HSTL16919DGG-T [NXP]

IC 16919 SERIES, LOW LEVEL TRIGGERED D LATCH, TRUE OUTPUT, PDSO48, 6.10 MM, PLASTIC, MO-153, SOT-362-1, TSSOP-48, FF/Latch;
HSTL16919DGG-T
型号: HSTL16919DGG-T
厂家: NXP    NXP
描述:

IC 16919 SERIES, LOW LEVEL TRIGGERED D LATCH, TRUE OUTPUT, PDSO48, 6.10 MM, PLASTIC, MO-153, SOT-362-1, TSSOP-48, FF/Latch

光电二极管 输出元件 逻辑集成电路 触发器
文件: 总8页 (文件大小:68K)
中文:  中文翻译
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INTEGRATED CIRCUITS  
HSTL16919  
9-bit to 18-bit HSTL to LVTTL  
memory address latch with  
12 kohm pull-up resistor  
Product data  
2004 Apr 15  
Supersedes data of 2001 Jul 19  
Philips  
Semiconductors  
Philips Semiconductors  
Product data  
9-bit to 18-bit HSTL to LVTTL memory address latch  
with 12 kohm pull-up resistor  
HSTL16919  
FEATURES  
PIN CONFIGURATION  
Inputs meet JEDEC HSTL Std. JESD 8–6, and outputs meet  
Level III specifications  
48  
47  
46  
V
2Q1  
1Q1  
1
2
3
CC  
12 kpull-up on D and LE inputs  
V
CC  
ESD classification testing is done to JEDEC Standard JESD22.  
GND  
1Q2  
Protection exceeds 2000 V to HBM per method A114.  
45 2Q2  
44 GND  
43 1Q3  
D1  
D2  
4
5
Latch-up testing is done to JEDEC Standard JESD78, which  
exceeds 100 mA.  
V
6
7
8
9
CC  
Packaged in 48-pin plastic thin shrink small outline package  
42  
41  
D3  
D4  
2Q3  
(TSSOP48)  
V
CC  
40 1Q4  
39  
GND  
DESCRIPTION  
The HSTL16919 is a 9-bit to 18-bit D-type latch designed for  
2Q4  
38 GND  
1LE 10  
3.15 V to 3.45 V V operation. The D inputs accept HSTL levels  
GND 11  
CC  
and the Q outputs provide LVTTL levels.  
37  
36  
V
12  
1Q5  
2Q5  
REF  
The HSTL16919 is particularly suitable for driving an address bus to  
two banks of memory. Each bank of nine outputs is controlled with  
its own latch-enable (LE) input.  
GND 13  
2LE 14  
GND 15  
D5 16  
35 GND  
34 1Q6  
33 2Q6  
Each of the nine D inputs is tied to the inputs of two D-type latches  
that provide true data (Q) at the outputs. While LE is LOW the Q  
outputs of the corresponding nine latches follow the D inputs. When  
LE is taken HIGH, the Q outputs are latched at the levels set up at  
the D inputs.  
32  
31  
30  
D6 17  
V
CC  
D7 18  
1Q7  
2Q7  
The HSTL16919 is characterized for operation from 0 °C to +70 °C.  
