HEF4071BT,653 [NXP]

HEF4071B - Quad 2-input OR gate SOIC 14-Pin;
HEF4071BT,653
型号: HEF4071BT,653
厂家: NXP    NXP
描述:

HEF4071B - Quad 2-input OR gate SOIC 14-Pin

栅 光电二极管 逻辑集成电路 触发器
文件: 总11页 (文件大小:103K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
HEF4071B  
Quad 2-input OR gate  
Rev. 06 — 1 December 2009  
Product data sheet  
1. General description  
The HEF4071B is a quad 2-input OR gate. The outputs are fully buffered for highest noise  
immunity and pattern insensitivity to output impedance variations.  
It operates over a recommended VDD power supply range of 3 V to 15 V referenced to VSS  
(usually ground). Unused inputs must be connected to VDD, VSS, or another input.  
It is also suitable for use over both the industrial (40 °C to +85 °C) and automotive  
(40 °C to +125 °C) temperature ranges.  
2. Features  
„ Fully static operation  
„ 5 V, 10 V, and 15 V parametric ratings  
„ Standardized symmetrical output characteristics  
„ Inputs and outputs are protected against electrostatic effects  
„ Operates across the automotive temperature range from 40 °C to +125 °C  
„ Complies with JEDEC standard JESD 13-B  
3. Applications  
„ Automotive and industrial  
4. Ordering information  
Table 1.  
Ordering information  
All types operate from 40 °C to +125 °C.  
Type number  
Package  
Name  
Description  
Version  
HEF4071BP  
HEF4071BT  
DIP14  
SO14  
plastic dual in-line package; 14 leads (300 mil)  
plastic small outline package; 14 leads; body width 3.9 mm  
SOT27-1  
SOT108-1  
 
 
 
 
HEF4071B  
NXP Semiconductors  
Quad 2-input OR gate  
5. Functional diagram  
1
2
1A  
1B  
1Y  
2Y  
3Y  
3
4
5
6
2A  
2B  
8
9
3A  
3B  
10  
11  
12 4A  
13 4B  
4Y  
nA  
nB  
nY  
001aaj110  
001aaj108  
Fig 1. Functional diagram  
Fig 2. Logic diagram (one gate)  
6. Pinning information  
6.1 Pinning  
HEF4071B  
1
2
3
4
5
6
7
14  
13  
12  
11  
10  
9
1A  
1B  
1Y  
2Y  
2A  
2B  
V
DD  
4B  
4A  
4Y  
3Y  
3B  
3A  
8
V
SS  
001aaj107  
Fig 3. Pin configuration  
6.2 Pin description  
Table 2.  
Symbol  
1A to 4A  
1B to 4B  
1Y to 4Y  
VSS  
Pin description  
Pin  
Description  
input  
1, 5, 8, 12  
2, 6, 9, 13  
3, 4, 10, 11  
7
input  
output  
ground (0 V)  
supply voltage  
VDD  
14  
HEF4071B_6  
© NXP B.V. 2009. All rights reserved.  
Product data sheet  
Rev. 06 — 1 December 2009  
2 of 11  
 
 
 
 
HEF4071B  
NXP Semiconductors  
Quad 2-input OR gate  
7. Functional description  
Table 3.  
Function table[1]  
Input  
nA  
L
Output  
nB  
L
nY  
L
L
H
L
H
H
H
H
H
H
[1] H = HIGH voltage level; L = LOW voltage level.  
8. Limiting values  
Table 4.  
Limiting values  
In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to VSS = 0 V (ground).  
Symbol Parameter  
Conditions  
Min  
0.5  
-
Max  
+18  
Unit  
V
VDD  
IIK  
supply voltage  
input clamping current  
input voltage  
VI < 0.5 V or VI > VDD + 0.5 V  
VO < 0.5 V or VO > VDD + 0.5 V  
±10  
mA  
V
VI  
0.5  
-
VDD + 0.5  
±10  
IOK  
II/O  
output clamping current  
input/output current  
supply current  
mA  
mA  
mA  
°C  
-
±10  
IDD  
Tstg  
Tamb  
Ptot  
-
50  
storage temperature  
ambient temperature  
total power dissipation  
65  
40  
+150  
+125  
°C  
Tamb = 40 °C to + 125 °C  
[1]  
[2]  
DIP14  
SO14  
-
-
-
750  
500  
100  
mW  
mW  
mW  
P
power dissipation  
per output  
[1] For DIP14 packages: above Tamb = 70 °C, Ptot derates linearly with 12 mW/K.  
[2] For SO14 packages: above Tamb = 70 °C, Ptot derates linearly with 8 mW/K.  
9. Recommended operating conditions  
Table 5.  
Symbol  
VDD  
Recommended operating conditions  
Parameter  
Conditions  
Min  
Max  
15  
Unit  
supply voltage  
3
V
VI  
input voltage  
0
VDD  
+125  
3.75  
0.5  
V
Tamb  
ambient temperature  
input transition rise and fall rate  
in free air  
40  
°C  
Δt/ΔV  
VDD = 5 V  
VDD = 10 V  
VDD = 15 V  
-
-
-
μs/V  
μs/V  
μs/V  
0.08  
HEF4071B_6  
© NXP B.V. 2009. All rights reserved.  
Product data sheet  
Rev. 06 — 1 December 2009  
3 of 11  
 
