  
295  
143  
215  
717  
97  
145  
483  
532  
77  
115  
383  
422  
57  
63  
85  
283  
312  
NOTES:  
1. Calculated for V = 0.35 V  
OL  
2. Assumes output driver V = 0.175 V at stated current  
OL  
3. +10 % to compensate for V range and resistor tolerance.  
DD  
1, 2, 3  
ABSOLUTE MAXIMUM RATINGS  
SYMBOL  
PARAMETER  
DC source reference voltage  
DC drain reference voltage  
DC gate reference voltage  
CONDITIONS  
RATING  
UNIT  
V
V
–0.5 to +7.0  
–0.5 to +7.0  
–0.5 to +7.0  
–0.5 to +7.0  
–0.5 to +7.0  
–50  
V
V
SREF  
DREF  
GREF  
V
V
V
DC voltage Port S  
V
Sn  
Dn  
n
V
DC voltage Port D  
V
n
I
DC diode current on reference pins  
DC diode current Port S  
V < 0 V  
I
mA  
mA  
mA  
mA  
°C  
REFK  
I
V < 0 V  
I
–50  
SK  
DK  
n
I
DC diode current Port D  
V < 0 V  
I
–50  
n
I
DC clamp current per channel  
Storage temperature range  
Channel in ON-state  
±128  
MAX  
T
stg  
–65 to +150  
NOTES:  
1. Stresses beyond those listed may cause permanent damage to the device. These are stress ratings only and functional operation of the  
device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to  
absolute-maximum-rated conditions for extended periods may affect device reliability.  
2. The performance capability of a high-performance integrated circuit in conjunction with its thermal environment can create junction  
temperatures which are detrimental to reliability. The maximum junction temperature of this integrated circuit should not exceed 150 °C.  
3. The input and output negative voltage ratings may be exceeded if the input and output clamp current ratings are observed.  
6
2004 Sep 29  
Philips Semiconductors  
Product data sheet  
2-bit bi-directional low voltage translator  
GTL2002  
RECOMMENDED OPERATING CONDITIONS  
LIMITS  
SYMBOL  
PARAMETER  
CONDITIONS  
UNIT  
Min  
0
Max  
5.5  
5.5  
5.5  
5.5  
64  
V
I/O  
Input/output voltage (Sn, Dn)  
V
V
1
V
DC source reference voltage  
DC drain reference voltage  
0
SREF  
DREF  
GREF  
PASS  
V
V
0
V
DC gate reference voltage  
0
V
I
Pass transistor current  
–40  
mA  
°C  
T
amb  
Operating ambient temperature range In free air  
+85  
NOTE:  
1. V  
V  
– 1.5 V for best results in level shifting applications.  
SREF  
DREF  
ELECTRICAL CHARACTERISTICS  
Over recommended operating free-air temperature range (unless otherwise noted)  
LIMITS  
SYMBOL  
PARAMETER  
TEST CONDITIONS  
= 1.365 V; V or V = 0.175 V;  
UNIT  
MAX  
1
MIN  
TYP  
V
= 3.0 V; V  
SREF  
= 15.2 mA  
DD  
Sn  
Dn  
V
OL  
LOW-level output voltage  
260  
350  
mV  
I
clamp  
V
Input clamp voltage  
Gate input leakage  
Gate capacitance  
Off capacitance  
I = –18 mA  
V
V
= 0 V  
= 0 V  
–1.2  
5
V
IK  
I
GREF  
I
IH  
V = 5 V  
I
µA  
pF  
pF  
pF  
GREF  
C
C
V = 3 V or 0 V  
I
19.4  
7.4  
18.6  
3.5  
4.4  
5.5  
67  
5
I(GREF)  
IO(OFF)  
V
O
V
O
= 3 V or 0 V  
= 3 V or 0 V  
V
GREF  
V
GREF  
V
GREF  
V
GREF  
V
GREF  
V
GREF  
V
GREF  
V
GREF  
V
GREF  
V
GREF  
= 0 V  
= 3 V  
C
On capacitance  
IO(ON)  
= 4.5 V  
= 3 V  
7
I
= 64 mA  
O
= 2.3 V  
= 1.5 V  
= 1.5 V  
= 4.5 V  
= 3 V  
9
V = 0 V  
I
105  
15  
10  
80  
70  
2
r
On-resistance  
on  
I
I
= 30 mA  
= 15 mA  
9
O
7
V = 2.4 V  
I
58  
O
V = 1.7 V  
I
= 2.3 V  
50  
NOTES:  
1. All typical values are measured at T  
= 25 °C  
amb  
2. Measured by the voltage drop between the Sn and the Dn terminals at the indicated current through the switch.  
On-state resistance is determined by the lowest voltage of the two (Sn or Dn) terminals.  