V
19  
CC  
29 GND  
28 1Q8  
D8 20  
D9 21  
27  
26  
GND 22  
2Q9 23  
1Q9 24  
2Q8  
V
CC  
25  
V
CC  
SW00768  
ORDERING INFORMATION  
T
amb  
= 0 °C to +70 °C  
Package  
Name  
Type number  
Description  
plastic thin shrink small outline package; 48 leads; body width 6.1 mm  
Version  
HSTL16919DGG  
TSSOP48  
SOT362-1  
2
2004 Apr 15  
Philips Semiconductors  
Product data  
9-bit to 18-bit HSTL to LVTTL memory address latch  
with 12 kohm pull-up resistor  
HSTL16919  
PIN DESCRIPTION  
LOGIC DIAGRAM (positive logic)  
PIN  
SYMBOL  
FUNCTION  
12  
V
V
REF  
CC  
4, 5, 7, 8, 16, 17,  
18, 20, 21  
D[1:9]  
1Q[1:9]  
2Q[1:9]  
Inputs  
12 k  
2, 46, 43, 40, 37,  
34, 31, 28, 24  
10  
4
1LE  
D1  
Outputs  
12 kΩ  
1, 45, 42, 39, 36,  
33, 30, 27, 23  
1D  
C1  
10  
14  
12  
1LE  
2LE  
2
Latch enable  
1Q1  
12 kΩ  
V
REF  
Reference voltage  
Supply voltage  
14  
2LE  
6, 19, 25, 26, 32,  
41, 47, 48  
V
CC  
1D  
C1  
1
3, 9, 11, 13, 15,  
22, 29, 35, 38, 44  
2Q1  
GND  
Ground  
TO EIGHT OTHER CHANNELS  
SW00906  
FUNCTION TABLE  
INPUTS  
OUTPUT  
LE  
L
D
H
L
Q
H
L
L
1
H
X
Q
0
NOTE:  
1. Output level before the indicated steady-state input conditions  
were established.  
3
2004 Apr 15  
Philips Semiconductors  
Product data  
9-bit to 18-bit HSTL to LVTTL memory address latch  
with 12 kohm pull-up resistor  
HSTL16919  
1
ABSOLUTE MAXIMUM RATINGS  
Over operating free-air temperature range (unless otherwise noted).  
SYMBOL  
PARAMETER  
Supply voltage range  
CONDITIONS  
RATING  
–0.5 to +4.6  
–0.5 to V +0.5  
UNIT  
V
V
CC  
2
V
I
Input voltage range  
V
CC  
2
V
Output voltage range  
Input clamp current  
Output clamp current  
–0.5 to V +0.5  
V
O
CC  
I
IK  
V < 0 V  
–50  
±50  
mA  
mA  
mA  
mA  
°C/W  
°C  
I
3
I
V < 0 V or V > V  
O O CC  
OK  
I
O
Continuous output current  
V
O
= 0 V to V  
CC  
±50  
Continuous current through each V or GND  
±100  
CC  
4
θ
Package thermal impedance  
89  
JA  
T
stg  
Storage temperature range  
–65 to +150  
NOTES:  
1. Stresses beyond those listed may cause permanent damage to the device. These are stress ratings only and functional operation of the  
device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to  
absolute-maximum-rated conditions for extended periods may affect device reliability.  
2. The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed.  
3. This current flows only when the output is in the HIGH state and V > V  
.
O
CC  
4. The package thermal impedance is calculated in accordance with JESD 51.  
1
RECOMMENDED OPERATING CONDITIONS  
LIMITS  
Nom  
SYMBOL  
PARAMETER  
UNIT  
Min  
Max  
3.45  
0.9  
V
CC  
Supply voltage  
Reference voltage  
Input voltage  
3.15  
V
V
V
REF  
0.68  
0.75  
V
I
0
1.5  
V
V
AC HIGH-level input voltage  
AC LOW-level input voltage  
DC HIGH-level input voltage  
DC LOW-level input voltage  
HIGH-level output current  
All inputs  
All inputs  
All inputs  
All inputs  
V
V
+ 200 mV  
V
IH  
REF  
V
V
V
– 200 mV  
V
IL  
REF  
V
IH  
+ 100 mV  
V
REF  
V
0
– 100 mV  
–24  
V
IL  
REF  
I
mA  
mA  
°C  
OH  
I
OL  
LOW-level output current  
24  
T
amb  
Operating free-air temperature range  
+70  
NOTE:  
1. All unused inputs of the device must be held at V or GND to ensure proper device operation.  
CC  
4
2004 Apr 15  
Philips Semiconductors  
Product data  
9-bit to 18-bit HSTL to LVTTL memory address latch  
with 12 kohm pull-up resistor  
HSTL16919  
ELECTRICAL CHARACTERISTICS  
Over recommended operating free-air temperature range (unless otherwise noted).  