 
 
 
 
 
HEF4071B  
NXP Semiconductors  
Quad 2-input OR gate  
10. Static characteristics  
Table 6.  
Static characteristics  
VSS = 0 V; VI = VSS or VDD; unless otherwise specified.  
Symbol Parameter  
Conditions  
VDD  
Tamb = 40 °C Tamb = +25 °C Tamb = +85 °C Tamb = +125 °C Unit  
Min  
3.5  
7.0  
11.0  
-
Max  
Min  
3.5  
7.0  
11.0  
-
Max  
Min  
3.5  
7.0  
11.0  
-
Max  
Min  
3.5  
7.0  
11.0  
-
Max  
VIH  
HIGH-level  
input voltage  
|IO| < 1 μA  
|IO| < 1 μA  
|IO| < 1 μA  
|IO| < 1 μA  
5 V  
10 V  
15 V  
5 V  
-
-
-
-
V
-
-
-
-
V
-
-
-
-
V
VIL  
LOW-level  
input voltage  
1.5  
1.5  
1.5  
1.5  
V
10 V  
15 V  
5 V  
-
3.0  
-
3.0  
-
3.0  
-
3.0  
V
-
4.0  
-
4.0  
-
4.0  
-
4.0  
V
VOH  
VOL  
IOH  
HIGH-level  
output voltage  
4.95  
9.95  
14.95  
-
-
4.95  
9.95  
14.95  
-
-
4.95  
9.95  
14.95  
-
-
4.95  
9.95  
14.95  
-
-
V
10 V  
15 V  
5 V  
-
-
-
-
V
-
-
-
-
V
LOW-level  
output voltage  
0.05  
0.05  
0.05  
0.05  
V
10 V  
15 V  
5 V  
-
0.05  
-
0.05  
-
0.05  
-
0.05  
V
-
0.05  
-
0.05  
-
0.05  
-
0.05  
V
HIGH-level  
output current  
VO = 2.5 V  
VO = 4.6 V  
VO = 9.5 V  
VO = 13.5 V  
VO = 0.4 V  
VO = 0.5 V  
VO = 1.5 V  
1.7  
0.64  
1.6  
4.2  
0.64  
1.6  
4.2  
-
-
1.4  
0.5  
1.3  
3.4  
0.5  
1.3  
3.4  
-
-
1.1  
0.36  
0.9  
2.4  
0.36  
0.9  
2.4  
-
-
1.1  
0.36  
0.9  
2.4  
0.36  
0.9  
2.4  
-
-
-
-
-
-
-
-
mA  
mA  
mA  
mA  
mA  
mA  
mA  
5 V  
-
-
-
10 V  
15 V  
5 V  
-
-
-
-
-
-
IOL  
LOW-level  
output current  
-
-
-
10 V  
15 V  
15 V  
-
-
-
-
-
-
II  
input leakage  
current  
±0.1  
±0.1  
±1.0  
±1.0 μA  
IDD  
supply current all valid input  
combinations;  
5 V  
10 V  
15 V  
-
-
-
-
0.25  
0.5  
1.0  
-
-
-
-
-
0.25  
0.5  
-
-
-
-
7.5  
15.0  
30.0  
-
-
-
-
-
7.5 μA  
15.0 μA  
30.0 μA  
IO = 0 A  
1.0  
CI  
input  
7.5  
-
pF  
capacitance  
HEF4071B_6  
© NXP B.V. 2009. All rights reserved.  
Product data sheet  
Rev. 06 — 1 December 2009  
4 of 11  
 
