HEF4555BT-T [NXP]
IC 4000/14000/40000 SERIES, OTHER DECODER/DRIVER, TRUE OUTPUT, PDSO16, PLASTIC, SOT-108, SO-14, Decoder/Driver;型号: | HEF4555BT-T |
厂家: | NXP |
描述: | IC 4000/14000/40000 SERIES, OTHER DECODER/DRIVER, TRUE OUTPUT, PDSO16, PLASTIC, SOT-108, SO-14, Decoder/Driver 驱动 光电二极管 输出元件 逻辑集成电路 |
文件: | 总13页 (文件大小:133K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
HEF4555B
1-of-4 decoder/demultiplexer
Rev. 5 — 18 November 2011
Product data sheet
1. General description
The HEF4555B contains two 1-of-4 decoders/demultiplexers. Each has two address
inputs (nA0 and nA1, an active LOW enable input (nE) and four mutually exclusive
outputs which are active HIGH (nY0 to nY3). When used as a decoder, nE when HIGH,
forces nY0 to nY3 LOW. When used as a demultiplexer, the appropriate output is selected
by the information on nA0 and nA1 with nE as data input. All unselected outputs are LOW.
It operates over a recommended VDD power supply range of 3 V to 15 V referenced to VSS
(usually ground). Unused inputs must be connected to VDD, VSS, or another input.
2. Features and benefits
Fully static operation
5 V, 10 V, and 15 V parametric ratings
Standardized symmetrical output characteristics
Specified from 40 C to +85 C
Complies with JEDEC standard JESD 13-B
3. Applications
Code conversion
Address decoding
Demultiplexing: when using the enable input as data input
4. Ordering information
Table 1.
Ordering information
All types operate from 40 C to +85 C.
Type number
Package
Name
Description
Version
HEF4555BP
HEF4555BT
DIP16
SO16
plastic dual in-line package; 16 leads (300 mil)
plastic small outline package; 16 leads; body width 3.9 mm
SOT38-4
SOT109-1
HEF4555B
NXP Semiconductors
1-of-4 decoder/demultiplexer
5. Functional diagram
1Y0
1Y1
1Y2
1Y3
4
5
6
7
nY0
2
1A0
nA0
nA1
nE
DECODER
3
1
1A1
1E
nY1
nY2
2Y0 12
2Y1 11
2Y2 10
14 2A0
DECODER
13 2A1
15 2E
2Y3
9
nY3
001aae753
001aae751
Fig 1. Functional diagram
Fig 2. Logic diagram for one decoder/multiplexer
6. Pinning information
6.1 Pinning
HEF4555B
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
1E
1A0
1A1
1Y0
1Y1
1Y2
1Y3
V
DD
2E
2A0
2A1
2Y0
2Y1
2Y2
2Y3
V
SS
001aae752
Fig 3. Pin configuration
HEF4555B
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© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 5 — 18 November 2011
2 of 13
HEF4555B
NXP Semiconductors
1-of-4 decoder/demultiplexer
6.2 Pin description
Table 2.
Symbol
Pin description
Pin
Description
1A0, 1A1, 2A0, 2A1
2, 3, 14, 13
address input
1E, 2E
1, 15
enable input (active LOW
output (active HIGH)
supply voltage
1Y0, 1Y1, 1Y2, 1Y3, 2Y0, 2Y1, 2Y2, 2Y3
4, 5, 6, 7, 12, 11, 10, 9
VDD
VSS
16
8
ground (GND)
7. Functional description
Table 3.
Function selection[1]
Inputs
Outputs
nE
L
nA0
L
nA1
L
nY0
H
nY1
L
nY2
L
nY3
L
L
H
L
L
H
L
L
L
L
H
L
L
H
L
L
H
H
L
L
L
H
H
X
X
L
L
L
L
[1] H = HIGH voltage level; L = LOW voltage level; X = don’t care.
8. Limiting values
Table 4.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
VDD
IIK
Parameter
Conditions
Min
Max
+18
10
Unit
V
supply voltage
0.5
input clamping current
input voltage
VI < 0.5 V or VI > VDD + 0.5 V
VO < 0.5 V or VO > VDD + 0.5 V
-
mA
V
VI
0.5
VDD + 0.5
10
IOK
output clamping current
input/output current
supply current
-
mA
mA
mA
C
II/O
-
10
IDD
-
50
Tstg
Tamb
Ptot
storage temperature
ambient temperature
total power dissipation
65
+150
+85
40
C
[1]
[2]
DIP16 package
SO16 package
per output
-
-
-
750
mW
mW
mW
500
P
power dissipation
100
[1] For DIP16 package: Ptot derates linearly with 12 mW/K above 70 C.