LIMITS  
SYMBOL  
PARAMETER  
TEST CONDITIONS  
= 3.15 V; I = –18 mA  
UNIT  
Max  
1
Min  
Typ  
V
IK  
V
50  
2
–1.2  
V
V
CC  
I
V
OH  
HIGH-level output voltage  
LOW-level output voltage  
Control inputs  
V
= 3.15 V; I = –24 mA  
2.4  
CC  
OH  
V
OL  
V
= 3.15 V; I = 24 mA  
0.5  
–500  
–500  
90  
V
CC  
OL  
V
V
= 3.45 V; V = 0 V or 1.5 V  
µA  
µA  
µA  
mA  
pF  
pF  
pF  
CC  
CC  
I
I
I
Data inputs  
= 3.45 V; V = 0 V or 1.5 V  
I
V
REF  
V
= 3.45 V; V = 0.68 V or 0.9 V  
REF  
CC  
I
Supply current  
Control inputs  
Data inputs  
Outputs  
V
= 3.45 V; V = 0 V or 1.5 V  
100  
CC  
CC  
I
V
= 0 V or 3.3 V; V = 0 V or 3.3 V  
CC  
CC  
I
C
I
V
= 0 V or 3.3 V; V = 0 V or 3.3 V  
2.5  
4
I
C
V
CC  
= 0 V; V = 0 V  
O
O
NOTE:  
1. All typical values are at V = 3.3 V; T  
= 25 °C.  
CC  
amb  
TIMING REQUIREMENTS  
Over recommended operating free-air temperature range (unless otherwise noted).  
V
= 3.3 V ± 0.15 V  
CC  
SYMBOL  
PARAMETER  
TEST CONDITIONS  
UNIT  
Min  
3
Max  
t
w
Pulse duration  
Setup time  
Hold time  
LE LOW (Figure 1)  
D before LE (Figure 2)  
D after LE (Figure 2)  
D after LE ↓  
0
ns  
ns  
ns  
ns  
t
su  
2
t
h
1
1
t
ldr  
Data race condition timeĂ  
NOTE:  
1. This is the maximum time after LE switches LOW that the data input can return to the latched state from the opposite state without producing  
a glitch on the output.  
SWITCHING CHARACTERISTICS  
Over recommended operating free-air temperature range; V  
= 0.75 V.  
REF  
V
CC  
= 3.3 V ± 0.15 V  
FROM  
(INPUT)  
TO  
(OUTPUT)  
SYMBOL  
PARAMETER  
UNIT  
Min  
1.9  
1.9  
Max  
3.4  
D
Q
Q
ns  
ns  
t
pd  
Propagation delay (Figure 3)  
LE  
4.2  
SIMULTANEOUS SWITCHING CHARACTERISTICS  
Over recommended operating free-air temperature range; V  
= 0.75 V  
REF  
V
CC  
= 3.3 V ± 0.15 V  
FROM  
(INPUT)  
TO  
(OUTPUT)  
SYMBOL  
PARAMETER  
UNIT  
Min  
1.9  
1.9  
Max  
4.4  
D
Q
Q
ns  
ns  
Propagation delay; all outputs switching  
(Figure 3)  
t
pd  
LE  
5.2  
5
2004 Apr 15  
Philips Semiconductors  
Product data  
9-bit to 18-bit HSTL to LVTTL memory address latch  
with 12 kohm pull-up resistor  
HSTL16919  
VOLTAGE WAVEFORMS  
LOAD CIRCUIT  
FROM OUTPUT  
UNDER TEST  
t
w
1.25 V  
0.25 V  
C
= 80 pF  
L
500 Ω  
INPUT  
V
V
REF  
REF  
(see Note)  
SW00770  
SW00773  
Figure 1. Pulse duration  
NOTE: C includes probe and jig capacitance.  