HEF4071B  
NXP Semiconductors  
Quad 2-input OR gate  
11. Dynamic characteristics  
Table 7.  
T
Dynamic characteristics  
amb = 25 °C; waveforms see Figure 4; test circuit see Figure 5; unless otherwise specified. [1]  
Symbol Parameter Conditions VDD Extrapolation formula Min  
nA or nB to nY 5 V  
Typ  
55  
25  
20  
45  
20  
15  
60  
30  
20  
Max  
115  
50  
Unit  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
tPHL  
HIGH to LOW  
28 ns + (0.55 ns/pF)CL  
15 ns + (0.23 ns/pF)CL  
12 ns + (0.16 ns/pF)CL  
18 ns + (0.55 ns/pF)CL  
9 ns + (0.23 ns/pF)CL  
7 ns + (0.16 ns/pF)CL  
10 ns + (1.00 ns/pF)CL  
9 ns + (0.42 ns/pF)CL  
6 ns + (0.28 ns/pF)CL  
-
-
-
-
-
-
-
-
-
propagation delay  
10 V  
15 V  
35  
tPLH  
LOW to HIGH  
nA or nB to nY 5 V  
90  
propagation delay  
10 V  
15 V  
5 V  
45  
30  
[2]  
tt  
transition time  
120  
60  
10 V  
15 V  
40  
[1] The typical value of the propagation delay and output transition time can be calculated with the extrapolation formula (CL in pF).  
[2] tt is the same as tTHL and tTLH  
.
Table 8.  
Dynamic power dissipation  
VSS = 0 V; tr = tf 20 ns; Tamb = 25 °C.  
Symbol Parameter  
VDD Typical formula  
where:  
PD  
dynamic power dissipation  
5 V PD = 1150 × fi + Σ(fo × CL) × VDD2 (μW) fi = input frequency in MHz;  
10 V PD = 4800 × fi + Σ(fo × CL) × VDD2 (μW)  
fo = output frequency in MHz;  
15 V PD = 19700 × fi + Σ(fo × CL) × VDD2 (μW)  
CL = output load capacitance in pF;  
Σ(fo × CL) = sum of the outputs;  
VDD = supply voltage in V.  
12. Waveforms  
t
r
t
f
V
I
90 %  
nA, nB input  
V
M
10 %  
0 V  
t
t
PHL  
PLH  
V
OH  
90 %  
nY output  
V
M
10 %  
V
OL  
t
t
TLH  
THL  
001aai140  
Measurement points are given in Table 9.  
Logic levels: VOL and VOH are typical output voltage levels that occur with the output load.  
Fig 4. Input to output propagation delay and output transition times  
HEF4071B_6  
© NXP B.V. 2009. All rights reserved.  
Product data sheet  
Rev. 06 — 1 December 2009  
5 of 11  
 
 
 
 
 
HEF4071B  
NXP Semiconductors  
Quad 2-input OR gate  
Table 9.  
Measurement points  
Supply voltage  
VDD  
Input  
VM  
Output  
VM  
5 V to 15 V  
0.5VDD  
0.5VDD  
V
DD  
V
I
V
O
G
DUT  
C
L
R
T
001aag182  
Test data is given in Table 10.  
Definitions for test circuit:  
DUT = Device Under Test.  
CL = load capacitance including jig and probe capacitance.  
RT = termination resistance should be equal to the output impedance Zo of the pulse generator.  
Fig 5. Test circuit  
Table 10. Test data  
Supply voltage  
VDD  
Input  
Load  
VI  
tr, tf  
CL  
5 V to 15 V  
VSS or VDD  
20 ns  
50 pF  
HEF4071B_6  
© NXP B.V. 2009. All rights reserved.  
Product data sheet  
Rev. 06 — 1 December 2009  
6 of 11  
 
HEF4071B  
NXP Semiconductors  
Quad 2-input OR gate  
13. Package outline  
DIP14: plastic dual in-line package; 14 leads (300 mil)  
SOT27-1  
D
M
E
A
2
A
A
1
L
c
e
w M  
Z
b
1
(e )  
1
b
M
H
14  
8
pin 1 index  
E
1
7
0
5
10 mm  
scale  
DIMENSIONS (inch dimensions are derived from the original mm dimensions)  
(1)  
Z
A
A
A
2
(1)  
(1)  
1
UNIT  
mm  
b
b
c
D
E
e
e
L
M
M
H
w
1
1
E
max.  
min.  
max.  
max.  
1.73  
1.13  
0.53  
0.38  
0.36  
0.23  
19.50  
18.55  
6.48  
6.20  
3.60  
3.05  
8.25  
7.80  
10.0  
8.3  
4.2  
0.51  
3.2  
2.54  
0.1  
7.62  
0.3  
0.254  
0.01  
2.2  
0.068  
0.044  
0.021  
0.015  
0.014  
0.009  
0.77  
0.73  
0.26  
0.24  
0.14  
0.12  
0.32  
0.31  
0.39  
0.33  
inches  
0.17  
0.02  
0.13  
0.087  
Note  
1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.  
REFERENCES  
OUTLINE  
EUROPEAN  
PROJECTION  
ISSUE DATE  
VERSION  
IEC  
JEDEC  
JEITA  
99-12-27  
03-02-13  
SOT27-1  
050G04  
MO-001  
SC-501-14  
Fig 6. Package outline SOT27-1 (DIP14)  
HEF4071B_6  
© NXP B.V. 2009. All rights reserved.  
Product data sheet  
Rev. 06 — 1 December 2009  
7 of 11  
 