[2] For SO16 package: Ptot derates linearly with 8 mW/K above 70 C.
HEF4555B
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 5 — 18 November 2011
3 of 13
HEF4555B
NXP Semiconductors
1-of-4 decoder/demultiplexer
9. Recommended operating conditions
Table 5.
Symbol
VDD
Recommended operating conditions
Parameter
Conditions
Min
Typ
Max
15
Unit
V
supply voltage
3
-
-
-
-
-
-
VI
input voltage
0
VDD
+85
3.75
0.5
V
Tamb
ambient temperature
input transition rise and fall rate
in free air
40
C
t/V
VDD = 5 V
VDD = 10 V
VDD = 15 V
-
-
-
s/V
s/V
s/V
0.08
10. Static characteristics
Table 6.
Static characteristics
VSS = 0 V; VI = VSS or VDD unless otherwise specified.
Symbol Parameter Conditions
VDD
Tamb = 40 C Tamb = 25 C Tamb = 85 C Unit
Min
Max
-
Min
Max
-
Min
Max
VIH
HIGH-level input voltage IO < 1 A
5 V
10 V
15 V
5 V
3.5
3.5
3.5
-
-
V
V
V
V
V
V
V
V
V
V
V
V
7.0
-
7.0
-
7.0
11.0
-
11.0
-
11.0
-
VIL
LOW-level input voltage
IO < 1 A
-
1.5
3.0
4.0
-
-
1.5
3.0
4.0
-
-
1.5
3.0
4.0
-
10 V
15 V
5 V
-
-
-
-
-
-
VOH
VOL
IOH
HIGH-level output voltage IO < 1 A;
VI = VSS or VDD
4.95
4.95
4.95
10 V
15 V
5 V
9.95
-
9.95
-
9.95
-
14.95
-
14.95
-
14.95
-
LOW-level output voltage IO < 1 A;
VI = VSS or VDD
-
0.05
0.05
0.05
1.7
0.52
1.3
3.6
-
-
0.05
0.05
0.05
1.4
0.44
1.1
3.0
-
-
0.05
0.05
0.05
10 V
15 V
5 V
-
-
-
-
-
-
HIGH-level output current VO = 2.5 V
-
-
-
1.1 mA
0.36 mA
0.9 mA
2.4 mA
VO = 4.6 V
VO = 9.5 V
5 V
-
-
-
10 V
15 V
5 V
-
-
-
VO = 13.5 V
-
-
-
IOL
LOW-level output current VO = 0.4 V
VO = 0.5 V
0.52
0.44
0.36
-
-
-
mA
mA
mA
10 V
15 V
15 V
5 V
1.3
-
1.1
-
0.9
VO = 1.5 V
3.6
-
3.0
-
2.4
II
input leakage current
supply current
VDD = 15 V
-
-
-
-
-
0.3
20
40
80
-
-
-
-
-
-
0.3
20
40
80
7.5
-
-
-
-
-
1.0 A
150 A
300 A
600 A
IDD
IO = 0 A;
VI = VSS or VDD
10 V
15 V
-
CI
input capacitance
-
pF
HEF4555B
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© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 5 — 18 November 2011
4 of 13
HEF4555B
NXP Semiconductors
1-of-4 decoder/demultiplexer
11. Dynamic characteristics
Table 7.
Dynamic characteristics
VSS = 0 V; Tamb = 25 C; for test circuit see Figure 5; unless otherwise specified.