L
Figure 4. Load circuit  
1.25 V  
0.25 V  
1.25 V  
LE  
V
REF  
t
su  
t
h
DATA INPUT  
V
V
REF  
REF  
0.25 V  
SW00771  
Figure 2. Setup and Hold times  
1.25 V  
0.25 V  
INPUT  
(Note 1)  
V
V
REF  
REF  
t
t
PHL  
PLH  
V
V
OH  
OUTPUT  
1.5 V  
1.5 V  
OL  
SW00772  
Figure 3. Propagation delay times  
NOTES:  
1. All input pulses are supplied by generators having the following  
characteristics: PRR 10 MHz, Z = 50 , t 1 ns, t 1 ns.  
O
r
f
2. The outputs are measured one at a time with one transition per  
measurement.  
3. t  
and t are the same as t .  
PLH pd  
PHL  
6
2004 Apr 15  
Philips Semiconductors  
Product data  
9-bit to 18-bit HSTL to LVTTL memory address latch  
with 12 kohm pull-up resistor  
HSTL16919  
TSSOP48: plastic thin shrink small outline package; 48 leads; body width 6.1 mm  
SOT362-1  
7
2004 Apr 15  
Philips Semiconductors  
Product data  
9-bit to 18-bit HSTL to LVTTL memory address latch  
with 12 kohm pull-up resistor  
HSTL16919  
REVISION HISTORY  
Rev  
Date  
Description  
_2  
20040415  
Product data (9397 750 13143). Supersedes data of 2001 Jul 19 (9397 750 08587).  
Modifications:  
Page 3: Logic diagram (positive logic) modified.  
_1  
20010719  
Product data (9397 750 08587). ECN 853-2269 26745of 19 July 2001.  
Data sheet status  
Product  
status  
Definitions  
[1]  
Level  
Data sheet status  
[2] [3]  
I
Objective data  
Development  
This data sheet contains data from the objective specification for product development.  
Philips Semiconductors reserves the right to change the specification in any manner without notice.  
II  
Preliminary data  
Qualification  
Production  
This data sheet contains data from the preliminary specification. Supplementary data will be published  
at a later date. Philips Semiconductors reserves the right to change the specification without notice, in  
order to improve the design and supply the best possible product.  
III  
Product data  
This data sheet contains data from the product specification. Philips Semiconductors reserves the  
right to make changes at any time in order to improve the design, manufacturing and supply. Relevant  
changes will be communicated via a Customer Product/Process Change Notification (CPCN).  
[1] Please consult the most recently issued data sheet before initiating or completing a design.  
[2] The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL  
http://www.semiconductors.philips.com.  
[3] For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.  
Definitions  
Short-form specification — The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see  
the relevant data sheet or data handbook.  
LimitingvaluesdefinitionLimiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting  
values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given  
in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability.  
Application information — Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no  
representation or warranty that such applications will be suitable for the specified use without further testing or modification.  
Disclaimers  
Life support — These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be  
expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree  
to fully indemnify Philips Semiconductors for any damages resulting from such application.  
Right to make changes — Philips Semiconductors reserves the right to make changes in the products—including circuits, standard cells, and/or software—described  
or contained herein in order to improve design and/or performance. When the product is in full production (status ‘Production’), relevant changes will be communicated  
viaaCustomerProduct/ProcessChangeNotification(CPCN).PhilipsSemiconductorsassumesnoresponsibilityorliabilityfortheuseofanyoftheseproducts,conveys  
nolicenseortitleunderanypatent, copyright, ormaskworkrighttotheseproducts, andmakesnorepresentationsorwarrantiesthattheseproductsarefreefrompatent,  
copyright, or mask work right infringement, unless otherwise specified.  
Koninklijke Philips Electronics N.V. 2004  
Contact information  
All rights reserved. Printed in U.S.A.  
For additional information please visit  
http://www.semiconductors.philips.com.  
Fax: +31 40 27 24825  
Date of release: 04-04  
9397 750 13143  
For sales offices addresses send e-mail to:  
sales.addresses@www.semiconductors.philips.com.  
Document order number:  
Philips  
Semiconductors  

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