HEF4071B  
NXP Semiconductors  
Quad 2-input OR gate  
SO14: plastic small outline package; 14 leads; body width 3.9 mm  
SOT108-1  
D
E
A
X
c
y
H
v
M
A
E
Z
8
14  
Q
A
2
A
(A )  
3
A
1
pin 1 index  
θ
L
p
L
1
7
e
detail X  
w
M
b
p
0
2.5  
scale  
5 mm  
DIMENSIONS (inch dimensions are derived from the original mm dimensions)  
A
(1)  
(1)  
(1)  
UNIT  
A
A
A
b
c
D
E
e
H
L
L
p
Q
v
w
y
Z
θ
1
2
3
p
E
max.  
0.25  
0.10  
1.45  
1.25  
0.49  
0.36  
0.25  
0.19  
8.75  
8.55  
4.0  
3.8  
6.2  
5.8  
1.0  
0.4  
0.7  
0.6  
0.7  
0.3  
mm  
1.75  
1.27  
0.05  
1.05  
0.25  
0.01  
0.25  
0.1  
0.25  
0.01  
8o  
0o  
0.010 0.057  
0.004 0.049  
0.019 0.0100 0.35  
0.014 0.0075 0.34  
0.16  
0.15  
0.244  
0.228  
0.039 0.028  
0.016 0.024  
0.028  
0.012  
inches  
0.041  
0.01 0.004  
0.069  
Note  
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.  
REFERENCES  
OUTLINE  
EUROPEAN  
PROJECTION  
ISSUE DATE  
VERSION  
IEC  
JEDEC  
JEITA  
99-12-27  
03-02-19  
SOT108-1  
076E06  
MS-012  
Fig 7. Package outline SOT108-1 (SO14)  
HEF4071B_6  
© NXP B.V. 2009. All rights reserved.  
Product data sheet  
Rev. 06 — 1 December 2009  
8 of 11  
HEF4071B  
NXP Semiconductors  
Quad 2-input OR gate  
14. Revision history  
Table 11. Revision history  
Document ID  
Release date  
20091201  
Data sheet status  
Change notice  
Supersedes  
HEF4071B_6  
Product data sheet  
-
HEF4071B_5  
Modifications:  
Section 9 “Recommended operating conditions” Δt/ΔV values updated.  
HEF4071B_5  
20090728  
20081128  
19950101  
19950101  
Product data sheet  
Product data sheet  
Product specification  
Product specification  
-
-
-
-
HEF4071B_4  
HEF4071B_CNV_3  
HEF4071B_CNV_2  
-
HEF4071B_4  
HEF4071B_CNV_3  
HEF4071B_CNV_2  
HEF4071B_6  
© NXP B.V. 2009. All rights reserved.  
Product data sheet  
Rev. 06 — 1 December 2009  
9 of 11  
 