Symbol Parameter
tPHL HIGH to LOW
Conditions
nAn nYn;
VDD
5 V
Extrapolation formula
88 ns + (0.55 ns/pF)CL
34 ns + (0.23 ns/pF)CL
22 ns + (0.16 ns/pF)CL
98 ns + (0.55 ns/pF)CL
39 ns + (0.23 ns/pF)CL
22 ns + (0.16 ns/pF CL
113 ns + (0.55 ns/pF)CL
44 ns + (0.23 ns/pF)CL
32 ns + (0.16 ns/pF)CL
123 ns + (0.55 ns/pF)CL
44 ns + (0.23 ns/pF)CL
32 ns + (0.16 ns/pF)CL
10 ns + (1.00 ns/pF)CL
9 ns + (0.42 ns/pF)CL
6 ns + (0.28 ns/pF)CL
Min
Typ
115
45
Max
230
90
Unit
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
[1]
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
propagation delay see Figure 4
10 V
15 V
5 V
30
65
nE nYn
125
50
250
95
10 V
15 V
5 V
30
65
[1]
tPLH
LOW to HIGH
nAn nYn
nE nYn
on nYn
140
55
280
105
75
propagation delay
10 V
15 V
5 V
40
150
55
295
110
75
10 V
15 V
5 V
40
[1][2]
tt
transition time
60
120
60
10 V
15 V
30
20
40
[1] The typical values of the propagation delay and transition times are calculated from the extrapolation formulas shown (CL in pF).
[2] Transition time tt is the same as the HIGH to LOW and LOW to HIGH transition times tTHL and tTLH
.
Table 8.
Dynamic power dissipation PD
PD can be calculated from the formulas shown. VSS = 0 V; tr = tf 20 ns; Tamb = 25 C.
Symbol
Parameter
VDD
5 V
Typical formula for PD (W)
Where:
2
PD
dynamic power
dissipation
PD = 4500 fi + (fo CL) VDD
fi = input frequency in MHz,
fo = output frequency in MHz,
2
2
10 V
15 V
PD = 18800 fi + (fo CL) VDD
PD = 45700 fi + (fo CL) VDD
CL = output load capacitance in pF,
DD = supply voltage in V,
(fo CL) = sum of the outputs.
V
HEF4555B
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© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 5 — 18 November 2011
5 of 13
HEF4555B
NXP Semiconductors
1-of-4 decoder/demultiplexer
12. Waveforms
V
DD
0.5V
nAn, nE input
nYn output
M
GND
t
t
PHL
PLH
V
OH
0.5V
M
V
OL
t
t
THL
TLH
001aal114
Measurement points are given in Table 9.
Logic levels: VOL and VOH are typical output voltage levels that occur with the output load.
Fig 4. Inputs nAn and nE to output nYn propagation delays
Table 9.
Measurement points
Supply voltage
VDD
Input
VM
Output
VM
5 V to 15 V
0.5VDD
0.5VDD
HEF4555B
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© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 5 — 18 November 2011
6 of 13
HEF4555B
NXP Semiconductors
1-of-4 decoder/demultiplexer
t
W
V
I
90 %
negative
pulse
V
V
V
M
M
10 %
0 V
t
t
r
f
t
t
f
r
V
I
90 %
positive
pulse
V
M
M
10 %
0 V
t
W
V
EXT
V
DD
V
V
O
I
G
DUT
R
T
C
L
001aal115
Test data is given in Table 10.
Definitions for test circuit:
Device Under Test (DUT);
RL = Load resistance;
CL = Load capacitance including jig and probe capacitance;
RT = Termination resistance should be equal to the output impedance Zo of the pulse generator;
VEXT = External voltage for measuring switching times.
Fig 5. Load circuitry for switching times
Table 10. Test data
Supply voltage
Input
VI
Load
CL
VEXT
tr = tf
tPLH, tPHL
open
tTHL, tTLH
5 V to 15 V
VDD
20 ns
50 pF
VDD
HEF4555B
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© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 5 — 18 November 2011
7 of 13
HEF4555B
NXP Semiconductors
1-of-4 decoder/demultiplexer
13. Package outline
DIP16: plastic dual in-line package; 16 leads (300 mil)
SOT38-4
D
M
E
A
2
A
A
1
L
c
e
w M
Z
b
1
(e )
1
b
b
2
16
9
M
H
pin 1 index
E
1
8
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
(1)
A
A
A
2
(1)
(1)
Z
1
w
UNIT
mm
b
b
b
c
D
E
e
e
L
M
M
H
1
2
1
E
max.
min.
max.
max.