7
2004 Sep 29  
Philips Semiconductors  
Product data sheet  
2-bit bi-directional low voltage translator  
GTL2002  
AC CHARACTERISTICS FOR TRANSLATOR TYPE APPLICATIONS  
V
REF  
= 1.365 V to 1.635 V; V  
= 3.0 V to 3.6 V; V  
= 2.36 V to 2.64 V; GND = 0 V; t = t 3.0 ns. Refer to the Test Circuit diagram.  
DD1  
DD2  
r
f
LIMITS  
T
amb  
= –40 °C to +85 °C  
SYMBOL  
PARAMETER  
WAVEFORM  
UNIT  
1
MIN  
TYP  
MAX  
5.5  
Propagation delay  
Sn to Dn; Dn to Sn  
2
t
0.5  
1.5  
ns  
PLH  
NOTES:  
1. All typical values are measured at V  
= 3.3 V, V  
= 2.5 V, V  
= 1.5 V and T = 25 °C.  
amb  
DD1  
DD2  
REF  
2. Propagation delay guaranteed by characterization.  
3. C of 30 pF and a C of 15 pF is guaranteed by design.  
ON(max)  
OFF(max)  
AC WAVEFORMS  
TEST CIRCUIT  
V
= 1.5 V; V = GND to 3.0 V  
M
IN  
V
V
V
V
DD2  
DD1  
DD2  
DD2  
200 kΩ  
150 Ω  
150 Ω  
150 Ω  
V
I
INPUT  
GND  
V
V
M
M
DUT  
t
t
PLH  
PHL  
0
0
V
DD2  
D
G
REF  
D
D
2
REF  
1
TEST JIG OUTPUT  
HIGH-to-LOW  
V
t
M
V
t
M
LOW-to-HIGH  
V
OL  
PHL  
PLH  
t
PHL  
t
PLH  
1
1
V
DD2  
S
REF  
DUT OUTPUT  
HIGH-to-LOW  
LOW-to-HIGH  
S
S
2
1
V
M
V
M
V
OL  
V
REF  
TEST  
JIG  
SA00659  
Waveform 1. The Input (S ) to Output (D ) propagation delays  
n
n
PULSE  
GENERATOR  
SA00646  
Waveform 2. Load circuit  
8
2004 Sep 29  
Philips Semiconductors  
Product data sheet  
2-bit bi-directional low voltage translator  
GTL2002  
AC CHARACTERISTICS FOR CBT TYPE APPLICATION  
GND = 0 V; t C = 50 pF  
R;  
L
LIMITS  
= –40 °C to +85 °C  
T
amb  
SYMBOL  
PARAMETER DESCRIPTION  
UNITS  
G
= 5 V ± 0.5 V  
REF  
Min  
Mean  
Max  
1
t
pd  
Propagation delay  
250  
ps  
NOTES:  
1. This parameter is warranted but not production tested. The propagation delay is based on the RC time constant of the typical on-state  
resistance of the switch and a load capacitance of 50 pF, when driven by an ideal voltage source (zero output impedance).  
AC WAVEFORMS  
TEST CIRCUIT AND WAVEFORMS  
V
= 1.5 V; V = GND to 3.0 V  
M
IN  
7 V  
500 Ω  
S1  
3 V  
0 V  
From Output  
Under Test  
Open  
GND  
1.5 V  
1.5 V  
500 Ω  
C
= 50 pF  
L
INPUT  
t
t
PHL  
PLH  
Load Circuit  
V
OH  
1.5 V  
1.5 V  
TEST  
S1  
OUTPUT  
t
open  
7 V  
pd  
V
OL  
t
/t  
PLZ PZL  
SA00639  
t
/t  
open  
PHZ PZH  
Waveform 3. Input (Sn) to Output (Dn) Propagation Delays  
DEFINITIONS  
C
=
Load capacitance includes jig and probe capacitance;  
see AC CHARACTERISTICS for value.  