HEF4071B  
NXP Semiconductors  
Quad 2-input OR gate  
15. Legal information  
15.1 Data sheet status  
Document status[1][2]  
Product status[3]  
Development  
Definition  
Objective [short] data sheet  
This document contains data from the objective specification for product development.  
This document contains data from the preliminary specification.  
This document contains the product specification.  
Preliminary [short] data sheet Qualification  
Product [short] data sheet Production  
[1]  
[2]  
[3]  
Please consult the most recently issued document before initiating or completing a design.  
The term ‘short data sheet’ is explained in section “Definitions”.  
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status  
information is available on the Internet at URL http://www.nxp.com.  
damage. NXP Semiconductors accepts no liability for inclusion and/or use of  
NXP Semiconductors products in such equipment or applications and  
therefore such inclusion and/or use is at the customer’s own risk.  
15.2 Definitions  
Draft — The document is a draft version only. The content is still under  
internal review and subject to formal approval, which may result in  
modifications or additions. NXP Semiconductors does not give any  
representations or warranties as to the accuracy or completeness of  
information included herein and shall have no liability for the consequences of  
use of such information.  
Applications — Applications that are described herein for any of these  
products are for illustrative purposes only. NXP Semiconductors makes no  
representation or warranty that such applications will be suitable for the  
specified use without further testing or modification.  
Limiting values — Stress above one or more limiting values (as defined in  
the Absolute Maximum Ratings System of IEC 60134) may cause permanent  
damage to the device. Limiting values are stress ratings only and operation of  
the device at these or any other conditions above those given in the  
Characteristics sections of this document is not implied. Exposure to limiting  
values for extended periods may affect device reliability.  
Short data sheet — A short data sheet is an extract from a full data sheet  
with the same product type number(s) and title. A short data sheet is intended  
for quick reference only and should not be relied upon to contain detailed and  
full information. For detailed and full information see the relevant full data  
sheet, which is available on request via the local NXP Semiconductors sales  
office. In case of any inconsistency or conflict with the short data sheet, the  
full data sheet shall prevail.  
Terms and conditions of sale — NXP Semiconductors products are sold  
subject to the general terms and conditions of commercial sale, as published  
at http://www.nxp.com/profile/terms, including those pertaining to warranty,  
intellectual property rights infringement and limitation of liability, unless  
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of  
any inconsistency or conflict between information in this document and such  
terms and conditions, the latter will prevail.  
15.3 Disclaimers  
General — Information in this document is believed to be accurate and  
reliable. However, NXP Semiconductors does not give any representations or  
warranties, expressed or implied, as to the accuracy or completeness of such  
information and shall have no liability for the consequences of use of such  
information.  
No offer to sell or license — Nothing in this document may be interpreted or  
construed as an offer to sell products that is open for acceptance or the grant,  
conveyance or implication of any license under any copyrights, patents or  
other industrial or intellectual property rights.  
Right to make changes — NXP Semiconductors reserves the right to make  
changes to information published in this document, including without  
limitation specifications and product descriptions, at any time and without  
notice. This document supersedes and replaces all information supplied prior  
to the publication hereof.  
Export control — This document as well as the item(s) described herein  
may be subject to export control regulations. Export might require a prior  
authorization from national authorities.  
Suitability for use — NXP Semiconductors products are not designed,  
authorized or warranted to be suitable for use in medical, military, aircraft,  
space or life support equipment, nor in applications where failure or  
malfunction of an NXP Semiconductors product can reasonably be expected  
to result in personal injury, death or severe property or environmental  
15.4 Trademarks  
Notice: All referenced brands, product names, service names and trademarks  
are the property of their respective owners.  
16. Contact information  
For more information, please visit: http://www.nxp.com  
For sales office addresses, please send an email to: salesaddresses@nxp.com  
HEF4071B_6  
© NXP B.V. 2009. All rights reserved.  
Product data sheet  
Rev. 06 — 1 December 2009  
10 of 11  
 
 
 
 
 
 
HEF4071B  
NXP Semiconductors  
Quad 2-input OR gate  
17. Contents  
1
2
3
4
5
General description . . . . . . . . . . . . . . . . . . . . . . 1  
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1  
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1  
Ordering information. . . . . . . . . . . . . . . . . . . . . 1  
Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2  
6
6.1  
6.2  
Pinning information. . . . . . . . . . . . . . . . . . . . . . 2  
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2  
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 2  
7
Functional description . . . . . . . . . . . . . . . . . . . 3  
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3  
Recommended operating conditions. . . . . . . . 3  
Static characteristics. . . . . . . . . . . . . . . . . . . . . 4  
Dynamic characteristics . . . . . . . . . . . . . . . . . . 5  
Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5  
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 7  
Revision history. . . . . . . . . . . . . . . . . . . . . . . . . 9  
8
9
10  
11  
12  
13  
14  
15  
Legal information. . . . . . . . . . . . . . . . . . . . . . . 10  
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 10  
Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 10  
Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 10  
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 10  
15.1  
15.2  
15.3  
15.4  
16  
17  
Contact information. . . . . . . . . . . . . . . . . . . . . 10  
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11  
Please be aware that important notices concerning this document and the product(s)  
described herein, have been included in section ‘Legal information’.  
© NXP B.V. 2009.  
All rights reserved.  
For more information, please visit: http://www.nxp.com  
For sales office addresses, please send an email to: salesaddresses@nxp.com  
Date of release: 1 December 2009  
Document identifier: HEF4071B_6  
 

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