1.73
1.30
0.53
0.38
1.25
0.85
0.36
0.23
19.50
18.55
6.48
6.20
3.60
3.05
8.25
7.80
10.0
8.3
4.2
0.51
3.2
2.54
0.1
7.62
0.3
0.254
0.01
0.76
0.068 0.021 0.049 0.014
0.051 0.015 0.033 0.009
0.77
0.73
0.26
0.24
0.14
0.12
0.32
0.31
0.39
0.33
inches
0.17
0.02
0.13
0.03
Note
1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
JEITA
95-01-14
03-02-13
SOT38-4
Fig 6. Package outline SOT38-4 (DIP16)
HEF4555B
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© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 5 — 18 November 2011
8 of 13
HEF4555B
NXP Semiconductors
1-of-4 decoder/demultiplexer
SO16: plastic small outline package; 16 leads; body width 3.9 mm
SOT109-1
D
E
A
X
c
y
H
v
M
A
E
Z
16
9
Q
A
2
A
(A )
3
A
1
pin 1 index
θ
L
p
L
1
8
e
w
M
detail X
b
p
0
2.5
scale
5 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
A
(1)
(1)
(1)
UNIT
A
A
A
b
c
D
E
e
H
L
L
p
Q
v
w
y
Z
θ
1
2
3
p
E
max.
0.25
0.10
1.45
1.25
0.49
0.36
0.25
0.19
10.0
9.8
4.0
3.8
6.2
5.8
1.0
0.4
0.7
0.6
0.7
0.3
mm
1.27
0.05
1.05
0.041
1.75
0.25
0.01
0.25
0.01
0.25
0.1
8o
0o
0.010 0.057
0.004 0.049
0.019 0.0100 0.39
0.014 0.0075 0.38
0.16
0.15
0.244
0.228
0.039 0.028
0.016 0.020
0.028
0.012
inches
0.069
0.01 0.004
Note
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
JEITA
99-12-27
03-02-19
SOT109-1
076E07
MS-012
Fig 7. Package outline SOT109-1 (SO16)
HEF4555B
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© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 5 — 18 November 2011
9 of 13
HEF4555B
NXP Semiconductors
1-of-4 decoder/demultiplexer
14. Revision history
Table 11. Revision history
Document ID
Release date
20111118
Data sheet status
Change notice
Supersedes
HEF4555B v.5
Product data sheet
-
HEF4555B v.4
Modifications:
• Table 6: IOH minimum values changed to maximum
HEF4555B v.4
20100106
19950101
19950101
Product data sheet
Product specification
Product specification
-
-
-
HEF4555B_CNV v.3
HEF4555B_CNV v.3
HEF4555B_CNV v.2
HEF4555B_CNV v.2
-
HEF4555B
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© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 5 — 18 November 2011
10 of 13
HEF4555B
NXP Semiconductors
1-of-4 decoder/demultiplexer
15. Legal information
15.1 Data sheet status
Document status[1][2]
Product status[3]
Development
Definition
Objective [short] data sheet
This document contains data from the objective specification for product development.
This document contains data from the preliminary specification.
This document contains the product specification.
Preliminary [short] data sheet Qualification
Product [short] data sheet Production
[1]
[2]
[3]
Please consult the most recently issued document before initiating or completing a design.
The term ‘short data sheet’ is explained in section “Definitions”.
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
malfunction of an NXP Semiconductors product can reasonably be expected
15.2 Definitions
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
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shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
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15.3 Disclaimers
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information.
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punitive, special or consequential damages (including - without limitation - lost
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Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
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authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
HEF4555B
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 5 — 18 November 2011
11 of 13
HEF4555B
NXP Semiconductors
1-of-4 decoder/demultiplexer
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
15.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
16. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
HEF4555B
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 5 — 18 November 2011
12 of 13
HEF4555B
NXP Semiconductors
1-of-4 decoder/demultiplexer
17. Contents
1
2
3
4
5
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Ordering information. . . . . . . . . . . . . . . . . . . . . 1
Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2
6
6.1
6.2
Pinning information. . . . . . . . . . . . . . . . . . . . . . 2
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3
7
Functional description . . . . . . . . . . . . . . . . . . . 3
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3
Recommended operating conditions. . . . . . . . 4
Static characteristics. . . . . . . . . . . . . . . . . . . . . 4
Dynamic characteristics . . . . . . . . . . . . . . . . . . 5
Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 8
Revision history. . . . . . . . . . . . . . . . . . . . . . . . 10
8
9
10
11
12
13
14
15
Legal information. . . . . . . . . . . . . . . . . . . . . . . 11
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 11
Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 12
15.1
15.2
15.3
15.4
16
17
Contact information. . . . . . . . . . . . . . . . . . . . . 12
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2011.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 18 November 2011
Document identifier: HEF4555B
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