L
SA00012  
Waveform 4. Load circuit  
9
2004 Sep 29  
Philips Semiconductors  
Product data sheet  
2-bit bi-directional low voltage translator  
GTL2002  
SO8: plastic small outline package; 8 leads; body width 3.9 mm  
SOT96-1  
10  
2004 Sep 29  
Philips Semiconductors  
Product data sheet  
2-bit bi-directional low voltage translator  
GTL2002  
TSSOP8: plastic thin shrink small outline package; 8 leads; body width 3 mm  
SOT505-1  
11  
2004 Sep 29  
Philips Semiconductors  
Product data sheet  
2-bit bi-directional low voltage translator  
GTL2002  
VSSOP8: plastic very thin shrink small outline package; body width 2.3 mm  
SOT765-1  
12  
2004 Sep 29  
Philips Semiconductors  
Product data sheet  
2-bit bi-directional low voltage translator  
GTL2002  
REVISION HISTORY  
Rev  
Date  
Description  
_3  
20040929  
Product data (9397 750 13058). Supersedes data of 2003 Apr 01 (9397 750 11349).  
Modifications:  
“Features” section on page 2, last bullet: add “(MSOP8)”  
“Ordering information” table on page 2: add “(MSOP)” to cell 8-Pin Plastic TSSOP in Packages column.  
Add VSSOP8 package offering.  
_2  
_1  
20030401  
20000816  
Product data (9397 750 11349); ECN 853-2214 29603 Dated 28 February 2003.  
Supersedes data dated 2000 Aug 16 (9397 750 07417).  
Product data (9397 750 07417); ECN 853-2214 24367 dated 2000 Aug 16.  
13  
2004 Sep 29  
Philips Semiconductors  
Product data sheet  
2-bit bi-directional low voltage translator  
GTL2002  
Data sheet status  
Product  
status  
Definitions  
[1]  
Level  
Data sheet status  
[2] [3]  
I
Objective data sheet  
Development  
This data sheet contains data from the objective specification for product development.  
Philips Semiconductors reserves the right to change the specification in any manner without notice.  
II  
Preliminary data sheet  
Product data sheet  
Qualification  
Production  
This data sheet contains data from the preliminary specification. Supplementary data will be published  
at a later date. Philips Semiconductors reserves the right to change the specification without notice, in  
order to improve the design and supply the best possible product.  
III  
This data sheet contains data from the product specification. Philips Semiconductors reserves the  
right to make changes at any time in order to improve the design, manufacturing and supply. Relevant  
changes will be communicated via a Customer Product/Process Change Notification (CPCN).  
[1] Please consult the most recently issued data sheet before initiating or completing a design.  
[2] The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL  
http://www.semiconductors.philips.com.  
[3] For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.  
Definitions  
Short-form specification — The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see  
the relevant data sheet or data handbook.  
LimitingvaluesdefinitionLimiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting  
values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given  
in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability.  
Application information — Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no  
representation or warranty that such applications will be suitable for the specified use without further testing or modification.  
Disclaimers  
Life support — These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be  
expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree  
to fully indemnify Philips Semiconductors for any damages resulting from such application.  
Right to make changes — Philips Semiconductors reserves the right to make changes in the products—including circuits, standard cells, and/or software—described  
or contained herein in order to improve design and/or performance. When the product is in full production (status ‘Production’), relevant changes will be communicated  
viaaCustomerProduct/ProcessChangeNotification(CPCN).PhilipsSemiconductorsassumesnoresponsibilityorliabilityfortheuseofanyoftheseproducts,conveys  
nolicenseortitleunderanypatent, copyright, ormaskworkrighttotheseproducts, andmakesnorepresentationsorwarrantiesthattheseproductsarefreefrompatent,  
copyright, or mask work right infringement, unless otherwise specified.  
Koninklijke Philips Electronics N.V. 2004  
Contact information  
All rights reserved. Printed in U.S.A.  
For additional information please visit  
http://www.semiconductors.philips.com.  
Fax: +31 40 27 24825  
Date of release: 09-04  
9397 750 13058  
For sales offices addresses send e-mail to:  
sales.addresses@www.semiconductors.philips.com.  
Document order number:  
Philips  
Semiconductors  

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